Reaction cavity cover plate and thin film deposition equipment
By designing the reaction chamber cover plate, gas through the cavity line is introduced into the reaction chamber using a gas conduit, the risk of gas leakage in the prior art is solved, and safe gas management and real-time monitoring are achieved.
Patent Information
- Application Number
- CN202421354466.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2023-12-15
- Filing Date
- 2024-06-13
- Publication Date
- 2025-06-03
- Estimated Expiration
- 2034-06-13
AI Technical Summary
The existing transparent cover plate cannot safely discharge gas in the through-lumen pipe position, resulting in the risk of gas leakage.
A reaction chamber cover plate is designed, including a transparent viewing window and a first air outlet of at least one through-cloud pipe, and the leaked through-cloud gas is introduced into the reaction chamber through a gas conduit to avoid gas leakage.
It effectively avoids the risk of gas leakage, ensures gas safety in the reaction chamber, and supports real-time monitoring and optical measurement.
Smart Images
Figure CN222935499U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of thin film deposition, in particular to a reaction chamber cover plate and a thin film deposition device. Background Art
[0002] The reaction chamber of a semiconductor thin film device is sealed and invisible during the process. However, it is necessary to observe the wafer transfer, ceramic component offset, etc. under high temperature conditions during this process. Therefore, the transparent cover plate not only provides the ability for real-time monitoring, but also supports key process steps such as optical measurement and lithography, and at the same time helps with maintenance and prevents contamination.
[0003] For the transparent cover plates in the prior art, although they can meet the observation conditions, gas cannot be safely discharged at the position of the through-chamber pipeline. Therefore, when there is residual gas in the gas pipeline or there is a human error in operation, there will be a risk of gas leakage.
[0004] In order to overcome the above-mentioned defects existing in the prior art, there is an urgent need in the art for a reaction chamber cover plate technology for introducing residual gas in the gas pipeline into the reaction chamber to avoid the danger caused by gas leakage. Summary of the Utility Model
[0005] The following gives a brief overview of one or more aspects to provide a basic understanding of these aspects. This overview is not an exhaustive survey of all contemplated aspects, and is neither intended to identify key or decisive elements of all aspects nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that follows.
[0006] In order to overcome the above-mentioned defects existing in the prior art, the utility model provides a reaction chamber cover plate and a thin film deposition device for introducing residual gas in the gas pipeline into the reaction chamber to avoid the danger caused by gas leakage.
[0007] Specifically, the reaction chamber cover plate provided according to the first aspect of the utility model includes: a cover plate body, on which there is a transparent observation window and at least one first air outlet of a through-chamber pipeline, wherein the observation window is used to observe the situation in the reaction chamber, and the through-chamber pipeline is used to transfer the through-chamber gas from below the reaction chamber to above the reaction chamber; and a gas guide pipe, the first end of which is connected to the first air outlet, and the second end of which is connected to the reaction chamber to introduce the through-chamber gas leaked from the first air outlet into the reaction chamber.
[0008] Further, in some embodiments of the present utility model, the reaction chamber is connected to an air extraction pump. At least one second air inlet is further provided on the cover body. The second end of the air guide pipe accesses the reaction chamber through the at least one second air inlet to introduce the cavity-passing gas leaked from the first air outlet into the reaction chamber.
[0009] Further, in some embodiments of the present utility model, the cavity cover further includes an air box, which is arranged below the reaction chamber and connected to the first air inlet of the cavity-passing pipeline, and is used for introducing process gas into the reaction chamber through the at least one first air outlet, the air guide pipe and the second air inlet when the user observes the situation in the reaction chamber through the observation window, so as to simulate the process environment in the reaction chamber.
[0010] Further, in some embodiments of the present utility model, the cavity cover further includes a baffle, which is arranged below the at least one second air inlet and is used for uniformly dispersing the cavity-passing gas introduced from the second air inlet into the reaction chamber to simulate the process environment in the reaction chamber.
[0011] Further, in some embodiments of the present utility model, the air box includes a plurality of air supply units and is connected to a plurality of the first air outlets arranged on the cover body through a plurality of the cavity-passing pipelines. The first end of the air guide pipe includes a plurality of interfaces, which are used for respectively connecting the first air outlets of at least one unused cavity-passing pipeline to introduce the cavity-passing gas leaked from the first outlet into the reaction chamber.
