Power device heat dissipation structure for electric heater

Abstract

The utility model relates to the field of electric heaters, in particular to a power device heat dissipation structure for an electric heater. The power device heat dissipation structure for the electric heater comprises a boss. A component assembly is arranged at the top of the boss, and a circuit board is mounted at the top of the component assembly; wherein the bottom of the boss is connected with a radiator; the component assembly comprises a frame, a mounting groove is formed in the bottom of the frame, and a plurality of power devices are arranged below the frame. According to the power device heat dissipation structure for the electric heater, the power device and the insulating heat conduction pad are directly fixed together through the design of the frame to form a component assembly, the welding length of the pins is reserved, welding with other parts is easy, meanwhile, the assembly process of the power device heat dissipation structure is simplified, and the production cost is reduced. Efficient heat conduction and mechanical stability are achieved, and the problems that in the prior art, installation is complex, heat dissipation is poor, and electrical connection is not reliable are solved.

Description

Technical Field

[0001] The utility model relates to the field of electric heaters, in particular to a heat dissipation structure for power devices of an electric heater. Background Art

[0002] A printed circuit board, also known as a printed wiring board, is often abbreviated as PCB in English. The whole process of a PCB blank board going through SMT component mounting and then DIP plug-in is called PCBA for the assembled component. IGBT, an insulated gate bipolar transistor, is a composite fully controlled voltage-driven power semiconductor device composed of a BJT (bipolar junction transistor) and a MOS (insulated gate field effect transistor), combining the advantages of high input impedance of MOSFET and low on-state voltage drop of GTR. GTR has a low saturation voltage drop and a large current density, but requires a large drive current; MOSFET has a very small drive power and a fast switching speed, but has a large on-state voltage drop and a small current density. IGBT combines the advantages of the above two devices, with a small drive power and a low saturation voltage drop. An IGBT module is a modular semiconductor product formed by bridging and packaging an IGBT (insulated gate bipolar transistor chip) and an FWD (diode chip) through a specific circuit; the packaged IGBT module is directly applied to devices such as inverters and UPS uninterruptible power supplies. The insulating heat-conducting pad is a component that transfers the heat generated by the IGBT to the heat dissipation component. It has excellent insulation properties, and has a certain flexibility and compressibility. It can fill the gap between the IGBT and the heat dissipation component, complete the heat transfer between the heat-generating part and the heat-dissipating part, and can be arbitrarily cut according to the actual use environment to meet the use of products of different sizes. The IGBT frame is a support structure for installing and fixing the IGBT. The radiator is a heat dissipation structure of the electric heater, used to transfer the heat generated by the heating element to the fluid medium to achieve the heating function.

[0003] In traditional electric heaters, as a key power control component, the connection of the IGBT to the load electrode often requires a complex wiring and fixing structure, which not only increases the assembly difficulty, but also may cause problems such as overheating and short circuit due to loose contacts, affecting the safety and lifespan of the equipment.

[0004] Therefore, it is necessary to provide a new heat dissipation structure for power devices of an electric heater to solve the above technical problems. Summary of the Utility Model

[0005] To overcome the defects of the prior art, a heat dissipation structure for power devices of an electric heater is provided to solve the above problems.

[0006] The heat dissipation structure for power devices of an electric heater provided by the present utility model includes: a boss; a component assembly is arranged at the top of the boss, and a circuit board is installed at the top of the component assembly; wherein, a radiator is connected to the bottom of the boss; the component assembly includes a frame, and an installation groove is formed at the bottom of the frame, and a plurality of power devices are arranged below the frame, and each power device is installed in the installation groove.

[0007] Preferably, the component assembly further includes an insulating heat-conducting pad, and the insulating heat-conducting pad is located below the frame, and the top of the insulating heat-conducting pad is bonded to the bottom of each power device.

[0008] Preferably, a plurality of pins are connected to one side of each power device, a plurality of holes for the pins to pass through are formed in the frame, and each pin respectively passes through the holes and is connected to the circuit board.

[0009] Preferably, connection ears are connected to both sides of the frame, and fixing holes are formed in the connection ears, screws are arranged in both fixing holes, and nut posts are arranged below the two screws at the top of the radiator, and the screws are threadedly connected to the nut posts through the connection ears.

