Wafer liquid supply device

The wafer liquid supply device designed through modular assembly method solves the problem of assembly and maintenance of the supply arm and adjustment module in the prior art, and achieves the effect of simplifying the assembly process and convenient maintenance.

CN222932496UActive Publication Date: 2025-06-03江苏元夫半导体科技有限公司
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Patent Information

Application Number
CN202421491472.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-26
Publication Date
2025-06-03
Estimated Expiration
2034-06-26

AI Technical Summary

Technical Problem

The installation process of the existing polishing liquid conveying device is cumbersome and inconvenient to disassemble, resulting in difficulty in assembly and maintenance of the supply arm and adjustment module.

Method used

A wafer liquid supply device is designed, adopting a modular assembly method, and the supply arm and adjustment module are installed on the workbench, realizing the modular assembly of the supply arm and adjustment module, which is convenient for assembly and maintenance.

Benefits of technology

The assembly process of supply arms and adjustment modules is simplified, assembly efficiency is improved, and later maintenance is facilitated, reducing maintenance costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a wafer liquid supply device, which comprises a driving module, an adjusting module and a supply arm, and is characterized in that the driving module is mounted on a workbench; the adjusting module is detachably installed on the workbench and comprises a rotating shaft, a bearing and a bearing sleeve, the bearing is arranged on the outer side of the rotating shaft and located in the bearing sleeve, the bearing sleeve is detachably connected with the workbench, and the driving module is in transmission connection with one end of the rotating shaft; the supply arm is detachably connected to the other end of the rotating shaft, and the supply arm is provided with a first nozzle and a second nozzle which spray towards the wafer. According to the wafer liquid supply device provided by the utility model, the assembled supply arm and the adjusting module are uniformly mounted on the workbench, so that modular assembly of the supply arm and the adjusting module can be realized, and the assembly process of the supply arm and the adjusting module is simple; when the supply arm and the adjusting module need to be repaired or maintained, the supply arm and the adjusting module can be uniformly detached from the workbench, and later repair or maintenance of the supply arm and the adjusting module is facilitated.
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Description

Technical Field

[0001] The utility model relates to the technical field of polishing equipment, in particular to a wafer liquid supply device. Background Art

[0002] In the process of chemical mechanical polishing (CMP), polishing liquid is a key element of the CMP processing technology. The performance of the polishing liquid directly affects the quality of the wafer surface after polishing. A suitable polishing liquid can achieve the effects of high material removal rate, high flatness, and uniform film thickness. Therefore, the polishing liquid delivery device is crucial.

[0003] In the related art, the rotation of the polishing liquid delivery device is realized by driving the rotation of the rotating shaft. However, the bearing and the rotating shaft are sequentially installed on the workbench, and the installation process is cumbersome and the disassembly is inconvenient. Summary of the Utility Model

[0004] The utility model aims to at least solve one of the technical problems existing in the prior art. For this reason, an object of the utility model is to provide a wafer liquid supply device, which can realize the modular assembly of the supply arm and the adjustment module, making the assembly process of the supply arm and the adjustment module simple, and also facilitating the later maintenance or repair of the supply arm and the adjustment module.

[0005] The wafer liquid supply device according to the embodiment of the utility model is used for a wafer processing device. The wafer processing device includes a workbench. The wafer liquid supply device includes: a workbench; a driving module installed on the workbench; an adjustment module including a rotating shaft, a bearing and a bearing sleeve. The bearing is arranged outside the rotating shaft, the bearing is located in the bearing sleeve, and the bearing sleeve is detachably connected to the workbench. The driving module is in transmission connection with one end of the rotating shaft; a supply arm detachably connected to the other end of the rotating shaft, and the supply arm has a first nozzle and a second nozzle for spraying towards the wafer.

[0006] The wafer liquid supply device according to the embodiment of the utility model can realize the modular assembly of the assembled supply arm and the adjustment module by uniformly installing the supply arm and the adjustment module on the workbench, so as to facilitate the assembly of the supply arm and the adjustment module, making the assembly process of the supply arm and the adjustment module simple; when it is necessary to repair or maintain the supply arm and the adjustment module later, the supply arm and the adjustment module can be uniformly removed from the workbench, thus facilitating the later maintenance or repair of the supply arm and the adjustment module.

