Jet heat dissipation type power module

Abstract

A jet heat dissipation type power module comprises a heat dissipation bottom plate, a heat dissipation water channel covering the heat dissipation bottom plate, and a plurality of chips welded on the heat dissipation bottom plate. The heat dissipation water channel comprises a body, at least two water inlets formed in the side, away from the heat dissipation bottom plate, of the body, at least two water outlets formed in the two opposite sides of the body and a plurality of nozzles arranged in the body. The side, facing the water inlet, of the body is at least provided with two water inlet cavities, and the side, facing the heat dissipation bottom plate, of the body is at least provided with two cooling cavities. According to the module, high-speed jet cooling liquid is sprayed to the heat dissipation bottom plate in all directions through the multiple nozzles, so that the heat dissipation capacity of the module is greatly improved, and the outflow capacity of the module is improved. According to the module, original aluminum wire bonding is replaced by copper clip bonding, so that the structure of the module is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of power modules, in particular to a power module with jet heat dissipation. Background Art

[0002] A power module is a functional combination of power electronic devices encapsulated into a module. With the rapid development of modern technology, the market demand for power modules is increasing rapidly. The heat dissipation effect of power modules will affect the use of the modules. Therefore, the heat dissipation problem of power modules has become a top priority. For example, Chinese Patent CN202210614207.2 discloses a power module assembly, a motor controller and a vehicle, which includes a chip layer. The chip layer includes a substrate and a first chip and a second chip disposed on the substrate; a first phase change heat exchanger and a second phase change heat exchanger. Phase change media are disposed in both the first phase change heat exchanger and the second phase change heat exchanger, and heat of the chip layer is absorbed through phase change. The first phase change heat exchanger exchanges heat with the first chip, and the second phase change heat exchanger exchanges heat with the second chip. The first phase change heat exchanger and the second phase change heat exchanger are insulated and connected to each other. This module can ensure a reliable insulation effect while maximizing the areas of the first phase change heat exchanger and the second phase change heat exchanger, and improve the reliability of the power module assembly. However, its heat dissipation effect can still be further improved. Summary of the Utility Model

[0003] In view of this, the utility model provides a power module with jet heat dissipation to solve the above problems.

[0004] A power module with jet heat dissipation includes a heat dissipation bottom plate, a heat dissipation water channel covering the heat dissipation bottom plate, and several chips welded on the heat dissipation bottom plate. The heat dissipation water channel includes a body, at least two water inlets opened on a side of the body away from the heat dissipation bottom plate, at least two water outlets opened on opposite sides of the body, and several nozzles disposed in the body. The body is respectively provided with at least two water inlet chambers on a side facing the side with the water inlets, and at least two cooling chambers on a side facing the heat dissipation bottom plate. The nozzle includes a water pipe, a spray head disposed at an end of the water pipe. The several water pipes are divided into three types, namely several first water pipes directly facing the water inlets, several second water pipes corresponding to the edges of the water inlets, and several third water pipes corresponding to the water inlet chambers. The end of the first water pipe away from the spray head abuts against the water inlet chamber. The end of the second water pipe away from the spray head is in a semi-circular tube shape, and its concave surface faces the center position of the water inlet. The end of the third water pipe away from the spray head is located in the water inlet chamber, and the length of the third water pipe is greater than the length of the first water pipe.

[0005] Further, a housing is provided on one side of the heat dissipation base plate away from the heat dissipation water channel.

[0006] Further, the housing is fixedly connected to the heat dissipation base plate through four fasteners disposed at the corners of the housing.

[0007] Further, a plurality of the nozzles are respectively fixedly provided between the water inlet chamber and the cooling chamber.

[0008] Further, the end of the spray head away from the water pipe is in a protruding arc shape, and a plurality of spray openings are formed thereon, and the spray openings are communicated with the water pipe.

[0009] Further, a plurality of the chips are bonded by copper clips.

[0010] Compared with the prior art, in the jet heat dissipation type power module provided by the present invention, a high-speed jet of coolant is sprayed onto the heat dissipation base plate through a plurality of the nozzles, so that the heat dissipation capacity of the module is greatly improved, and the outflow capacity of the module is improved. The module uses copper clip bonding to replace the original aluminum wire bonding, improves the structure of the module, and makes the layout more reasonable. Description of the Drawings

[0011] Figure 1 is a schematic structural diagram of a jet heat dissipation type power module provided by the present invention.

[0012] Figure 2 is Figure 1 a cross-sectional schematic diagram of the jet heat dissipation type power module.

[0013] Figure 3 is Figure 1 a schematic structural diagram of a nozzle of the jet heat dissipation type power module.

[0014] Figure 4 is Figure 1 a schematic diagram of a first water pipe of the jet heat dissipation type power module.

[0015] Figure 5 is Figure 1 a schematic diagram of a second water pipe of the jet heat dissipation type power module.

[0016] Figure 6 is Figure 1 a schematic diagram of a third water pipe of the jet heat dissipation type power module. Detailed Embodiments

[0017] The following further details the specific embodiments of the present utility model. It should be understood that the description of the embodiments of the present utility model herein does not limit the protection scope of the present utility model.

[0018] As Figure 1 shown, it is a schematic structural diagram of a spray-cooled power module provided by the present utility model. The spray-cooled power module includes a heat dissipation base plate 10, a heat dissipation water channel 20 covering the heat dissipation base plate 10, and several chips 30 welded on the heat dissipation base plate 10. It can be imagined that the spray-cooled power module also includes some other functional modules, such as electrical component modules, power supply modules, etc., which are well-known technologies to those skilled in the art and will not be elaborated here one by one.

