Film cutting equipment and film cutting system

Abstract

The utility model discloses thin film cutting equipment and a thin film cutting system. The thin film cutting equipment comprises a rack which comprises a feeding station and a die cutting station; the cutting bearing table is movably arranged on the rack, the cutting bearing table can controllably move relative to the rack to pass through the feeding station and the die cutting station, a substrate assembly used for bearing a film is arranged on the cutting bearing table, and the substrate assembly is movably connected with the cutting bearing table; the die cutting forming mechanism is arranged on the rack and used for cutting the film; and the substrate shifting mechanism is arranged on the rack, and the substrate shifting mechanism can push the substrate assembly to move on the cutting bearing table. According to the thin film cutting equipment provided by the embodiment of the invention, the substrate shifting mechanism is configured, and when the number of times that the substrate assembly is subjected to stamping of the die cutting forming mechanism at the same position exceeds the preset number of times, the substrate shifting mechanism can push the substrate assembly to move relative to the cutting bearing table, so that an over-deep cutting trace is prevented from being formed on the substrate.

Description

Technical Field

[0001] This application relates to the technical field of battery manufacturing, and particularly to a film cutting device and a film cutting system. Background Art

[0002] During the processing and production of batteries, a film cutting device is required to cut films (such as proton membranes, adhesive films, etc.). Since the thickness of the film is very thin and the material is relatively soft, and the cutting shape of the film is also relatively complex, in the existing cutting process, the film usually needs to be laid on a flexible substrate to prevent the film from deforming and wrinkling during cutting.

[0003] However, since the substrate is usually made of a flexible material such as rubber, when the cutting tool module of the film cutting device cuts the film too many times at a fixed position, relatively deep cutting marks will be left on the substrate. Such relatively deep cutting marks will damage the flatness of the substrate surface, resulting in a reduction in the contact area between the film and the substrate and a weakening of the adhesion of the film, which is likely to reduce the die-cutting quality and even lead to die-cutting failure. Summary of the Utility Model

[0004] Embodiments of this application disclose a film cutting device and a film cutting system. After the die-cutting forming mechanism cuts the film a preset number of times, the position of the substrate assembly can be automatically adjusted to avoid excessive cutting marks on the substrate assembly and adhesion to the film, effectively improving the quality of film cutting.

[0005] To achieve the above object, in a first aspect, embodiments of this application disclose a film cutting device, including: a frame, the frame includes a loading station and a die-cutting station; a cutting carrier table, movably arranged on the frame, the cutting carrier table can be controllably moved relative to the frame to pass through the loading station and the die-cutting station, and a substrate assembly for carrying the film is arranged on the cutting carrier table, and the substrate assembly is movably connected to the cutting carrier table; a die-cutting forming mechanism, arranged on the frame, the die-cutting forming mechanism is used for cutting the film; a substrate shifting mechanism, arranged on the frame, the substrate shifting mechanism can push the substrate assembly to move on the cutting carrier table.

[0006] In a possible implementation manner of the first aspect, the substrate assembly includes: a bottom plate, movably connected to the cutting carrier table; a rubber pad, arranged on the bottom plate; at least two layers of adhesively bonded protective films, and the protective film at the bottom layer is pasted on the rubber pad.

[0007] In a possible implementation manner of the first aspect, a release coating is applied to the protective film facing away from the rubber pad.

[0008] In a possible implementation of the first aspect, the substrate assembly can move in a first direction or a second direction relative to the cutting support platform in the same horizontal plane, and the substrate shifting mechanism includes: a first pushing assembly, which can drive the substrate assembly to move in the first direction; and a second pushing assembly, which can drive the substrate assembly to move in the second direction.

[0009] In a possible implementation of the first aspect, the first pushing assembly includes: a first pushing block, the first pushing block can abut against a side of the substrate assembly away from the die-cutting station along the first direction; a first linear guide rail, which is arranged on the frame and extends along the first direction, and the first pushing block can slide on the first linear guide rail; a first driving member, which is connected to the first pushing block, and the first driving member drives the first pushing block to move along the first direction, so that the first pushing block pushes the substrate assembly to move along the first direction.

[0010] In a possible implementation of the first aspect, the second pushing assembly includes: a second push block, which can abut against one side of the substrate assembly along the second direction; a second linear guide rail, which is arranged on the frame and extends along the second direction, and the second push block can slide on the second linear guide rail; a second driving member, which is connected to the second push block, and the second driving member drives the second push block to move along the second direction, so that the second push block pushes the substrate assembly to move along the second direction.

[0011] In a possible implementation of the first aspect, the die-cutting and forming mechanism includes: a driving device; a tool assembly, which is transmission-connected to the output end of the driving device, and the tool assembly can, under the drive of the driving device, abut against the substrate assembly along the height direction of the film cutting device to cut the film; a guide device, which is arranged on the frame, and the guide device extends along the height direction. The tool assembly is movably connected to the guide device, and the guide device guides the movement of the tool assembly along the height direction.

[0012] In a possible implementation of the first aspect, the driving device includes: a first mounting plate, fixed to the frame motor, and disposed on the first mounting plate;

[0013] A crankshaft is connected to the driving end of the motor, and a journal of the crankshaft is drivingly connected to the tool assembly.