[0007] According to some embodiments of the utility model, the workbench has a mounting groove, the bearing sleeve is inserted into the mounting groove, the upper end of the bearing sleeve has an extension portion extending in a radial direction, the workbench has a protrusion protruding toward the extension portion, and the extension portion and the protrusion are fixedly connected by fasteners.

[0008] According to some embodiments of the present utility model, the adjustment module further includes a first pressure cover and a second pressure cover, wherein the first pressure cover and the second pressure cover are respectively fixed at two ends of the outer ring of the bearing, and the first pressure cover and the second pressure cover are both detachably connected to the bearing sleeve.

[0009] According to some embodiments of the utility model, the adjustment module also includes a locking piece, the side wall of the rotating shaft has a protrusion arranged around the rotating shaft, the locking piece is detachably installed on the rotating shaft, and the protrusion and the locking piece are respectively fixed at both ends of the inner ring of the bearing.

[0010] According to some embodiments of the utility model, the side wall of the rotating shaft has an annular protrusion arranged around the rotating shaft, the annular protrusion has a sealing groove arranged toward the bearing sleeve, and the first pressure cover has the sealing block that cooperates with the sealing groove.

[0011] According to some embodiments of the present invention, the adjustment module further includes a fixing member, two bearings are provided, and the fixing member is fixed between the inner rings of the two bearings.

[0012] According to some embodiments of the present invention, the bearing is an angular contact bearing.

[0013] According to some embodiments of the utility model, the supply arm includes a fixed base plate and a protective cover detachably connected to the fixed base plate, a receiving chamber is defined between the protective cover and the fixed base plate, one end of the fixed base plate is detachably connected to the rotating shaft, a first pipeline and a second pipeline are arranged in the receiving chamber, the first pipeline is connected to the first nozzle, the first nozzle is connected to the fixed base plate, the first nozzle is used to spray high-pressure water toward the wafer, the second pipeline is connected to the second nozzle, and the second nozzle is used to spray polishing liquid toward the wafer. .

[0014] According to some embodiments of the present invention, a plurality of first nozzles are provided, and the spraying amounts of at least two of the first nozzles are different.

[0015] According to some embodiments of the present utility model, the driving module includes a driving motor, a transmission and a transmission structure, the transmission is transmission-connected between the driving motor and the transmission structure, and the transmission structure is transmission-connected to the rotating shaft.

[0016] Additional aspects and advantages of the present utility model will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present utility model. Description of the Drawings

[0017] The above and / or additional aspects and advantages of the present utility model will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0018] Figure 1 is a schematic diagram of a supply arm according to some embodiments of the present utility model;

[0019] Figure 2 is a cross-sectional view of a regulating module cooperating with a workbench according to some embodiments of the present utility model;

[0020] Figure 3 is Figure 2 a partial enlarged view of the cross-sectional view of the regulating module cooperating with the workbench in ;

[0021] Figure 4 is a schematic diagram of a driving module cooperating with a workbench according to some embodiments of the present utility model.

[0022] Reference Signs:

[0023] 10, workbench; 11, mounting groove; 12, bump;

[0024] 20, driving module; 21, driving motor; 22, transmission; 23, transmission structure; 231, driving wheel; 232, driven wheel;

[0025] 30, regulating module; 31, rotating shaft; 311, annular protrusion; 3111, sealing groove; 312, protruding portion; 313, channel; 32, bearing; 321, inner ring; 322, outer ring; 33, bearing sleeve; 331, extending portion; 34, first gland; 341, sealing block; 342, first extension plate; 35, second gland; 351, second extension plate; 36, locking member; 37, fixing member; 381, sealing gasket; 382, sealing ring; 391, first bolt; 392, second bolt;

[0026] 40, supply arm; 41, fixed bottom plate; 411, through hole; 42, first pipeline; 43, adapter; 44, bolt. Detailed Description of the Embodiments

[0027] Embodiments of the present utility model will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for explaining the present utility model and should not be construed as limiting the present utility model.

[0028] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality" means two or more, unless otherwise specifically defined.

