Shell of controller and controller

Abstract

The utility model discloses a shell of a controller and the controller, and relates to the technical field of controllers, and the shell comprises a first shell, a second shell and a heat dissipation pipe; the first shell and the second shell are connected to define an inner cavity, and the inner cavity is used for accommodating a circuit board; the heat dissipation pipe is arranged on the inner wall of the first shell and used for being arranged opposite to the circuit board, heat dissipation fins are arranged on the outer wall of the first shell, and the heat dissipation fins are arranged opposite to the heat dissipation pipe. A raised fence structure is arranged on the inner wall of the first shell, the fence structure divides the inner wall of the first shell into a central heat dissipation area and a peripheral heat dissipation area, the peripheral heat dissipation area surrounds the central heat dissipation area, and the central heat dissipation area is used for being arranged opposite to a main control chip of a circuit board; and the distribution density of the radiating pipes in the central radiating area is greater than that of the radiating pipes in the peripheral radiating area. Due to the fact that the calorific value of the main control chip is large, the heat dissipation efficiency of the main control chip can be improved by adopting the distribution density of the heat dissipation pipes.

Description

Technical Field

[0001] The present application relates to the technical field of controllers, and particularly to a housing of a controller and a controller. Background Art

[0002] With the development of technology, controllers are widely used in fields such as automotive electronics, household appliances, and industrial equipment. Since heat is inevitably generated during the operation of the controller, heat needs to be conducted to the outside in a timely and rapid manner through a heat dissipation structure. Otherwise, the functions of the relevant electronic components of the controller will be affected, and even the relevant electronic components of the controller may be burned out, ultimately resulting in the controller being unable to work. Therefore, the heat dissipation performance of the controller is directly related to the service life of the controller.

[0003] In the related art, the controller is usually cooled by air. Since the heat generation of different components of the controller is different, for example, the heat generation of the main control chip of the controller is relatively large. When the above-mentioned air-cooled heat dissipation method is adopted, for components with relatively large heat generation, there will be a problem of low heat dissipation efficiency, which will in turn affect the reliability and durability of the controller. Summary of the Utility Model

[0004] The present application discloses a housing of a controller and a controller to solve the problem of low heat dissipation efficiency of the air-cooled heat dissipation in the related art for components with relatively large heat generation.

[0005] To solve the above technical problems, the present application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application discloses a housing of a controller. The controller includes a circuit board. The housing includes a first housing, a second housing, and a heat dissipation tube.

[0007] The first housing and the second housing are connected to enclose an inner cavity for accommodating the circuit board.

[0008] The heat dissipation tube is provided on the inner wall of the first housing and is used to be disposed opposite to the circuit board. Heat dissipation fins are provided on the outer wall of the first housing and are disposed opposite to the heat dissipation tube.

[0009] A raised fence structure is provided on the inner wall of the first housing. The fence structure divides the inner wall of the first housing into a central heat dissipation area and a peripheral heat dissipation area. The peripheral heat dissipation area surrounds the central heat dissipation area. The central heat dissipation area is used to be disposed opposite to the main control chip of the circuit board.

[0010] The distribution density of the heat dissipation tubes in the central heat dissipation area is greater than the distribution density of the heat dissipation tubes in the peripheral heat dissipation area.

[0011] In a second aspect, an embodiment of the present application discloses a controller. The disclosed controller includes a circuit board and the above-mentioned housing, and the circuit board is disposed in the inner cavity surrounded by the first housing and the second housing.

[0012] The technical solution adopted by the present application can achieve the following technical effects:

[0013] The housing of the controller disclosed in the embodiment of the present application improves the related art. The disclosed housing includes a first housing, a second housing and a heat dissipation pipe; the first housing is connected to the second housing to enclose an inner cavity for accommodating a circuit board; the heat dissipation pipe is disposed on the inner wall of the first housing and is used to be disposed opposite to the circuit board, and heat dissipation fins are provided on the outer wall of the first housing and are disposed opposite to the heat dissipation pipe; a raised fence structure is provided on the inner wall of the first housing, and the fence structure divides the inner wall of the first housing into a central heat dissipation area and a peripheral heat dissipation area. The peripheral heat dissipation area surrounds the central heat dissipation area, and the central heat dissipation area is used to be disposed opposite to the main control chip of the circuit board; the distribution density of the heat dissipation pipes in the central heat dissipation area is greater than that of the heat dissipation pipes in the peripheral heat dissipation area. In the above solution, the dual heat dissipation mode of the heat dissipation pipe and the heat dissipation fin replaces the heat dissipation fan in the related art. Since the heat dissipation pipe and the heat dissipation fin have advantages such as simple structure and long service life, the reliability and durability of the controller are improved on the premise of ensuring the heat dissipation efficiency; and, since the distribution density of the heat dissipation pipes adopts a differential design, in the area of the main control chip with a large heat generation amount, the distribution density of the heat dissipation pipes is large, so as to improve the heat dissipation efficiency of the main control chip, and further improve the performance of the controller. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 Schematic diagram of the assembly structure of the first housing and the circuit board disclosed in the embodiment of the present application;

