Clamp for semiconductor test
By providing elastic components on the second clamp of the semiconductor test fixture, the problem that the existing PDFN fixture cannot effectively clamp semiconductor devices of different thicknesses is solved, and the accuracy of the measurement data is achieved.
Patent Information
- Application Number
- CN202421906111.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-07
- Publication Date
- 2025-06-03
- Estimated Expiration
- 2034-08-07
AI Technical Summary
Existing PDFN fixtures cannot effectively clamp semiconductor devices of different thicknesses, resulting in poor contact, detection failure and inaccurate measurement data.
A semiconductor test fixture is designed. By providing an elastic member on the second clamp, the elastic member presses the semiconductor device when the first clamp and the second clamp rotate, ensuring that devices of different thicknesses are clamped.
This design effectively avoids poor contact between semiconductor devices and fixtures and detection failures, ensuring the accuracy of measurement data.
Smart Images
Figure CN222932579U_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present application relate to the field of semiconductor technology, and particularly to a fixture for semiconductor testing. Background Art
[0002] After the semiconductor device is packaged, a series of tests generally need to be carried out to test whether the chip design inside the package meets the customer requirements and whether the quality of the packaged product is qualified. Before the semiconductor device is sold, a sample is taken for an aging experiment, including a series of aging experiments such as high-temperature reverse bias test, high-temperature gate reverse bias test, high-temperature and high-humidity reverse bias test, etc. The semiconductor device test needs to be operated under the clamping of a special fixture. Different packaging modes and different semiconductor devices have different special fixtures.
[0003] PDFN (Passive-Down-Flux-on-Noodle) is a packaging form of semiconductor devices. Its characteristic is that the pins are hidden in the package, and it has a good isolation from the external environment, ensuring the long-term stability and safety of the product. For each size of chip, there is a dedicated fixture for testing the package body structure. The PDFN fixture is a fixture specifically for clamping the PDFN package body structure, and has an upper and a lower fixture structure. The upper and lower fixture structures are rotatably connected by a rotating shaft. The middle part of the lower fixture plate has contacts connected to the pins, and the performance of the semiconductor device to be tested is tested through an external test device.
[0004] The existing PDFN fixtures are only suitable for patch-type fixtures with a conventional fixed thickness. In actual use, due to different packaging manufacturers, the thicknesses of different package body products are different, or due to the influence of other factors, the thickness of the device increases or decreases, resulting in the fixture not clamping tightly or clamping too tightly, so that the contact is poor, the detection fails, and the measurement data is inaccurate. Utility Model Content
[0005] The purpose of the embodiments of the present application is to provide a fixture for semiconductor testing and a measuring device, which can ensure the accuracy of measurement data.
[0006] To solve the above technical problems, the embodiments of the present application provide a fixture for semiconductor testing. The fixture for semiconductor testing includes a first clamping plate and a second clamping plate. The first clamping plate is provided with contact pieces that contact the pins of the semiconductor device; the second clamping plate is rotatably connected to the first clamping plate, and an elastic member is provided on the surface of the second clamping plate opposite to the first clamping plate. When the first clamping plate and the second clamping plate rotate and clamp semiconductor devices with different thicknesses, the elastic member plays a role in pressing the semiconductor device.
[0007] The fixture for semiconductor testing provided by the embodiments of the present application is provided with an elastic member on the side of the second clamping plate opposite to the first clamping plate. During the relative rotation of the first clamping plate and the second clamping plate, the elastic member presses the semiconductor device. Due to the existence of the elastic force of the elastic member, semiconductor device packaging products with different thicknesses can be clamped. In this way, the occurrence of poor contact between the semiconductor device and the fixture and detection failure can be avoided, and the accuracy of measurement data can be ensured.
[0008] In some embodiments, the elastic member includes a spring provided on the second clamping plate.
[0009] In some embodiments, the elastic member further includes a protective sleeve, and the protective sleeve is provided on the side of the spring away from the second clamping plate.
