Horizontal hot filament CVD (Chemical Vapor Deposition) coating device

Abstract

The utility model belongs to the technical field of coating, and particularly relates to a horizontal type hot wire CVD (chemical vapor deposition) coating device, which comprises a coating chamber, a plurality of heating wires, a plurality of heating wires and a plurality of heating wires, the heating wires are arranged in the coating chamber, and the heating wires comprise a transverse heating wire and a longitudinal heating wire; wherein the transverse hot wires and the longitudinal hot wires are arranged in a laminated manner, and the projections of the transverse hot wires and the longitudinal hot wires on the heating plate are crossed; the horizontal hot filament CVD coating device comprises a coating chamber, a heating plate is arranged on the top surface of the coating chamber, a gas uniformizing chamber is formed between the heating plate and the top surface of the coating chamber, and a plurality of gas uniformizing holes are formed in the heating plate, so that the introduced process gas is more uniform by arranging the gas uniformizing chamber, and meanwhile, the process gas in the gas uniformizing chamber is preheated by arranging the heating plate; and finally, the laminated and crossed hot wire assemblies are arranged, so that a temperature field formed by the hot wire assemblies is more uniform, and the process gas is prevented from crystallizing and dropping slag in the chamber.

Description

Technical Field

[0001] The utility model belongs to the technical field of coating, and particularly relates to a horizontal hot-wire CVD coating device. Background Art

[0002] The preparation process of the existing heterojunction solar cells includes texturing and cleaning, deposition coating, TCO deposition, and screen printing electrodes; among them, for the deposition coating process, plasma-enhanced chemical vapor deposition equipment or hot-wire CVD (Hot-Wire CVD, hereinafter referred to as HWCVD) equipment is often used in the industry for deposition coating.

[0003] In the related art, the hot-wire CVD process uses a high-temperature catalytic material to thermally decompose the process gas reaching the surface of the catalytic material into atomic groups required for coating. The atomic groups diffuse and move to deposit the required film layer on the surface of the silicon wafer. The structure is simple, the deposition rate is high, and the cost is low; however, the coating uniformity of the above coating device is poor, and it is easy to crystallize and drop slag in the chamber.

[0004] Therefore, how to solve the problems of poor coating uniformity of the existing coating device and easy crystallization and dropping slag of the process gas in the chamber is a technical problem that those skilled in the art need to solve urgently.

[0005] It should be noted that the above information disclosed in this background art section is only used to understand the background art of the concept of this application. Therefore, the above description is not considered as information of the prior art. Summary of the Utility Model

[0006] The embodiments of the present disclosure provide at least a horizontal hot-wire CVD coating device.

[0007] In a first aspect, the embodiments of the present disclosure provide a horizontal hot-wire CVD coating device, including: a coating chamber, in which a heating plate with a plurality of hot-wire assemblies is arranged, and the hot-wire assembly includes: a horizontal hot wire and a vertical hot wire; the horizontal hot wire and the vertical hot wire are arranged in a laminated manner, and their projections on the heating plate form a cross to improve the uniformity of the temperature field; and a gas-uniforming chamber is formed between the heating plate and the top surface of the coating chamber, and a plurality of gas-uniforming holes are formed in the heating plate so that the preheated process gas can enter the temperature field uniformly; wherein, the process gas enters the gas-uniforming chamber, is preheated by the heating plate, then passes through the gas-uniforming holes, and is then pyrolyzed at high temperature by the hot-wire assembly to deposit a coating.

[0008] In one of the embodiments, the hot-wire assemblies in adjacent rows are arranged in a staggered manner.

[0009] In one of the embodiments, the inclination angles of all the horizontal hot wires are the same; and the inclination angles of all the vertical hot wires are the same.

[0010] In one embodiment, the horizontal hot wire and the vertical hot wire in a hot wire assembly are arranged orthogonally.

[0011] In one embodiment, the four sides of the heating plate are hoisted at the top of the coating chamber through corresponding fixing blocks to form the gas distribution chamber.

[0012] In one embodiment, a gas source is externally connected to the gas distribution chamber.

[0013] In one embodiment, the hot wire assemblies are connected in series through conductive sheets and then connected to a power supply; or each of the hot wire assemblies is connected to an independent power supply.

[0014] In one embodiment, the hot wire assembly further includes: a hot wire fixing block; the hot wire fixing block is arranged on the lower surface of the heating plate, and both the horizontal hot wire and the vertical hot wire are arranged on the hot wire fixing block.

[0015] In one embodiment, the coating chamber is provided with a feed port and a discharge port; a transmission device and a heat insulation plate are arranged in the coating chamber; wherein the transmission device is adapted to receive and convey the carrier plate; the two heat insulation plates are respectively located on both sides of the gas distribution chamber.

[0016] The beneficial effect of the present utility model is that the horizontal hot wire CVD coating device makes the process gas introduced into the temperature field more uniform by setting the gas distribution chamber, and at the same time, the heating plate is set to preheat the process gas in the gas distribution chamber and then make it enter the temperature field. Moreover, the hot wire assembly generating the temperature field adopts stacked and crossed horizontal hot wires and vertical hot wires, making the formed temperature field more uniform, thereby avoiding the crystallization and slagging of the process gas in the chamber.

[0017] Other features and advantages of the present utility model will be described in the following description, and part of them will be obvious from the description, or will be understood by implementing the present utility model. The purpose and other advantages of the present utility model are realized and obtained by the structures specifically pointed out in the description, the claims and the drawings.

