Whole-board packaging mold

Abstract

The utility model belongs to the technical field of semiconductor / PCB (printed circuit board) packaging, and particularly provides a whole board packaging mold. The utility model aims to solve the problems of large volume, high manufacturing cost and long manufacturing period of the conventional whole-board packaging mold. The utility model relates to a whole board packaging mold. The whole board packaging mold is used for packaging a PCB (Printed Circuit Board) welded with a chip array; the whole board packaging mold comprises an upper mold assembly and a lower mold assembly, wherein the upper mold assembly comprises an upper mold; the lower die assembly comprises a lower die; the upper mold and the lower mold are detachably connected, and a containing space and a drainage channel are formed in the upper mold and the lower mold; and the accommodating space is used for accommodating the PCB. The whole board packaging die directly packages the whole PCB of the welding chip array, so that the die is miniaturized, and the manufacturing cost and the manufacturing period are effectively reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor / PCB board packaging, and particularly provides a whole-board packaging mold. Background Art

[0002] A packaging mold is a mold that packs a chip and a carrier with an insulating material, which can effectively prevent impurities in the air from corroding the chip circuit and is also more convenient for installation and transportation. The traditional semiconductor packaging mold welds the chip to a metal lead frame and then packs it through the packaging mold, which makes the semiconductor packaging mold large in volume, high in manufacturing cost, and long in manufacturing cycle.

[0003] Therefore, there is a need for a packaging mold with low manufacturing cost, short manufacturing cycle, and convenient transportation to solve the above problems. Summary of the Utility Model

[0004] An object of the utility model is to provide a whole-board packaging mold with small volume, low manufacturing cost, short manufacturing cycle, and convenient transportation.

[0005] To achieve the above object, the utility model provides a whole-board packaging mold, and the whole-board packaging mold is used for packaging a PCB board welded with a chip array;

[0006] The whole-board packaging mold includes an upper mold assembly and a lower mold assembly, the upper mold assembly includes an upper mold; the lower mold assembly includes a lower mold.

[0007] The upper mold is detachably connected to the lower mold and has an accommodation space and a drainage channel therein; the accommodation space is used for accommodating the PCB board.

[0008] Further, a cutting component includes a cutting plate and a main gate provided on the cutting plate, and the cutting plate is movably installed with the upper mold assembly so that the main gate is aligned with or away from one end of the drainage channel.

[0009] Further, at least one guide rail pin is provided on the upper mold, and at least one guide rail is provided on the cutting plate; each guide rail pin can correspondingly pass through one guide rail, and the cutting plate can rotate around the guide rail pin along the guiding direction of the guide rail so that the main gate is communicated with or cut off from the drainage channel.

[0010] Further, the guide rail is arc-shaped as a whole.

[0011] Further, the upper mold assembly includes an upper mold fixing member, the lower mold assembly includes a lower mold fixing member, and an accommodation space is formed between the upper mold fixing member and the lower mold fixing member, and the accommodation space is used for accommodating the PCB board.

[0012] Further, the upper die assembly further includes an upper die insert and an upper die side extrusion block. The upper die insert is located inside the upper die fixing member; the upper die side extrusion block is located on both sides of the upper die fixing member and the upper die insert; the upper die insert and the upper die side extrusion block are used to define the shape of the upper accommodation space of the upper die assembly; and the lower die assembly further includes a lower die insert and a lower die side extrusion block. The lower die insert is located inside the lower die fixing member; the lower die side extrusion block is located on both sides of the lower die fixing member and the lower die insert; the lower die insert and the lower die side extrusion block are used to define the shape of the lower accommodation space of the lower die assembly.

[0013] Further, the upper die assembly further includes a runner insert and a sub-gate insert disposed inside the upper die fixing member. The runner insert and the sub-gate insert together form a runner; the lower die assembly further includes a runner insert disposed inside the lower die fixing member, and the runner insert forms a runner; the runner and the runner together form the diversion channel.