[0014] In a possible implementation of the first aspect, the tool assembly includes: a second mounting plate, movably disposed on the guide device, the second mounting plate is located on the side of the first mounting plate away from the motor, and the second mounting plate is drivingly connected to the journal of the crankshaft; and a cutter module, disposed on the second mounting plate.

[0015] In a possible implementation of the first aspect, the film cutting device further includes: an electrostatic generating device, which is arranged on the die-cutting and forming mechanism, and the electrostatic generating device is used to generate an electrostatic effect so that the film is adsorbed on the substrate assembly.

[0016] In a possible implementation of the first aspect, the electrostatic generating device includes: a fixed bracket disposed on the die-cutting and forming mechanism, the fixed bracket including an extension portion extending in the height direction; an electrostatic generator disposed at an end of the extension portion.

[0017] A second aspect of the embodiments of the present application further provides a film cutting system, including the film cutting device provided in any one of the embodiments of the first aspect of the present application.

[0018] In a possible implementation of the second aspect, the film cutting devices are configured to be at least two, and the two film cutting devices are arranged at intervals along a second direction; the substrate displacement mechanisms of the two film cutting devices share the same second driving member.

[0019] Compared with the prior art, the beneficial effects of the present application are:

[0020] The film cutting device provided in the embodiments of the present application is configured with a cutting carrier table, and the cutting carrier table can move to the die-cutting station where the die-cutting and forming mechanism is located to perform die-cutting operations on the film to be cut. A substrate assembly is movably connected to the cutting carrier table, and the film cutting device is further configured with a substrate displacement mechanism for pushing the substrate assembly. When the substrate assembly receives stamping from the die-cutting and forming mechanism at the same position for more than a preset number of times, the substrate displacement mechanism can push the substrate assembly to move relative to the cutting carrier table, so that the substrate assembly changes its position relative to the die-cutting and forming mechanism, avoiding the formation of too deep cutting marks on the substrate assembly, ensuring the surface flatness of the substrate assembly and reducing the risk of film cutting failure, and improving the quality and efficiency of film cutting.

[0021] The additional aspects and advantages of the present application will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present application. Description of the Drawings

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1 The front view of the film cutting device disclosed in the embodiments of the present application;

[0024] Figure 2 The side view of the film cutting device disclosed in the embodiments of the present application;

[0025] Figure 3 The attached view of the film cutting system disclosed in the embodiments of the present application;

[0026] Figure 4 The front view of the film cutting system disclosed in the embodiment of the present application;

[0027] Figure 5 The front view of the substrate assembly in the film cutting device disclosed in the embodiment of the present application;

[0028] Figure 6 The side view of the first pushing assembly in the film cutting device disclosed in the embodiment of the present application;

[0029] Figure 7 The front view of the electrostatic generating device in the film cutting device disclosed in the embodiment of the present application;

[0030] Figure 8 The schematic diagram of the electrostatic control module of the electrostatic generating device in the film cutting device disclosed in the embodiment of the present application.

[0031] Explanation of reference numerals:

[0032] 100 - Film cutting device; 10 - Frame; A - Loading station; B - Die cutting station; 20 - Cutting carrier table; 201 - Driving mechanism; 2011 - First lead screw; 2012 - Slide rail; 2013 - Slide block; 202 - Substrate assembly; 2021 - Bottom plate; 2022 - Rubber pad; 2023 - Protective film; 30 - Die cutting and forming mechanism; 301 - Driving device; 3011 - First mounting plate; 3012 - Motor; 3013 - Crankshaft; 302 - Tool assembly; 3021 - Second mounting plate; 3022 - Cutting tool module; 303 - Guiding device; 3031 - Guide post; 304 - Buffer assembly; 40 - Substrate shifting mechanism; 401 - First pushing assembly; 4011 - First push block; 4012 - First linear guide rail; 4013 - First driving member; 4014 - Second lead screw; 402 - Second pushing assembly; 4021 - Second push block; 4022 - Second linear guide rail; 4023 - Second driving member; 50 - Electrostatic generating device; 501 - Fixed bracket; 502 - Electrostatic generator; 503 - Electrostatic control module; 200 - Film cutting system. Detailed implementation manners

[0033] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0034] In this application, the orientation or positional relationship indicated by terms such as "upper" and "lower" is based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe this application and its embodiments, and are not used to limit that the indicated device, element, or component must have a specific orientation, or be constructed and operated in a specific orientation.

[0035] Moreover, in addition to being used to represent the orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0036] In addition, the terms "mounted", "arranged", "provided with", and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral structure; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, or there may be internal communication between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0037] In addition, terms such as "first" and "second" are mainly used to distinguish different devices, elements, or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements, or components. Unless otherwise specified, the meaning of "a plurality" is two or more.

[0038] The technical solution of this application will be further described below in conjunction with the embodiments and the drawings.

[0039] Please refer to Figure 1 and Figure 2 , Figure 1 is the front view of the film cutting device 100 disclosed in the embodiment of this application, Figure 2 is the side view of the film cutting device 100 disclosed in the embodiment of this application. The film cutting device 100 includes: a frame 10, and the frame 10 includes a loading station A and a die-cutting station B; a cutting carrier 20, movably arranged on the frame 10, and the cutting carrier 20 can be controllably moved relative to the frame 10 to pass through the loading station A and the die-cutting station B. A substrate assembly 202 for carrying the film is arranged on the cutting carrier 20, and the substrate assembly 202 is movably connected to the cutting carrier 20; a die-cutting and forming mechanism 30, arranged on the frame 10, and the die-cutting and forming mechanism 30 is used for cutting the film; a substrate shifting mechanism 40, arranged on the frame 10, and the substrate shifting mechanism can push the substrate assembly 202 to move on the cutting carrier 20.

