Flip chip packaging die bonder
By designing a crystal-covered crystal-packaged crystal-encapsulated crystal-solid machine with a motor-driven swing rod and a rotating rod, the problem of chip tilting and low crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-solid crystal-s
Patent Information
- Application Number
- CN202421956579.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-13
- Publication Date
- 2025-05-30
- Estimated Expiration
- 2034-08-13
AI Technical Summary
During the working process of existing crystal-covered crystal-packaging solid crystal machines, the solid crystal suction nozzle needs to be moved from one side to the other, and moves on the arc path, resulting in a possible inclination after the chip is installed and the solid crystal efficiency is low.
A crystal-covered crystal-packaged crystal-fixing machine is designed, using a motor to drive the swing rod to drive the rotating rod and the swing arm to swing reciprocate, and the integrated plate and multiple solid crystal-fixing nozzles are driven to move back and forth between the material disk and the substrate through the connecting seat to ensure that the chip always maintains a straight state during the crystal-fixing process.
It effectively improves the crystal solidification efficiency, ensures that the chip remains upright during the crystal solidification process, avoids the problem of tilting after the chip is installed, and is convenient to disassemble and assemble, and has high flexibility in use.
Smart Images
Figure CN222927464U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor packaging equipment, in particular to a flip chip packaging die bonding machine. Background Art
[0002] Semiconductor packaging refers to the process of packaging and protecting semiconductor chips manufactured through a series of processes so that they can work properly in various electronic devices and provide functions such as electrical connection, heat dissipation, mechanical support and environmental protection. The die bonder is mainly used to accurately fix the chip (usually a semiconductor chip) on the substrate (such as a printed circuit board, lead frame, etc.).
[0003] At present, during the operation of a flip chip packaging die bonding machine, the chip is fixed on the substrate mainly by a swing arm, and the die bonding nozzle in the existing die bonding machine needs to move from one side to the other side when adsorbing and fixing the chip, and moves on an arc path during the process. In order to avoid the chip from tilting after installation, often only one die bonding nozzle is provided for operation, resulting in a problem of low die bonding efficiency. Therefore, to address the above problems, we propose a new flip chip packaging die bonding machine. Utility Model Content
[0004] The purpose of the utility model is to solve the problem in the prior art that, during the operation of a flip-chip packaging die bonding machine, the chip is mainly fixed on the substrate by a swing arm, and the die bonding nozzle in the existing die bonding machine needs to move from one side to the other side when adsorbing and fixing the chip, and moves on an arc path during the process. In order to avoid tilting of the chip after installation, often only one die bonding nozzle is provided for work, resulting in low die bonding efficiency. The flip-chip packaging die bonding machine is proposed.
[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a flip chip packaging die bonding machine, including a die bonding machine main body, a die bonding machine drive box is matched with a front surface of the die bonding machine main body near the top position, a motor is installed at the bottom of the die bonding machine drive box near the center, the motor output end rotates through the bottom of the die bonding machine drive box and extends to the top, the motor output end is fixedly connected with a swing rod, the top of the swing rod is located at a position away from the motor output end and is rotatably connected with a rotating rod, the inner bottom of the die bonding machine drive box is fixedly connected with a first rotating shaft and a second rotating shaft near the rear side, the outer surfaces of the first rotating shaft and the second rotating shaft are rotatably connected with a first swing arm and a second swing arm respectively, the bottom of the first swing arm and the second swing arm are rotatably connected with a connecting shaft near the front end, and a connecting seat is fixedly connected between the bottoms of the two connecting shafts.
[0006] Preferably, a waist-shaped groove is provided on the outer surface of the first swing arm, and the outer surface of the rotating rod and the inner surface wall of the waist-shaped groove are slidably fitted.
[0007] Preferably, the first rotating shaft and the second rotating shaft are located on the same straight line, the first swing arm and the second swing arm are arranged in parallel, and the straight line formed by the first rotating shaft and the second rotating shaft is arranged in parallel with the connecting seat.
[0008] Preferably, an integrated board is provided at the bottom of the connecting seat, and a plurality of die bonding nozzles are provided in a matching manner at the bottom of the integrated board.
[0009] Preferably, a positioning hole is provided at the center of the top of the connecting seat, a lead screw is fixedly connected to the center of the top of the integrated board, and buckles are symmetrically and fixedly connected to the top of the integrated board near the front and rear side edges, and the buckles are snap-connected to the connecting seat.