[0014] Further, an upper die positioning block is provided at the edge of the upper die, and a lower die positioning block is provided at the edge of the lower die. The upper die positioning block and the lower die positioning block are engaged to position the upper die and the lower die; and / or, guide posts are provided at the edge of the lower die assembly, and through holes are provided inside the upper die. The guide posts pass through the through holes to accurately position the upper die and the lower die.

[0015] Further, a positioning pin is provided on the lower die, and the positioning pin is used to position the PCB board; and / or, the lower die assembly further includes a positioning pin insert, and the positioning pin insert is used to define the position of the positioning pin.

[0016] Further, the cross-section of the positioning pin is set to be rhombus-shaped.

[0017] Further, any one or more of the upper die assembly, the lower die assembly, and the blanking assembly are provided with handles; and / or, the upper die fixing member and the upper die insert, the upper die side extrusion block and the upper die fixing member, the lower die fixing member and the lower die insert, the lower die fixing member and the lower die side extrusion block, the upper die fixing member and the runner insert, the upper die fixing member and the sub-gate insert, and the lower die fixing member and the runner insert are fixedly connected by fasteners.

[0018] Based on the foregoing description, those skilled in the art can understand that in the foregoing technical solution of the present utility model, by directly encapsulating the entire PCB board with the welded chip array using the whole-board encapsulation mold, the mold is miniaturized, and the mold is detachably connected, so that the core can be replaced, enabling the mold to be adapted to a variety of different types / models of cores, effectively reducing the manufacturing cost. Further, the inserts in the whole-board encapsulation mold and the mold are both detachably connected, enabling the whole-board encapsulation mold to be adapted to different types / models of PCB boards by replacing the internal inserts when facing semiconductor chip materials of different products. The encapsulation mold of the present utility model is small in volume, low in manufacturing cost, and short in manufacturing cycle, and is suitable for experiments or small-batch production. Description of the Drawings

[0019] To more clearly illustrate the technical solution of the present utility model, some embodiments of the present utility model will be described hereinafter with reference to the drawings. Those skilled in the art should understand that the components or parts denoted by the same reference numerals in different drawings are the same or similar; the drawings of the present utility model are not necessarily drawn to scale. In the drawings:

[0020] Figure 1 is an exploded view of the structure of the encapsulation assembly in some embodiments of the present utility model;

[0021] Figure 2 is Figure 1 a bottom view of the cutting component and the upper mold component;

[0022] Figure 3 is Figure 2 a sectional view of the cutting component and the upper mold component along the A-A direction;

[0023] Figure 4 is Figure 1 a top view of the lower mold component;

[0024] Figure 5 is Figure 4 a sectional view of the lower mold component along the B-B direction.

[0025] Explanation of the Reference Numerals in the Drawings:

[0026] 100, whole-board encapsulation mold;

[0027] 1, cutting component; 11, cutting board; 12, main gate; 13, guide rail; 14, first handle; 15, handle seat;

[0028] 2, upper mold component; 21, guide rail pin; 22, upper mold fixing part; 23, upper mold insert; 24, upper mold side extrusion block; 25, upper runner insert; 26, sub-gate insert; 27, upper mold positioning block; 28, second handle; 29, upper mold side insert;

[0029] 3. Lower die assembly; 31. Lower die fixing part; 32. Lower die insert; 33. Lower die side extrusion block; 34. Lower runner insert; 35. Lower die positioning block; 36. Guide pillar; 37. Locating pin; 38. Locating pin insert; 39. Third handle;

[0030] 4. Fastener; 5. Mold lifting threaded hole. Specific embodiments

[0031] Those skilled in the art should understand that the embodiments described below are only part of the embodiments of the present invention, rather than all the embodiments of the present invention. These embodiments are intended to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention. Based on the embodiments provided by the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts should still fall within the protection scope of the present invention.