[0015] Figure 2 Schematic diagram of the structure of the first housing disclosed in the embodiment of the present application;

[0016] Figure 3 Schematic diagram of the structure of the controller disclosed in the embodiment of the present application;

[0017] Figure 4 Exploded view of the controller disclosed in the embodiment of the present application;

[0018] Figure 5 Top view of the controller disclosed in the embodiment of the present application;

[0019] Figure 6 Side view of the controller disclosed in the embodiment of the present application;

[0020] Figure 7Cross-sectional view of the controller disclosed in the embodiments of the present application;

[0021] Figure 8 Partial enlarged cross-sectional view of the controller disclosed in the embodiments of the present application;

[0022] Figure 9 Schematic structural diagram of the circuit board disclosed in the embodiments of the present application;

[0023] Figure 10 One of the schematic diagrams of the layout of the heat dissipation tubes disclosed in the embodiments of the present application;

[0024] Figure 11 Another schematic diagram of the layout of the heat dissipation tubes disclosed in the embodiments of the present application.

[0025] Explanation of reference numerals:

[0026] 100 - Controller, 110 - Circuit board, 111 - Main control chip, 112 - Grounding part, 120 - First housing, 121 - Heat dissipation fins, 122 - Fence structure, 1221 - Central heat dissipation area, 1222 - Peripheral heat dissipation area, 123 - Card slot, 124 - First flanging, 130 - Second housing, 131 - Support part, 132 - Second flanging, 133 - Mounting foot, 140 - Heat dissipation tube, 141 - First heat dissipation tube, 1411 - First central tube body, 1412 - First peripheral tube body, 1412a - First tube body, 1412b - Second tube body, 142 - Second heat dissipation tube, 1421 - Second central tube body, 1422 - Second peripheral tube body, 1422a - Third tube body, 1422b - Fourth tube body, 143 - Heat dissipation tube body, 150 - Circuit board connector, 160 - Waterproof eaves, 170 - Thermal conductive medium layer. Detailed implementation manners

[0027] To make the objectives, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be clearly and completely described below in conjunction with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0028] The terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such used data can be interchanged under appropriate circumstances so that the embodiments of the present application can be implemented in an order different from those illustrated or described herein, and the objects distinguished by "first", "second", etc. are usually of the same category, and the number of objects is not limited. For example, the first object can be one or multiple.

[0029] The technical solutions disclosed in each embodiment of the present application will be described in detail below with reference to the accompanying drawings.

[0030] Please refer to Figures 1 to 11 , an embodiment of the present application discloses a housing of a controller 100. The controller 100 can be used in fields such as automotive electronics, household appliances, and industrial equipment. Taking automotive electronics as an example, the controller 100 can be an autonomous driving controller or a domain controller of a vehicle. The controller 100 can include a circuit board 110, which is the main heat-generating component of the controller 100. The circuit board 110 can be a PCB (Printed Circuit Board) or an FPC (Flexible Printed Circuit board).

[0031] As Figures 1 to 4 shown, the housing can include a first housing 120, a second housing 130, and a heat dissipation tube 140. The first housing 120 is connected to the second housing 130 to enclose an inner cavity. The circuit board 110 is installed in the inner cavity by means of snap connection, bolt connection, etc. The first housing 120 and the second housing 130 can be connected by means of welding, bonding, snap connection, bolt connection, etc. Exemplarily, bolt holes can be respectively formed in the first housing 120 and the second housing 130, and bolts can be used to realize the detachable connection between the first housing 120 and the second housing 130. The first housing 120 and the second housing 130 can be made of high thermal conductivity die-cast aluminum material. Compared with ordinary die-cast aluminum material, the high thermal conductivity die-cast aluminum material has a larger thermal conductivity coefficient, which is more conducive to transferring the heat generated by the circuit board 110 to the outside. Of course, the specific materials of the first housing 120 and the second housing 130 are not limited in the embodiments of the present invention.