[0010] Preferably, the outer surface of the lead screw is slidably fitted with the inner wall of the positioning hole, and a fixing nut is threadedly connected to the position of the outer surface of the lead screw above the connecting seat.
[0011] Preferably, a support plate is installed at the position near the front side of the inner bottom of the die bonding machine drive box, and a plurality of balls are movably connected in a row on the top of the support plate, and the outer surfaces of the balls are in contact with the bottoms of the first swing arm and the second swing arm.
[0012] Compared with the prior art, the advantages and positive effects of the present utility model are as follows:
[0013] 1. In the present utility model, when the rotating rod at the top of the swing rod rotates after the motor is started, it cooperates with the waist-shaped groove to pull the first swing arm to swing reciprocally. The first swing arm, the second swing arm and the connecting seat form a parallelogram. Therefore, when the connecting seat drives the die bonding nozzles below the integrated board to reciprocate between the tray and the substrate, it will not tilt. When a plurality of die bonding nozzles are installed at the bottom of the connecting seat through the integrated board for work, the die bonding operation of the chips can be carried out in batches, and it is ensured that the chips always remain upright, effectively improving the die bonding efficiency.
[0014] 2. In the present utility model, according to different usage requirements, different numbers of die bonding nozzles can be replaced. When removing, rotate the fixing nut and remove it from the outside of the lead screw, then swing the buckle to disconnect it from the connecting seat, and then the integrated board and the die bonding nozzles can be removed downward. When installing, press the integrated board upward so that the buckle is snap-connected to the connecting seat, and then fix the lead screw passing through the positioning hole with the fixing nut. The disassembly and assembly are convenient, the use flexibility is relatively high, and it is convenient for later maintenance and replacement. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 is a perspective view of the flip-chip packaging die bonder proposed by the present utility model;
[0016] Figure 2 is an exploded view of a partial structure of the flip-chip packaging die bonder proposed by the present utility model;
[0017] Figure 3 Schematic diagram of the first swing arm structure of the flip-chip packaging die bonder proposed by the present utility model;
[0018] Figure 4 Schematic diagram of the connecting seat structure of the flip-chip packaging die bonder proposed by the present utility model.
[0019] Legend: 1. Main body of the die bonder; 11. Driving box of the die bonder; 2. Motor; 21. Swing rod; 22. Rotating rod; 3. First rotating shaft; 31. Second rotating shaft; 32. First swing arm; 33. Oval slot; 34. Second swing arm; 4. Connecting shaft; 41. Connecting seat; 42. Positioning hole; 5. Integrated board; 51. Die bonding nozzle; 6. Snap; 61. Lead screw; 62. Fixed nut; 7. Support plate; 71. Ball. Detailed implementation manners
[0020] In order to more clearly understand the above-mentioned objects, features and advantages of the present utility model, the following further describes the present utility model with reference to the drawings and embodiments. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments may be combined with each other.
[0021] In the following description, many specific details are set forth to fully understand the present utility model. However, the present utility model may be implemented in other ways different from those described herein. Therefore, the present utility model is not limited by the specific embodiments disclosed in the following specification.
[0022] Embodiment 1: As Figures 1-4As shown in the figure, the present utility model provides a flip-chip packaging die bonder, which includes a die bonder main body 1. A die bonder drive box 11 is provided at a position near the top of the front surface of the die bonder main body 1. A motor 2 is installed near the center of the bottom of the die bonder drive box 11. The output end of the motor 2 rotates through the bottom of the die bonder drive box 11 and extends upward. The output end of the motor 2 is fixedly connected to a swing rod 21. The top of the swing rod 21 is rotatably connected to a rotating rod 22 at a position away from the output end of the motor 2. A first rotating shaft 3 and a second rotating shaft 31 are fixedly connected to the inner bottom of the die bonder drive box 11 near the rear side. The outer surfaces of the first rotating shaft 3 and the second rotating shaft 31 are respectively rotatably connected to a first swing arm 32 and a second swing arm 34. The bottoms of the first swing arm 32 and the second swing arm 34 near the front end are rotatably connected to a connecting shaft 4. A connecting seat 41 is fixedly connected between the bottoms of the two connecting shafts 4. An oval slot 33 is formed on the outer surface of the first swing arm 32. The outer surface of the rotating rod 22 and the inner wall of the oval slot 33 are in sliding fit. The first rotating shaft 3 and the second rotating shaft 31 are on the same straight line. The first swing arm 32 and the second swing arm 34 are arranged in parallel. The straight line formed by the first rotating shaft 3 and the second rotating shaft 31 is parallel to the connecting seat 41. An integrated board 5 is provided at the bottom of the connecting seat 41. A plurality of die bonding nozzles 51 are provided at the bottom of the integrated board 5 in a matching manner.
