Suction nozzle structure and chip adsorption equipment

Abstract

The utility model provides a suction nozzle structure and chip adsorption equipment, relates to semiconductor technical field, the suction nozzle structure comprises a suction nozzle base and a suction nozzle head, the suction nozzle head is detachably installed on the suction nozzle base, the suction nozzle base is provided with an external connection air groove, an air cavity groove is arranged in the suction nozzle head, the air cavity groove is communicated with the external connection air groove, and the external connection air groove is communicated with the external connection air groove. The suction nozzle head is provided with an adsorption end face and an installation end face which are opposite, the installation end face is correspondingly attached to the suction nozzle base, a communicating air groove is formed in the center of the adsorption end face, and the communicating air groove and the edge air groove are both communicated with the air cavity groove. Compared with the prior art, the air cavity groove is additionally arranged and can serve as an air storage space, so that the adsorption air pressure of the edge air grooves and the communicated air grooves can be improved, the adsorption force is improved, and the adsorption effect is guaranteed. Meanwhile, a double-air-groove structure of the edge air grooves and the communicating air grooves is adopted, so that the edge adsorption force can be improved, and the chip mounting and separating efficiency is improved while the adsorption effect is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and more specifically, to a nozzle structure and a chip adsorption device. Background Art

[0002] With the rapid development of the semiconductor industry, in the chip mounting process, a nozzle is usually used to mount a chip. However, the nozzle is usually made of materials such as rubber or metal, and usually uses single-hole adsorption. During the long-term mounting process, there are abnormal situations such as wear or damage on the surface of the nozzle. When the nozzle is worn or damaged, it will lead to poor vacuum adsorption and the chip cannot be picked up, so the adsorption effect is poor. In addition, after the existing wafer is cut and separated, silicon residues (fish silicon skeletons) are formed on the blue film. When the nozzle picks up the chip, it is difficult to separate the fish silicon skeleton from the chip, resulting in picking failure. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a nozzle structure and a chip adsorption device, which can improve the chip adsorption effect and the chip picking success rate.

[0004] The embodiments of the utility model are implemented as follows:

[0005] In a first aspect, the utility model provides a nozzle structure, including a nozzle base and a nozzle head. The nozzle head is detachably installed on the nozzle base. The nozzle base has an external air groove. An air cavity groove is arranged in the nozzle head. The air cavity groove communicates with the external air groove. The nozzle head has an opposite adsorption end face and an installation end face. The installation end face is correspondingly attached to the nozzle base. A communication air groove is arranged at the center of the adsorption end face for correspondingly adsorbing the middle part of the chip. An edge air groove is arranged at the edge of the adsorption end face for correspondingly adsorbing the edge of the chip. Both the communication air groove and the edge air groove communicate with the air cavity groove.

[0006] In an optional embodiment, the size of the installation end face is larger than that of the adsorption end face.

[0007] In an optional embodiment, the nozzle head is in the shape of a multi-sided pyramid frustum.

[0008] In an optional embodiment, the edge air groove is in a ring shape and surrounds the communication air groove.

[0009] In an optional embodiment, an air hole column is arranged on the top side of the nozzle base. The external air groove is formed in the air hole column. The nozzle head is detachably installed on the air hole column, and the installation end face is attached to the nozzle base around the air hole column.

[0010] In an alternative embodiment, the air hole column is rectangular and the external air groove is circular.

[0011] In an alternative embodiment, the mounting end face is further provided with an assembly groove communicating with the air cavity groove, and the assembly groove is adapted to the air hole column.

[0012] In an alternative embodiment, the depth of the assembly groove is greater than or equal to the height of the air hole column relative to the nozzle base, so that the distance between the end face of the air hole column and the nozzle base is less than or equal to the distance between the air cavity groove and the nozzle base.

[0013] In an alternative embodiment, at least a part of the area on the nozzle base is provided with a first magnetic attraction member, and the mounting end face is provided with a second magnetic attraction member. The first magnetic attraction member and the second magnetic attraction member attract each other so that the mounting end face fits on the nozzle base.

[0014] In a second aspect, the present utility model provides a chip adsorption device, including a machine table, a mounting head, and a nozzle structure according to any one of the foregoing embodiments. The mounting head is arranged on the machine table, the nozzle base is arranged on the mounting head, and a vacuum pipe communicating with the external air groove is arranged on the mounting head.