[0032] The heat dissipation tube 140 is provided on the inner wall of the first housing 120 and is disposed opposite to the circuit board 110. The heat dissipation tube 140 can be a copper tube, an aluminum tube, etc. A heat dissipation medium (such as water, cooling oil, etc.) is filled inside the heat dissipation tube 140. Heat dissipation fins 121 are provided on the outer wall of the first housing 120, and the heat dissipation fins 121 are disposed opposite to the heat dissipation tube 140. The heat dissipation fins 121 can increase the heat dissipation area of the outer wall of the first housing 120. The heat generated by the circuit board 110 can be quickly transferred to the outside of the housing through the heat dissipation tube 140, the first housing 120, and the heat dissipation fins 121 to achieve heat dissipation.

[0033] It should be added that since the heat dissipation tube 140 is made of a metal material, in order to avoid signal interference with the circuit board 110, the heat dissipation tube 140 can be grounded through the first housing 120, thereby being able to improve the protection level of EMC (Electromagnetic Compatibility).

[0034] As Figures 1 to 4 shown, the inner wall of the first housing 120 may be provided with a protruding fence structure 122. The shape of the fence structure 122 may be circular, polygonal, etc. The fence structure 122 divides the inner wall of the first housing 120 into a central heat dissipation area 1221 and a peripheral heat dissipation area 1222. The central heat dissipation area 1221 is located inside the fence structure 122, and the peripheral heat dissipation area 1222 is located outside the fence structure 122. That is, the peripheral heat dissipation area 1222 is disposed around the central heat dissipation area 1221. The central heat dissipation area 1221 is disposed opposite to the main control chip 111 of the circuit board 110. The main control chip 111 is the main heat dissipation component on the circuit board 110. In order to enable the heat generated by the main control chip 111 to be quickly transferred to the outside of the housing through the heat dissipation pipe 140, the first housing 120, and the heat dissipation fins 121, the distribution density of the heat dissipation pipes 140 in the central heat dissipation area 1221 may be greater than the distribution density of the heat dissipation pipes 140 in the peripheral heat dissipation area 1222. Since the greater the distribution density of the heat dissipation pipes 140, the stronger the heat exchange ability, the heat generated by the main control chip 111 can be quickly absorbed, the main control chip 111 can be quickly cooled in a targeted manner, and thus the heat dissipation efficiency of the controller 100 is improved.

[0035] As can be seen from the above description, the housing of the controller 100 disclosed in the embodiments of the present application improves the related art. By using the first housing 120 with good thermal conductivity and providing the heat dissipation pipe 140 and the heat dissipation fins 121 on the first housing 120, the dual heat dissipation mode of the heat dissipation pipe 140 and the heat dissipation fins 121 replaces the heat dissipation fan in the related art. Since the heat dissipation pipe 140 and the heat dissipation fins 121 have the advantages of simple structure and long service life, the reliability and durability of the controller 100 are improved while ensuring the heat dissipation efficiency. At the same time, the size of the controller 100 can be reduced and the operating noise can be lowered. And, since the distribution density of the heat dissipation pipes 140 adopts a differential design, in the area of the main control chip 111 with a large heat generation, the distribution density of the heat dissipation pipes 140 is large, so that the heat dissipation efficiency of the main control chip 111 can be improved, and thus the performance of the controller 100 is improved.

[0036] Furthermore, as Figures 1 to 2As shown, the heat dissipation tube 140 may include a first heat dissipation tube 141 and a second heat dissipation tube 142. The first heat dissipation tube 141 includes a first central tube body 1411 and a first peripheral tube body 1412, and the second heat dissipation tube 142 includes a second central tube body 1421 and a second peripheral tube body 1422. Both the first central tube body 1411 and the second central tube body 1421 are disposed in the central heat dissipation area 1221. Since the area of the central heat dissipation area 1221 is small, the first central tube body 1411 and the second central tube body 1421 are relatively concentratedly distributed in the central heat dissipation area 1221, so that the heat dissipation tube 140 has a relatively large distribution density in the central heat dissipation area 1221, which is more conducive to the rapid heat dissipation of the main control chip 111.