[0040] The film cutting device 100 may include a first direction X and a second direction Y in a horizontal plane, and the second direction Y may intersect the first direction X. In some examples, the second direction Y may be perpendicular or approximately perpendicular to the first direction X. It can be understood that the second direction Y may be "approximately perpendicular" to the first direction X, that is, the included angle between the second direction Y and the first direction X may be approximately equal to 90°, such as 88°, 89°, 91°, or 92°, etc.

[0041] Meanwhile, the height direction Z of the film cutting device 100 may intersect the plane where the first direction X and the second direction Y are located. The height direction Z may be perpendicular or approximately perpendicular to the plane where the first direction X and the second direction Y are located. It can be understood that the height direction Z may be "approximately perpendicular" to the plane where the first direction X and the second direction Y are located, that is, the included angle between the height direction Z and the plane where the first direction X and the second direction Y are located may be approximately equal to 90°, such as 88°, 89°, 91°, or 92°, etc.

[0042] The film cutting device 100 includes a frame 10. The frame 10 is the main support structure of the film cutting device 100, providing stable structural support for the mechanisms and devices in the film cutting device 100. Optionally, the frame 10 can be made of a material with a certain structural strength.

[0043] The cutting carrier table 20 of the film cutting device 100 is movably arranged on the frame 10, and the cutting carrier table 20 can be controlled to slide relative to the frame 10. A driving mechanism 201 for driving the cutting carrier table 20 may also be configured on the frame 10 to drive the cutting carrier table 20 to slide relative to the frame 10.

[0044] As Figure 3 shown, the frame 10 includes a loading station A for loading and a die-cutting station B for cutting the film. The loading station A and the die-cutting station B are arranged at intervals along the first direction X. The cutting carrier table 20 can reciprocate along the first direction X under the drive of the driving mechanism 201 to pass through the loading station A and the die-cutting station B. When the driving mechanism 201 drives the cutting carrier table 20 to move to the loading station A, the film to be cut can be loaded onto the cutting carrier table 20, and then the driving mechanism 201 drives the cutting carrier table 20 to move to the die-cutting station B for film cutting processing.

[0045] Optionally, the driving mechanism 201 can be a servo motor or a cylinder. The output end of the driving mechanism 201 can be connected to the first lead screw 2011 through a coupling, and the nut connected to the cutting carrier table 20 is slidably engaged with the first lead screw 2011, so as to realize the reciprocating movement of the cutting carrier table 20 along the first direction X under the drive of the driving mechanism 201.

[0046] Optionally, a slide rail 2012 may be further provided on the frame 10, and a slider 2013 may be slidably provided on the slide rail 2012, and the slider 2013 is connected to the cutting platform 20 to ensure that the cutting platform 20 slides along the first direction X stably and accurately.

[0047] The die-cutting and forming mechanism 30 is disposed on the frame 10, and the die-cutting and forming mechanism 30 includes a movable tool assembly 302. The die-cutting and forming mechanism 30 can be located above the cutting platform 20 along the height direction Z, so that when the cutting platform 20 moves to the die-cutting station B, the tool assembly 302 can move toward the cutting platform 20 to punch and cut the film.

[0048] The substrate assembly 202 is used to directly support the film to be cut, and the substrate assembly 202 is flexible, so when the cutter assembly 302 cuts the film, the cutter assembly 302 presses the film. The substrate assembly 202 will be slightly deformed, thereby reducing the flexibility of the substrate assembly 202 to ensure that the cut film has a smooth edge and an intact shape.

[0049] The substrate assembly 202 is movably disposed on the cutting platform 20. In this way, the substrate assembly 202 can move in a horizontal plane relative to the cutting platform 20. When the die-cutting and forming mechanism 30 punches and cuts on the substrate assembly 202 for more than a preset number of times, the substrate assembly 202 can be controllably moved on the cutting platform 20 to avoid the die-cutting and forming mechanism 30 repeatedly punching the same position of the substrate assembly 202, resulting in too deep cutting marks, which will damage the flatness of the substrate assembly 202 and affect the cutting quality of the film by the die-cutting and forming mechanism 30.

[0050] like Figure 3 and Figure 4 As shown, the substrate shifting mechanism 40 can be directly or indirectly disposed on the frame 10. The substrate shifting mechanism 40 can push the substrate assembly 202 to move relative to the cutting stage 20 in a horizontal plane to adjust the position of the substrate assembly 202 relative to the cutting stage 20.

[0051] Exemplarily, when the tool assembly 302 punches the same position of the substrate assembly 202 more than 20 times, the substrate shifting mechanism 40 pushes the substrate assembly 202 so that the substrate assembly 202 changes position relative to the tool assembly 302, thereby preventing the tool assembly 302 from punching further and further deepening the previous cutting marks, so as to maintain the surface flatness of the substrate assembly 202 as much as possible.

