Wafer heating device

Abstract

The utility model provides a wafer heating device, comprising a heat transfer assembly comprising a first heat transfer member, one side of which is used for placing a wafer; the mica heater is arranged on the other side of the first heat transfer piece; the connecting assembly is connected with the mica heater and the heat transfer assembly; and the supporting assembly is used for arranging the heat transfer assembly and the mica heater. By adopting the mica heater, the heating value of the mica heater is easy to regulate and control, the use is convenient, the preparation process is simple, and the later maintenance is facilitated.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductor processing, and particularly relates to a wafer heating device. Background Art

[0002] At present, thick film heaters are mostly used in wafer heating devices at the present stage. The thick film heaters need to go through steps such as designing circuits, making stencils, screen printing, and high-temperature sintering. Moreover, the substrates of thick film heaters generally use alumina or zirconia ceramics, resulting in a long production cycle, cumbersome manufacturing processes, and high costs. Summary of the Invention

[0003] To solve at least one technical problem in the prior art, an embodiment of the utility model provides a wafer heating device, which shortens the production cycle and reduces costs. To achieve the above technical purposes, the technical solution adopted in the embodiment of the utility model is as follows:

[0004] An embodiment of the utility model provides a wafer heating device, including:

[0005] A heat transfer component, including a first heat transfer member, one side of the first heat transfer member is used for placing a wafer;

[0006] A mica heater, arranged on the other side of the first heat transfer member;

[0007] A connection component, connecting the mica heater and the heat transfer component;

[0008] A support component, used for arranging the heat transfer component and the mica heater.

[0009] Further, the mica heater includes:

[0010] A mica substrate, on which a heating wire is provided;

[0011] A first mica plate, arranged on one side of the mica substrate;

[0012] A second mica plate, arranged on the other side of the mica substrate.

[0013] Further, the heat transfer component further includes a second heat transfer disk, and the second heat transfer disk is arranged between the first heat transfer member and the mica heater.

[0014] Further, the material of the first heat transfer member is aluminum;

[0015] And / or, the first heat transfer member is processed by an anodic oxidation process;

[0016] And / or, the material of the second heat transfer disk is stainless steel.

[0017] Further, a limiting component is provided on a side of the first heat transfer member facing away from the mica heater, and the limiting component includes:

[0018] A limiting disk, the limiting disk is provided with a through hole,

[0019] A limiting column, the limiting column passes through the through hole and is fixedly connected to the first heat transfer member.

[0020] Further, it further includes a pressing plate, the pressing plate is arranged on a side of the mica heater facing away from the heat transfer component and is fixedly connected to the mica heater;

[0021] An overtemperature protection switch is provided on the pressing plate; and / or, a platinum thermal resistor is provided inside the first heat transfer member.

[0022] Further, a first mounting hole is provided on the pressing plate, a second mounting hole is provided on the mica heater, and a third mounting hole is provided on the heat transfer component, and the positions of the first mounting hole, the second mounting hole, and the third mounting hole correspond to each other;

[0023] The connection component includes a connection bolt, and the connection bolt passes through the first mounting hole, the second mounting hole, and is threadedly connected to the third mounting hole.

[0024] Further, the support component includes a housing, the housing includes a receiving cavity, and the receiving cavity is used to arrange the heat transfer component, the mica heater, the pressing plate, and the connection component;

[0025] A support step is provided on a side of the receiving cavity facing away from the first heat transfer member, and the inner diameter of the support step is smaller than the inner diameter of the receiving cavity.

[0026] Further, the support component further includes:

[0027] A wire harness fixing plate, the wire harness fixing plate is arranged between the pressing plate and the support step and is fixedly connected to the support step, and a first wire outlet hole is provided on the wire harness fixing plate;

[0028] A first heightening column, one end of the first heightening column is fixedly connected to the wire harness fixing plate and the other end is fixedly connected to the pressing plate.