[0037] The first peripheral tube body 1412 is disposed at the end of the first central tube body 1411 and extends towards the direction away from the second central tube body 1421 to the peripheral heat dissipation area 1222. The second peripheral tube body 1422 is disposed at the end of the second central tube body 1421 and extends towards the direction away from the first central tube body 1411 to the peripheral heat dissipation area 1222. That is to say, the heat dissipation tube 140 is divergently distributed in the peripheral heat dissipation area 1222. The reason for this design is that the heat generated by the components in the peripheral heat dissipation area 1222 is relatively small. The main functions of the first peripheral tube body 1412 and the second peripheral tube body 1422 are to exchange heat with the first central tube body 1411 and the second central tube body 1421. The divergently distributed first peripheral tube body 1412 and second peripheral tube body 1422 have a large interval, which can reduce interference and is conducive to improving the heat dissipation efficiency of the first peripheral tube body 1412 and the second peripheral tube body 1422 respectively.

[0038] In addition, in order to further improve the heat dissipation efficiency, the number of the heat dissipation tubes 140 can be appropriately increased, such as using three, four or other numbers of heat dissipation tubes 140.

[0039] The first central tube body 1411 has a first end and a second end opposite to each other. The first peripheral tube body 1412 can be disposed at the first end of the first central tube body 1411 or at the second end of the first central tube body 1411. Similarly, the second central tube body 1421 has a first end and a second end opposite to each other. The second peripheral tube body 1422 can be disposed at the first end of the second central tube body 1421 or at the second end of the second central tube body 1421. In this embodiment, as Figures 1 to 2As shown in the figure, first outer tubes 1412 are provided at both ends of the first central tube 1411, and second outer tubes 1422 are provided at both ends of the second central tube 1421. Specifically, the first outer tube 1412 includes a first tube 1412a and a second tube 1412b. The first tube 1412a and the second tube 1412b are respectively provided at both ends of the first central tube 1411 and extend towards the outer heat dissipation area 1222 in a direction away from the second central tube 1421. The second outer tube 1422 includes a third tube 1422a and a fourth tube 1422b. The third tube 1422a and the fourth tube 1422b are respectively provided at both ends of the second central tube 1421 and extend towards the outer heat dissipation area 1222 in a direction away from the first central tube 1411.

[0040] By respectively providing the first tube 1412a and the second tube 1412b at both ends of the first central tube 1411, and respectively providing the third tube 1422a and the fourth tube 1422b at both ends of the second central tube 1421, the heat absorbed by the first central tube 1411 and the second central tube 1421 can be quickly transferred to the first housing 120 and the heat dissipation fins 121, thereby improving the heat dissipation efficiency.

[0041] In an alternative embodiment of the present application, as Figures 10 to 11 shown, the heat dissipation tube 140 may include a plurality of heat dissipation tubes 143. One ends of the plurality of heat dissipation tubes 143 are all provided in the central heat dissipation area 1221 and are connected to each other. A common connection point can be used to connect one ends of the plurality of heat dissipation tubes 143 to the same point, or one ends of the plurality of heat dissipation tubes 143 can be interconnected in pairs to form a heat dissipation tube 140 with a tree branch-like structure. The other ends of the plurality of heat dissipation tubes 143 all extend in a divergent manner towards the outer heat dissipation area 1222. Since one ends of the plurality of heat dissipation tubes 143 are relatively concentratedly provided in the central heat dissipation area 1221, the distribution density of the heat dissipation tube 140 in the central heat dissipation area 1221 can be improved, which is more conducive to the rapid heat dissipation of the main control chip 111. In the outer heat dissipation area 1222, the intervals between the plurality of heat dissipation tubes 143 distributed in a divergent manner are relatively large, which can reduce the interference between the plurality of heat dissipation tubes 143 and is conducive to improving the heat dissipation efficiency of each of the plurality of heat dissipation tubes 143.