[0029] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0030] The following refers to Figures 1-4 Describe a wafer liquid supply device according to an embodiment of the present utility model.

[0031] A wafer liquid supply device according to an embodiment of the present utility model, the wafer liquid supply device is used for a wafer processing apparatus, the wafer processing apparatus includes a workbench 10, a driving module 20, an adjusting module 30, and a supply arm 40. The driving module 20 is installed on the workbench 10, the adjusting module 30 is detachably connected to the workbench 10 through a bearing sleeve 33, and the workbench 10 can provide installation positions for the driving module 20 and the adjusting module 30, which can ensure the stability when the driving module 20 drives the rotating shaft 31 of the adjusting module 30 to rotate.

[0032] The adjustment module 30 is detachably mounted on the workbench 10, and it can be that the entire adjustment module 30 is mounted on the workbench 10. The adjustment module 30 includes a rotating shaft 31, a bearing 32, and a bearing sleeve 33. The bearing 32 is provided outside the rotating shaft 31, the bearing 32 is located within the bearing sleeve 33, and the bearing sleeve 33 is detachably connected to the workbench 10. The adjustment module 30 can be detachably connected to the workbench 10 only through the bearing sleeve 33. The driving module 20 is drivingly connected to one end of the rotating shaft 31. The bearing 32 includes an inner ring 321 and an outer ring 322. The inner ring 321 of the bearing 32 is in interference fit with the rotating shaft 31, and the inner ring 321 and the rotating shaft 31 can rotate synchronously; the outer ring 322 of the bearing 32 is fixedly connected to the bearing sleeve 33, and the bearing sleeve 33 is detachably connected to the workbench 10, that is, the bearing sleeve 33 can be fixed to the workbench 10; the inner ring 321 of the bearing 32 can rotate relative to the outer ring 322, that is, the rotating shaft 31 can rotate relative to the workbench 10. For example, the bearing sleeve 33 can be mounted on the workbench 10 through fasteners.

[0033] The supply arm 40 is detachably connected to the other end of the rotating shaft 31. The supply arm 40 has a first nozzle and a second nozzle that spray towards the wafer. The rotating shaft 31 and the supply arm 40 can be connected by bolts 44. When the supply arm 40 needs to be repaired or maintained, the supply arm 40 can be detached from the adjustment module 30. For example, the first nozzle and the second nozzle can spray different liquids. The first nozzle can provide abrasive liquid for the wafer; the second nozzle can provide high-pressure water for the wafer.

[0034] The driving module 20 drives the rotating shaft 31 of the adjustment module 30 to rotate. When the rotating shaft 31 rotates, it can synchronously drive the supply arm 40 to rotate. The supply arm 40 can synchronously drive the first nozzle and the second nozzle to rotate, and can control the landing position of the spray liquid at any time; through the action of the driving module 20, the landing position of the spray liquid can be automatically adjusted. For example, the rotating shaft 31 can rotate within a range of 360°, and the supply arm 40 can also rotate within a range of 360°; the rotation angle of the supply arm 40 can also be designed according to actual needs.

[0035] There are two installation methods for installing each module of the wafer liquid supply device. One of them is: Install the rotating shaft 31 into the inner ring 321 of the bearing 32, and then install the assembled rotating shaft 31 and bearing 32 into the bearing sleeve 33. After that, install the assembled adjustment module 30 onto the workbench 10 uniformly, and then install the supply arm 40 onto one end of the rotating shaft 31, and connect the other end of the rotating shaft 31 to the drive module 20. By installing the assembled adjustment module 30 onto the workbench 10, modular assembly of the adjustment module 30 can be achieved, which is convenient for the assembly of the adjustment module 30 and makes the assembly process of the adjustment module 30 simple; when maintenance or repair of the adjustment module 30 is required later, the adjustment module 30 can be removed from the workbench 10 uniformly, thus facilitating the later maintenance or repair of the adjustment module 30.