[0032] It should be noted that in the description of the present invention, the terms indicating directions or positional relationships such as "center", "upper", "lower", "top", "bottom", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings. This is only for convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, so it cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0033] In addition, it should also be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installation", "connection", "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can also be the communication inside two elements. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0034] The following refers to Figures 1 to 5 to describe in detail the whole-board packaging mold in some embodiments of the present invention. Among them, Figure 1 is the structural decomposition diagram of the packaging component in some embodiments of the present invention; Figure 2 is Figure 1 the bottom view of the cutting component and the upper die assembly in Figure 3 is Figure 2 the sectional view of the cutting component and the upper die assembly along the A-A direction in Figure 4 is Figure 1Top view of the middle and lower mold components; Figure 5 is Figure 4 Cross-sectional view of the middle and lower mold components along the B-B direction.

[0035] Prior to this, it should be noted that for the convenience of description and to enable those skilled in the art to quickly understand the technical solution of the present invention, only the technical features that are strongly related (directly or indirectly) to the technical problems and / or technical concepts to be solved by the present invention will be described hereinafter, and the technical features that are weakly related to the technical problems and / or technical concepts to be solved by the present invention will not be elaborated. Since the technical features with weak relevance belong to the common general knowledge in the art, even if the present invention does not describe such features with weak relevance, it will not result in insufficient disclosure of the present invention.

[0036] As Figure 1 shown, in some embodiments of the present invention, a whole-board encapsulation mold 100 is provided for encapsulating and soldering a PCB board with a chip array, including an upper mold component 2, a lower mold component 3, and a cutting component 1. The upper mold component 2 includes an upper mold. The lower mold component 3 includes a lower mold. The upper mold is connected to the lower mold and has an accommodation space and a drainage channel therein. The cutting component 1 includes a cutting plate 11 and a main gate 12 provided on the cutting plate 11. The cutting plate 11 is movably installed with the upper mold component 2 so that the main gate 12 is aligned with or away from one end of the drainage channel.

[0037] At least one guide pin 21 is provided on the upper mold, and at least one guide rail 13 is provided on the cutting plate 11. Each guide pin 21 can pass through a corresponding guide rail 13, and the cutting plate 11 can rotate around the guide pin 21 along the guiding direction of the guide rail 13 so that the main gate 12 is communicated with or cut off from the drainage channel.

[0038] Specifically, at least one guide pin 21 is provided on the upper mold. In this embodiment, the upper mold can be connected to the cutting plate 11 only by the cooperation of the guide pin 21 on the upper mold and the guide rail 13 on the cutting plate 11.

[0039] The number of guide pins 21 in the present invention can be configured according to actual needs and will not be limited herein. However, in this embodiment, two guide pins 21 are configured, and correspondingly, two guide rails 13 are configured. The setting positions of the guide rails 13 can be configured according to the structure of the actual whole-board encapsulation mold 100. However, in this embodiment, the two guide rails 13 are symmetrically distributed about the center on the cutting piece.

[0040] Among them, the guide rail 13 is arc-shaped as a whole.

[0041] The blanking plate 11 is provided with a main gate 12, and the main gate 12 is configured as a through-hole, and the main gate 12 is aligned with any position of the drainage channel. In this embodiment, the main gate 12 is provided at the central position of the blanking plate 11. The shape of the main gate 12 can be set as a circle, and the diameter of the main gate 12 gradually increases along the thickness direction of the blanking plate 11. The larger-diameter end of the main gate 12 is connected to the port of the injection equipment, and the smaller-diameter end of the main gate 12 is connected to the drainage channel to inject glue into the drainage channel through the main gate 12.

[0042] The blanking plate 11 is detachably connected to the upper mold. When glue injection is required, the blanking plate 11 is installed with the upper mold and then glue injection starts; after the glue injection is completed, the blanking plate 11 can be removed to facilitate the next processing of the whole-board encapsulation mold 100.

[0043] The upper mold and the lower mold are detachably connected. Specifically, demolding threaded holes 5 are provided at the edges of the upper mold and the lower mold to facilitate the operator to install / detach the upper and lower molds.