[0010] In some embodiments, the elastic member further includes a hollow protrusion. The protrusion is provided on the second clamping plate and surrounds the spring. The protrusion is provided with an outer snap ring, and the protective sleeve is provided with an inner snap ring. The inner snap ring is restricted by the outer snap ring to move within the protrusion.
[0011] In some embodiments, the distance that the protrusion protrudes from the second clamping plate is 2 mm.
[0012] In some embodiments, the second clamping plate is further provided with a recess, and the spring is provided in the recess.
[0013] In some embodiments, the depth of the recess is 2 mm, and the free length of the spring is 4.5 mm.
[0014] In some embodiments, the second clamping plate is further provided with a buckle, and the buckle is used to clamp the semiconductor device on the first clamping plate.
[0015] In some embodiments, the first clamping plate is further provided with a groove, and the contact piece is located in the groove.
[0016] In some embodiments, a temperature sensor is further provided in the groove. Description of the Drawings
[0017] One or more embodiments are exemplarily illustrated by the pictures in the corresponding drawings. These exemplary illustrations do not limit the embodiments. Elements with the same reference numerals in the drawings represent similar elements. Unless otherwise stated, the drawings in the figures do not constitute a proportional limitation.
[0018] Figure 1 It is a schematic side structure diagram of the second clamping plate of the fixture for semiconductor testing provided by some embodiments of the present application;
[0019] Figure 2 It is a schematic side structure diagram of the fixture for semiconductor testing provided by some embodiments of the present application;
[0020] Figure 3 It is a top view of one side of the elastic component installed on the second clamping plate of the fixture for semiconductor testing provided by some embodiments of the present application.
[0021] Explanation of reference numerals in the drawings: 11 - first clamping plate; 111 - contact piece; 112 - groove; 113 - temperature sensor; 12 - second clamping plate; 121 - elastic component; 1211 - spring; 1212 - protective sleeve; 1213 - protrusion; 1214 - outer snap ring; 1215 - inner snap ring; 122 - buckle; 123 - depression. Detailed implementation manners
[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the following will elaborate on the various implementation manners of the present application in conjunction with the accompanying drawings. However, those of ordinary skill in the art can understand that in the various implementation manners of the present application, many technical details are provided for readers to better understand the present application. However, even without these technical details and various changes and modifications based on the following implementation manners, the technical solutions claimed in the present application can still be implemented. The division of the following embodiments is for convenience of description and should not constitute any limitation to the specific implementation manners of the present application. The various embodiments can be combined and cross-referenced with each other on the premise of not being contradictory.
[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present application; the terms "including" and "having" and any variations thereof in the specification and claims of the present application and the above accompanying drawing descriptions are intended to cover non-exclusive inclusion.
[0024] In the description of the embodiments of the present application, technical terms such as "first" and "second" are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity, specific order, or primary-secondary relationship of the indicated technical features. In the description of the embodiments of the present application, "a plurality" means two or more unless otherwise specifically defined.
[0025] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral body; it can also be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.
[0026] After the semiconductor device is packaged, a series of tests are generally required to test whether the chip design inside the package meets the customer's requirements and whether the quality of the packaged product is qualified. Before the semiconductor device is sold, a sampling aging experiment is carried out, including a series of aging experiments such as high-temperature reverse bias test, high-temperature gate reverse bias test, and high-temperature and high-humidity reverse bias test. The semiconductor device test needs to be operated under the clamping of a special fixture. Different packaging modes and different semiconductor devices have different special fixtures.
[0027] PDFN (Passive-Down-Flux-on-Noodle) is a packaging form of semiconductor devices. Its characteristic is that the pins are hidden in the package, and it has a good isolation from the external environment, ensuring the long-term stability and safety of the product. For each size of chip, there is a dedicated package structure test fixture. The PDFN fixture is a fixture specifically for clamping the PDFN package structure, which has upper and lower fixture structures. The upper and lower fixture structures are rotationally connected by a rotating shaft. The middle part of the lower fixture plate has contacts connected to the pins, and the performance of the semiconductor device to be tested is tested through an external test device.