[0042] As Figures 1 to 2As shown, the heat dissipation pipe 140 can be fixed to the first housing 120 by means of press riveting, welding, etc. In this embodiment, a clamping groove 123 can be provided on the inner wall of the first housing 120, and the heat dissipation pipe 140 can be fixed in the clamping groove 123 by clamping. The heat dissipation pipe 140 can be entirely placed in the clamping groove 123, or only a part of the heat dissipation pipe 140 can be fixed by using the clamping groove 123. By using the clamping groove 123 to fix the heat dissipation pipe 140, it can ensure good contact between the heat dissipation pipe 140 and the first housing 120, facilitating the conduction of heat from the heat dissipation pipe 140 to the first housing 120 and the heat dissipation fins 121; it can also reduce the amount of thermal paste between the heat dissipation pipe 140 and the first housing 120, reducing the production cost.

[0043] The first housing 120 and the second housing 130 are important media in the heat dissipation process of the circuit board 110. To further improve the heat dissipation efficiency, a heat dissipation coating can be provided on at least one of the first housing 120 and the second housing 130. The manufacturing process of the heat dissipation coating includes but is not limited to anodic oxidation, painting, powder spraying, coating, etc. The purpose of providing the heat dissipation coating is to increase the surface emissivity of the first housing 120 and the second housing 130, thereby enhancing the radiation heat dissipation performance of the first housing 120 and the second housing 130, enabling the first housing 120 and the second housing 130 to quickly exchange heat with the external environment.

[0044] In an alternative embodiment of the present application, as Figure 7 shown, a thermal conductive medium layer 170 can be provided between the heat dissipation pipe 140 and the circuit board 110. The thermal conductive medium can include thermal conductive gel, thermal conductive silicone grease, etc. By providing the thermal conductive medium layer 170 between the heat dissipation pipe 140 and the circuit board 110, the heat generated by the circuit board 110 can be quickly transferred to the heat dissipation pipe 140 through the thermal conductive medium layer 170.

[0045] Based on the above scheme of the thermal conductive medium layer 170, if the thermal conductive medium layer 170 is to be in contact with the heat dissipation pipe 140 and the circuit board 110 respectively, the thermal conductive medium layer 170 needs to have a certain thickness, but the thickness of the thermal conductive medium layer 170 cannot be too thick. If the thickness of the thermal conductive medium layer 170 is too thick, the surface of the circuit board 110 will have a problem of high thermal resistance due to the thick thermal conductive medium layer 170, which is not conducive to the heat dissipation of the circuit board 110.

[0046] Generally, the thickness of the thermal conductive medium layer 170 is not greater than 0.8 mm. To control the thickness of the thermal conductive medium layer 170, as Figure 4 and Figure 7As shown in the figure, a raised support portion 131 can be provided between the inner wall of the second housing 130 and the circuit board 110. The support portion 131 can be fixedly provided on the inner wall of the second housing, or can be fixedly provided on the surface of the circuit board 110 facing the second housing 130. On the one hand, the support portion 131 can respectively abut against the inner wall of the second housing 130 and the surface of the circuit board 110, so as to support the circuit board 110, so that the gap for accommodating the heat-conducting medium layer 170 between the first housing 120 and the circuit board 110 is not too large, thereby controlling the thickness of the heat-conducting medium layer 170, avoiding affecting the heat-conducting efficiency between the circuit board 110 and the heat-dissipating tube 140, and at the same time reducing the thickness of the whole machine; on the other hand, the support portion 131 can also compensate for the fitting tolerance between the circuit board 110 and the first housing 120 and the second housing 130, which is beneficial to the stable installation of the circuit board 110.

[0047] In some embodiments, as Figures 7 to 8 shown, a first flanging 124 can be extended and provided at the edge of the first housing 120 facing the second housing 130, and a second flanging 132 can be extended and provided at the edge of the second housing 130 facing the first housing 120. When the first housing 120 and the second housing 130 are buckled, the first flanging 124 and the second flanging 132 are overlapped. When the electromagnetic wave passes through the housing, it needs to cross more obstacles, so that the energy of the electromagnetic wave can be effectively reduced, and thus the mutual interference between the controller 100 and external electronic devices can be effectively reduced.