[0044] As Figure 2 and Figure 3 shown, the upper mold includes an upper mold fixing member 22 and upper mold side extrusion blocks 24. The upper mold side extrusion blocks 24 are located on both sides of the upper mold fixing member 22, and the upper mold fixing member 22 and the upper mold side extrusion blocks 24 form an upper accommodation space. The lower mold assembly 3 includes a lower mold fixing member 31 and lower mold side extrusion blocks 33. The lower mold side extrusion blocks 33 are located on both sides of the lower mold fixing member 31, and the lower mold fixing member 31 and the lower mold side extrusion blocks 33 form a lower accommodation space. The upper accommodation space and the lower accommodation space together form an accommodation space for accommodating the PCB board.

[0045] Among them, the upper mold fixing member 22 and the upper mold side extrusion blocks 24 on both sides are fixedly connected by fasteners 4. The lower mold fixing member 31 and the lower mold side extrusion blocks 33 on both sides are fixedly connected by fasteners 4.

[0046] The upper mold further includes an upper mold insert 23 and upper mold side inserts 29. The upper mold insert 23 and the upper mold side inserts 29 are installed inside the upper mold fixing member 22. The upper mold insert 23 and the upper mold side inserts 29 are used to define the shape of the upper accommodation space of the upper mold assembly 2.

[0047] Both the upper mold insert 23 and the upper mold side inserts 29 are detachably connected to the upper mold fixing member 22. Specifically, both the upper mold insert 23 and the upper mold side inserts 29 are fixedly connected to the upper mold fixing member 22 by fasteners 4.

[0048] The upper mold fixing member 22 and the upper mold insert 23 are detachably connected. Specifically, the upper mold fixing member 22 and the upper mold insert 23 are fixedly connected by fasteners 4.

[0049] The upper die side extruding block 24 is detachably connected to the upper die fixing member 22. Specifically, the upper die fixing member 22 and the upper die side extruding block 24 are fixedly connected by a fastener 4.

[0050] As Figure 4 and Figure 5 shown, the lower die assembly 3 further includes a lower die insert 32 and a lower die side insert. The lower die insert 32 and the lower die side insert are installed inside the lower die fixing member 31. The lower die insert 32 and the lower die side insert are used to define the shape of the lower accommodation space of the lower die assembly 3.

[0051] Both the lower die insert 32 and the lower die side insert are detachably connected to the lower die fixing member 31. Specifically, both the lower die insert 32 and the lower die side insert are fixedly connected to the lower die fixing member 31 by a fastener 4.

[0052] The upper die assembly 2 further includes an upper runner insert 25 and a sub-gate insert 26 disposed inside the upper die fixing member 22. The upper runner insert 25 and the sub-gate insert 26 form an upper runner, and the upper runner insert 25 is configured with a through-hole structure adapted to the main gate 12 so as to introduce resin raw material into the drainage channel through the main gate 12. The lower die assembly 3 further includes a lower runner insert 34 disposed inside the lower die fixing member 31. The lower runner insert 34 forms a lower runner. The upper runner and the lower runner together form a drainage channel.

[0053] The upper runner insert 25, the sub-gate insert 26 are detachably connected to the upper die fixing member 22. Specifically, the upper runner insert 25 and the upper die fixing member 22 are fixedly connected by a fastener 4, and the sub-gate insert 26 and the upper die fixing member 22 are fixedly connected by a fastener 4.

[0054] Wherein, the fastener 4 can be set as a screw or a bolt.

[0055] It should be noted that the inserts in the whole-board packaging mold 100 of the present utility model are all detachably installed, that is, those skilled in the art can replace the inserts in the upper die and the lower die according to different products to adapt to different types / models of PCB boards, thereby improving the adaptability of the packaging components.

[0056] In other embodiments of the present utility model, guide posts 36 are provided at the edge of the lower die assembly 3, and through-holes are provided inside the upper die. The guide posts 36 pass through the through-holes to position the upper die and the lower die, avoiding the problem of misalignment caused by the operator's installation.

