Bonding pressure head and wafer bonding machine

Abstract

The utility model relates to the technical field of semiconductor material processing equipment, in particular to a bonding pressure head and a wafer bonding machine. The bonding pressure head comprises a driving part, a connecting part and a crimping part, the crimping part is connected with the driving part through the connecting part; the crimping part comprises a crimping unit, the crimping unit comprises a first crimping surface, and the first crimping surface is used for being in contact with a to-be-pressed sample; the driving part comprises a flexible cavity, and the flexible cavity can expand or contract so as to generate or release pressure between the first crimping surface and the to-be-pressed sample; the connecting part comprises an adjusting unit, and the adjusting unit is used for adjusting the parallelism of the first crimping surface and the sample to be pressed; and a gap is formed between the driving part and the crimping part. The wafer bonding machine comprises the bonding pressure head. The bonding pressure head and the wafer bonding machine are convenient to adjust the parallelism between the pressure head and a sample to be pressed during daily use, and can generate uniform pressure during crimping.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor material processing equipment, and particularly relates to a bonding head and a wafer bonder. Background Art

[0002] In semiconductor material manufacturing technology, the bonding technology of bonding two wafers together has been widely used. When bonding wafers, it is necessary to uniformly apply pressure to two or more wafers that have been aligned and adhered to bond the wafers together. The parallelism between the bonding head and the wafer to be pressed is crucial, directly determining the yield of the bonded product. Therefore, a bonding head with adjustable parallelism is required to facilitate the calibration of the parallelism of the bonding head during daily use. Summary of the Utility Model

[0003] The purpose of the present utility model is to provide a bonding head and a wafer bonder, which are convenient for adjusting the parallelism between the head and the sample to be pressed during daily use and can generate uniform pressure during pressing.

[0004] To achieve this purpose, the present utility model adopts the following technical solutions: A bonding head, comprising: a driving part, a connecting part, and a pressing part;

[0005] The pressing part is connected to the driving part through the connecting part;

[0006] The pressing part includes a pressing unit, and the pressing unit includes a first pressing surface for contacting the sample to be pressed;

[0007] The driving part includes a flexible cavity, and the flexible cavity can expand or contract to generate or release pressure between the first pressing surface and the sample to be pressed;

[0008] The connecting part includes an adjusting unit for adjusting the parallelism between the first pressing surface and the sample to be pressed;

[0009] There is a gap between the driving part and the pressing part.

[0010] Preferably, the flexible cavity includes at least one rigid end plate;

[0011] The connecting part is connected to the rigid end plate.

[0012] Preferably, the flexible cavity includes a flexible side wall, and the rigid end plate is connected to the end face of the flexible side wall.

[0013] Preferably, the flexible side wall is a metal bellows.

[0014] Preferably, the adjusting unit includes a screw;

[0015] One end of the screw is directly or indirectly screwed to the rigid end plate;

[0016] The indirect screwing includes screwing the screw on an external component of the rigid end plate;

[0017] The other end of the screw is clamped to the crimping unit.

[0018] Preferably, a locking unit is further included, and the locking unit is used to lock the relative positions of the screw and the rigid end plate.

[0019] Preferably, a heating unit is further included, and the heating unit is connected to the crimping unit;

[0020] The heating unit has a second crimping surface, and the second crimping surface is used to contact the sample to be crimped.

[0021] Preferably, a heat insulation unit is arranged between the heating unit and the crimping unit;

[0022] An insulation unit is arranged between the heating unit and the crimping unit.

[0023] Preferably, the sample to be crimped includes a wafer, a wafer cutting, a stacked wafer, and a stacked wafer cutting.

[0024] A wafer bonding machine includes the above bonding head.

[0025] Advantages of the present utility model:

[0026] The bonding head and the wafer bonding machine provided in this application are convenient for adjusting the parallelism between the head and the sample to be crimped during daily use, and can generate uniform pressure during crimping. Description of the drawings

[0027] Figure 1 is a schematic structural diagram of the bonding head of the present utility model;

[0028] Figure 2 is Figure 1 a partial enlarged schematic diagram at A in

[0029] In the figure: 1. Driving part; 2. Crimping part; 3. Telescopic unit; 4. End plate; 5. Cavity; 6. Connecting part; 7. Crimping unit; 8. Heat insulation unit; 9. Insulation unit; 10. Heating unit; 11. Screw; 12. Locking nut; 13. Jack; 14. Disc washer; 15. Snap ring. Specific embodiments

[0030] The present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only for explaining the present utility model, rather than limiting the present utility model. Additionally, it should be noted that for the convenience of description, only the parts related to the present utility model rather than all the structures are shown in the drawings.

[0031] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0032] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over", and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "beneath", and "underneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0033] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "right", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0034] See Figure 1 Figure 2, this embodiment provides a bonding head, which is composed of a driving part 1, a connecting part 6 and a crimping part 2. The crimping part 2 is connected to the driving part 1 through the connecting part 6. The driving part 1 includes a telescopic unit 3. In this embodiment, the telescopic unit 3 is a metal bellows. It also includes an end plate 4, and the end plate 4 is connected to the end face of the metal bellows. At least a closed cavity 5 formed by enclosing the telescopic unit 3 and the end plate 4. The closed cavity 5 is a flexible cavity. When air pressure or hydraulic pressure is filled into the cavity 5, the metal bellows is pressed and expanded, and the volume of the flexible cavity increases. When the pressure is released, the metal bellows contracts, and the volume of the flexible cavity decreases. As the volume of the flexible cavity changes, the end plate 4 generates displacement.