[0052] The process of the film cutting device 100 cutting the film is as follows: The cutting carrier table 20 moves to the loading station A under the drive of the drive mechanism 201, and film loading is completed at the loading station A, and the film is laid on the substrate assembly 202. Subsequently, the drive mechanism 201 drives the cutting carrier table 20 to move to the die-cutting station B to complete the film cutting at the die-cutting station B. After the finished film is unloaded, the cutting carrier table 20 moves to the loading station A again for loading. This cycle continues until the stamping of the substrate assembly 202 by the die-cutting and forming mechanism 30 at the same position reaches the preset number of times.

[0053] After the stamping of the substrate assembly 202 by the die-cutting and forming mechanism 30 at the same position reaches the preset number of times, when the cutting carrier table 20 moves to the loading station A for loading next time, the substrate displacement mechanism 40 first displaces the substrate assembly 202, then lays the film on the substrate assembly 202, and then the drive mechanism 201 drives the cutting carrier table 20 to move to the die-cutting station B. At this time, the stamping position of the die-cutting and forming mechanism 30 on the substrate assembly 202 changes, thereby avoiding the die-cutting and forming mechanism 30 from leaving too deep cutting marks on the substrate and damaging the surface flatness of the substrate.

[0054] In this way, the cutting carrier table 20 is configured in the film cutting device 100 provided in the embodiment of the present application. The cutting carrier table 20 can move to the die-cutting station B where the die-cutting and forming mechanism 30 is located to perform die-cutting operations on the film to be cut. The substrate assembly 202 is movably connected to the cutting carrier table 20. The film cutting device 100 is also configured with a substrate displacement mechanism 40 for pushing the substrate assembly 202. When the substrate assembly 202 receives the stamping of the die-cutting and forming mechanism 30 at the same position more than the preset number of times, the substrate displacement mechanism 40 can push the substrate assembly 202 to move relative to the cutting carrier table 20, so that the substrate assembly 202 changes its position relative to the die-cutting and forming mechanism 30, avoiding the formation of too deep cutting marks on the substrate assembly 202, ensuring the surface flatness of the substrate assembly 202 and reducing the risk of film cutting failure, and improving the quality and efficiency of film cutting.

[0055] To improve the service life of the substrate assembly 202, in some embodiments, as Figure 5 shown, the substrate assembly 202 includes: a bottom plate 2021, movably connected to the cutting carrier table 20; a rubber pad 2022, provided on the bottom plate 2021; at least two layers of adhesively bonded protective films 2023, pasted on the rubber pad 2022, and a release coating is applied to the protective film 2023 away from the rubber pad 2022.

[0056] The bottom plate 2021 is movably connected to the cutting platform 20, and the bottom plate 2021 has a certain supporting performance to provide structural support for the rubber pad 2022. The surface of the bottom plate 2021 can be anodized to improve its wear resistance and corrosion resistance. In addition, the bottom plate 2021 is also convenient for setting a connecting piece to achieve connection with the above-mentioned XY axis slide, so that the bottom plate 2021 can move relative to the cutting platform 20.

[0057] The bottom surface of the rubber pad 2022 can be closely fitted with the bottom plate 2021, and the rubber pad 2022 can be fixed to the bottom plate 2021 by double-sided tape or screws to prevent the rubber pad 2022 from shifting during the cutting process. The rubber pad 2022 can have an anti-static function and can also provide necessary buffering for the punching and cutting of the film by the cutter assembly 302, so that the film is protected from unnecessary damage during the cutting process, while ensuring the effect of film cutting and forming.

[0058] At least two layers of protective films 2023 are adhered to the surface of the rubber pad 2022 . The at least two layers of protective films 2023 are adhered to each other. The protective film 2023 at the lower layer is adhered to the rubber pad 2022 , and the protective film 2023 at the upper layer is used to contact the film to be cut.

[0059] When the displacement of the substrate assembly 202 along the first direction X or the second direction Y reaches the maximum, it means that it may not be suitable to continue to protect the surface flatness of the substrate assembly 202 by adjusting the position of the substrate assembly 202, and the protective film 2023 on the surface of the substrate assembly 202 may have reached the end of its service life. At this time, the protective film 2023 on the upper layer can be directly torn off from the protective film 2023 on the lower layer, and then a new layer of protective film 2023 can be re-pasted to conveniently replace the protective film 2023 to increase the service life of the rubber pad 2022.

[0060] Optionally, the protective films 2023 and the protective films 2023 and the rubber pad 2022 may be bonded together by double-sided tape.

[0061] In some embodiments, a heavy release agent is sprayed on the upper protective film 2023, that is, the protective film 2023 on the side facing away from the rubber pad 2022. The heavy release agent can prevent the die-cutting mechanism 30 from pressing the film too tightly against the substrate assembly 202 when cutting the film, which is conducive to the film waste formed after cutting being more easily removed by the waste discharge mechanism configured in the film cutting device 100, avoiding the adhesion of the film waste to the cut finished film, and ensuring that the position of the cut finished film will not be disturbed, thereby improving the cutting quality of the film and the working efficiency of the film cutting device 100.

[0062] It should be noted that the thickness of the protective film 2023 can be selected according to process requirements. For example, the protective film 2023 can be selected to use a PET film (Polyester Film), and the thickness of the PET film is about 0.2 mm. In this way, the protective film 2023 will neither affect the buffering effect of the rubber pad 2022 nor form a protection for the rubber pad 2022 to avoid frequent replacement of the rubber pad 2022.