[0036] The other one is: Install the rotating shaft 31 into the inner ring 321 of the bearing 32, and then install the assembled rotating shaft 31 and bearing 32 into the bearing sleeve 33. After that, install the supply arm 40 onto one end of the rotating shaft 31; then install the assembled supply arm 40 and adjustment module 30 onto the workbench 10 uniformly, and connect the other end of the rotating shaft 31 to the drive module 20. By installing the assembled supply arm 40 and adjustment module 30 onto the workbench 10 uniformly, modular assembly of the supply arm 40 and adjustment module 30 can be achieved, which is convenient for the assembly of the supply arm 40 and adjustment module 30 and makes the assembly process of the supply arm 40 and adjustment module 30 simple; when maintenance or repair of the supply arm 40 and adjustment module 30 is required later, the supply arm 40 and adjustment module 30 can be removed from the workbench 10 uniformly, thus facilitating the later maintenance or repair of the supply arm 40 and adjustment module 30.

[0037] For the wafer liquid supply device according to the embodiment of the present invention, by installing the assembled supply arm 40 and adjustment mechanism 30 onto the workbench 10 uniformly, modular assembly of the supply arm 40 and adjustment mechanism 30 can be achieved, which is convenient for the assembly of the supply arm 40 and adjustment mechanism 30 and makes the assembly process of the supply arm 40 and adjustment mechanism 30 simple; when maintenance or repair of the supply arm 40 and adjustment mechanism 30 is required later, the supply arm 40 and adjustment mechanism 30 can be removed from the workbench 10 uniformly, thus facilitating the later maintenance or repair of the supply arm 40 and adjustment mechanism 30.

[0038] According to some embodiments of the present invention, referring to Figures 2-3, the workbench 10 has a mounting groove 11, and the bearing sleeve 33 of the adjustment module 30 is inserted through the mounting groove 11. A part of the bearing sleeve 33 is located inside the mounting groove 11, and the other part of the bearing sleeve 33 extends out from the opening of the mounting groove 11. The mounting groove 11 can provide an installation position for the bearing sleeve 33 of the adjustment module 30. When the bearing sleeve 33 is installed in the mounting groove 11, the mounting groove 11 can play a role in limiting the installation of the bearing sleeve 33, which helps the adjustment module 30 to be accurately positioned and installed on the workbench 10.

[0039] The upper end of the bearing sleeve 33 has an extension 331 extending in the radial direction. Above the workbench 10, there is a bump 12 protruding towards the extension 331. The extension 331 and the bump 12 are fixedly connected by fasteners, which can make the fixing method of the bearing sleeve 33 and the workbench 10 simple, and also improve the stability of the adjustment module 30 fixed to the workbench 10; when the adjustment module 30 is repaired or maintained later, the adjustment module 30 can be removed from the workbench 10 by disassembling the fasteners, which can make the disassembly method of the adjustment module 30 simple and easy to operate.

[0040] The mounting groove 11 has a through hole penetrating the bottom wall of the mounting groove 11. One end of the rotating shaft 31 can extend out through the through hole to be connected with the driving module 20; the other end of the rotating shaft 31 can extend out through the opening of the mounting groove 11 to be connected with the supply arm 40.

[0041] According to some embodiments of the present invention, referring to Figures 2-3 , the adjustment module 30 further includes a first gland 34 and a second gland 35. The first gland 34 and the second gland 35 are respectively fixed at both ends of the outer ring 322 of the bearing 32. Through the action of the first gland 34 and the second gland 35, the outer ring 322 of the bearing 32 can be fixed to the bearing sleeve 33; the first gland 34 and the second gland 35 are both detachably connected to the bearing sleeve 33, which is convenient for the installation and disassembly of the first gland 34 and the second gland 35 and the bearing sleeve 33.

[0042] The first gland 34 and the second gland 35 are respectively installed at both ends of the outer ring 322 of the bearing 32, which can effectively prevent external contaminants (such as dust and particles) from entering the interior of the bearing 32, reduce wear, and extend the service life. At the same time, the first gland 34 and the second gland 35 can also assist in maintaining the lubricant, ensuring the lubrication effect when the bearing 32 rotates, and further improving the stability and operating efficiency of the adjustment module 30.