[0028] The existing PDFN fixtures are only suitable for patch-type fixtures with a conventional fixed thickness. In actual use, due to different packaging manufacturers, the thicknesses of different package products are different, or due to the influence of other factors, the thickness of the device increases or decreases, resulting in the fixture being clamped too loosely or too tightly, so that there is poor contact, detection failure, and inaccurate measurement data.
[0029] The fixture for semiconductor testing provided by this application is provided with an elastic member on the surface of the second clamping plate opposite to the first clamping plate. During the mutual rotation of the first clamping plate and the second clamping plate, the elastic member presses the semiconductor device. Due to the existence of the elastic force of the elastic member, semiconductor device packaging products with different thicknesses can be clamped. In this way, the occurrence of poor contact between the semiconductor device and the fixture and detection failure can be avoided, and the accuracy of the measurement data can be ensured.
[0030] The following combines Figure 1 、 Figure 2 With Figure 3 To illustrate the fixture for semiconductor testing provided by some embodiments of this application.
[0031] As Figure 2 Shown, the fixture for semiconductor testing provided by some embodiments of this application includes a first clamping plate 11 and a second clamping plate 12. The first clamping plate 11 is provided with a contact piece 111 that contacts the pins of the semiconductor device; the second clamping plate 12 is rotationally connected to the first clamping plate 11, and an elastic member 121 is provided on the surface of the second clamping plate 12 opposite to the first clamping plate 11. When the first clamping plate 11 and the second clamping plate 12 rotate and clamp semiconductor devices with different thicknesses, the elastic member 121 plays a role in pressing the semiconductor device.
[0032] It should be noted that the fixture clamps the semiconductor device by the rotation of the first clamping plate 11 and the second clamping plate 12. One side of the first clamping plate 11 and the second clamping plate 12 is connected by a rotating shaft, and the other side can rotate freely. There are multiple contact pieces 111. Multiple pins of the semiconductor device are in contact with the multiple contact pieces 111 on the first clamping plate 11. The contact pieces 111 apply power to the gate, source, and drain terminals of the chip through an external detection device, so as to detect whether the chip design inside the semiconductor device package meets the customer's requirements. An elastic member 121 is provided at the middle position of the surface of the second clamping plate 12 opposite to the first clamping plate 11. The elastic element in the elastic member 121 can be composed of a thermosetting elastomer, a thermoplastic elastomer, or a spring 1211. During the mutual rotation of the first clamping plate 11 and the second clamping plate 12, the elastic member 121 presses the semiconductor device. Due to the existence of the elastic force of the elastic member 121, semiconductor device package products with different thicknesses can be clamped.
[0033] The fixture for semiconductor testing provided by the embodiment of the present application sets the elastic member 121 on the surface of the second clamping plate 12 opposite to the first clamping plate 11. During the mutual rotation of the first clamping plate 11 and the second clamping plate 12, the elastic member 121 presses the semiconductor device. Due to the existence of the elastic force of the elastic member 121, semiconductor device package products with different thicknesses can be clamped. In this way, the occurrence of poor contact between the semiconductor device and the fixture and detection failure can be avoided, and the accuracy of measurement data can be guaranteed.
[0034] As Figure 1 shown, in some embodiments of the present application, the elastic member 121 includes a spring 1211 provided on the second clamping plate 12.
[0035] It should be noted that a recess 123 is provided at the middle position of the surface of the second clamping plate 12 opposite to the first clamping plate 11. The recess 123 can be cylindrical. One end of the spring 1211 is fixed on the bottom wall of the recess 123, and the other end is a free end and protrudes from the recess 123 for a certain distance. During the clamping process, the free end contacts the semiconductor device to be clamped. By using the elastic force of the spring 1211, the packages of semiconductor devices with different thicknesses can be clamped.
