Semiconductor packaging equipment with novel chip suction nozzle cooling mechanism

Abstract

The utility model discloses a semiconductor packaging device with a novel chip suction nozzle cooling mechanism, comprising an operation platform, the operation platform is provided with a frame cabin with a built-in frame body, one side of the frame cabin is provided with a welding window, and the operation platform is also connected with a chip suction nozzle assembly; a cooling mechanism is further arranged on the operation platform and comprises an air supply adjusting box, the air supply adjusting box is connected to a metal air pipe connecting cavity through a hose, and the metal air pipe connecting cavity is installed on the equipment frame through an installation block. A long-strip-shaped metal gas pipe is arranged at the lower end of the metal gas pipe connecting cavity, an expanded cavity is formed in the end portion of the lower end of the metal gas pipe, and a strip-shaped opening is formed in the side, close to the chip suction nozzle assembly, of the expanded cavity, so that it can be guaranteed that gas flow coverage is uniform, meanwhile, the influence on H2N2 gas coverage in a welding area is avoided, and the welding quality is improved. And the anti-oxidation effect in the welding process is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a semiconductor packaging device with a novel chip nozzle cooling mechanism. Background Art

[0002] The frames used for packaging semiconductor products are all in a relatively enclosed frame bin, and the bin is filled with H2N2 gas to prevent oxidation during the heating process of the frames. The welding part of the frame base island at the welded opening of the frame bin is exposed and welded to the chip. The H2N2 gas overflows from the closed frame bin, forming an antioxidant protection atmosphere here.

[0003] In the Die Bond process of semiconductor packaging, overheating of the chip nozzle and its attached mechanism will seriously affect production efficiency and product quality, and cooling is required. The traditional cooling method uses porous dispersed air flow: at least three metal air pipes are used, and 4 circular air holes are provided on the air outlet cavity at the end of the air pipe. The air outlet is uneven, there are defects such as mutual interference of air flows, poor cooling effect, and possible damage to the antioxidant environment in the welding area (the messy and uneven air outlet will impact the normal H2N2 gas coverage area in the welding area below).

[0004] Therefore, there is an urgent need for a solution that can provide uniform and efficient cooling without affecting the antioxidant effect of welding. Summary of the Utility Model

[0005] The technical problem to be solved by the utility model is: in order to overcome the deficiencies existing in the prior art, a semiconductor packaging device with a novel chip nozzle cooling mechanism is provided, aiming to solve the problems of uneven air flow, low cooling efficiency, and influence on the antioxidant effect in the welding area in the traditional cooling method.

[0006] The technical solution adopted by the utility model to solve its technical problems is: a semiconductor packaging device with a novel chip nozzle cooling mechanism, including an operation platform, a frame bin with an internal frame body is arranged on the operation platform, a welding window is arranged on one side of the frame bin, and a chip nozzle assembly is also connected to the operation platform;

[0007] A cooling mechanism is also arranged on the operation platform. The cooling mechanism includes a gas supply adjustment box, the gas supply adjustment box is connected to a metal air pipe connection cavity through a hose, the metal air pipe connection cavity is installed on the equipment frame through a mounting block, a long strip-shaped metal air pipe is arranged at the lower end of the metal air pipe connection cavity, a bulging cavity is arranged at the lower end of the metal air pipe, and a strip-shaped opening is arranged on one side of the bulging cavity close to the chip nozzle assembly.

[0008] Further, the strip-shaped opening of the utility model is parallel to the surface of the operation platform below it;

[0009] By adopting the above technical solution, the cooling gas outlet structure design with a strip opening structure ensures uniform distribution of airflow, improves cooling efficiency, and appropriately increases the airflow speed to overcome gap resistance and achieve efficient heat exchange. This cooling system will not interfere with the H2N2 gas coverage in the Die Bond area, ensuring the anti-oxidation effect during welding.

[0010] Furthermore, the expansion cavity described in the utility model is a cylindrical structure.

[0011] Furthermore, the gas supply regulating box described in the utility model includes an air chamber connected to an external gas supply device, and the air chamber is provided with gas supply connectors for several gases. The gas supply connector is also provided with a speed regulating knob. The gas supply is flexible, and the required gas can be selected for gas supply connection, including cooling gas, adjusting the air flow speed, ensuring uniform air flow coverage, and avoiding the impact on the H2N2 gas coverage in the welding area.

[0012] The beneficial effects of the utility model are as follows: the utility model adopts a cooling air pipe of a new structure, with a bulged top and a cooling opening parallel to the ground. Combined with the adjustable airflow speed, it can ensure uniform airflow coverage while avoiding the influence of H2N2 gas coverage on the welding area, ensuring the antioxidant effect during the welding process; significantly improving the cooling efficiency and reducing the negative impact caused by overheating. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0014] Figure 1 It is a structural schematic diagram of the utility model;

[0015] Figure 2 It is a structural schematic diagram showing the strip opening on the expansion cavity.