[0043] Referring to Figures 2-3In a specific embodiment, a first extension plate 342 is provided on the circumference of the first gland 34. The first extension plate 342 abuts against the extension portion 331 of the bearing sleeve 33, and the first extension plate 342 and the extension portion 331 are fixedly connected by a first bolt 391, so that the first gland 34 can be fixed on the bearing sleeve 33. A sealing ring 382 is also provided between the first gland 34 and the extension portion 331, which is used to seal the assembly gap between the first gland 34 and the bearing sleeve 33, prevent external contaminants (such as dust and particles) from entering the interior of the bearing 32, reduce wear, and extend the service life.

[0044] A gasket 381 is also provided between the bump 12 of the workbench 10 and the extension portion 331, which is used to seal the assembly gap between the bearing sleeve 33 and the workbench 10, and prevent external contaminants (such as dust and particles) from entering the installation groove 11.

[0045] A second extension plate 351 is provided on the circumference of the second gland 35. The second extension plate 351 abuts against one end of the bearing sleeve 33, and the extension plate 351 and the bearing sleeve 33 are fixedly connected by a second bolt 392, so that the second gland 35 can be fixed on the bearing sleeve 33.

[0046] According to some embodiments of the present invention, with reference to Figures 2-3 , the adjustment module 30 further includes a locking member 36. The side wall of the rotating shaft 31 has a protruding portion 312 provided around the rotating shaft 31, and the locking member 36 is detachably installed on the rotating shaft 31. For example, the locking member 36 can be threadedly connected to the rotating shaft 31.

[0047] The protruding portion 312 and the locking member 36 are respectively fixed to the upper and lower ends of the inner ring 321 of the bearing 32. Through the action of the protruding portion 312 and the locking member 36, the inner ring 321 of the bearing 32 can be fixed to the rotating shaft 31, increasing the connection rigidity and stability between the rotating shaft 31 and the inner ring 321 of the bearing 32. This not only helps to ensure that the rotating shaft 31 can still maintain an accurate position during high-speed rotation or under force, but also can prevent the deviation of the rotating shaft 31 caused by vibration or external force, thereby improving the precise control ability of the entire liquid supply process.

[0048] According to some embodiments of the present invention, with reference to Figures 2-3 , the side wall of the rotating shaft 31 has an annular protrusion 311 provided around the rotating shaft. The annular protrusion 311 is provided above the protruding portion 312. The annular protrusion 311 has a sealing groove 3111 facing the bearing sleeve. The first gland 34 has a sealing block 341, and the sealing block 341 is located in the sealing groove 3111. With the cooperation of the sealing groove 3111 and the sealing block 341, a bent sealing structure is formed between the rotating shaft 31 and the first gland 34, and water or dust in the external environment is not easily introduced into the cooperation space between the rotating shaft 31 and the bearing sleeve 33.

[0049] According to some embodiments of the present utility model, referring to Figures 2-3 , the adjustment module 30 further includes a fixing member 37. There are two bearings 32, and the fixing member 37 is fixed between the inner rings 321 of the two bearings 32. By using two bearings 32, compared with the design of using a single bearing 32, it can provide a more uniform load distribution, enhance the smoothness of the rotation of the rotating shaft 31, and reduce vibration and wear. The two bearings 32 are respectively located at both ends of the rotating shaft 31 and jointly support the rotating shaft 31 to ensure the stability of the rotation of the rotating shaft 31. The fixing member 37 is installed between the inner rings 321 of the two bearings 32, which plays a role in connecting and fixing the two bearings 32 so that the two bearings 32 can work together without relative sliding or misalignment.

[0050] According to some embodiments of the present utility model, referring to Figure 1 , the bearing 32 is an angular contact bearing, and the angular contact bearing can bear both radial load and axial load at the same time. The angular contact ball bearing can bear a large one-way axial load, and the larger the contact angle, the greater the load-bearing capacity. The raceway surface of the outer ring of the angular contact bearing forms a certain contact angle with the bearing axis in one or two directions of the bearing, which enables the angular contact bearing to better bear the combined load.

[0051] According to some embodiments of the present utility model, referring to Figure 1 , the supply arm 40 includes a fixed bottom plate 41 and a protective cover, and the protective cover is detachably connected to the fixed bottom plate 41. A receiving cavity is defined between the protective cover and the fixed bottom plate 41, and a first pipeline 42 is arranged in the receiving cavity. The receiving cavity is designed to be closed, which can prevent moisture or dust in the external environment from entering the receiving cavity and can keep the first pipeline 42 clean; and after the protective cover is opened, the first pipeline 42 can be exposed, which is convenient for the operator to repair or replace the first pipeline 42.