[0063] As introduced above, the substrate assembly 202 can move relative to the cutting carrier 20 in the same horizontal plane along the first direction X or the second direction Y. In order to enable the substrate shifting mechanism 40 to push the substrate assembly 202 to move along the first direction X or the second direction Y, in some embodiments, as Figure 3 shown, the substrate shifting mechanism 40 includes a first pushing component 401 and a second pushing component 402. The first pushing component 401 can drive the substrate assembly 202 to move along the first direction X, and the second pushing component 402 can drive the substrate assembly 202 to move along the second direction Y.

[0064] Optionally, the substrate assembly 202 can be connected to the cutting carrier 20 through an XY-axis slide, so that the substrate assembly 202 can move relative to the cutting carrier 20 in the horizontal plane along the first direction X or the second direction Y.

[0065] The first pushing component 401 can push the substrate assembly 202 along the first direction X to cause the substrate assembly 202 to displace along the first direction X to adjust the position of the substrate assembly 202 relative to the cutting carrier 20. The second pushing component 402 can push the substrate assembly 202 along the second direction Y to cause the substrate assembly 202 to displace along the second direction Y to adjust the position of the substrate assembly 202 relative to the cutting carrier 20 along the second direction Y.

[0066] Exemplarily, when the tool assembly 302 punches the same position of the substrate assembly 202 more than 20 times, the substrate assembly 202 can be pushed along the first direction X by the first pushing component 401, or the substrate assembly 202 can be pushed along the second direction Y by the second pushing component 402, or both the first pushing component 401 pushes the substrate assembly 202 along the first direction X and the second pushing component 402 pushes the substrate assembly 202 along the second direction Y, so that the substrate assembly 202 changes its position relative to the tool assembly 302, avoiding the punching of the tool assembly 302 from further deepening the previous cutting marks, maintaining the surface flatness of the substrate assembly 202 as much as possible, reducing the damage rate of the substrate assembly 202, and improving the working efficiency of the film cutting device 100 at the same time.

[0067] In some embodiments, as Figure 6As shown in the figure, the first pushing component 401 includes: a first pushing block 4011, which can abut against one side of the substrate component 202 away from the die-cutting station B in the first direction X; a first linear guide rail 4012, which is arranged on the frame 10 and extends along the first direction X, and the first pushing block 4011 can slide on the first linear guide rail 4012; a first driving member 4013, which is connected to the first pushing block 4011, and the first driving member 4013 drives the first pushing block 4011 to move in the first direction X, so as to push the substrate component 202 to move in the first direction X.

[0068] The first pushing block 4011 is used to push the substrate component 202 to move. The first pushing block 4011 can be located on one side of the substrate component 202 away from the die-cutting station B in the first direction X. The first pushing block 4011 is connected to the first driving member 4013, and the first driving member 4013 can drive the first pushing block 4011 to gradually move from the feeding station A to the die-cutting station B, so as to push the substrate component 202 to gradually move.

[0069] Optionally, the first driving member 4013 can be a servo motor, a driving cylinder, etc. When the first driving member 4013 is a servo motor 3012, the first pushing component 401 further includes a second lead screw 4014. The second lead screw 4014 is usually connected to the servo motor through a coupling. The servo motor drives the second lead screw 4014 to rotate, and the second lead screw 4014 drives the first pushing block 4011 to perform a linear motion along the first linear guide rail 4012 through a nut matched with it.

[0070] Optionally, the first pushing block 4011 can be made of a metal material. The metal material has sufficient hardness and wear resistance to withstand the frictional force and impact force generated when pushing the substrate component 202.

[0071] Optionally, in order to avoid generating a large impact force when the first pushing block 4011 contacts the substrate component 202 and causing damage to the substrate component 202, a buffer structure can be coated or provided on the outside of the first pushing block 4011.

[0072] The first linear guide rail 4012 is arranged on the frame 10 and extends along the first direction X. The first pushing block 4011 is movably connected to the first linear guide rail 4012, so as to ensure that the first pushing block 4011 can always move along the first direction X, so as to ensure that the moving path of the substrate component 202 has accurate directivity.

[0073] The first linear guide rail 4012 is arranged on the frame 10 and can be arranged corresponding to the loading station A. In order to reasonably utilize the space on the frame 10, the first push block 4011 is constructed with a groove facing the die-cutting station B, and the groove can accommodate a part of the cutting carrier 20. In this way, when the first push block 4011 pushes the substrate assembly 202 along the first direction X, it can avoid the cutting carrier 20 below the substrate assembly 202 to prevent interference with the cutting carrier 20.

[0074] It should be noted that the movement path of the first push block 4011 is correlated with the length of the substrate assembly 202 along the first direction X. When the first push block 4011 reaches the first extreme position, the substrate assembly 202 may be covered with cutting marks along the first direction X. At this time, it may be necessary to tear off the uppermost protective film 2023 of the substrate assembly 202 to replace it with a new one.

[0075] In some embodiments, as Figure 3 shown, the second pushing component 402 includes: a second push block 4021, which can abut against one side of the substrate assembly 202 along the second direction Y; a second linear guide rail 4022, arranged on the frame 10 and extending along the second direction Y, and the second push block 4021 can slide on the second linear guide rail 4022; a second driving member 4023, connected to the second push block 4021, and the second driving member 4023 drives the second push block 4021 to move along the second direction Y so that the second push block 4021 pushes the substrate assembly 202 to move along the second direction Y.