[0012] Further, in some embodiments of the present utility model, the cavity cover further includes: a travel switch pressure plate, which is arranged on the surface of the cover body and is aligned with the travel switch installed in the reaction chamber, and is used for releasing the interlock when the cover body closes or presses down the travel switch to allow the reaction chamber to transfer wafers.
[0013] Further, in some embodiments of the present utility model, the cavity cover further includes: a limit block, which is arranged on the side surface of the cover body and is used for positioning the cover body and the reaction chamber, so that the observation window of the cover body is aligned with the reaction chamber, the air guide pipe is aligned with the cavity-passing pipeline, and / or the travel switch pressure plate is aligned with the travel switch.
[0014] Further, in some embodiments of the present utility model, the cavity cover further includes: at least two handles, which are arranged on the edge of the upper surface of the cover body and are used for opening the cover body to debug its wafer transfer process.
[0015] Further, in some embodiments of the present utility model, the reaction chamber includes a plurality of chamber units. The cover body includes a corresponding number of cover units. The observation window and / or the first air outlet are provided on the plurality of cover units. The second air inlet is provided on any one of the cover units.
[0016] In addition, the thin film deposition apparatus provided by the second aspect of the present utility model includes: a reaction chamber for performing a thin film deposition reaction on a wafer therein; a through-chamber pipeline for transporting a through-chamber gas from below the reaction chamber to above the reaction chamber; and a reaction chamber cover as described in the first aspect of the present utility model for observing the situation in the reaction chamber and introducing the through-chamber gas leaking from the first air outlet of the through-chamber pipeline on the reaction chamber cover into the reaction chamber. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] After reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings, the above features and advantages of the present utility model can be better understood. In the drawings, the components are not necessarily drawn to scale, and components with similar relevant characteristics or features may have the same or similar reference numerals.
[0018] Figure 1 The split structure diagram of the thin film deposition apparatus provided by some embodiments of the present utility model is shown.
[0019] Figure 2 The top view schematic diagram of the reaction chamber cover provided by some embodiments of the present utility model is shown.
[0020] Figure 3 The front view schematic diagram of the reaction chamber cover provided by some embodiments of the present utility model is shown.
[0021] Figure 4 The reverse view schematic diagram of the reaction chamber cover provided by some embodiments of the present utility model is shown.
[0022] REFERENCE NUMERALS:
[0023] 10 Reaction chamber
[0024] 20 Chamber cover
[0025] 21 Observation window
[0026] 22 First air outlet
[0027] 23 Air duct
[0028] 24 Second air inlet
[0029] 25 Baffle
[0030] 26 Travel Switch Pressure Plate
[0031] 27 Travel Switch
[0032] 28 Limit Block
[0033] 29 Handle Detailed Embodiment
[0034] The following specific embodiments illustrate the implementation manners of the present utility model. Those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. Although the description of the present utility model will be introduced in conjunction with preferred embodiments, this does not mean that the features of this utility model are limited to this implementation manner. On the contrary, the purpose of introducing the utility model in conjunction with the implementation manner is to cover other alternatives or modifications that may be extended based on the claims of the present utility model. In order to provide a deep understanding of the present utility model, many specific details will be included in the following description. The present utility model can also be implemented without these details. In addition, in order to avoid confusing or obscuring the key points of the present utility model, some specific details will be omitted in the description.
[0035] In the description of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.
[0036] In addition, the "upper", "lower", "left", "right", "top", "bottom", "horizontal", and "vertical" used in the following description should be understood as the orientations shown in this section and the related drawings. This relative term is only for the convenience of description and does not represent that the device described needs to be manufactured or operated in a specific orientation, so it should not be understood as a limitation to the present utility model.
[0037] It can be understood that although the terms "first", "second", "third", etc. can be used here to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first component, region, layer, and / or part discussed below can be called the second component, region, layer, and / or part without departing from some embodiments of the present utility model.
[0038] As described above, although the transparent cover plate in the prior art can meet the observation conditions, it cannot safely discharge gas at the position of the cavity-piercing pipeline. Therefore, when there is residual gas in the gas pipeline or when personnel operate by mistake, there will be a risk of gas leakage.
[0039] In order to overcome the above-mentioned defects existing in the prior art, the present utility model provides a reaction cavity cover plate and a thin film deposition device, which are used to introduce residual gas in the gas pipeline into the reaction cavity to avoid danger caused by gas leakage.