[0029] Further, the support component further includes:

[0030] A PCB wire outlet board, the PCB wire outlet board is arranged on a side of the support step facing away from the wire harness fixing plate, the inner diameter of the support step is larger than the inner diameter of the PCB wire outlet board and smaller than the outer diameter of the PCB wire outlet board, and a second wire outlet hole is provided on the PCB wire outlet board;

[0031] The second elevation post, one end of the second elevation post is fixedly connected to the PCB wire outlet board, and the other end is fixedly connected to the wire harness fixing board.

[0032] The beneficial effects brought by the technical solution provided by the embodiment of the present utility model are as follows:

[0033] 1) In the embodiment of the present utility model, by adopting a mica heater, the heating value of the mica heater is easy to regulate and control, it is convenient to use, the preparation process is simple, which is beneficial to later maintenance.

[0034] 2) The embodiment of the present utility model adopts the first heat transfer member and the second heat transfer member, which is beneficial to later maintenance. By setting the pressure plate and the connection assembly, it is convenient to disassemble; an overtemperature protection switch (61) is arranged on the pressure plate, and a platinum thermal resistor is arranged inside the first heat transfer member at the same time, realizing real-time monitoring of the temperature and avoiding damage to other devices due to too high temperature. Description of the Drawings

[0035] Figure 1 It is a schematic structural diagram of the wafer heating device in the embodiment of the present utility model.

[0036] Figure 2 It is a cross-sectional view of the wafer heating device in the embodiment of the present utility model.

[0037] Figure 3 It is a detail view of the wafer heating device in the embodiment of the present utility model. Detailed Embodiments

[0038] In order to make the objectives, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0039] In the description of the embodiment of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present utility model. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0040] In the description of the embodiments of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can also be the communication inside two components. It can be a wireless connection or a wired connection. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0041] In addition, the technical features involved in different embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.

[0042] The embodiments of the present utility model provide a wafer heating device, including:

[0043] A heat transfer component 1, including a first heat transfer member 11, one side of the first heat transfer member 11 is used for placing a wafer;

[0044] A mica heater 2 is provided on the other side of the first heat transfer member 11;

[0045] A connection component 3 connects the mica heater 2 and the heat transfer component 1;

[0046] A support component 4 is used to set the heat transfer component 1 and the mica heater 2.

[0047] This application uses a mica heater 2. The mica heater 2 has uniform heating, a simple manufacturing process, low cost, and the values of the heating wires are clear, which is convenient for use.

[0048] As Figure 2 and Figure 3 shown, the mica heater 2 is provided on the lower side of the first heat transfer member 11 and forms an integral body with the first heat transfer member 11 through the connection component 3. The support component 4 can stably support the mica heater 2 and the first heat transfer member 11. During operation, a wafer is placed on the upper side of the first heat transfer member 11, and the mica heater 2 is turned on to heat the wafer.

[0049] The shapes of the mica heater 2 and the heat transfer component 1 are not limited. They can be circular or square, etc., and can be customized according to the size of the wafer.

[0050] Furthermore, the mica heater 2 includes:

[0051] A mica substrate 21, on which heating wires are provided;

[0052] A first mica plate 22, disposed on one side of the mica substrate 21;

[0053] The second mica board 23 is disposed on the other side of the mica substrate 21 .

[0054] like Figure 3 As shown, the first mica board 22, the mica substrate 21, and the second mica board 23 are arranged in sequence, and the heating wire can be a resistance wire. The value of the resistance wire is clear, so the mica board heater 2 with different values ​​can be selected according to actual needs. It is easy to use, the preparation process is simple, and it is conducive to later maintenance.

[0055] The present application does not limit the distribution of the heating wires on the mica substrate 21 , and the specific distribution form of the resistance wires can be adaptively adjusted according to actual needs, for example, a serpentine distribution, a disc-shaped distribution, etc. can be adopted.

[0056] Furthermore, the heat transfer component 1 also includes a second heat transfer plate 12 , and the second heat transfer plate 12 is arranged between the first heat transfer element 11 and the mica heater 2 .

[0057] like Figure 3 As shown, the materials of the first heat transfer member 11 and the second heat transfer plate 12 can be the same or different. When the surface of the first heat transfer member 11 is damaged, the first heat transfer member 11 can be replaced in time. This structure is conducive to later maintenance.