[0076] The second push block 4021 is used to push the substrate assembly 202 to move, and the second push block 4021 can be located on one side of the substrate assembly 202 along the second direction Y. The second push block 4021 is connected to the second driving member 4023, and the second driving member 4023 can drive the second push block 4021 to gradually move along the second direction Y.

[0077] Optionally, the second driving member 4023 can be a servo motor, a driving cylinder, etc. When the second driving member 4023 is a servo motor, the second pushing component 402 further includes a lead screw. Usually, the lead screw is connected to the servo motor through a coupling. The servo motor drives the lead screw to rotate, and the lead screw then drives the second push block 4021 to perform a linear motion along the second linear guide rail 4022 through a nut matched with it.

[0078] Optionally, the second push block 4021 can be made of a metal material, and the metal material has sufficient hardness and wear resistance to withstand the frictional force and impact force generated when pushing the substrate assembly 202.

[0079] Optionally, in order to prevent the second push block 4021 from generating a large impact force when contacting the substrate assembly 202 and causing damage to the substrate assembly 202 , a buffer structure may be coated or provided on the outside of the second push block 4021 .

[0080] The second linear guide rail 4022 extends along the second direction Y, and the second push block 4021 is movably connected to the second linear guide rail 4022, thereby ensuring that the second push block 4021 can always move along the second direction Y, so as to ensure that the moving path of the substrate assembly 202 has precise directionality.

[0081] The second linear guide rail 4022 can be disposed outside the frame 10 and corresponding to the loading station A. The second push block 4021 is configured with a groove facing the die-cutting station B, and the groove can accommodate a portion of the cutting platform 20, so that when the second push block 4021 pushes the substrate assembly 202 along the second direction Y, the cutting platform 20 below the substrate assembly 202 can be avoided to avoid interference with the cutting platform 20.

[0082] It should be noted that the moving path of the second push block 4021 is correlated with the length of the substrate assembly 202 along the second direction Y. When the second push block 4021 reaches the second extreme position, the substrate assembly 202 along the second direction Y may be covered with cutting marks. At this time, it may be necessary to tear off the top protective film 2023 of the substrate assembly 202 and replace it with a new protective film 2023.

[0083] In order to realize the die-cutting and forming mechanism 30 to cut the film, in some embodiments, as Figure 1 , Figure 3 and Figure 4 As shown, the die-cutting and forming mechanism 30 includes: a driving device 301; a tool assembly 302, which is transmission-connected to the output end of the driving device 301, and the tool assembly 302 can, under the drive of the driving device 301, abut against the substrate assembly 202 along the height direction Z of the film cutting device 100 to cut the film; a guide device 303, which is arranged on the frame 10, and the guide device 303 extends along the height direction Z. The tool assembly 302 is movably connected to the guide device 303, and the guide device 303 guides the movement of the tool assembly 302 along the height direction Z; a buffer assembly 304, which abuts between the cutting tool assembly 302 and the frame 10 of the film cutting device 100, and the buffer assembly 304 is used to reset the tool assembly 302 to the initial position along the height direction Z.

[0084] The driving device 301 is used to drive the tool assembly 302 to reciprocate along the height direction Z of the film cutting device 100 to punch and cut the film to be cut on the substrate assembly 202. The driving device 301 is used to drive the tool assembly 302 to reciprocate along the height direction Z to cut the film.

[0085] To ensure the directivity of the reciprocating movement of the tool assembly 302 in the height direction Z, a guiding device 303 is further configured in the film cutting device 100. The guiding device 303 is arranged on the frame 10 and extends along the height direction Z of the film cutting device 100. The tool assembly 302 is movably connected to the guiding device 303, so that it can always reciprocate in the height direction Z along the guiding device 303.

[0086] Optionally, a buffer assembly 304 can be further arranged between the frame 10 and the tool assembly 302. The buffer assembly 304 can provide a buffering force for the stamping and disassembling of the tool assembly 302 on the substrate assembly 202, so as to avoid damage to the film caused by excessive cutting force of the tool assembly 302.

[0087] In some embodiments, as Figure 1 and Figure 3 shown, the driving device 301 includes: a first mounting plate 3011, fixed to the frame 10; a motor 3012, arranged on the first mounting plate 3011; a crankshaft 3013, arranged on the first mounting plate 3011. The crankshaft 3013 is connected to the driving end of the motor 3012, and the journal of the crankshaft 3013 is drivingly connected to the tool assembly 302.

[0088] The driving device 301 includes a first mounting plate 3011, and the first mounting plate 3011 can be fixed on the frame 10. Exemplarily, as Figure 1 、 Figure 2 and Figure 3 shown, the first mounting plate 3011 can be arranged on the guiding device 303, so as to be fixed relative to the frame 10. For example, a plurality of first mounting holes can be formed on the first mounting plate 3011, and the guiding device 303 includes a plurality of guiding columns 3031. Each first mounting hole cooperates with the corresponding guiding column 3031, and the first mounting plate 3011 is stably mounted on the guiding mechanism through a fixing structure.

[0089] Optionally, the first mounting plate 3011 can be made of sheet metal, so that the first mounting plate 3011 has sufficient rigidity and stability to support and fix the crankshaft 3013.