[0035] The connecting part 6 is at least partially connected to the end plate 4 and at least another part is connected to the crimping unit 7. In this embodiment, the crimping unit 7 is a metal plate, which has a first crimping surface with a flat surface, and the first crimping surface is the surface directly contacting the sample to be crimped.

[0036] In this embodiment, the cross-sectional dimensions of the flexible cavity, the end plate 4, and the crimping unit 7 are quite similar. When the flexible cavity expands to generate a crimping force, the pressure can be evenly transmitted to the sample to be crimped, and no obvious central pressure point will be generated on the crimping interface.

[0037] As a preferred embodiment in this example, a heating unit 10 is also provided. In this embodiment, the heating unit 10 is a heating plate. The heating unit 10 is connected to the crimping unit 7. The non-connected surface of the heating unit 10 is a flat second crimping surface. When crimping the sample, the sample is heated and crimped through the second crimping surface, which can improve the crimping effect.

[0038] In this embodiment, the heating unit 10 is an electric heating plate. To prevent the electric heating plate from leaking electricity and damaging the bonding head, an insulating unit 9 is provided between the heating unit 10 and the crimping unit 7. In this embodiment, the insulating unit 9 is a ceramic plate. In this embodiment, a heat insulating unit 8 is also provided between the heating unit 10 and the crimping unit 7 to block heat transfer.

[0039] In this embodiment, the connecting part 6 includes an adjusting unit for adjusting the parallelism between the crimping surface and the sample to be crimped. The crimping surface includes the first crimping surface or the second crimping surface. The adjusting unit includes a screw 11.

[0040] One end of the screw 11 is directly or indirectly screwed to the end plate 4. Indirect screwing includes the screw being screwed to an external component of the rigid end plate, such as an adapter plate. The other end of the screw 11 is clamped to the crimping unit 7 through a snap ring 15. As a preferred embodiment, a disc spring gasket 14 is provided between the snap ring 15 and the crimping unit 7, which can form a pre-tightening force between the snap ring 15 and the crimping unit 7 to keep the screw 11 in a good state.

[0041] In this embodiment, there are three adjusting units. By adjusting the depth at which the screw rods 11 on different adjusting units are inserted into the end plate 4, the inclination angle of the crimping unit 7 can be adjusted, so as to make the parallelism between the first crimping surface or the second crimping surface of the crimping unit 7 and the sample to be crimped.

[0042] In this embodiment, the screw rod 11 is provided with a jack 13. By inserting a tool into the jack 13, the screw rod 11 can be rotated, so as to adjust the screwing depth. The screw rod 11 is also provided with a locking nut 12. After the screwing depth of the screw rod 11 is adjusted to the target depth, the screw rod 11 is locked by the locking nut 12 to prevent the screw rod 11 from rotating during operation.

[0043] This embodiment provides a wafer bonder, which includes the above-mentioned bonding head and also includes a sample platform. The first crimping surface or the second crimping surface of the bonding head faces the sample platform, and a sample is placed on the sample table. The sample on the sample platform is crimped by the above-mentioned bonding head. When the bonder is in use, the parallelism between the first crimping surface or the second crimping surface and the sample is adjusted regularly through the adjusting unit. In this embodiment, the sample includes wafers, wafer cuttings, stacked wafers, and stacked wafer cuttings.

[0044] The bonding head and the wafer bonder provided in this embodiment are convenient for adjusting the parallelism between the head and the sample to be crimped during daily use, and can generate uniform pressure during crimping.

[0045] Obviously, the above-mentioned embodiments of the present invention are only examples for clearly explaining the present invention, and are not limitations on the embodiments of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. A bonding press head, characterized in that: include: Driving part, connecting part and crimping part; The crimping portion is connected to the driving portion through the connecting portion; The crimping portion includes a crimping unit, the crimping unit includes a first crimping surface, and the first crimping surface is used to contact the sample to be crimped; The driving part includes a flexible cavity, and the flexible cavity can expand or contract to generate or release pressure between the first crimping surface and the sample to be pressed; The connecting portion includes an adjustment unit, and the adjustment unit is used to adjust the parallelism between the first crimping surface and the sample to be pressed; There is a gap between the driving part and the crimping part.

2. The bonding head according to claim 1, characterized in that: The flexible cavity includes at least one rigid end plate; The connecting portion is connected to the rigid end plate.

3. The bonding press head according to claim 2, characterized in that: The flexible cavity comprises a flexible side wall, and the rigid end plate is connected to the end surface of the flexible side wall.

4. The bonding press head according to claim 2, characterized in that: The flexible side wall is a metal bellows.

5. The bonding press head according to claim 2, characterized in that: The adjustment unit includes a screw; One end of the screw rod is directly or indirectly screwed to the rigid end plate; The other end of the screw rod is clamped on the crimping unit.

6. The bonding press head according to claim 5, characterized in that: It also includes a locking unit, which is used to lock the relative position of the screw rod and the rigid end plate.

7. The bonding press head according to claim 1, characterized in that: It also includes a heating unit, which is connected to the crimping unit; The heating unit has a second pressing surface, and the second pressing surface is used for contacting the sample to be pressed.

8. The bonding press head according to claim 7, characterized in that: A heat insulation unit is arranged between the heating unit and the crimping unit; An insulating unit is arranged between the heating unit and the crimping unit.

9. The bonding press head according to claim 1, characterized in that: The samples to be pressed include wafers, wafer cuts, stacked wafers, and stacked wafer cuts.

10. A wafer bonding machine, characterized in that: It comprises the bonding press head described in any one of claims 1-9.

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