[0057] In other embodiments of the present utility model, an upper die positioning block 27 is provided at the edge of the upper die, and the upper die positioning block 27 abuts against the edge of the lower die. A lower die positioning block 35 is provided at the edge of the lower die, and the lower die positioning block 35 abuts against the edge of the upper die to accurately position the upper die and the lower die, further ensuring that the operator can accurately install the upper die and the lower die in the correct positions. The upper die positioning block 27 and the lower die positioning block 35 can be provided on any two or more corresponding side edges of the upper die / lower die. Among them, the upper die positioning block 27 and the lower die positioning block 35 on each side can be provided as one or more.

[0058] In this embodiment, a positioning pin 37 is further provided on the lower die, and the positioning pin 37 is used to position the PCB board.

[0059] Furthermore, the lower die assembly 3 further includes a positioning pin insert 38, and the positioning pin insert 38 is used to limit the position of the positioning pin 37.

[0060] The cross-section of the positioning pin 37 can be set as square, circular or rhombic. In this embodiment, the positioning pin 37 is set as rhombic, and the rhombic positioning pin 37 can provide a certain thermal expansion gap to avoid the problem of heat expansion of the whole-board encapsulation die 100 after injecting resin raw materials.

[0061] Any one or more of the upper die assembly 2, the lower die assembly 3 and the cutting component 1 are provided with handles to facilitate the operator to install / dismantle the whole-board encapsulation die 100. Specifically, in order to avoid the handles of the die assemblies in the middle being covered during the installation process, the positions of the handles in the upper die assembly 2, the lower die assembly 3 and the cutting plate 11 can be set on different sides to facilitate the operator to grasp. In this embodiment, the first handle 14 in the cutting plate 11 is arranged in the width direction of the cutting plate 11, and the first handle 14 is configured as a round rod. The first handle 14 is integrally formed with the cutting plate 11. Alternatively, the cutting component 1 further includes a handle seat 15, one end of the handle seat 15 is fixedly connected to the edge of the cutting plate 11, and the other end of the handle seat 15 is fixedly connected to one end of the first handle 14. The second handle in the upper die assembly 2 is arranged in the width direction of the upper die. The third handle 39 of the lower die assembly 3 is arranged in the length direction of the lower die. Both the second handle 28 and the third handle 39 include a grip rod and a connecting piece. Both ends of the grip rod are connected to one end of a connecting piece, and the other end of each connecting piece is connected to the edge of the upper die or the lower die.

[0062] To facilitate the operator to grasp, the surfaces of the first handle 14, the second handle 28 and the third handle 39 are further provided with anti-slip structures. Among them, the anti-slip structure can be adding anti-slip patterns on the handle surface, adding a frosted layer or sleeving an anti-slip rubber layer.

[0063] Those skilled in the art can understand that, by directly encapsulating the entire PCB board with the welded chip array using the whole-board encapsulation mold 100 of the present utility model, the mold is miniaturized, and the mold is detachably connected, so that the core can be replaced, enabling the mold to be adapted to a variety of different types / models of cores, effectively reducing the manufacturing cost. Further, the inserts in the whole-board encapsulation mold 100 are detachably connected to the mold, so that when the whole-board encapsulation mold 100 faces semiconductor chip materials of different products, the internal inserts can be replaced to be adapted to different types / models of PCB boards. The encapsulation mold 100 of the present utility model is small in volume, low in manufacturing cost, and short in manufacturing cycle, and is suitable for experiments or small-batch production.

[0064] So far, the technical solutions of the present utility model have been described in combination with multiple foregoing embodiments. However, it is easy for those skilled in the art to understand that the protection scope of the present utility model is not limited to these specific embodiments. Without departing from the technical principle of the present utility model, those skilled in the art can split and combine the technical solutions in the above-mentioned various embodiments, and can also make equivalent changes or replacements to the relevant technical features. Any changes, equivalent replacements, improvements, etc. made within the technical concept and / or technical principle of the present utility model will fall within the protection scope of the present utility model.