[0010] Preferably, reinforcing ribs are installed on both sides of the frame, and the reinforcing ribs are located at the bottom of the connection ears.

[0011] Preferably, the four corners of the boss are all rounded off.

[0012] Compared with the related art, the heat dissipation structure for power devices of an electric heater provided by the present utility model has the following beneficial effects:

[0013] By designing the frame, the present utility model directly fixes the power device and the insulating heat-conducting pad together to form a component assembly, and reserves the welding length of the pins, which is easy to be welded with other components. At the same time, the assembly process with the heat dissipation structure is simplified, high-efficiency heat conduction and mechanical stability are realized, and the problems of complex installation, poor heat dissipation and unreliable electrical connection in the prior art are solved. Description of the Drawings

[0014] Figure 1 It is a schematic structural diagram of a preferred embodiment of the heat dissipation structure for power devices of an electric heater provided by the present utility model;

[0015] Figure 2 For Figure 1 The schematic structural diagram of the component assembly shown;

[0016] Figure 3 For Figure 1 The schematic structural diagram of the power device shown.

[0017] Reference numerals in the figure: 1, frame; 2, power device; 3, insulating and heat-conducting pad; 4, radiator; 5, screw; 6, circuit board; 7, reinforcing rib; 8, pin; 9, component assembly; 10, boss. Detailed implementation mode

[0018] In order to make the purpose, technical solution and advantages of the present utility model clearer, the following further details the present utility model in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0019] The following describes the specific implementation of the present utility model in detail in conjunction with specific embodiments.

[0020] Please refer to Figures 1 to 3 , a heat dissipation structure for a power device of an electric heater provided by an embodiment of the present utility model, the heat dissipation structure for a power device of an electric heater includes: a boss 10; a component assembly 9 is arranged at the top of the boss 10, and a circuit board 6 is installed at the top of the component assembly 9; wherein, a radiator 4 is connected to the bottom of the boss 10; the component assembly 9 includes a frame 1, and an installation groove is opened at the bottom of the frame 1, a plurality of power devices 2 are arranged below the frame 1, and each power device 2 is installed in the installation groove. The component assembly 9 further includes an insulating and heat-conducting pad 3, and the insulating and heat-conducting pad 3 is located below the frame 1, and the top of the insulating and heat-conducting pad 3 is adhesively bonded to the bottom of each power device 2. A plurality of pins 8 are connected to one side of each power device 2, a plurality of holes for the pins 8 to pass through are opened on the frame 1, and each pin 8 respectively passes through the holes and is connected to the circuit board 6.

[0021] It should be noted that: the frame 1 is an IGBT frame, the power device 2 is an IGBT power device, the pin 8 is an IGBT pin, and the component assembly 9 is an IGBT component assembly. The insulating and heat-conducting pad 3 not only helps the power device 2 to transfer heat while maintaining electrical insulation, but also protects the power device 2 from external environmental factors that may cause short circuits. The radiator 4 is responsible for dissipating the received heat to a wider environment, so as to keep the working temperature of the power device 2 within a safe range. The circuit board 6 is installed on the top of the component assembly 9, and has a certain physical isolation from the high-temperature area of the power device, which helps to reduce the thermal influence of the heat source on the circuit board and the components thereon, and ensures the stable operation of the electronic components. The frame 1 is provided with holes, and the positions of the holes are consistent with those of the pins 8. The pins 8 are provided with U-shaped bending parts, and the bending angle is 90°. The pins 8 vertically pass through the holes on the frame 1. After the power device 2 and the frame 1 are installed, the pins 8 are 2.5-3 mm higher than the holes, and are welded to the circuit board 6 through the protruding part.

[0022] In an embodiment of the present utility model, please refer to Figure 1 andFigure 2 , connecting ears are connected to both sides of the frame 1, and fixing holes are provided on the connecting ears. Screws 5 are arranged in both fixing holes. Nut columns are arranged below the two screws 5 at the top of the radiator 4. The screws 5 are threadedly connected to the nut columns through the connecting ears.

[0023] It should be noted that: the connecting ear, as a key component for connecting the frame 1 and the radiator 4, not only fixes the frame 1 but also provides a stable structure to withstand external forces and vibrations. The fixing hole is designed on the connecting ear to accommodate the screw 5, making the installation and disassembly of the frame 1 simple. During maintenance, only the screw needs to be tightened or loosened. The nut column is located at the top of the radiator 4 and is threadedly matched with the screw 5 to fix the radiator 4. It ensures that the screw 5 can firmly press the frame 1 on the radiator 4, improving the heat dissipation efficiency through a sufficient contact area.