[0036] In some embodiments of the present application, the elastic member 121 further includes a protective sleeve 1212, and the protective sleeve 1212 is provided on the side of the spring 1211 away from the second clamping plate 12.
[0037] That is to say, the protective sleeve 1212 is fixed to the free end of the spring 1211, and the protective sleeve 1212 is in direct contact with the clamped semiconductor device. The protective sleeve 1212 can be made of a material with certain plasticity and softness such as plastic, which can protect the semiconductor device from being scratched by the spring 1211. The protective sleeve 1212 can be circular or square, and the size of the protective sleeve 1212 is larger than the diameter of the spring 1211. The size of the protective sleeve 1212 can be 3.7 mm (millimeters).
[0038] In some embodiments of the present application, the elastic member 121 further includes a hollow protrusion 1213. The protrusion 1213 is disposed on the second clamping plate 12 at a position outside the recess 123 and surrounds the spring 1211. An outer snap ring 1214 is provided on the protrusion 1213, and an inner snap ring 1215 is provided on the protective sleeve 1212. The inner snap ring 1215 is restricted by the outer snap ring 1214 to move within the protrusion 1213.
[0039] It should be noted that the protrusion 1213 can be made of the same material as the second clamping plate 11, and can be welded or thread-fixed to the second clamping plate 12. The protrusion 1213 can be circular or square, and the inner diameter of the protrusion 1213 is substantially the same as the size of the recess 123. The outer diameter of the protrusion 1213 is 5.1 mm. The outer snap ring 1214 on the protrusion 1213 is located on the outside of the protrusion 1213 and is an annular object with a hole in the middle. The spring 1211 passes through the outer snap ring 1214. The protective sleeve 1212 has a structure similar to a hat, with the top in contact with the semiconductor device, and the inner snap ring 1215 is located on the side wall equivalent to the brim. The protective sleeve 1212 passes through the outer snap ring 1214. When the spring 1211 is compressed to the maximum extent, the top of the protective sleeve 1212 is flush with the outer snap ring 1214. When the spring 1211 is in the natural state, the inner snap ring 1215 just snaps onto the inner wall of the outer snap ring 1214. The cooperation between the inner snap ring 1215 and the outer snap ring 1214 enables the spring 1211 to be compressed only within the cavity formed by the recess 123, the protrusion 1213, and the protective sleeve 1212.
[0040] In some embodiments of the present application, a recess 123 is further provided on the second clamping plate 12, and the spring 1211 is disposed in the recess 123.
[0041] It should be noted that the spring 1211 can also be directly disposed on the surface of the second clamping plate 12. At this time, the entire elastic member 121 protrudes from the second clamping plate, and the distance between the second clamping plate 12 and the first clamping plate 11 becomes larger, which is not conducive to clamping the semiconductor device. The spring 1211 is disposed in the recess 123, making the elastic member 121 more compact, facilitating clamping of the semiconductor device, and also reducing the overall size of the fixture.
[0042] In some embodiments of the present application, the protrusion 1213 protrudes from the second clamping plate 12 by a distance of 2 mm.
[0043] In some embodiments of the present application, the depth of the recess 123 is 2 mm, and the free length of the spring 1211 is 4.5 mm.
[0044] It should be noted that the distance by which the protrusion 1213 protrudes from the second clamping plate 12, that is, the height of the protrusion 1213, should not be too high. If the protrusion 1213 is too high, it will affect the overall size of the fixture. If the protrusion 1213 is too low, it will be difficult to manufacture and increase the cost. The depth of the recess 123 should not be too deep either. If the recess 123 is too deep, it will damage the structural strength of the first clamping plate 11 and easily cause fracture. If the recess 123 is too shallow, it will not provide enough installation space for the spring 1211. The free length of the spring 1211, that is, the longest length of the spring 1211 in the uncompressed state, is 4.5 mm. Subtracting the depth of the recess 123, which is 2 mm, and the height of the protrusion 1213, which is 2 mm, these two fixed and non-compressible dimensions, the compressible distance of the spring 1211 is 0.5 mm. The thickness difference of the semiconductor device packages produced by most manufacturers is within 0.5 mm. This size setting of the spring 1211 component meets the requirement of clamping the vast majority of semiconductor device packages.