[0015] The beneficial effects of the embodiments of the present utility model include:

[0016] The nozzle structure provided by the embodiments of the present utility model detachably mounts the nozzle head on the nozzle base, and connects the external air groove of the nozzle base to an external pipeline. The air cavity groove in the nozzle head communicates with the external air groove, and the mounting end face of the nozzle head fits on the nozzle base. A communication air groove is arranged at the center of the nozzle end face, which can correspondingly adsorb the middle part of the chip, and an edge air groove is arranged at the edge of the adsorption end face, which can correspondingly adsorb the edge of the chip. Both the edge air groove and the communication air groove communicate with the air cavity groove. Compared with the prior art, by adding an air cavity groove, the present utility model can be used as a gas storage space, thereby improving the adsorption air pressure of the edge air groove and the communication air groove, further improving the adsorption force, and ensuring the adsorption effect. At the same time, by adopting the double-air-groove structure of the edge air groove and the communication air groove, the edge adsorption force can be improved, and the edge air groove can also suck silicon residues, improving the mounting and separation efficiency of the chip while ensuring the adsorption effect. Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0018] Figure 1 An assembly schematic diagram of the nozzle structure provided by the embodiment of the present utility model from the first perspective;

[0019] Figure 2 An exploded structure schematic diagram of the nozzle structure provided by the embodiment of the present utility model from the first perspective;

[0020] Figure 3 An exploded structure schematic diagram of the nozzle structure provided by the embodiment of the present utility model from the second perspective;

[0021] Figure 4 An assembly cross-sectional view of the nozzle structure provided by the embodiment of the present utility model from the second perspective.

[0022] Icon:

[0023] 100 - Nozzle structure; 110 - Nozzle base; 111 - External air groove; 112 - Air hole column; 113 - First magnetic part; 130 - Nozzle head; 131 - Air cavity groove; 132 - Adsorption end face; 133 - Installation end face; 134 - Connecting air groove; 135 - Edge air groove; 136 - Assembly groove; 137 - Second magnetic part. Detailed implementation manners

[0024] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Apparently, the described embodiments are some but not all of the embodiments of the present utility model. Generally, the components of the embodiments of the present utility model described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the present utility model to be protected, but merely represents the selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts fall within the scope of protection of the present utility model.

[0026] It should be noted that: similar reference numerals and letters denote similar items in the following accompanying drawings. Therefore, once an item is defined in one accompanying drawing, it does not need to be further defined and explained in subsequent accompanying drawings.

[0027] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present utility model is usually placed during use. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model. In addition, the terms "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0028] In addition, terms such as "horizontal" and "vertical" do not mean that the components are required to be absolutely horizontal or hanging vertically, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0029] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0030] First Embodiment

[0031] Please refer to Figures 1 to 4 , this embodiment provides a nozzle structure 100. By adding an air cavity groove 131, it can serve as a gas storage space, thereby improving the adsorption air pressure of the edge air groove 135 and the communication air groove 134, further improving the adsorption force, and ensuring the adsorption effect. At the same time, by adopting the double-air-groove structure of the edge air groove 135 and the communication air groove 134, the edge adsorption force can be improved, and the edge air groove 135 can also suck silicon residues, improving the chip mounting and separation efficiency while ensuring the adsorption effect.

[0032] The nozzle structure 100 provided by the embodiment of the present utility model includes a nozzle base 110 and a nozzle head 130. The nozzle head 130 is detachably mounted on the nozzle base 110. The nozzle base 110 has an external air groove 111. An air cavity groove 131 is provided in the nozzle head 130. The air cavity groove 131 communicates with the external air groove 111. And the nozzle head 130 has an opposite adsorption end face 132 and a mounting end face 133. The mounting end face 133 is correspondingly attached to the nozzle base 110. A communication air groove 134 is provided at the center of the adsorption end face 132 for correspondingly adsorbing the middle part of the chip. An edge air groove 135 is provided at the edge of the adsorption end face 132 for correspondingly adsorbing the edge of the chip. And both the communication air groove 134 and the edge air groove 135 communicate with the air cavity groove 131.

[0033] It should be noted that in this embodiment, the nozzle head 130 is detachably mounted on the nozzle base 110, and the external air groove 111 of the nozzle base 110 is communicated with an external pipeline. The air cavity groove 131 in the nozzle head 130 communicates with the external air groove 111. And the mounting end face 133 of the nozzle head 130 is attached to the nozzle base 110. A communication air groove 134 is provided at the center of the nozzle end face, which can correspondingly adsorb the middle part of the chip. An edge air groove 135 is provided at the edge of the adsorption end face 132, which can correspondingly adsorb the edge of the chip. Both the edge air groove 135 and the communication air groove 134 communicate with the air cavity groove 131. By adding the air cavity groove 131, it can be used as a gas storage space, so as to improve the adsorption air pressure of the edge air groove 135 and the communication air groove 134, and then improve the adsorption force and ensure the adsorption effect. At the same time, by adopting the double air groove structure of the edge air groove 135 and the communication air groove 134, the edge adsorption force can be improved, and the edge air groove 135 can also suck silicon residues, so as to improve the chip mounting and separation efficiency while ensuring the adsorption effect.