[0024] In the embodiment of the present utility model, please refer to Figure 1 and Figure 3 , reinforcing ribs 7 are installed on both sides of the frame 1, and the reinforcing ribs 7 are located at the bottom of the connecting ears.

[0025] It should be noted that: the setting of the reinforcing ribs 7 is mainly used to enhance the rigidity and strength of the frame 1 to resist deformation caused by the loading process or mechanical vibration. It can effectively extend the service life of the frame 1 and the entire structure. The reinforcing ribs 7 are located at the bottom of the connecting ears, optimizing the force distribution, making the stress received by the connecting ears more uniform, reducing possible stress concentration points, and thus avoiding premature damage or fatigue of the connecting ears. The setting of the reinforcing ribs 7 is beneficial to improving the durability of the entire frame 1 structure, reducing wear caused by long-term use, especially in application scenarios where the frame 1 is frequently installed and disassembled.

[0026] In the embodiment of the present utility model, please refer to Figure 1 and Figure 3 , the four corners of the boss 10 are all chamfered.

[0027] It should be noted that: removing sharp edges can significantly reduce the risk of harm to operators during the assembly and use processes. The smooth edges reduce the possibility of cuts or scratches.

[0028] The working principle of the heat dissipation structure for the power device used in the electric heater provided by the present utility model is as follows: First, bend the pins 8 on the power device 2 at 90°, then press and fit them into the installation slots of the frame 1. Then, attach the insulating heat-conducting pad 3 to the installation slots under the frame 1. Thus, the assembly unit 9 is assembled. The pins 8 are located in the reserved holes. After completing the soldering with the circuit board 6, install the assembly unit 9 at the position corresponding to the top bosses 10 of the radiator 4. The bosses 10 are pressed into the installation slots of the frame 1, and use screws 5 to fasten the connecting ears at both ends of the assembly unit 9 to the nut posts on the radiator 4, so that the assembly unit 9 is completely fastened to the radiator 4, and the insulating heat-conducting pad 3 is closely attached to the radiator 4.

[0029] The circuits and controls involved in the present utility model are all prior arts and will not be elaborated here too much.

[0030] The above are only the embodiments of the present utility model, and do not limit the patent scope of the present utility model accordingly. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present utility model, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present utility model.

Claims

1. A power device heat dissipation structure for an electric heater, characterized in that: include: Boss (10); A component assembly (9) is arranged on the top of the boss (10), and a circuit board (6) is installed on the top of the component assembly (9); Wherein, a heat sink (4) is connected to the bottom of the boss (10); The component assembly (9) comprises a frame (1), and a mounting groove is provided at the bottom of the frame (1). A plurality of power devices (2) are arranged below the frame (1), and each of the power devices (2) is installed in the mounting groove.

2. The power device heat dissipation structure for an electric heater according to claim 1, characterized in that: The component assembly (9) further comprises an insulating thermally conductive pad (3), and the insulating thermally conductive pad (3) is located below the frame (1), and the top of the insulating thermally conductive pad (3) is bonded to the bottom of each power device (2).

3. The power device heat dissipation structure for an electric heater according to claim 2, characterized in that: One side of each power device (2) is connected to a plurality of pins (8); a plurality of holes for the pins (8) to pass through are provided on the frame (1); each pin (8) passes through a hole and is connected to a circuit board (6).

4. The power device heat dissipation structure for an electric heater according to claim 3, characterized in that: Both sides of the frame (1) are connected with connecting ears, and fixing holes are provided on the connecting ears. Screws (5) are provided in the two fixing holes. The top of the heat sink (4) is provided with nut columns below the two screws (5). The screws (5) are threadedly connected to the nut columns through the connecting ears.

5. The power device heat dissipation structure for an electric heater according to claim 4, characterized in that: Reinforcing ribs (7) are installed on both sides of the frame (1), and the reinforcing ribs (7) are located at the bottom of the connecting ears.

6. The power device heat dissipation structure for an electric heater according to claim 5, characterized in that: The four corners of the boss (10) are all rounded.

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