Semiconductor chip carrier
By designing a vehicle for semiconductor chips, and using the matching fixing chips between the base plate and the support parts, the problems of low efficiency and poor quality controllability caused by multiple transfers in semiconductor chip production are solved, and efficient production and good finished product quality are achieved.
Patent Information
- Application Number
- CN202421464662.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-25
- Publication Date
- 2025-05-30
- Estimated Expiration
- 2034-06-25
AI Technical Summary
Multiple transfers are required in the production and processing of semiconductor chips, resulting in low production efficiency and poor controllability of finished products.
A semiconductor chip carrier is designed, including a base plate and a plurality of support members. The semiconductor chip is fixed through the through holes and through grooves of the base plate and the support members to achieve the smooth progress of the three processes of patch, furnace and cleaning.
It effectively improves production efficiency, ensures the quality of finished products, and avoids the problems of inefficiency and poor quality controllability caused by multiple transfers.
Smart Images
Figure CN222927438U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of chip carriers, and particularly relates to a semiconductor chip carrier. Background Art
[0002] A semiconductor chip is a key component used in electronic devices. It consists of a large number of tiny electronic components, and its functions are realized by integrating them on a semiconductor material. The main functions of semiconductor chips are to process, store, and transmit information. They are widely used in fields such as computers, mobile phones, smart homes, communication devices, and automotive electronics, and can perform complex computing, storage, and control tasks.
[0003] A semiconductor chip includes a semiconductor sheet and electronic components soldered on the semiconductor sheet. During the semiconductor chip processing, the following three steps are usually involved: chip mounting, furnace passing, and cleaning. Chip mounting is to solder the electronic components onto the semiconductor sheet, furnace passing is to cure the soldering joints of the electronic components and the semiconductor sheet, and cleaning is to clean the surface of the semiconductor chip after soldering. In the prior art, three kinds of carriers are respectively required to limit and fix the semiconductor chip for the above three processes. Since the semiconductor chip needs to be transferred multiple times, the production efficiency is low, and the controllability of the finished product quality is poor.
[0004] Therefore, in view of the above technical problems, it is necessary to provide a semiconductor chip carrier. Summary of the Utility Model
[0005] The purpose of the utility model is to provide a semiconductor chip carrier, which can solve the problems of multiple transfers, low production efficiency, and poor controllability of the finished product quality in the production and processing of semiconductor chips.
[0006] To achieve the above purpose, the technical solution provided by a specific embodiment of the utility model is as follows:
[0007] A semiconductor chip carrier includes a bottom plate and a plurality of receiving members. The bottom plate is provided with a first area and a second area surrounding the first area. The first area is provided with a plurality of through holes, and the second area is provided with a through groove communicating with the first area; a plurality of receiving members are arranged on one side of the first area, and the receiving members are arranged in a position-avoiding manner with respect to the through holes. The side of the receiving member away from the bottom plate is used to receive the semiconductor chip.
[0008] In one or more embodiments of the utility model, the vertical projection of the receiving member on the first area includes two relatively opposite first arcs and two relatively opposite second arcs. The two first arcs are bent in a direction approaching each other, and the two second arcs are bent in a direction away from each other.
[0009] In one or more embodiments of the present utility model, the arc length of the first arc is greater than that of the second arc. In a direction perpendicular to the first region, the through holes are disposed between the first arcs corresponding to adjacent receiving members and between the second arcs corresponding to adjacent receiving members.
[0010] In one or more embodiments of the present utility model, the through holes include a first through hole and a second through hole. The aperture of the first through hole is greater than that of the second through hole. The first through hole is disposed between the first arcs corresponding to adjacent receiving members, and the second through hole is disposed between the second arcs corresponding to adjacent receiving members.
[0011] In one or more embodiments of the present utility model, the semiconductor chip carrier further includes a cover plate adapted to the shape of the second region. The cover plate can abut against a surface of the semiconductor chip away from the receiving member, and enclose a gap with the through groove for the cleaning liquid to pass through.
[0012] In one or more embodiments of the present utility model, a plurality of grooves are formed on the inner side of the cover plate close to the first region. There is an overlapping part between the grooves and the through grooves, so as to form the gap between the grooves and the through grooves.
[0013] In one or more embodiments of the present utility model, the bottom plate is further provided with a plurality of positioning columns, and positioning holes adapted to the positions of the positioning columns are formed at corresponding positions of the cover plate.
