Heat pipe radiator

Abstract

The utility model discloses a heat pipe radiator which comprises a radiator substrate and fin assemblies, a plurality of sets of fin assemblies are arranged on the radiator substrate, and each fin assembly comprises a fin body, a heat pipe shell, a liquid absorption core and a supporting structure. The fin body is connected with the outer side wall of the heat pipe shell, the liquid absorption core and the supporting structure are filled in the heat pipe shell, and the lower portion of the heat pipe shell is connected with the radiator substrate. Meanwhile, by means of the protrusions of the heat pipe structure, disturbance of airflow flowing through the fin body can be increased, heat exchange efficiency can be improved, electronic elements can work within a reasonable temperature range, the service life of the electronic elements is prolonged, the overall structure is compact, the space size and the weight of the heat pipe radiator are reduced, and the heat pipe radiator is suitable for large-scale popularization and application. The requirements for miniaturization and light weight of the heat pipe radiator are met, and the design is ingenious.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation, and relates to a heat pipe radiator. Background Art

[0002] With the development of electronic components towards high integration and miniaturization, the heat flux density of electronic devices has increased sharply, resulting in higher requirements for heat dissipation of electronic devices. Heat pipe radiators can be used to dissipate heat from electronic components. However, traditional heat pipe radiators have low heat dissipation efficiency and cannot meet the heat dissipation requirements of high-power electronic components, resulting in too high device temperature and ultimately affecting the performance and lifespan of the components; high-power and small-volume electronic devices have a relatively large heat flux density, and highly integrated electronic devices have higher requirements for efficient heat dissipation; traditional heat pipe radiators can meet certain heat dissipation requirements, but most heat pipe radiators are assembled by heat pipes and heat dissipation fins for heat dissipation. There is a large contact thermal resistance at the connection between the heat pipe and the fins, resulting in low heat dissipation efficiency and inability to meet the heat dissipation requirements of high-power electronic components, leading to too high device temperature and ultimately affecting the performance and lifespan of the components. Summary of the Invention

[0003] In view of the above situation, to overcome the defects of the prior art, the purpose of the present utility model is to provide a heat pipe radiator. By integrating the heat pipe structure with the radiator substrate, the thermal resistance of the radiator substrate and the fin body can be effectively reduced, and the fin efficiency of the radiator can be improved. At the same time, by using the protrusion of the heat pipe structure, the air flow passing through the fin body can be disturbed, enhancing the heat transfer efficiency, enabling the electronic components to work within a reasonable temperature range, extending the service life of the electronic devices, with a compact overall structure, reducing the space size and weight of the heat pipe radiator, meeting the requirements of miniaturization and lightweight of the heat pipe radiator, and having a clever design.

[0004] To achieve the above purpose, the present utility model provides the following technical solutions:

[0005] A heat pipe radiator includes a radiator substrate and a fin assembly. A plurality of groups of fin assemblies are provided on the radiator substrate. The fin assembly includes a fin body, a heat pipe shell, a wick, and a support structure; the fin body is connected to the outer side wall of the heat pipe shell, the inside of the heat pipe shell is filled with a wick and a support structure, and the lower part of the heat pipe shell is connected to the radiator substrate.

[0006] Further, a plurality of round holes are provided on the radiator substrate, a through hole is provided inside the heat pipe shell, and the through hole inside the heat pipe shell communicates with the round holes on the radiator substrate to form a heat pipe internal cavity, and the heat pipe internal cavity is filled with a wick and a support structure.

[0007] Further, a liquid working medium is also filled inside the heat pipe internal cavity.

[0008] As a further aspect, the wick is in the structure of sintered powder, microchannels or metal mesh.

[0009] As a further aspect, the support structure is in the structure of a serpentine spring or a porous corrugated pipe.

[0010] Compared with the prior art, the beneficial effects of the present utility model are as follows: by integrating the heat pipe structure with the radiator substrate, the thermal resistance of heat conduction of the radiator substrate and the fin body can be effectively reduced, and the efficiency of the radiator fins can be improved. At the same time, by using the protrusion of the heat pipe structure, the airflow flowing through the fin body can be disturbed, the heat exchange efficiency can be enhanced, so that the electronic components can work within a reasonable temperature range, the service life of the electronic devices can be prolonged, the overall structure is compact, the space size and weight of the heat pipe radiator are reduced, the requirements for miniaturization and light weight of the heat pipe radiator are met, and the design is ingenious. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a schematic structural view of the heat pipe radiator of the present utility model;

[0012] Figure 2 is an exploded structural view of the heat pipe radiator of the present utility model;

[0013] Figure 3 is a schematic structural view of the fin assembly of the present utility model;

[0014] Figure 4 is a schematic sectional view of the fin assembly and the radiator substrate of the present utility model;

[0015] Reference numerals: 1, radiator substrate; 11, round hole; 2, fin assembly; 21, fin body; 22, heat pipe shell; 23, wick and support structure; 24, internal cavity of the heat pipe. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] The following describes in detail a plastic encapsulated connector for a new energy vehicle provided by the present utility model with reference to the drawings and specific embodiments. At the same time, it should be noted here that in order to make the embodiments more detailed, the following embodiments are the best and preferred embodiments. For some well-known technologies, those skilled in the art can also adopt other alternative methods for implementation; and the drawings are only for more specific description of the embodiments, and are not intended to specifically limit the present utility model.