Claims

1. A whole board packaging mold, characterized in that: The whole board packaging mold is used to package a PCB board with a chip array welded thereon; The whole board packaging mold includes an upper mold assembly and a lower mold assembly, wherein the upper mold assembly includes an upper mold; and the lower mold assembly includes a lower mold; The upper mold is detachably connected to the lower mold and has a containing space and a drainage channel therein; The accommodation space is used to accommodate the PCB board.

2. The whole board packaging mold according to claim 1, characterized in that: The cutting assembly comprises a cutting plate and a main gate arranged on the cutting plate. The cutting plate and the upper mold assembly can be movably mounted so that the main gate is aligned with or away from one end of the drainage channel.

3. The whole board packaging mold according to claim 2, characterized in that: The upper mold is provided with at least one guide pin, and the cutting plate is provided with at least one guide rail; Each of the guide rail pins can pass through a corresponding guide rail, and the cutting plate can rotate around the guide rail pin along the guide direction of the guide rail, so that the main gate is connected to or disconnected from the drainage channel.

4. The whole board packaging mold according to claim 3, characterized in that: The guide rail is arc-shaped as a whole.

5. The whole board packaging mold according to claim 1, characterized in that: The upper mold comprises an upper mold fixing part and an upper mold side extrusion block, the upper mold side extrusion blocks are located on both sides of the upper mold fixing part, and the upper mold fixing part and the upper mold side extrusion blocks form an upper accommodating space; The lower mold comprises a lower mold fixing part and a lower mold side extrusion block, the lower mold side extrusion blocks are located on both sides of the lower mold fixing part, and the lower mold fixing part and the lower mold side extrusion blocks form a lower accommodating space; The upper accommodating space and the lower accommodating space together form the accommodating space.

6. The whole board packaging mold according to claim 5, characterized in that: The upper mold further comprises an upper mold insert and an upper mold side insert, wherein the upper mold insert and the upper mold side insert are installed on the inner side of the upper mold fixing member; the upper mold insert and the upper mold side insert are used to define the shape of the upper accommodating space of the upper mold assembly; and, The lower mold also includes a lower mold insert and a lower mold side insert, which are installed on the inner side of the lower mold fixing part; the lower mold insert and the lower mold side extrusion block are used to limit the shape of the lower accommodating space located in the lower mold assembly.

7. The whole board packaging mold according to claim 6, characterized in that: The upper mold assembly further includes an upper runner insert and a sub-gate insert disposed on the inner side of the upper mold fixing member, and the upper runner insert and the sub-gate insert together form an upper runner; the lower mold assembly further includes a lower runner insert disposed on the inner side of the lower mold fixing member, and the lower runner insert forms a lower runner; The upper flow channel and the lower flow channel together form the drainage channel.

8. The whole board packaging mold according to claim 1, characterized in that: The edge of the lower mold is provided with a guide post, the inner side of the upper mold is provided with a through hole, and the guide post passes through the through hole to preliminarily position the upper mold and the lower mold; and / or, The upper mold edge is provided with an upper mold positioning block, and the upper mold positioning block abuts against the edge of the lower mold; the lower mold edge is provided with a lower mold positioning block, and the lower mold positioning block abuts against the edge of the upper mold, so as to accurately position the upper mold and the lower mold.

9. The whole board packaging mold according to claim 6, characterized in that: The lower mold is provided with a positioning pin, and the positioning pin is used to position the PCB board; and / or, The lower mold assembly also includes a locating pin insert, which is used to define the position of the locating pin.

10. The whole board packaging mold according to claim 9, characterized in that: The cross section of the positioning pin is arranged to be prismatic.

11. The whole board packaging mold according to claim 3, characterized in that: Any one or more of the upper mold assembly, the lower mold assembly and the cutting assembly is provided with a handle.

12. The whole board packaging mold according to claim 7, characterized in that: The upper mold fixing part and the upper mold insert, the upper mold side extrusion block and the upper mold fixing part, the lower mold fixing part and the lower mold insert, the lower mold fixing part and the lower mold side extrusion block, the upper mold fixing part and the upper runner insert, the upper mold fixing part and the sub-gate insert, and the lower mold fixing part and the lower runner insert are all fixedly connected by fasteners.

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