[0040] In some non-limiting embodiments, the reaction cavity cover plate provided in the first aspect of the present utility model can be implemented in the thin film deposition device provided in the second aspect of the present utility model.
[0041] Specifically, please refer to Figures 1 to 2 . Figure 1 Fig. shows a split structure schematic diagram of a thin film deposition device provided according to some embodiments of the present utility model. Figure 2 Fig. shows a top view schematic diagram of a reaction cavity cover plate provided according to some embodiments of the present utility model.
[0042] As Figures 1 to 2 shown, the thin film deposition device includes a reaction cavity 10, a cavity-piercing pipeline (not shown), and a reaction cavity cover plate 20. The reaction cavity 10 can include a plurality of cavity units for performing parallel thin film deposition reactions on wafers therein. The cavity-piercing pipeline is used to transfer the cavity-piercing gas from below the reaction cavity 10 to above the reaction cavity 10. The reaction cavity cover plate 20 includes a corresponding number of a plurality of cover plate units for observing the situation in the reaction cavity 10 and introducing the cavity-piercing gas leaked from the first air outlet 22 into the reaction cavity 10.
[0043] Please further refer to Figures 2 to 4 . Figure 3 Fig. shows a front view schematic diagram of the cover plate of the reaction cavity 10 provided according to some embodiments of the present utility model. Figure 4 Fig. shows a reverse view schematic diagram of the cover plate of the reaction cavity 10 provided according to some embodiments of the present utility model.
[0044] As Figures 2 to 4As shown in the figure, the reaction chamber cover plate 20 provided by the first aspect of the present utility model includes a cover plate body and an air guide pipe 23. The cover plate body is provided with a transparent observation window 21 and at least one first air outlet 22 for a cavity-passing pipeline. Herein, the observation window 21 can be respectively arranged on each cover plate unit for observing the conditions of the corresponding cavity units in the reaction chamber 10. The cavity-passing pipeline is used to transmit the cavity-passing gas from the lower part of the reaction chamber 10 to the upper part of the reaction chamber 10. The first end of the air guide pipe 23 is connected to the first air outlet 22 of each cover plate unit located on the cover plate body, and its second end is connected to the reaction chamber 10 to introduce the cavity-passing gas leaked from the first air outlet 22 into the reaction chamber 10.
[0045] Further, in some embodiments of the present utility model, the reaction chamber 10 is connected to a suction pump. The cover plate body is further provided with at least one second air inlet 24. The second air inlet 24 is arranged on any one cover plate unit. The second end of the air guide pipe 23 is connected to the corresponding cavity unit of the reaction chamber 10 through at least one second air inlet 24 to introduce the cavity-passing gas leaked from the first air outlet 22 into the corresponding cavity unit of the reaction chamber 10.
[0046] In addition, the above-mentioned reaction chamber cover plate 20 further includes an air box (not shown), a baffle 25, a travel switch pressing plate 26, a limit block 28, and at least two handles 29.
[0047] Specifically, the air box is arranged below the reaction chamber 10 and is connected to the first air inlet 22 of the cavity-passing pipeline. When the user observes the conditions in the reaction chamber 10 through the observation window 21, process gas is introduced into the reaction chamber 10 through at least one first air outlet 22, the air guide pipe 23, and the second air inlet 24 to simulate the process environment in the reaction chamber 10.
[0048] Further, in some embodiments, the above-mentioned air box may include multiple gas supply units and is connected to multiple first air outlets 22 arranged on the cover plate body through multiple cavity-passing pipelines. Correspondingly, the first end of the air guide pipe 23 may include multiple interfaces for respectively connecting the first air outlets 22 of at least one unused cavity-passing pipeline to introduce the cavity-passing gas leaked from the first air outlet 22 into the reaction chamber 10.
[0049] In addition, the baffle 25 is arranged below at least one second air inlet 24 for evenly dispersing the cavity-passing gas introduced from the second air inlet 24 into the reaction chamber 10 to simulate the process environment in the reaction chamber 10.
[0050] The travel switch pressing plate 26 is arranged on the lower surface of the cover plate body and is aligned with the travel switch 27 installed in the reaction chamber 10 for unlocking the interlock when the cover plate body is closed or presses down the travel switch 27 to allow the reaction chamber 10 to transfer wafers.