[0048] The circuit board 110 of the controller 100 communicates and interconnects with the outside through the circuit board connector 150 on the side of the first housing 120. In a water-related environment, the circuit board connector 150 will inevitably touch the water flow. If the water flow further invades the circuit board 110, it is easy to cause problems such as short circuit and damage of the circuit board 110. Based on this, as Figures 3 to 6 shown, a waterproof eaves 160 can be provided in the circumferential direction of the circuit board connector 150. The waterproof eaves 160 is connected to the side of the first housing 120. The specific connection method can be welding, bonding, etc. The waterproof eaves 160 and the first housing 120 can also adopt an integral structure. By providing the waterproof eaves 160, the probability of water flow invading the circuit board connector 150 can be reduced, and the waterproof performance of the controller 100 can be improved to a certain extent.

[0049] Please refer to Figures 1 to 11 , this application embodiment also discloses a controller 100. The disclosed controller 100 can include a circuit board 110 and the above-mentioned housing, and the circuit board 110 is arranged in the inner cavity surrounded by the first housing 120 and the second housing 130.

[0050] As can be seen from the above description, the housing of the controller 100 disclosed in the embodiments of the present application improves the related art. By using the first housing 120 with good heat conduction performance and providing heat dissipation tubes 140 and heat dissipation fins 121 on the first housing 120, the dual heat dissipation mode of the heat dissipation tubes 140 and the heat dissipation fins 121 replaces the heat dissipation fan in the related art. Since the heat dissipation tubes 140 and the heat dissipation fins 121 have advantages such as simple structure and long service life, the reliability and durability of the controller 100 are improved while ensuring the heat dissipation efficiency. At the same time, the size of the controller 100 can be reduced and the operating noise can be lowered. Moreover, due to the differential design of the distribution density of the heat dissipation tubes 140, in the area of the main control chip 111 with a large heat generation amount, the distribution density of the heat dissipation tubes 140 is large, so as to improve the heat dissipation efficiency of the main control chip 111, and further improve the performance of the controller 100.

[0051] In some embodiments, a raised fence structure 122 is provided on the inner wall of the first housing 120. The fence structure 122 divides the inner wall of the first housing 120 into a central heat dissipation area 1221 and a peripheral heat dissipation area 1222. The peripheral heat dissipation area 1222 surrounds the central heat dissipation area 1221. The central heat dissipation area 1221 is used to be disposed opposite to the main control chip 111 of the circuit board 110. A plurality of raised grounding members 112 are provided on the periphery of the main control chip 111. The plurality of grounding members 112 are respectively in contact with the fence structure 122 and the heat dissipation tubes 140, so that the circuit board 110 can be grounded through the heat dissipation tubes 140 and the first housing 120. Since the heat dissipation tubes 140 are slightly lower than the fence structure 122, in order to enable the plurality of grounding members 112 to be stably in contact with the fence structure 122 and the heat dissipation tubes 140 respectively, along the vertical direction of the board surface of the circuit board 110, the height of the grounding member 112 in contact with the fence structure 122 is less than the height of the grounding member 112 in contact with the heat dissipation tubes 140. It should be noted that the height of the grounding member 112 is the dimension protruding from the board surface of the circuit board 110 with the board surface of the circuit board 110 as the reference.

[0052] The controller 100 can be fixed to a vehicle, a household appliance, or an industrial device through the second housing 130. Specifically, as Figures 3 to 4 shown, mounting feet 133 can be extended and provided on the side surface of the second housing 130. Structures such as bolt holes and buckles can be provided on the mounting feet 133, so that the controller 100 can be mounted and fixed through the mounting feet 133, improving the convenience of mounting the controller 100.

[0053] In the above embodiments of the present application, the differences between the various embodiments are mainly described. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a more optimal embodiment. Considering the simplicity of the writing, it will not be elaborated here.

[0054] The embodiments of the present application have been described above in conjunction with the accompanying drawings. However, the present application is not limited to the above specific embodiments. The above specific embodiments are merely illustrative rather than restrictive. Under the inspiration of the present application, those of ordinary skill in the art can also make many forms without departing from the purpose of the present application and the scope protected by the claims, and all of them fall within the protection scope of the present application.