[0058] In the present application, the materials of the first heat transfer member 11 and the second heat transfer member are not limited. In a specific embodiment, the material of the first heat transfer member 11 is aluminum;

[0059] and / or, the first heat transfer element 11 is treated by an anodic oxidation process;

[0060] And / or, the second heat transfer plate 12 is made of stainless steel.

[0061] The first heat transfer member 11 will come into contact with the air when in use. By limiting the material of the first heat transfer member 11 to aluminum and forming an aluminum oxide passivation layer on the aluminum surface through an anodizing process, rust and the like caused by contact between the surface of the first heat transfer member 11 and the air can be avoided, thereby ensuring the heating quality of the wafer.

[0062] The second heat transfer plate 12 is made of stainless steel, which has good thermal conductivity and strong corrosion resistance. For example, 304 stainless steel can be used to ensure the heating effect of the wafer heating device while reducing costs.

[0063] Furthermore, a limiting assembly 5 is provided on a side of the first heat transfer member 11 away from the mica heater 2, and the limiting assembly 5 includes:

[0064] The limiting disk 51 is provided with a through hole.

[0065] The limiting post 52 passes through the through hole and is fixedly connected to the first heat transfer member 11.

[0066] The limiting component 5 can ensure that the wafer remains stable in position during the heating process and prevent the wafer from shifting.

[0067] The position and quantity of the limiting component 5 are not limited. In a specific embodiment, the wafer heating device includes six groups of the limiting components 5, and the six groups of the limiting components 5 are equally spaced along the circumference. It can be understood that the material of the limiting component 5 is an insulator.

[0068] Furthermore, the material of the limiting component 5 is ceramic.

[0069] Further, it further includes a pressing plate 6, and the pressing plate 6 is arranged on the side of the mica heater 2 away from the heat transfer component 1 and is fixedly connected to the mica heater 2;

[0070] The over-temperature protection switch 61 is arranged on the pressing plate 6; and / or, a platinum thermal resistor is arranged inside the first heat transfer member 11.

[0071] The material of the pressing plate 6 can be made of heat-insulating materials, such as Figure 2 and Figure 3 As shown, the pressing plate 6 is arranged on the lower side of the mica heater 2, which plays a role in heat preservation and can also prevent the mica heater 2 from having a thermal impact on equipment other than the wafer heating device.

[0072] Arranging the over-temperature protection switch 61 on the pressing plate 6 and arranging the platinum thermal resistor PT100 inside the first heat transfer member 11 can both achieve real-time monitoring of the temperature and prevent other devices from being damaged due to excessive temperature.

[0073] The specific configuration of the connection component 3 in this application is not limited either. In a specific embodiment, the pressing plate 6 is provided with a first mounting hole, the mica heater 2 is provided with a second mounting hole, and the heat transfer component 1 is provided with a third mounting hole, and the positions of the first mounting hole, the second mounting hole, and the third mounting hole correspond one by one;

[0074] The connection component 3 includes a connection bolt, and the connection bolt passes through the first mounting hole, the second mounting hole, and is threadedly connected to the third mounting hole.

[0075] Such as Figure 3As shown, the connecting bolts are used to connect and fix the pressure plate 6, the mica heater 2 and the heat transfer component 1 to form a whole. The structure is simple, easy to disassemble and assemble, and convenient for later maintenance. In the above embodiments, the number and position of the connecting components 3 can be adaptively adjusted according to actual needs. In one embodiment, the connecting components 3 are provided in three groups, and the three groups of the connecting components 3 are evenly spaced along the circumferential direction. In another embodiment, the connecting components 3 are provided in six groups, and the six groups of the connecting components 3 are evenly spaced along the circumferential direction. The more the number of the connecting components 3, the more stable the connection between the heat transfer component 1, the mica heater 2 and the pressure plate 6.

[0076] In another specific embodiment, the connection component 3 includes a clamp, which can clamp the mica heater 2, the heat transfer component 1, and the side of the pressing plate 6 to form a whole.