[0014] In one or more embodiments of the present utility model, a concave portion is provided on a surface of the first region away from the receiving member, and the concave portion is communicated with the through hole.
[0015] In one or more embodiments of the present utility model, a plurality of avoidance grooves for the clamping jaws to pass through are further formed in the second region.
[0016] In one or more embodiments of the present utility model, a plurality of magnetic members are further fixedly arranged in the second region, and the magnetic members are used for adsorbing and fixing the cover plate.
[0017] Compared with the prior art, the semiconductor chip carrier of the present utility model can fix the semiconductor chip by using the through holes, through grooves of the bottom plate and the mutual cooperation with the receiving members. After the fixing is completed, it is convenient for the smooth progress of the three processes of chip mounting, furnace passing and cleaning. Since the semiconductor chip does not need to be transferred multiple times, the production efficiency can be effectively improved and the quality of the finished product can be guaranteed. Description of the Drawings
[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments recorded in the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0019] Figure 1 An exploded view of a semiconductor chip carrier in an embodiment of the present invention;
[0020] Figure 2 is Figure 1 an enlarged view of part A in
[0021] Figure 3 is Figure 2 an enlarged view of part B in
[0022] Figure 4 A top view of the semiconductor chip carrier in an embodiment of the present invention after the cover plate is covered on the bottom plate;
[0023] Figure 5 is Figure 4 an enlarged view of part C in
[0024] Figure 6 A back structure diagram of the semiconductor chip carrier in an embodiment of the present invention;
[0025] Figure 7 is Figure 6 an enlarged view of part D in
[0026] Main reference numeral description:
[0027] 1. Bottom plate; 11. Through hole; 111. First through hole; 112. Second through hole; 12. Through groove; 13. Depressed part; 14. Avoidance groove; 15. Long strip hole; 2. Bearing part; 21. First arc; 22. Second arc; 3. Cover plate; 31. Groove; 32. Positioning hole; 4. Positioning column; 5. Magnetic attraction part. Detailed implementation manners
[0028] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0029] Refer toFigure 1 and Figure 2 In one embodiment of the present utility model, a semiconductor chip carrier includes a bottom plate 1, a plurality of receiving members 2, and a cover plate 3.
[0030] Referring to Figure 1 , the bottom plate 1 is provided with a first region and a second region surrounding the first region. In this embodiment, the shape of the surface of the bottom plate 1 is rectangular, the first region is the central part of the bottom plate 1, and the second region is the edge part of the bottom plate 1.
[0031] Referring to Figure 2 and Figure 3 , a plurality of through holes 11 are formed in the first region, and a plurality of through grooves 12 communicating with the first region are formed in the second region. The plurality of receiving members 2 are arranged on one side of the first region, and the receiving members 2 are arranged to avoid the through holes 11. The side of the receiving member 2 away from the bottom plate 1 is used to receive the semiconductor chip. In this embodiment, the receiving member 2 and the bottom plate 1 are integrally formed. The cover plate 3 is adapted to the shape of the second region (combined with Figure 1 ), the cover plate 3 can be in contact with the side of the semiconductor chip away from the receiving member 2, and encloses a gap for the cleaning liquid to pass through with the through groove 12 (for details of the gap, see Figure 5 ).
[0032] When processing the semiconductor chip, it specifically includes the following three steps: chip mounting, furnace passing, and cleaning.
[0033] In the chip mounting step, first place the sheet of the semiconductor chip on the receiving member 2, then place the semiconductor chip carrier above an external adsorption device, and then start the adsorption device. Through the through holes 11, a vacuum negative pressure environment is formed between the semiconductor sheet and the bottom plate 1 to fix the semiconductor sheet and the bottom plate 1. After the fixing is completed, the electronic components are sequentially soldered on the semiconductor sheet by an external soldering device, and finally the adsorption device is turned off and the semiconductor chip carrier is taken out.
[0034] In the furnace passing step, first cover the cover plate 3 on the side of the semiconductor chip away from the bottom plate 1, and use the cover plate 3 to fix the periphery of the semiconductor chip, so as to complete the limit fixing of the semiconductor chip. Then place the carrier with the fixed semiconductor chip in a heating device, and heat and cure the solder joints through the heating device to ensure the firmness of the welding of the electronic components and reduce the possible position offset of the electronic components on the semiconductor sheet. Among them, in this step, the through holes 11 play a certain heat dissipation role, reducing the possibility of temperature deformation of the semiconductor chip in the heating furnace.