[0052] The first pipeline 42 is communicated with the first nozzle, and the high-pressure water in the first pipeline 42 can be sprayed onto the wafer through the first nozzle. The first nozzle is detachably connected to the fixed bottom plate 41, and the first nozzle can also be removed from the fixed bottom plate 41, which is convenient for the installation and replacement of the first nozzle.

[0053] One end of the fixed bottom plate 41 is detachably connected to the rotating shaft 31, and the fixed bottom plate 41 and the rotating shaft 31 can be fixed by bolts 44; when the rotating shaft 31 rotates, it can drive the fixed bottom plate 41 to rotate, that is, drive the supply arm 40 to rotate.

[0054] A second pipeline is also provided in the accommodating chamber, and the second pipeline has a second nozzle. The accommodating chamber is of closed design, which can prevent moisture or dust in the external environment from entering the accommodating chamber, and can keep the second pipeline clean; and after opening the protective cover, the second pipeline can be exposed to the outside, which can facilitate the operator to repair or replace the second pipeline. The second nozzle is used to spray the grinding liquid toward the wafer, and the grinding liquid and high-pressure water sprayed toward the wafer are sprayed toward the wafer from different second nozzles and the first nozzle respectively, so that the grinding liquid and high-pressure water can be provided at the same time when processing the wafer.

[0055] Reference Figure 1 In a specific implementation, the wafer liquid supply device further includes a first liquid inlet pipe, which is connected to one end of the first pipeline 42, and an adapter 43 is provided between the first liquid inlet pipe and the first pipeline 42, for connecting the first liquid inlet pipe and the first pipeline 42. A through hole 411 is also provided at one end of the fixed bottom plate 41, and a channel 313 connected to the through hole 411 is provided inside the rotating shaft 31. The first liquid inlet pipe is located in the channel 313 and penetrates the through hole 411 to be connected to the adapter 43, and the second pipeline is also located in the channel 313 and penetrates the through hole 411.

[0056] According to some embodiments of the present invention, referring to Figure 1 The first nozzle is provided with a plurality of nozzles, and at least two nozzles have different spraying amounts. The first nozzle includes a first sub-nozzle and a second sub-nozzle, and the first sub-nozzle and the second sub-nozzle have different spraying amounts. The first sub-nozzle can spray a large flow of high-pressure water, and the second sub-nozzle can spray a small flow of high-pressure water. The first sub-nozzle and the second sub-nozzle can also be replaced with each other according to the use requirements of the flow rate, so as to achieve the purpose of adjusting the flow rate at some positions.

[0057] According to some embodiments of the present invention, referring to Figure 4 The drive module 20 includes a drive motor 21, a transmission 22 and a transmission structure 23. The transmission 22 is transmission-connected between the drive motor 21 and the transmission structure 23, and the transmission structure 23 is transmission-connected to the rotating shaft 31. The transmission 22 can adjust the speed of the drive motor 21 delivered to the transmission structure 23 to adjust the speed of the rotating shaft 31 and flexibly control the speed of the supply arm 40 during the spraying process. The transmission 22 can be a reducer to reduce the speed of the drive motor 21 delivered to the transmission structure 23; the transmission 22 can be a speed increaser to increase the speed of the drive motor 21 delivered to the transmission structure 23. The transmission structure 23 can be a gear, a pulley, a chain or other structure to ensure efficient, stable and accurate power transmission and reduce power loss and vibration.

[0058] The driving module 20 includes a driving motor 21, which can be directly connected to the rotating shaft 31 to drive the rotating shaft 31 to rotate, thereby saving space occupied by the driving module 20. For example, the driving motor 21 can be a direct drive motor.

[0059] Referring to Figure 4 a specific embodiment of Figure 4 , the transmission 22 is a speed reducer, the drive motor 21 can be rotatably connected to the speed reducer, and the speed reducer can reduce the rotational speed output by the drive motor 21. The transmission structure 23 can include a driving wheel 231, a transmission belt, and a driven wheel 232. The driving wheel 231 is connected to the speed reducer, the transmission belt is sleeved on the transmission shafts of the driving wheel 231 and the driven wheel 232, and the driven wheel 232 is connected to the rotating shaft 31.