[0045] In some embodiments of the present application, the second clamping plate 12 is further provided with a buckle 122, and the buckle 122 is used to clamp on the first clamping plate 11 to clamp the semiconductor device.
[0046] It should be noted that one side of the first clamping plate 11 and the second clamping plate 12 is connected by a rotating shaft, and the other side can rotate freely. The buckle 122 is provided on the freely movable side of the second clamping plate 12. When clamping the semiconductor device, the buckle 122 clamps on the first clamping plate 11, thereby clamping the semiconductor device.
[0047] In some embodiments of the present application, the first clamping plate 11 is further provided with a groove 112, and the contact piece 111 is located in the groove 112.
[0048] It should be noted that the groove 112 is used to place the semiconductor device package product to be detected, and the pins are in contact with the contact piece 111 to detect whether the various performances of the product meet the requirements.
[0049] In some embodiments of the present application, a temperature sensor 113 is further provided in the groove 112.
[0050] It should be noted that in some special tests, when the semiconductor is powered on for a long time under the clamping of the fixture, the chip will generate high temperature, and it is necessary to monitor the real-time temperature of the semiconductor device to be tested. For example, when conducting high-temperature and high-pressure experiments, the difference between the case temperature of the semiconductor device and the ambient temperature can be monitored in real time, and a series of tests such as observing the correlation between its temperature change and the result during avalanche testing. The temperature sensor 113 is directly in contact with the outer surface of the semiconductor device, and a small electronic display screen is installed on the outside of the fixture, and the temperature measured by the temperature sensor 113 is directly displayed on the display screen.
[0051] Those of ordinary skill in the art can understand that the above-described embodiments are specific examples for implementing the present application, and in actual applications, various changes can be made in form and details without departing from the spirit and scope of the present application.
Claims
1. A semiconductor test fixture, characterized in that: include: A first clamping plate is provided with contact pieces for contacting with pins of the semiconductor device; The second clamping plate is rotatably connected to the first clamping plate. An elastic component is provided on a side of the second clamping plate opposite to the first clamping plate. When the first clamping plate and the second clamping plate rotate and clamp semiconductor devices of different thicknesses, the elastic component plays a role in pressing the semiconductor devices.
2. The semiconductor test fixture according to claim 1, wherein: The elastic component includes a spring arranged on the second clamping plate.
3. The semiconductor test jig according to claim 2, wherein: The elastic component further comprises a protective cover, and the protective cover is arranged on a side of the spring away from the second clamping plate.
4. The semiconductor test jig according to claim 3, wherein: The elastic component further comprises a hollow protrusion, which is arranged on the second clamping plate and surrounds the spring, the protrusion is provided with an outer snap ring, the protective sleeve is provided with an inner snap ring, and the inner snap ring is restricted by the outer snap ring to move in the protrusion.
5. The semiconductor test jig according to claim 4, wherein: The protrusion protrudes from the second clamping plate by 2 mm.
6. The semiconductor test jig according to claim 2, wherein: The second clamping plate is also provided with a recess, and the spring is arranged in the recess.
7. The semiconductor test jig according to claim 6, wherein: The depth of the recess is 2 mm and the free length of the spring is 4.5 mm.
8. The semiconductor test jig according to claim 1, wherein: The second clamping plate is further provided with a buckle, and the buckle is used to clamp the semiconductor device on the first clamping plate.
9. The semiconductor test jig according to claim 1, wherein: The first clamping plate is also provided with a groove, and the contact piece is located in the groove.
10. The semiconductor test jig according to claim 9, wherein: A temperature sensor is also arranged in the groove.