[0019] Please refer to Figures 2 to 6 together. A housing 11 is provided on the side of the heat dissipation base plate 10 away from the heat dissipation water channel 20. The housing 11 is fixedly connected to the heat dissipation base plate 10 through four fasteners provided at the corners of the housing 11 to protect the chip 30 and facilitate subsequent potting and encapsulation operations on the chip 30.

[0020] The heat dissipation water channel 20 includes a body 21, at least two water inlets 22 opened on the side of the body 21 away from the heat dissipation base plate 10, at least two water outlets 23 opened on opposite sides of the body 21, and several nozzles 24 provided in the body 21.

[0021] An inlet chamber 25 is opened at one end of the water inlet 22 facing the heat dissipation base plate 10. The diameter of the inlet chamber 25 is larger than that of the water inlet 22. The inlet chamber 25 is used to store diffused coolant, thereby increasing the number of the nozzles 24 and improving the heat dissipation effect.

[0022] At least two cooling chambers 26 are opened on the side of the body 21 facing the heat dissipation base plate 10. The two cooling chambers 26 correspond to the two inlet chambers 25 respectively and are communicated with the two water outlets 23 respectively.

[0023] Several of the nozzles 24 are respectively fixedly provided between the inlet chamber 25 and the cooling chamber 26. The nozzle 24 includes a water pipe 27 and a spray head 28 provided at the end of the water pipe 27.

[0024] The water pipes 27 are divided into three types, namely, a plurality of first water pipes 271 facing the water inlet 22, a plurality of second water pipes 272 corresponding to the edge of the water inlet 22, and a plurality of third water pipes 273 corresponding to the water inlet chamber 25. The end of the first water pipe 271 away from the nozzle 28 abuts against the water inlet chamber 25, so that the coolant in the water inlet chamber 25 can directly enter the first water pipe 271 and be sprayed out from the nozzle 28. The end of the second water pipe 272 away from the nozzle 28 is in a semicircular tube shape, and its concave surface faces the center of the water inlet 22, so that the efficiency of the second water pipe 272 receiving the coolant is improved. The end of the third water pipe 273 away from the nozzle 28 is located in the water inlet chamber 25, and the length of the third water pipe 273 is greater than the length of the first water pipe 271. When the coolant hits the third water pipe 273, it can form a small kick flow with the third water pipe 273, thereby increasing the flow rate of the coolant and further improving the heat dissipation effect.

[0025] The end of the nozzle 28 away from the water pipe 27 is in a convex arc shape, and is provided with a plurality of nozzles 29, which are connected to the water pipe 27, thereby increasing the flow rate of the coolant, so that the coolant can be dispersedly sprayed onto the surface of the heat dissipation base plate 10 through the plurality of nozzles 29, thereby improving the heat dissipation effect.

[0026] Copper clip bonding is used between several chips 30 to replace the original aluminum wire bonding, which improves the structure of the module and makes the layout more reasonable. The chip 30 is soldered on the DBC substrate by solder reflow once, and then the module is soldered on the heat dissipation base plate 10 by reflow twice. The chip 30 and the reflow soldering operation should be prior art, and their working principles will not be described in detail here.

[0027] Compared with the prior art, the jet cooling power module provided by the utility model sprays high-speed jets of coolant onto the cooling base plate 10 through a plurality of the nozzles 24, thereby greatly improving the heat dissipation capacity of the module and the outflow capacity of the module. The module uses copper clip bonding to replace the original aluminum wire bonding, which improves the structure of the module and makes the layout more reasonable.

[0028] The above are only preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention. Any modification, equivalent substitution or improvement within the spirit of the present invention are included in the scope of the claims of the present invention.

Claims

1. A jet heat dissipation power module, characterized in that: The jet cooling power module includes a heat dissipation base plate, a heat dissipation channel covered on the heat dissipation base plate, and a plurality of chips welded on the heat dissipation base plate. The heat dissipation channel includes a body, at least two water inlets opened on a side of the body away from the heat dissipation base plate, at least two water outlets opened on two opposite sides of the body, and a plurality of nozzles arranged in the body. The body has at least two water inlet chambers respectively opened on a side with the water inlet, and at least two cooling chambers opened on a side of the body facing the heat dissipation base plate. The nozzles include a plurality of nozzles arranged in the body. The invention comprises a water pipe and a nozzle arranged at the end of the water pipe, wherein the water pipes are divided into three types, namely, a plurality of first water pipes facing the water inlet, a plurality of second water pipes corresponding to the edge of the water inlet, and a plurality of third water pipes corresponding to the water inlet chamber, wherein the end of the first water pipe away from the nozzle abuts against the water inlet chamber, the end of the second water pipe away from the nozzle is in a semicircular tube shape with a concave surface facing the center of the water inlet, the end of the third water pipe away from the nozzle is located in the water inlet chamber, and the length of the third water pipe is greater than that of the first water pipe.

2. The jet heat dissipation power module according to claim 1, characterized in that: A shell is arranged on a side of the heat dissipation bottom plate away from the heat dissipation water channel.

3. The jet heat dissipation power module according to claim 2, characterized in that: The shell is fixedly connected to the heat dissipation base plate through four fasteners arranged at the corners of the shell.

4. The jet heat dissipation power module according to claim 1, characterized in that: A plurality of the nozzles are respectively fixedly arranged between the water inlet chamber and the cooling chamber.

5. The jet heat dissipation power module according to claim 1, characterized in that: The end of the nozzle away from the water pipe is in a convex arc shape, and is provided with a plurality of nozzles which are communicated with the water pipe.

6. The jet heat dissipation power module according to claim 1, characterized in that: The chips are bonded with each other using copper clips.

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