[0077] Furthermore, the support assembly 4 includes a shell 41, and the shell 41 includes a receiving cavity A, and the receiving cavity A is used to arrange the heat transfer assembly 1, the mica heater 2, the pressing plate 6 and the connecting assembly 3;

[0078] A supporting step 411 is provided on a side of the accommodating chamber A away from the first heat transfer element 11 . The inner diameter of the supporting step 411 is smaller than the inner diameter of the accommodating chamber A.

[0079] like Figure 3 As shown, the supporting step 411 is provided on the lower side of the shell 41, and the connecting bolts connect the pressure plate 6, the mica heater 2 and the heat transfer component 1 to form a whole and are arranged in the accommodating cavity A. The structure is simple, stable and easy to disassemble.

[0080] Furthermore, the inner diameter of the accommodating chamber A is larger than the diameter of the mica heater 2; and / or, the inner diameter of the accommodating chamber A is larger than the diameter of the heat transfer component 1, and / or, the inner diameter of the accommodating chamber A is larger than the diameter of the pressure plate 6, so that there is a gap between the mica heater 2 and the inner wall of the accommodating chamber A, which facilitates heat dissipation.

[0081] Furthermore, the support assembly 4 also includes:

[0082] A wire harness fixing plate 42, the wire harness fixing plate 42 is disposed between the pressing plate 6 and the supporting step 411 and is fixedly connected to the supporting step 411, and a first wire outlet hole is provided on the wire harness fixing plate 42;

[0083] A first heightening column 43, one end of which is fixedly connected to the wiring harness fixing plate 42, and the other end of which is fixedly connected to the pressing plate 6;

[0084] The harness fixing plate 42 is fixedly connected to the supporting step 411. Figure 1 and Figure 2 As shown, in a specific embodiment, a fourth mounting hole is provided on the wiring harness fixing plate, a fifth mounting hole is provided on the supporting step 411, and the wafer heating device also includes a mounting bolt, which passes through the fifth mounting hole and is threadedly connected to the fourth mounting hole, so that the wiring harness fixing plate can be connected and fixed to the supporting step.

[0085] Furthermore, the support assembly 4 also includes:

[0086] PCB outlet plate 45, the PCB outlet plate 45 is arranged on the side of the support step 411 away from the wire harness fixing plate 42, the inner diameter of the support step 411 is larger than the inner diameter of the PCB outlet plate 45 and smaller than the outer diameter of the PCB outlet plate 45, and the PCB outlet plate 45 is provided with a second outlet hole;

[0087] A second heightening column, one end of which is fixedly connected to the PCB outlet plate 45 , and the other end of which is fixedly connected to the wire harness fixing plate 42 .

[0088] Both ends of the first raising column 43 and the second raising column are provided with threads, wherein the two ends of the first raising column 43 are respectively threadedly connected to the pressure plate 6 and the harness fixing plate 42, and the two ends of the second raising column are respectively threadedly connected to the harness fixing plate 42 and the PCB outlet plate 45. The first raising column 43 allows a gap between the harness fixing plate 42 and the pressure plate 6, and the second raising column allows a gap between the harness fixing plate 42 and the PCB outlet plate 45, which is conducive to heat dissipation and can prevent the mica heater 2 from causing thermal effects on equipment other than the wafer heating device. The heights of the first raising column 43 and the second raising column can be adaptively adjusted according to actual needs. Furthermore, an exhaust joint is also provided on the PCB outlet plate 45, which can extract impurities such as particles in the wafer heating device to improve the heating quality of the wafer heating device.

[0089] During installation, first, use the connecting bolts to sequentially screw into the first mounting hole, the second mounting hole, and the third mounting hole to connect and fix the pressure plate 6, the mica heater 2, and the heat transfer component 1. Thread one end of the first heightening column 43 to the pressure plate 6 and the other end to the wire harness fixing plate 42, then place the whole into the accommodating cavity A, connect all the circuits to the circuit and the main control circuit. Then, place the PCB wire outlet board 45 outside the support step 411, thread one end of the second heightening column to the wire harness fixing plate 42 and the other end to the PCB wire outlet board 45. Finally, screw the installation bolts into the fifth mounting hole and the fourth mounting hole in sequence to connect and fix the support step 411 and the wire harness fixing plate 42, and the installation is completed.