[0035] In the cleaning step, the carrier with the semiconductor chip fixed thereon is placed in a cleaning device, and the cleaning device makes the cleaning liquid flow horizontally so that the cleaning liquid flows horizontally from the overflow tank 12 through the surface of the semiconductor chip, thereby completing the cleaning of the semiconductor chip. At the same time, the through holes 11 facilitate the upward flow of the cleaning liquid from the bottom, thereby cleaning the lower surface of the semiconductor sheet. Among them, the cleaning mainly aims at removing impurities generated by soldering and dust that may exist on the surface of the semiconductor chip.
[0036] Referring to Figure 4 and Figure 5 , in this embodiment, the vertical projection of the receiving member 2 on the first region includes two mutually opposite first arcs 21 and two mutually opposite second arcs 22. The two first arcs 21 are bent in a direction approaching each other, and the two second arcs 22 are bent in a direction away from each other. The arc length of the first arc 21 is greater than the arc length of the second arc 22. In the direction perpendicular to the first region, the through holes 11 are provided between the corresponding first arcs 21 of adjacent receiving members 2 and between the corresponding second arcs 22 of adjacent receiving members 2.
[0037] Specifically, the through hole 11 includes a first through hole 111 and a second through hole 112. The aperture of the first through hole 111 is larger than that of the second through hole 112. The first through hole 111 is provided between the corresponding first arcs 21 of adjacent receiving members 2, and the second through hole 112 is provided between the corresponding second arcs 22 of adjacent receiving members 2.
[0038] The number and shape of the receiving members 2 are set to increase the contact area between the semiconductor sheet and the receiving members 2, thereby solving the problem that when the semiconductor sheet is adsorbed during the chip mounting step, excessive pressure may exist at some positions, causing deformation of the semiconductor sheet.
[0039] Further, referring to Figure 6 and Figure 7 , a recess 13 is provided on the surface of the first region away from the receiving member 2, and the recess 13 communicates with the through hole 11. The provision of the recess 13 forms a buffer space for the air flow, which can reduce the situation where the adsorption force on a local position of the semiconductor sheet is too large when the adsorption device adsorbs and fixes the semiconductor sheet. The reason is that when the adsorption device adsorbs the semiconductor sheet, the pressure at the positions near the first through hole 111 and the second through hole 112 of the semiconductor sheet is relatively large, resulting in possible deformation of the semiconductor sheet at these positions. And the recess 13 forms a certain buffer space for the air flow, which can evenly disperse the adsorption force and reduce the possible deformation of the semiconductor sheet.
[0040] Referring to Figure 5, on the inner side of the cover plate 3 close to the first area, a plurality of grooves 31 are provided. There is an overlapping part between the grooves 31 and the through grooves 12, so as to form a gap between the grooves 31 and the through grooves 12. Through the cooperation of the grooves 31 and the through grooves 12, it is convenient to complete the cleaning of the semiconductor chip during the cleaning step. At the same time, the remaining protruding parts between the grooves 31 of the cover plate 3 can abut against the side of the semiconductor chip away from the receiving member 2, so as to effectively limit the position of the semiconductor chip.
[0041] Referring to Figure 2 , for the convenience of installation and removal of the semiconductor chip. A plurality of avoidance grooves 14 for the clamping jaws to pass through are further provided in the second area. In this embodiment, there are four avoidance grooves 14, which are respectively arranged at the four corners of the bottom plate 1.
[0042] Referring to Figure 2 , for the convenience of precise installation of the cover plate 3, the bottom plate 1 is further provided with a plurality of positioning posts 4, and positioning holes 32 adapted to the positions of the positioning posts 4 are provided at the corresponding positions of the cover plate 3. When the cover plate 3 is covered on the bottom plate 1, only by aligning the positioning holes 32 with the positioning posts 4 can the precise installation of the cover plate 3 be completed. In this embodiment, there are two positioning posts 4. In other embodiments, there may also be other numbers.