Claims

1. A housing of a controller, the controller (100) comprising a circuit board (110), characterized in that: The housing comprises a first housing (120), a second housing (130) and a heat dissipation pipe (140); The first shell (120) and the second shell (130) are connected to form an inner cavity, and the inner cavity is used to accommodate the circuit board (110); The heat dissipation pipe (140) is arranged on the inner wall of the first shell (120) and is used to be arranged opposite to the circuit board (110); the outer wall of the first shell (120) is provided with heat dissipation fins (121); the heat dissipation fins (121) are arranged opposite to the heat dissipation pipe (140); The inner wall of the first shell (120) is provided with a raised fence structure (122), the fence structure (122) divides the inner wall of the first shell (120) into a central heat dissipation area (1221) and a peripheral heat dissipation area (1222), the peripheral heat dissipation area (1222) surrounds the central heat dissipation area (1221), and the central heat dissipation area (1221) is used to be arranged opposite to the main control chip (111) of the circuit board (110); The distribution density of the heat dissipation pipes (140) in the central heat dissipation area (1221) is greater than the distribution density of the heat dissipation pipes (140) in the peripheral heat dissipation area (1222).

2. The housing according to claim 1, characterized in that The heat dissipation pipe (140) comprises a first heat dissipation pipe (141) and a second heat dissipation pipe (142); the first heat dissipation pipe (141) comprises a first central pipe body (1411) and a first peripheral pipe body (1412); and the second heat dissipation pipe (142) comprises a second central pipe body (1421) and a second peripheral pipe body (1422); The first central tube body (1411) and the second central tube body (1421) are both arranged in the central heat dissipation area (1221); the first peripheral tube body (1412) is arranged at the end of the first central tube body (1411) and extends to the peripheral heat dissipation area (1222) in a direction away from the second central tube body (1421); the second peripheral tube body (1422) is arranged at the end of the second central tube body (1421) and extends to the peripheral heat dissipation area (1222) in a direction away from the first central tube body (1411).

3. The housing according to claim 2, characterized in that: The first peripheral tube body (1412) comprises a first tube body (1412a) and a second tube body (1412b), wherein the first tube body (1412a) and the second tube body (1412b) are respectively arranged at two ends of the first central tube body (1411), and extend in a direction away from the second central tube body (1421) to the peripheral heat dissipation area (1222); The second peripheral tube body (1422) includes a third tube body (1422a) and a fourth tube body (1422b), wherein the third tube body (1422a) and the fourth tube body (1422b) are respectively arranged at two ends of the second central tube body (1421), and extend in a direction away from the first central tube body (1411) to the peripheral heat dissipation area (1222).

4. The housing according to claim 1, characterized in that The heat dissipation pipe (140) comprises a plurality of heat dissipation pipe bodies (143), one end of each of the plurality of heat dissipation pipe bodies (143) is arranged in the central heat dissipation area (1221) and is connected to each other, and the other end of each of the plurality of heat dissipation pipe bodies (143) extends in a divergent manner toward the peripheral heat dissipation area (1222).

5. The housing according to claim 1, characterized in that: The inner wall of the first shell (120) is provided with a slot (123), and at least a portion of the heat dissipation pipe (140) is fixedly snapped into the slot (123).

6. The housing according to claim 1, characterized in that At least one of the first shell (120) and the second shell (130) is provided with a heat dissipation coating.

7. The housing according to claim 1, characterized in that A heat-conducting medium layer (170) is provided between the heat dissipation pipe (140) and the circuit board (110).

8. The housing according to claim 7, characterized in that A protruding support portion (131) is provided between the inner wall of the second housing (130) and the circuit board (110), and the support portion (131) is used to support the circuit board (110).

9. The housing according to claim 1, characterized in that A first flange (124) is provided on the edge of the first shell (120) extending toward the second shell (130), and a second flange (132) is provided on the edge of the second shell (130) extending toward the first shell (120), and the first flange (124) and the second flange (132) are overlapped.

10. The housing according to claim 1, characterized in that A circuit board connector (150) is provided on the side of the first shell (120), a waterproof eave (160) is provided in the circumference of the circuit board connector (150), and the waterproof eave (160) is connected to the side of the first shell (120).

11. A controller, characterized in that: It comprises a circuit board (110) and the shell according to any one of claims 1 to 10, wherein the circuit board (110) is arranged in the inner cavity surrounded by the first shell (120) and the second shell (130).

12. The controller according to claim 11, characterized in that: A plurality of protruding grounding members (112) are provided on the peripheral side of the main control chip (111), and the plurality of grounding members (112) are respectively in contact with the fence structure (122) and the heat dissipation pipe (140), and along the vertical direction of the board surface of the circuit board (110), the height of the grounding member (112) in contact with the fence structure (122) is less than the height of the grounding member (112) in contact with the heat dissipation pipe (140).

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