[0016] Numbers in the figure: 1. operating platform, 2. frame bin, 3. welding window, 4. nozzle assembly, 5. air supply regulating box, 6. hose, 7. metal air pipe connecting cavity, 8. mounting block, 9. expansion cavity, 10. strip opening, 11. air chamber, 12. air supply connector. DETAILED DESCRIPTION

[0017] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Apparently, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0018] As Figure 1 and Figure 2 shown, a semiconductor packaging device with a novel chip nozzle cooling mechanism includes an operation platform 1, a frame bin 2 with an internal frame body is arranged on the operation platform 1, a welding window 3 is arranged on one side of the frame bin 2, and a chip nozzle assembly 4 is also connected to the operation platform 1;

[0019] A cooling mechanism is also arranged on the operation platform 1. The cooling mechanism includes a gas supply regulating box 5. The gas supply regulating box 5 is connected to a metal gas pipe connection cavity 7 through a hose 6. The metal gas pipe connection cavity 7 is installed on the equipment frame through a mounting block 8. A long strip-shaped metal gas pipe 13 is arranged at the lower end of the metal gas pipe connection cavity 7. An inflated cavity 9 is arranged at the lower end of the metal gas pipe 13. A strip-shaped opening 10 is arranged on one side of the inflated cavity 9 close to the chip nozzle assembly 4.

[0020] Among them, the strip-shaped opening 10 is parallel to the surface of the operation platform 1 below it; the inflated cavity 9 is a cylindrical structure.

[0021] The gas supply regulating box 5 includes a gas chamber 11 connected to an external gas supply device. A gas supply connector 12 for several kinds of gases is arranged on the gas chamber 11. A speed regulating knob is also arranged on the gas supply connector 12. The gas supply is flexible, and the required gas can be selected for gas supply connection, including cooling gas, and the air flow speed can be adjusted to ensure uniform air flow coverage and avoid affecting the coverage of H2N2 gas in the welding area at the same time.

[0022] Working principle:

[0023] Connect the gas supply regulating box and the metal gas pipe, and adjust the cooling air flow speed to an appropriate range. The strip-shaped opening of the gas pipe has been aligned with the chip nozzle assembly during installation;

[0024] To ensure that the cooling air flow effectively covers the chip nozzle and its attached mechanism without disturbing the coverage of H2N2 gas in the welding area below, and directly blows air at the chip nozzle and its attached mechanism to achieve efficient cooling.

[0025] In the present utility model, the design of the cooling gas outlet structure with a strip-shaped opening structure ensures the uniform distribution of air flow, improves the cooling efficiency, and this cooling system does not interfere with the coverage of H2N2 gas in the Die Bond area, ensuring the antioxidant effect during the welding process.

[0026] The above are only the preferred specific embodiments of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution of the present utility model and its inventive concept, makes equivalent substitutions or changes, and should be covered within the protection scope of the present utility model.

Claims

1. A semiconductor packaging device with a novel chip nozzle cooling mechanism, characterized in that: The operating platform (1) comprises a frame bin (2) with a built-in frame body, a welding window (3) is arranged on one side of the frame bin (2), and a chip suction nozzle assembly (4) is also connected to the operating platform (1); The operating platform (1) is also provided with a cooling mechanism, and the cooling mechanism includes an air supply regulating box (5), and the air supply regulating box (5) is connected to the metal air pipe connecting cavity (7) through a hose (6), and the metal air pipe connecting cavity (7) is installed on the equipment frame through a mounting block (8), and a long metal air pipe (13) is provided at the lower end of the metal air pipe connecting cavity (7), and an expansion cavity (9) is provided at the lower end of the metal air pipe (13), and a strip opening (10) is opened on the side of the expansion cavity (9) close to the chip suction nozzle assembly (4).

2. A semiconductor packaging device with a novel chip nozzle cooling mechanism as claimed in claim 1, characterized in that: The strip-shaped opening (10) is parallel to the surface of the operating platform (1) below it.

3. A semiconductor packaging device with a novel chip nozzle cooling mechanism as claimed in claim 1, characterized in that: The expansion cavity (9) is a cylindrical structure.

4. A semiconductor packaging device with a novel chip nozzle cooling mechanism as claimed in claim 1, characterized in that: The gas supply regulating box (5) comprises an air chamber (11) connected to an external gas supply device, the air chamber (11) is provided with gas supply connectors (12) for several kinds of gases, and the gas supply connector (12) is also provided with a speed regulating knob.

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