[0090] The driving device 301 further includes a motor 3012 and a crankshaft 3013 connected to the output end of the motor 3012. The crankshaft 3013 can be connected to the output shaft of the motor 3012 through a coupling.

[0091] The motor 3012 is disposed on the first mounting plate 3011, and the crankshaft 3013 can rotate along with the motor 3012. The journal in the crankshaft 3013 can convert the rotational motion of the crankshaft 3013 into a linear reciprocating motion. The tool assembly 302 can be connected to the crankshaft 3013, and the linear motion direction of the journal can be along the height direction Z of the film cutting device 100, so that the tool assembly 302 abuts against the substrate assembly 202 to cut the film.

[0092] In some embodiments, as Figure 1 and Figure 3 shown, the tool assembly 302 includes: a second mounting plate 3021, movably disposed on the guiding device 303, the second mounting plate 3021 is located on the side of the first mounting plate 3011 away from the motor 3012, and one end of the reset assembly abuts against the second mounting plate 3021; a cutter module 3022, disposed on the second mounting plate 3021.

[0093] The tool assembly 302 includes a second mounting plate 3021, and the second mounting plate 3021 is located on the side of the first mounting plate 3011 away from the motor 3012. The second mounting plate 3021 is in driving connection with the journal of the crankshaft 3013. The second mounting plate 3021 includes a plurality of second mounting holes, and each second mounting hole is slidably connected to one of the guiding columns 3031 in the guiding device 303. In this way, when the journal of the crankshaft 3013 drives the second mounting plate 3021 to move reciprocally, the guiding column 3031 of the guiding device 303 can guide the moving path of the second mounting plate 3021 to ensure the accuracy of the film cutting position.

[0094] A cutter module 3022 is disposed on the second mounting plate 3021. The cutter module 3022 is located on the side of the second mounting plate 3021 facing the frame 10, and the cutting surface of the cutter module 3022 protrudes from the second mounting plate 3021 to ensure that the cutter module 3022 can abut against the substrate assembly 202.

[0095] Optionally, a buffer assembly 304 can be disposed between the second mounting plate 3021 and the fixing member disposed on the frame 10 to buffer the punching force of the cutter module 3022. The buffer assembly 304 can be a spring.

[0096] To ensure that the film can be stably adsorbed on the substrate assembly 202, in some embodiments, as Figure 1 , Figure 3 and Figure 7 shown, the film cutting device 100 is further configured with an electrostatic generating device 50. The electrostatic generating device 50 is disposed in the die-cutting and forming mechanism 30, and the electrostatic generating device 50 is used to generate an electrostatic effect to adsorb the film on the substrate assembly 202.

[0097] The static electricity generating device 50 can apply static electricity to the thin film and flatly adsorb the soft thin film onto the substrate assembly 202. After the thin film is cut, the static electricity applied by the static electricity generating device 50 can still adsorb the finished thin film with a complex shape and the thin film waste after forming onto the substrate assembly 202, and then the waste removal mechanism takes away the waste, and the finished thin film with a complex shape will not be disturbed, so as to avoid adverse effects on subsequent process lamination.

[0098] Exemplarily, when the cutting carrier table 20 is at the loading station A waiting for loading, the static electricity generating device 50 can be turned on, so that the thin film loaded on the substrate assembly 202 will be stably adsorbed on the substrate assembly 202, ensuring the position stability of the cutting carrier table 20 during the movement to the die-cutting station B, and also ensuring that the thin film will not shift on the substrate assembly 202 during the cutting process, so as to ensure the smooth progress of cutting.

[0099] Further, the static electricity generating device 50 includes: a fixed bracket 501, which is arranged on the die-cutting and forming mechanism 30; a static electricity generator 502, which is arranged on the fixed bracket 501, and the static electricity generator 502 is close to the cutting carrier table 20 along the height direction Z of the thin film cutting device 100.

[0100] The static electricity generating device 50 includes a fixed bracket 501. Specifically, the fixed bracket 501 can be arranged on the first mounting plate 3011 in the die-cutting and forming mechanism 30. Since the first mounting plate 3011 is fixedly installed on the frame 10, the first mounting plate 3011 can ensure the structural stability of the static electricity generating device 50.

[0101] Optionally, the fixed bracket 501 can include an extension part, and the extension part extends along the height direction Z of the thin film cutting device 100.

[0102] As Figure 7 and Figure 8 shown, the static electricity generating device 50 further includes a static electricity generator 502 and a static electricity control module 503 for controlling the operation of the static electricity generator. The static electricity generator 502 can generate static electricity that enables the thin film to closely adhere to the substrate assembly 202. The static electricity generator 502 is arranged at the end of the extension part of the fixed bracket 501. In this way, the static electricity generator 502 can be closer to the substrate assembly 202 to ensure the static electricity effect.

[0103] Exemplarily, when the cutting carrier table 20 is at the loading station A waiting for loading, the static electricity generating device 50 can be turned on, so that the thin film loaded on the substrate assembly 202 will be stably adsorbed on the substrate assembly 202, ensuring the position stability of the cutting carrier table 20 during the movement to the die-cutting station B, and also ensuring that the thin film will not shift on the substrate assembly 202 during the cutting process, so as to ensure the smooth progress of cutting.

[0104] The second aspect of the embodiments of the present application further provides a film cutting system 200, as Figure 3 and Figure 4 shown. The film cutting system 200 includes a film cutting device 100. It can be understood that the film cutting system 200 adopting the film cutting device 100 provided in the above embodiments has all the technical effects of the film cutting device 100 in the above embodiments, which will not be elaborated here.