[0023] The effect achieved by the entire embodiment 1 is that the die bonder main body 1 and the die bonder drive box 11 form a die bonder body, and its model is ASM-AD898. During operation, the die bonding nozzles 51 below are mainly used for vacuum adsorption to adsorb the chips on the tray and then fix them on the substrate by means of glue bonding to complete the die bonding operation in flip-chip packaging. The principle is a mature existing technology and will not be elaborated here. During the die bonding process, when the die bonding nozzles 51 pick up and bond the chips, the motor 2 is started to drive the swing rod 21 to rotate continuously. When the swing rod 21 rotates, the rotating rod 22 at its top will drive the first swing arm 32 to swing continuously around the first rotating shaft 3 in cooperation with the oval slot 33. During the swinging process of the first swing arm 32, the connecting shaft 4 at the bottom of its front end will drive another connecting shaft 4 to move through the connecting seat 41. Since the other connecting shaft 4 is rotatably connected to the second swing arm 34, the second swing arm 34 will swing around the second rotating shaft 31. Moreover, the first rotating shaft 3, the second rotating shaft 31 and the two connecting shafts 4 form a parallelogram. Therefore, the connecting seat 41 will not rotate or tilt during the movement process. When the plurality of die bonding nozzles 51 are installed at the bottom of the connecting seat 41 through the integrated board 5 to work, the die bonding operation of the chips can be carried out batch by batch, and it is ensured that the chips always remain upright, effectively improving the die bonding efficiency.
[0024] Embodiment 2: As Figures 1-4As shown, a positioning hole 42 is provided at the center of the top of the connecting seat 41. A lead screw 61 is fixedly connected to the center of the top of the integrated board 5. Clasps 6 are symmetrically and fixedly connected to the top of the integrated board 5 near the front and rear side edges. The clasps 6 are snap-connected to the connecting seat 41. The outer surface of the lead screw 61 is slidably fitted with the inner wall of the positioning hole 42. A fixing nut 62 is threadedly connected to the outer surface of the lead screw 61 above the connecting seat 41. A support plate 7 is installed at the position near the front side of the inner bottom of the die bonding machine drive box 11. A plurality of balls 71 are movably connected in an array on the top of the support plate 7. The outer surfaces of the balls 71 are in contact with the bottoms of the first swing arm 32 and the second swing arm 34.
[0025] The overall effect achieved by the entire Embodiment 2 is that, according to different usage requirements, different numbers of die bonding nozzles 51 can be replaced and installed. When removing, rotate the fixing nut 62 and then remove it from the outside of the lead screw 61. Swing the clasp 6 to disconnect it from the connecting seat 41, and then the integrated board 5 and the die bonding nozzles 51 can be removed downward. When installing, press the integrated board 5 upward so that the clasp 6 is snap-connected to the connecting seat 41, and then fix the lead screw 61 passing through the positioning hole 42 with the fixing nut 62. The disassembly and assembly are convenient, the usage flexibility is relatively high, and it is also convenient for later maintenance and replacement. The support plate 7 is mainly used to support the first swing arm 32 and the second swing arm 34, so that they can be more stable during the movement process. The balls 71 on the support plate 7 play the role of converting the sliding friction between the first swing arm 32 and the second swing arm 34 and the support plate 7 into rolling friction, reducing the friction damage and friction resistance.