[0090] Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solutions of the present invention rather than to limit them. Although the present invention has been described in detail with reference to the examples, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention, and they should all be covered within the scope of the claims of the present invention.

Claims

1. A wafer heating device, characterized in that: include: A heat transfer component (1) comprises a first heat transfer element (11), wherein one side of the first heat transfer element (11) is used for placing a wafer; A mica heater (2) is arranged on the other side of the first heat transfer element (11); A connecting component (3) connecting the mica heater (2) and the heat transfer component (1); A support assembly (4) is used to arrange the heat transfer assembly (1) and the mica heater (2).

2. The wafer heating device according to claim 1, characterized in that: The mica heater (2) comprises: A mica substrate (21), wherein a heating wire is provided on the mica substrate (21); A first mica plate (22), arranged on one side of the mica substrate (21); The second mica board (23) is arranged on the other side of the mica substrate (21).

3. The wafer heating device according to claim 1, characterized in that: The heat transfer component (1) further comprises a second heat transfer plate (12), wherein the second heat transfer plate (12) is arranged between the first heat transfer element (11) and the mica heater (2).

4. The wafer heating device according to claim 3, characterized in that: The first heat transfer element (11) is made of aluminum; and / or, the first heat transfer element (11) is treated by an anodic oxidation process; And / or, the second heat transfer plate (12) is made of stainless steel.

5. The wafer heating device according to claim 1, characterized in that: A limiting component (5) is provided on a side of the first heat transfer element (11) facing away from the mica heater (2), and the limiting component (5) comprises: A limiting plate (51), wherein the limiting plate (51) is provided with a through hole. A limiting column (52), wherein the limiting column (52) passes through the through hole and is fixedly connected to the first heat transfer element (11).

6. The wafer heating device according to claim 1, characterized in that: It also comprises a pressing plate (6), wherein the pressing plate (6) is arranged on a side of the mica heater (2) facing away from the heat transfer component (1) and is fixedly connected to the mica heater (2); An over-temperature protection switch (61) is provided on the pressing plate (6); and / or a platinum thermal resistor is provided inside the first heat transfer element (11).

7. The wafer heating device according to claim 6, characterized in that: The pressing plate (6) is provided with a first mounting hole, the mica heater (2) is provided with a second mounting hole, and the heat transfer component (1) is provided with a third mounting hole, and the positions of the first mounting hole, the second mounting hole, and the third mounting hole correspond to each other; The connection assembly (3) comprises a connection bolt, which passes through the first mounting hole, the second mounting hole, and is threadedly connected to the third mounting hole.

8. The wafer heating device according to claim 6, characterized in that: The support assembly (4) comprises a shell (41), the shell (41) comprises a receiving cavity (A), and the receiving cavity (A) is used to arrange the heat transfer assembly (1), the mica heater (2), the pressing plate (6) and the connecting assembly (3); A support step (411) is provided on a side of the accommodating cavity (A) facing away from the first heat transfer element (11); the inner diameter of the support step (411) is smaller than the inner diameter of the accommodating cavity (A).

9. The wafer heating device according to claim 8, characterized in that: The support assembly (4) further comprises: a wire harness fixing plate (42), the wire harness fixing plate (42) being disposed between the pressing plate (6) and the supporting step (411) and fixedly connected to the supporting step (411), the wire harness fixing plate (42) being provided with a first wire outlet hole; A first raising column (43), wherein one end of the first raising column (43) is fixedly connected to the wiring harness fixing plate (42) and the other end of the first raising column (43) is fixedly connected to the pressing plate (6).

10. The wafer heating device according to claim 9, characterized in that: The support assembly (4) further comprises: a PCB outlet plate (45), the PCB outlet plate (45) being arranged on a side of the support step (411) away from the wire harness fixing plate (42), the inner diameter of the support step (411) being larger than the inner diameter of the PCB outlet plate (45) and smaller than the outer diameter of the PCB outlet plate (45), and the PCB outlet plate (45) being provided with a second outlet hole; A second raising column, wherein one end of the second raising column is fixedly connected to the PCB outlet plate (45) and the other end is fixedly connected to the wire harness fixing plate (42).

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