[0105] Furthermore, the film cutting device 100 is configured to be at least two, and the two film cutting devices 100 are arranged at intervals along the second direction Y; the substrate displacement mechanisms 40 of the two film cutting devices 100 share the same second driving member 4023.

[0106] The at least two film cutting devices 100 are arranged at intervals along the second direction Y, and the second linear guide rails 4022 of the film cutting devices 100 are located in the middle of the two film cutting devices 100. Since the second linear guide rails 4022 are also arranged along the second direction Y, this provides the implementation conditions for the two film cutting devices 100 to share one second driving member 4023.

[0107] Each film cutting device 100 includes a second push block 4021, but the two second push blocks 4021 are driven by sharing one second driving member 4023, which can save one second driving member 4023. Since the working timing of the second push blocks 4021 of each film cutting device 100 may be different, therefore, the two second push blocks 4021 sharing one second driving member 4023 will not affect the working rhythm of the entire film cutting system 200, while ensuring the operation rate of the film cutting system 200, reducing the cost of the entire system.

[0108] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A film cutting device, characterized in that: include: A frame, the frame comprising a loading station and a die-cutting station; A cutting platform is movably arranged on the frame, the cutting platform can be controllably moved relative to the frame to pass through the loading station and the die-cutting station, a substrate assembly for carrying a film is arranged on the cutting platform, and the substrate assembly is movably connected to the cutting platform; A die-cutting and forming mechanism, arranged on the frame, and used for cutting the film; A substrate shifting mechanism is arranged on the frame, and the substrate shifting mechanism can push the substrate assembly to move on the cutting carrier.

2. The film cutting device according to claim 1, characterized in that: The substrate assembly comprises: A bottom plate, movably connected to the cutting support platform; A rubber pad, arranged on the bottom plate; At least two layers of protective films are bonded to each other, and the protective film at the bottom layer is bonded to the rubber pad.

3. The film cutting device according to claim 2, characterized in that: A release coating is coated on the protective film facing away from the rubber pad.

4. The film cutting device according to claim 2, characterized in that: The substrate assembly can move relative to the cutting platform in the same horizontal plane along a first direction or a second direction, and the substrate shifting mechanism includes: a first pushing component, wherein the first pushing component is capable of driving the substrate component to move along the first direction; A second pushing component is configured to drive the substrate component to move along the second direction, wherein the second direction intersects the first direction.

5. The film cutting device according to claim 4, characterized in that: The first pushing component comprises: a first push block, the first push block being capable of abutting against a side of the substrate assembly away from the die-cutting station along the first direction; A first linear guide rail, disposed on the frame and extending along the first direction, and the first push block can slide on the first linear guide rail; The first driving member is connected to the first pushing block, and the first driving member drives the first pushing block to move along the first linear guide rail, so that the first pushing block pushes the substrate assembly to move along the first direction.

6. The film cutting device according to claim 5, characterized in that: The second pushing component comprises: a second pushing block, the second pushing block being capable of abutting against one side of the substrate assembly along the second direction; A second linear guide rail, disposed on the frame and extending along the second direction, and the second push block can slide on the second linear guide rail; The second driving member is connected to the second pushing block, and the second driving member drives the second pushing block to move along the second linear guide rail, so that the second pushing block pushes the substrate assembly to move along the second direction.

7. The film cutting device according to any one of claims 1 to 6, characterized in that: The die-cutting and forming mechanism comprises: Drive device; A cutter assembly, the cutter assembly is drivingly connected to the output end of the driving device, and the cutter assembly can be driven by the driving device to abut against the substrate assembly along the height direction of the film cutting device to cut the film; A guide device is arranged on the frame, the guide device extends along the height direction, the tool assembly is movably connected to the guide device, and the guide device guides the movement of the tool assembly along the height direction.

8. The film cutting device according to claim 7, characterized in that: The driving device comprises: A first mounting plate, fixed to the frame; A motor, arranged on the first mounting plate; A crankshaft is connected to the driving end of the motor, and a journal of the crankshaft is drivingly connected to the tool assembly.

9. The film cutting device according to claim 8, characterized in that: The tool assembly comprises: A second mounting plate is movably disposed on the guide device, the second mounting plate is located on a side of the first mounting plate away from the motor, and the second mounting plate is drivingly connected to a journal of the crankshaft; The cutter module is arranged on the second mounting plate.

10. The film cutting device according to any one of claims 1 to 6, characterized in that: The film cutting device also includes: An electrostatic generating device is arranged on the die-cutting and forming mechanism, and is used to generate an electrostatic effect so that the film is adsorbed on the substrate assembly.

11. The film cutting device according to claim 10, characterized in that: The electrostatic generating device comprises: A fixed bracket, arranged on the die-cutting and forming mechanism, wherein the fixed bracket comprises an extension portion extending in a height direction; The electrostatic generator is arranged at the end of the extension portion.

12. A film cutting system, characterized in that: include: The film cutting device according to any one of claims 1 to 11.

13. The film cutting system according to claim 12, characterized in that: The film cutting devices are configured as at least two, and the two film cutting devices are arranged at intervals along the second direction; The substrate shifting mechanisms of the two film cutting devices share the same second driving member.

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