[0026] Working principle: During the die bonding process, when the die bonding nozzle 51 picks up and bonds the die, the motor 2 is started to drive the swing rod 21 to rotate continuously. When the swing rod 21 rotates, the rotating rod 22 at its top will pull the first swing arm 32 to swing continuously around the first rotating shaft 3 under the cooperation of the oval slot 33. During the swinging process of the first swing arm 32, the connecting shaft 4 at the bottom of its front end will drive another connecting shaft 4 to move through the connecting seat 41. Since the other connecting shaft 4 is rotationally connected to the second swing arm 34, the second swing arm 34 will swing around the second rotating shaft 31. Moreover, the first rotating shaft 3, the second rotating shaft 31, and the two connecting shafts 4 form a parallelogram. Therefore, the connecting seat 41 will not rotate and tilt during the movement. When multiple die bonding nozzles 51 work by being installed at the bottom of the connecting seat 41 through the integrated board 5, the die bonding operation of the chips can be carried out in batches, and it is ensured that the chips always remain in an upright state, effectively improving the die bonding efficiency. According to different usage requirements, die bonding nozzles 51 with different numbers can be replaced. When removing, after rotating the fixing nut 62 and removing it from the outside of the lead screw 61, swing the buckle 6 to disconnect it from the connecting seat 41, and then the integrated board 5 and the die bonding nozzles 51 can be removed downward. When installing, press the integrated board 5 upward so that the buckle 6 engages with the connecting seat 41, and then fix the lead screw 61 passing through the positioning hole 42 with the fixing nut 62. The disassembly and assembly are convenient, the flexibility of use is relatively high, and it is convenient for later maintenance and replacement.
[0027] The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention in other forms. Any person skilled in the art may use the disclosed technical content to make changes or modifications into equivalent embodiments with equivalent changes and apply them to other fields. However, as long as it does not depart from the technical content of the technical solution of the present invention, any simple modification, equivalent change, and modification made to the above embodiments based on the technical essence of the present invention still fall within the protection scope of the technical solution of the present invention.
Claims
1. A flip chip packaging die bonding machine, comprising a die bonding machine host (1), characterized in that: A crystal bonding machine drive box (11) is provided at a position near the top of the front surface of the crystal bonding machine main body (1), and a motor (2) is installed at a position near the center of the bottom of the crystal bonding machine drive box (11). The output end of the motor (2) rotates through the bottom of the crystal bonding machine drive box (11) and extends to the top. The output end of the motor (2) is fixedly connected to a swing rod (21), and the top of the swing rod (21) is located at a position away from the output end of the motor (2) and is rotatably connected to a rotating rod (22). The inner bottom of the crystal bonding machine drive box (11) is fixedly connected to a first rotating shaft (3) and a second rotating shaft (31) near the rear side, and the outer surfaces of the first rotating shaft (3) and the second rotating shaft (31) are respectively rotatably connected to a first swing arm (32) and a second swing arm (34), and the bottoms of the first swing arm (32) and the second swing arm (34) are both rotatably connected to a connecting shaft (4) near the front end, and a connecting seat (41) is fixedly connected between the bottoms of the two connecting shafts (4).
2. The flip chip packaging die bonding machine according to claim 1, characterized in that: The outer surface of the first swing arm (32) is provided with a waist-shaped groove (33), and the outer surface of the rotating rod (22) and the inner surface wall of the waist-shaped groove (33) are slidably fitted.
3. The flip chip packaging die bonding machine according to claim 2, characterized in that: The first rotating shaft (3) and the second rotating shaft (31) are located on the same straight line, the first swing arm (32) and the second swing arm (34) are arranged in parallel, and the straight line formed by the first rotating shaft (3) and the second rotating shaft (31) and the connecting seat (41) are arranged in parallel.
4. The flip chip packaging die bonding machine according to claim 3, characterized in that: An integrated board (5) is arranged at the bottom of the connection seat (41), and a plurality of crystal bonding nozzles (51) are matched and arranged at the bottom of the integrated board (5).
5. The flip chip packaging die bonding machine according to claim 4, characterized in that: A positioning hole (42) is provided at the center of the top of the connecting seat (41); a screw rod (61) is fixedly connected to the center of the top of the integrated board (5); buckles (6) are symmetrically fixedly connected to the top of the integrated board (5) near the front and rear side edges; the buckles (6) are snap-fitted and connected to the connecting seat (41).
6. The flip chip packaging die bonding machine according to claim 5, characterized in that: The outer surface of the screw rod (61) is slidably fitted with the inner wall of the positioning hole (42), and a fixing nut (62) is threadedly connected to the outer surface of the screw rod (61) at a position above the connecting seat (41).
7. The flip chip packaging die bonding machine according to claim 6, characterized in that: A support plate (7) is installed at a position near the front side of the inner bottom of the crystal bonding machine driving box (11), and a plurality of balls (71) are arranged and movably connected on the top of the support plate (7), and the outer surfaces of the balls (71) are in contact with the bottoms of the first swing arm (32) and the second swing arm (34).