[0034] It is worth noting that during actual assembly, the adsorption base can be mounted on the mounting head on the machine table, and the external air pipe is communicated with the external air groove 111 to provide adsorption force. During adsorption, in one mode, the communication air groove 134 can be used to adsorb the middle part of the chip, and the edge air groove 135 adsorbs the edge area of the chip. By adopting the double air groove structure, the adsorption effect can be further improved and chip pickup failure can be avoided. In another mode, the communication air groove 134 can be used to adsorb the middle part of the chip, and the edge air groove 135 is used to adsorb the silicon residue (fish silicon skeleton) at the edge of the chip after cutting, so as to better separate the chip.

[0035] In this embodiment, the size of the mounting end face 133 is larger than that of the adsorption end face 132. Specifically, the adsorption end face 132 is in a rectangular shape, and its size is adapted to the size of the chip to be adsorbed, so that the edge air groove 135 can just adsorb at the edge of the chip.

[0036] It should be noted that the nozzle head 130 and the nozzle base 110 are detachable structures here. Therefore, the nozzle head 130 of different specifications can be replaced according to the chip size. The sizes of the adsorption end faces 132 of the nozzle heads 130 of different specifications are different, which can greatly improve its applicability.

[0037] In this embodiment, the nozzle head 130 is in the shape of a multi-pyramid frustum. Specifically, the nozzle head 130 is in the shape of a frustum, so that the width of the nozzle head 130 gradually decreases in the direction from the installation end face 133 to the adsorption end face 132, and the positioning accuracy for the chip is higher.

[0038] Furthermore, the edge air groove 135 is annular and surrounds the communicating air groove 134. Specifically, the edge air groove 135 is in the shape of a rectangular ring and is distributed along the edge of the adsorption end face 132, and the communicating air groove 134 can also be rectangular, so as to be able to target the central area of the chip. In other preferred embodiments of the present utility model, the edge air groove 135 can also adopt an intermittent dot-shaped opening structure, which can generally realize the edge adsorption of the chip.

[0039] In this embodiment, an air hole column 112 is provided on the top side of the nozzle base 110. An external air groove 111 is formed in the air hole column 112. The nozzle head 130 is detachably installed on the air hole column 112, and the installation end face 133 is attached to the nozzle base 110 around the air hole column 112. Specifically, the air hole column 112 is integrally provided on the top side surface of the nozzle base 110 and protrudes upward. An external air groove 111 is formed in the middle of the air hole column 112, and the nozzle head 130 can be installed and fixed on the air hole column 112.

[0040] In this embodiment, the air hole column 112 is rectangular and the external air groove 111 is circular. Of course, in other preferred embodiments of the present utility model, the air hole column 112 can also be circular, and the external air groove 111 can also be rectangular. The specific shapes of the air hole column 112 and the external air groove 111 are not specifically limited here.

[0041] In this embodiment, an assembly groove 136 communicating with the air cavity groove 131 is further provided on the installation end face 133. The assembly groove 136 is adapted to the air hole column 112. Specifically, the shape of the assembly groove 136 is adapted to the outer contour shape of the air hole column 112, so that the assembly groove 136 can just fit over the air hole column 112 and is fixed by an interference fit method, and it is ensured that the installation end face 133 is closely attached to the surface of the nozzle base 110 to reduce air leakage.

[0042] In this embodiment, the depth of the assembly groove 136 is greater than or equal to the height of the air hole column 112 relative to the nozzle base 110, so that the distance between the end face of the air hole column 112 and the nozzle base 110 is less than or equal to the distance between the air cavity groove 131 and the nozzle base 110. Among them, the internal splicing height of the air hole column 112 is lower than the height where the air cavity groove 131 is located, so as to avoid the air hole column 112 affecting the volume of the air cavity groove 131.

[0043] In other preferred embodiments, the nozzle base 110 and the nozzle head 130 can also be fixed by a magnetic attraction structure. Specifically, at least part of the area of the nozzle base 110 is provided with a first magnetic attraction member 113, and the mounting end face 133 is provided with a second magnetic attraction member 137. The first magnetic attraction member 113 and the second magnetic attraction member 137 attract each other, so that the mounting end face 133 fits on the nozzle base 110. Among them, both the first magnetic attraction member 113 and the second magnetic attraction member 137 are magnet structures.