[0043] There is also a possibility that the cover plate 3 may be separated from the bottom plate 1 after being covered. Therefore, in an optional embodiment, a plurality of magnetic attraction members 5 (see Figure 6 ) are fixedly arranged in the second area. The magnetic attraction members 5 are used to adsorb and fix the cover plate 3. The magnetic attraction members 5 can be selected as magnets, and the cover plate 3 is selected as a metal that can be magnetically attracted. In this embodiment, the cover plate 3 is made of manganese steel. Since in the cleaning step, the cleaning liquid is a chemical reagent, if the traditional bonding method is used to fix the cover plate 3 and the bottom plate 1, the cleaning liquid may react chemically with the adhesive, which may affect the performance of the semiconductor chip. By adsorbing and fixing the cover plate 3 and the bottom plate 1 with the magnetic attraction members 5, the above problems can be effectively avoided. Compared with fixing by screws, magnetic attraction fixing is more rapid and convenient.
[0044] Referring to Figure 6 , a long strip hole 15 for avoiding the label of the semiconductor chip is further provided on the side of the first area. The long strip hole 15 can prevent the label from contacting the bottom plate 1 to reduce heat transfer, so as to reduce the possibility of the label of the semiconductor chip being scorched at high temperature during the furnace passing step.
[0045] The semiconductor chip carrier designed by the present utility model is convenient for the smooth progress of three processes of chip mounting, furnace passing and cleaning after the semiconductor chip is fixed. Since the semiconductor chip does not need to be transferred multiple times, the production efficiency can be effectively improved and the production quality of the semiconductor chip can be ensured.
[0046] For those skilled in the art, it is obvious that the present utility model is not limited to the details of the above-mentioned exemplary embodiments, and the present utility model can be implemented in other specific forms without departing from the spirit or basic characteristics of the present utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present utility model is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present utility model. Any reference signs in the claims should not be construed as limiting the claims involved.
[0047] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. A semiconductor chip carrier, characterized in that: include: A bottom plate (1) is provided with a first area and a second area surrounding the first area, the first area is provided with a plurality of through holes (11), and the second area is provided with a through groove (12) communicating with the first area; and A plurality of receiving members (2) are arranged on one side of the first area, and the receiving members (2) and the through holes (11) are arranged in an avoidance manner. The side of the receiving members (2) away from the base plate (1) is used for receiving semiconductor chips.
2. The semiconductor chip carrier according to claim 1, characterized in that: The vertical projection of the receiving member (2) on the first area comprises two first arcs (21) opposite to each other and two second arcs (22) opposite to each other, the two first arcs (21) are bent in directions approaching each other, and the two second arcs (22) are bent in directions away from each other.
3. The semiconductor chip carrier according to claim 2, characterized in that: The arc length of the first arc (21) is greater than the arc length of the second arc (22), and in a direction perpendicular to the first region, the through hole (11) is arranged between the first arcs (21) corresponding to adjacent receiving parts (2) and between the second arcs (22) corresponding to adjacent receiving parts (2).
4. The semiconductor chip carrier according to claim 3, characterized in that: The through hole (11) comprises a first through hole (111) and a second through hole (112); the aperture of the first through hole (111) is larger than that of the second through hole (112); the first through hole (111) is arranged between the first arcs (21) corresponding to adjacent receiving parts (2); and the second through hole (112) is arranged between the second arcs (22) corresponding to adjacent receiving parts (2).
5. The semiconductor chip carrier according to claim 1, characterized in that: It also comprises a cover plate (3) adapted to the shape of the second area, the cover plate (3) being capable of abutting against a side of the semiconductor chip away from the receiving member (2) and enclosing a gap with the groove (12) for the cleaning liquid to pass through.
6. The semiconductor chip carrier according to claim 5, characterized in that: A plurality of grooves (31) are provided on the inner side of the cover plate (3) close to the first area, and overlapping portions are provided between the grooves (31) and the through grooves (12), so that the gap is formed between the grooves (31) and the through grooves (12).
7. The semiconductor chip carrier according to claim 5, characterized in that: The bottom plate (1) is also provided with a plurality of positioning posts (4), and corresponding positions of the cover plate (3) are provided with positioning holes (32) adapted to the positions of the positioning posts (4).
8. The semiconductor chip carrier according to claim 1, characterized in that: A recessed portion (13) is provided on a surface of the first region away from the receiving member (2), and the recessed portion (13) is connected to the through hole (11).
9. The semiconductor chip carrier according to claim 5, characterized in that: The second area is also provided with a plurality of avoidance grooves (14) for the clamping claws to pass through.
10. The semiconductor chip carrier according to claim 5, characterized in that: The second area is also fixedly provided with a plurality of magnetic suction members (5), and the magnetic suction members (5) are used to absorb and fix the cover plate (3).