[0051] The limit block 28 is arranged on the side surface of the cover plate body and is used to position the cover plate body and the reaction cavity 10, so that the observation window 21 of the cover plate body is aligned with the reaction cavity 10, the air guide pipe 23 is aligned with the cavity-passing pipeline, and / or the travel switch pressing plate 26 is aligned with the travel switch 27.
[0052] The at least two handles 29 are arranged on the edge of the upper surface of the cover plate body and are used to open the cover plate body for debugging its wafer transfer process.
[0053] In summary, the reaction cavity cover plate 20 and the thin film deposition equipment provided by the present utility model can both be used to introduce residual gas in the gas pipeline into the reaction cavity 10 to avoid danger caused by gas leakage.
[0054] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions that are illustrated and described herein or that are not illustrated and described herein but are understandable to those skilled in the art.
[0055] The foregoing description of the disclosure has been provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A reaction chamber cover plate, characterized in that: include: a cover plate body, on which a transparent observation window and at least one first gas outlet of a through-cavity pipeline are provided, wherein the observation window is used to observe the situation in the reaction cavity, and the through-cavity pipeline is used to transmit the through-cavity gas from the bottom of the reaction cavity to the top of the reaction cavity; as well as A gas guide tube has a first end connected to the first gas outlet and a second end connected to the reaction chamber so as to guide the through-cavity gas leaked from the first gas outlet into the reaction chamber.
2. The cavity cover plate according to claim 1, characterized in that: The reaction chamber is connected to an air pump, and the cover body is provided with at least one second air inlet. The second end of the air guide pipe is connected to the reaction chamber via the at least one second air inlet to introduce the through-cavity gas leaked from the first air outlet into the reaction chamber.
3. The cavity cover plate according to claim 2, characterized in that: Also includes: The gas box is arranged below the reaction chamber and connected to the first gas inlet of the through-cavity pipeline, and is used to introduce process gas into the reaction chamber through the at least one first gas outlet, the gas duct and the second gas inlet when the user observes the situation in the reaction chamber through the observation window, so as to simulate the process environment in the reaction chamber.
4. The cavity cover plate according to claim 3, characterized in that: Also includes: The baffle is disposed below the at least one second gas inlet and is used to evenly disperse the cavity-penetrating gas introduced from the second gas inlet into the reaction chamber to simulate the process environment in the reaction chamber.
5. The cavity cover plate according to claim 3, characterized in that: The air box includes a plurality of air supply units, which are connected to a plurality of the first air outlets disposed on the cover body via a plurality of the through-cavity pipes. The first end of the gas guide tube includes a plurality of interfaces for respectively connecting to the first gas outlet of at least one of the inactivated through-cavity pipelines, so as to introduce the through-cavity gas leaked from the first gas outlet into the reaction chamber.
6. The cavity cover plate according to claim 1, characterized in that: Also includes: A travel switch pressing plate is arranged on the surface of the cover body and is aligned with the travel switch installed in the reaction chamber, and is used to release the interlock when the cover body is closed or the travel switch is pressed down to allow the reaction chamber to transmit film.
7. The cavity cover plate according to claim 6, characterized in that: Also includes: A limit block is arranged on the side of the cover body, and is used to position the cover body and the reaction chamber so that the observation window of the cover body is aligned with the reaction chamber, the air guide tube is aligned with the through-cavity pipeline, and / or the travel switch pressure plate is aligned with the travel switch.
8. The cavity cover plate according to claim 1, characterized in that: Also includes: At least two handles are arranged on the edge of the upper surface of the cover body and are used to open the cover body to debug its film transmission process.
9. The cavity cover plate according to claim 2, characterized in that: The reaction chamber includes a plurality of chamber units, and the cover body includes a corresponding number of cover units, wherein the observation window and / or the first air outlet is provided on a plurality of the cover units, and the second air inlet is provided on any one of the cover units.
10. A thin film deposition device, characterized in that: include: A reaction chamber, used for performing a thin film deposition reaction on the wafer therein; A through-cavity pipeline, used for transmitting the through-cavity gas from the bottom of the reaction cavity to the top of the reaction cavity; as well as The reaction chamber cover plate according to any one of claims 1 to 9 is used to observe the situation in the reaction chamber, and to introduce the through-cavity gas leaked from the through-cavity pipeline at the first gas outlet of the reaction chamber cover plate into the reaction chamber.