[0060] When the supply arm 40 needs to rotate, the drive motor 21 is started. The speed reducer can reduce the rotational speed of the drive motor 21, transmit the rotational speed of the drive motor 21 to the driving wheel 231. When the driving wheel 231 rotates, power is transmitted to the driven wheel 232 under the action of the transmission belt, enabling efficient and smooth transmission of power. The driven wheel 232 can drive the rotating shaft 31 to rotate, and when the rotating shaft 31 rotates, it can drive the supply arm 40 to rotate, so as to realize the rotation of the supply arm 40.

[0061] In the description of this specification, the descriptions with reference to terms such as "some embodiments", "optionally", "further", or "some examples" etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0062] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A wafer liquid supply device, used in wafer processing equipment, characterized in that: The wafer processing equipment comprises a workbench, and the wafer liquid supply device comprises: A driving module, wherein the driving module is installed on the workbench; An adjusting module, wherein the adjusting module is detachably mounted on the workbench, the adjusting module comprises a rotating shaft, a bearing and a bearing sleeve, wherein the bearing is arranged on the outside of the rotating shaft, the bearing is located in the bearing sleeve, the bearing sleeve is detachably connected to the workbench, and the driving module is drivingly connected to one end of the rotating shaft; A supply arm is detachably connected to the other end of the rotating shaft, and the supply arm has a first nozzle and a second nozzle that spray toward the wafer.

2. The wafer liquid supply device according to claim 1, characterized in that: The workbench has a mounting groove, the bearing sleeve is inserted into the mounting groove, the upper end of the bearing sleeve has an extension portion extending in a radial direction, the workbench has a protrusion protruding toward the extension portion, and the extension portion and the protrusion are fixedly connected by fasteners.

3. The wafer liquid supply device according to claim 1, characterized in that: The regulating module further includes a first pressure cover and a second pressure cover, wherein the first pressure cover and the second pressure cover are respectively fixed at two ends of the outer ring of the bearing, and the first pressure cover and the second pressure cover are both detachably connected to the bearing sleeve.

4. The wafer liquid supply device according to claim 3, characterized in that: The adjustment module also includes a locking member, the side wall of the rotating shaft has a protrusion arranged around the rotating shaft, the locking member is detachably mounted on the rotating shaft, and the protrusion and the locking member are respectively fixed to two ends of the inner ring of the bearing.

5. The wafer liquid supply device according to claim 3, characterized in that: The side wall of the rotating shaft has an annular protrusion arranged around the rotating shaft, the annular protrusion has a sealing groove arranged toward the bearing sleeve, and the first pressure cover has a sealing block matched with the sealing groove.

6. The wafer liquid supply device according to any one of claims 1 to 5, characterized in that: The adjustment module further comprises a fixing member, two of the bearings are provided, and the fixing member is fixed between the inner rings of the two bearings.

7. The wafer liquid supply device according to claim 6, characterized in that: The bearing is an angular contact bearing.

8. The wafer liquid supply device according to claim 1, characterized in that: The supply arm includes a fixed base plate and a protective cover detachably connected to the fixed base plate, a accommodating chamber is defined between the protective cover and the fixed base plate, one end of the fixed base plate is detachably connected to the rotating shaft, a first pipeline and a second pipeline are arranged in the accommodating chamber, the first pipeline is connected to the first nozzle, the first nozzle is connected to the fixed base plate, the first nozzle is used to spray high-pressure water toward the wafer, the second pipeline is connected to the second nozzle, and the second nozzle is used to spray grinding liquid toward the wafer.

9. The wafer liquid supply device according to claim 8, characterized in that: There are a plurality of the first nozzles, and at least two of the first nozzles have different spraying amounts.

10. The wafer liquid supply device according to claim 1, characterized in that: The driving module includes a driving motor, a transmission and a transmission structure. The transmission is transmission-connected between the driving motor and the transmission structure, and the transmission structure is transmission-connected to the rotating shaft.