[0017] It should be noted that in the specification, the mention of "an embodiment", "embodiment", "exemplary embodiment", "some embodiments", etc. indicates that the described embodiments may include specific features, structures or characteristics, but not necessarily every embodiment includes such specific features, structures or characteristics. Additionally, when combining embodiments to describe a specific feature, structure or characteristic, the implementation of such feature, structure or characteristic in combination with other embodiments (whether explicitly described or not) should be within the knowledge of those skilled in the relevant art.

[0018] Generally, terms can be understood at least in part from their use in context. For example, at least in part depending on the context, the term "one or more" as used herein can be used to describe any feature, structure or characteristic in a singular sense, or can be used to describe a combination of features, structures or characteristics in a plural sense. Additionally, the term "based on" can be understood as not necessarily intended to convey a set of exclusive factors, but rather, at least in part depending on the context, can allow for the existence of other factors that are not necessarily explicitly described.

[0019] It can be understood that the meanings of "on", "above", and "over" in the present disclosure should be construed in the broadest manner such that "on" not only means "directly on" something, but also includes the meaning of being "on" something with intervening features or layers therebetween, and "above" or "over" not only means "above" or "over" something, but also can include the meaning of being "above" or "over" something with no intervening features or layers therebetween.

[0020] Furthermore, spatial relative terms such as "under", "below", "lower", "above", "upper", etc. are used herein for convenience of description to describe the relationship of one element or feature to another or other elements or features, as shown in the drawings. The spatial relative terms are intended to cover different orientations in the use or operation of the device other than the orientation depicted in the drawings. The device can be oriented in other ways, and the spatial relative descriptive terms used herein can be interpreted correspondingly.

[0021] Referring to Figures 1-4 As shown, a heat pipe radiator includes a radiator base plate 1 and a fin assembly 2. A plurality of groups of fin assemblies 2 are provided on the radiator base plate 1. The fin assembly 2 includes a fin body 21, a heat pipe shell 22, a wick and a support structure 23. The fin body 21 is connected to the outer side wall of the heat pipe shell 22. The heat pipe shell 22 is filled with a wick and a support structure 23 inside. The lower part of the heat pipe shell 22 is connected to the radiator base plate 1.

[0022] Preferably, a plurality of round holes 11 are provided on the radiator substrate 1, a through hole is provided inside the heat pipe shell 22, and the through hole inside the heat pipe shell 22 communicates with the round holes 11 on the radiator substrate 1 to form a heat pipe internal cavity 24. A wick and a support structure 23 are filled in the heat pipe internal cavity 24.

[0023] Preferably, a liquid working medium is further filled inside the heat pipe internal cavity 24.

[0024] Preferably, the wick 23 is in the structure of sintered powder or microchannels or metal mesh.

[0025] Preferably, the support structure 23 is in the structure of a serpentine spring or a porous bellows.

[0026] The working principle is as follows: An electronic component is installed on the lower surface of the radiator substrate. The heat generated by the electronic component is first transferred to the radiator substrate. The radiator substrate is integrated with the heat pipe. By virtue of the high heat transfer capacity of the heat pipe, the heat transferred to the radiator substrate is quickly transported to the radiator fin body connected to the heat pipe. The cold air takes away the heat transferred to the fins through convective heat transfer, realizing efficient heat dissipation of the electronic device.

[0027] According to the disclosure and teachings of the above specification, those skilled in the art of the present invention can also make appropriate changes and modifications to the above embodiments. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present invention should also fall within the protection scope of the claims of the present invention. In addition, although some specific terms are used in this specification, these terms are only for convenience of description and do not constitute any limitation to the present invention.

Claims

1. A heat pipe radiator, characterized in that: It includes a radiator substrate and a fin assembly. The radiator substrate is provided with a plurality of fin assemblies. The fin assembly includes a fin body, a heat pipe shell, a liquid wick and a supporting structure. The fin body is connected to the outer wall of the heat pipe shell. The heat pipe shell is filled with a liquid wick and a supporting structure. The lower part of the heat pipe shell is connected to the radiator substrate.

2. The heat pipe radiator according to claim 1, characterized in that: The radiator substrate is provided with a plurality of circular holes, the heat pipe shell is provided with through holes, the through holes inside the heat pipe shell and the circular holes on the radiator substrate are connected to form an internal cavity of the heat pipe, and the internal cavity of the heat pipe is filled with a liquid wick and a supporting structure.

3. The heat pipe radiator according to claim 2, characterized in that: The inner cavity of the heat pipe is also filled with liquid working medium.

4. The heat pipe radiator according to any one of claims 1 to 3, characterized in that: The liquid wick is a structure of sintered powder, microchannels or metal mesh.

5. The heat pipe radiator according to any one of claims 1 to 3, characterized in that: The supporting structure is a serpentine spring or a multi-hole bellows structure.

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