[0044] To sum up, the nozzle structure 100 provided by the embodiment of the present utility model detachably mounts the nozzle head 130 on the nozzle base 110, and connects the external air groove 111 of the nozzle base 110 to an external pipeline. The air cavity groove 131 in the nozzle head 130 is connected to the external air groove 111, and the mounting end face 133 of the nozzle head 130 fits on the nozzle base 110. A communication air groove 134 is provided at the center of the nozzle end face, which can correspondingly adsorb the middle part of the chip, and an edge air groove 135 is provided at the edge of the adsorption end face 132, which can correspondingly adsorb the edge of the chip. Both the edge air groove 135 and the communication air groove 134 are connected to the air cavity groove 131. Compared with the prior art, by adding the air cavity groove 131, the present utility model can be used as a gas storage space, thereby improving the adsorption air pressure of the edge air groove 135 and the communication air groove 134, and further improving the adsorption force to ensure the adsorption effect. At the same time, by adopting the double air groove structure of the edge air groove 135 and the communication air groove 134, the edge adsorption force can be improved, and the edge air groove 135 can also suck silicon residues, improving the chip mounting and separation efficiency while ensuring the adsorption effect.

[0045] Second Embodiment

[0046] This embodiment provides a chip adsorption device, including a machine table, a mounting head and a nozzle structure 100. The basic structure, principle, technical effects generated by the nozzle structure 100 are the same as those of the first embodiment. For a brief description, for the parts not mentioned in this embodiment, reference can be made to the corresponding content in the first embodiment.

[0047] The chip adsorption device provided in this embodiment includes a machine table, a mounting head, and a nozzle structure 100. The nozzle structure 100 includes a nozzle base 110 and a nozzle head 130. The nozzle head 130 is detachably mounted on the nozzle base 110. The nozzle base 110 has an external air groove 111. An air cavity groove 131 is provided in the nozzle head 130. The air cavity groove 131 communicates with the external air groove 111. The nozzle head 130 has an opposite adsorption end face 132 and a mounting end face 133. The mounting end face 133 is correspondingly attached to the nozzle base 110. A communication air groove 134 is provided at the center of the adsorption end face 132 for correspondingly adsorbing the middle part of the chip. An edge air groove 135 is provided at the edge of the adsorption end face 132 for correspondingly adsorbing the edge of the chip. Both the communication air groove 134 and the edge air groove 135 communicate with the air cavity groove 131. The mounting head is arranged on the machine table. The nozzle base 110 is arranged on the mounting head. And a vacuum pipe communicating with the external air groove 111 is provided on the mounting head.

[0048] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A nozzle structure, characterized in that: It includes a nozzle base and a nozzle head, the nozzle head is detachably mounted on the nozzle base, the nozzle base has an external air groove, the nozzle head is provided with an air cavity groove, the air cavity groove is connected to the external air groove, and the nozzle head has a relative adsorption end face and a mounting end face, the mounting end face corresponds to and fits the nozzle base, a connecting air groove is provided at the center of the adsorption end face for corresponding to the middle of the adsorption chip, an edge air groove is provided at the edge of the adsorption end face for corresponding to the edge of the adsorption chip, and the connecting air groove and the edge air groove are both connected to the air cavity groove.

2. The nozzle structure according to claim 1, characterized in that: The size of the installation end surface is larger than the size of the adsorption end surface.

3. The nozzle structure according to claim 2, characterized in that: The nozzle head is in the shape of a polygonal frustum.

4. The nozzle structure according to claim 2, characterized in that: The edge air groove is annular and is arranged around the communicating air groove.

5. The nozzle structure according to claim 1, characterized in that: An air hole column is arranged on the top side of the nozzle base, the external air groove is formed in the air hole column, the nozzle head is detachably mounted on the air hole column, and the mounting end surface is attached to the nozzle base around the air hole column.

6. The nozzle structure according to claim 5, characterized in that: The pore column is rectangular, and the external air groove is circular.

7. The nozzle structure according to claim 5, characterized in that: The mounting end surface is also provided with an assembly groove communicated with the air cavity groove, and the assembly groove is adapted to the air hole column.

8. The nozzle structure according to claim 7, characterized in that: The depth of the assembly groove is greater than or equal to the height of the pore column relative to the nozzle base, so that the distance between the end surface of the pore column and the nozzle base is less than or equal to the distance between the air cavity groove and the nozzle base.

9. The nozzle structure according to claim 5, characterized in that: A first magnetic component is disposed on at least a partial area of ​​the nozzle base, and a second magnetic component is disposed on the mounting end surface. The first magnetic component and the second magnetic component are attracted to each other so that the mounting end surface is attached to the nozzle base.

10. A chip adsorption device, characterized in that: It comprises a machine platform, a mounting head and a nozzle structure as described in any one of claims 1 to 9, wherein the mounting head is arranged on the machine platform, the nozzle base is arranged on the mounting head, and a vacuum air pipe connected to the external air groove is arranged on the mounting head.

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