[0018] In order to make the above-mentioned objects, features and advantages of the present utility model more obvious and understandable, specific preferred embodiments are hereby given, and detailed descriptions are made in conjunction with the accompanying drawings as follows. Description of the Drawings

[0019] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the following drawings are some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0020] Figure 1 Schematic cross-sectional structure diagram of a horizontal hot-wire CVD coating device provided by an embodiment of the present disclosure;

[0021] Figure 2 Schematic structure diagram of a heating plate with a hot-wire assembly provided by an embodiment of the present disclosure;

[0022] Figure 3 Schematic layout diagram of a hot-wire assembly provided by an embodiment of the present disclosure;

[0023] Figure 4 Schematic power supply structure diagram between hot-wire assemblies provided by an embodiment of the present disclosure;

[0024] Figure 5 Another schematic power supply structure diagram between hot-wire assemblies provided by an embodiment of the present disclosure;

[0025] Figure 6 Side view of a horizontal hot-wire CVD coating device provided by an embodiment of the present disclosure.

[0026] In the figure:

[0027] Coating chamber 1, feed inlet 11, discharge outlet 12;

[0028] Hot-wire assembly 2, horizontal hot-wire 21, vertical hot-wire 22, hot-wire fixing block 23;

[0029] Heating plate 3, gas homogenizing holes 31, fixing block 32;

[0030] Gas homogenizing chamber 4, transmission device 5, carrier plate 6, heat insulation plate 7, gas source 8, power supply 9. Detailed implementation manners

[0031] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Apparently, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0032] The following will describe in detail some embodiments of the present utility model with reference to the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments may be combined with each other.

[0033] As Figure 1As shown, at least one horizontal hot-wire CVD coating device is provided in an embodiment of the present disclosure, which includes: a coating chamber 1, in which a heating plate 3 with a plurality of hot-wire assemblies 2 is arranged, and the hot-wire assembly 2 includes: a horizontal hot wire 21 and a vertical hot wire 22; the horizontal hot wire 21 and the vertical hot wire 22 are arranged in a laminated manner, and their projections on the heating plate 3 form a cross to improve the uniformity of the temperature field; and a gas-uniforming chamber 4 is formed between the heating plate 3 and the top surface of the coating chamber 1, and a plurality of gas-uniforming holes 31 are formed in the heating plate 3 to enable the preheated process gas to enter the temperature field uniformly; wherein, the process gas enters the gas-uniforming chamber 4, is preheated by the heating plate 3, then passes through the gas-uniforming holes 31, and is then pyrolyzed at high temperature by the hot-wire assembly 2 to deposit a coating.

[0034] In this embodiment, the process gas introduced into the coating chamber 1 will first enter the gas-uniforming chamber 4, and then be uniformly discharged through the gas-uniforming holes 31 on the heating plate 3. Subsequently, the process gas is pyrolyzed at high temperature by the hot-wire assembly 2 to deposit the required film layer on the surface of the silicon wafer; wherein, the process gas passes through the gas-uniforming holes 31 after being preheated by the heating plate 3, and then passes through the laminated and cross-set hot-wire assembly 2, which can effectively prevent the process gas from crystallizing and dropping slag in the coating chamber 1 and improve the coating uniformity.

[0035] In some embodiments, the four sides of the heating plate 3 are hoisted at the top of the coating chamber 1 through corresponding fixing blocks 32 to form the gas-uniforming chamber 4; wherein, a gas source 8 is externally connected to the gas-uniforming chamber 4.

[0036] Specifically, the four sides of the gas-uniforming chamber 4 are all hermetically arranged, only the upper part is connected to a gas source 8, and a plurality of gas-uniforming holes 31 are formed in the lower heating plate 3.

[0037] In some embodiments, the inclination angles of the horizontal hot wires 21 are the same, and the inclination angles of the vertical hot wires 22 are the same; preferably, the horizontal hot wire 21 and the vertical hot wire 22 in a hot-wire assembly 2 are orthogonally arranged.

[0038] As Figure 2 shown, in some embodiments, the hot-wire assembly 2 further includes: a hot-wire fixing block 23; the hot-wire fixing block 23 is arranged on the lower surface of the heating plate 3; wherein, both the horizontal hot wire 21 and the vertical hot wire 22 are arranged on the hot-wire fixing block 23.

[0039] Specifically, the distance that the vertical hot wire 22 extends downward is less than the distance that the horizontal hot wire 21 extends downward, so as to present a laminated arrangement, and the vertical hot wire 22 and the horizontal hot wire 21 are cross-arranged, which can expand the working surface of the hot-wire assembly 2, improve the overall heating uniformity of the coating chamber 1, enable the process gas to fully react after passing through the working surface of the hot-wire assembly 2, and thus be uniformly deposited on the silicon wafer.

[0040] As Figure 3As shown, in some embodiments, the hot wire assemblies 2 in adjacent rows are arranged in a staggered manner; specifically, the staggered arrangement can increase the density of the hot wire assemblies 2 and improve the uniformity of the temperature field through which the process gas passes, thereby improving the coating uniformity.

[0041] As Figure 4 shown, in one application scenario, the hot wire assemblies 2 are connected in series through conductive sheets and then connected to a power supply 9.

[0042] As Figure 5 shown, in another application scenario, each hot wire assembly 2 is connected to an independent power supply 9.

[0043] As Figure 1 、 Figure 6 shown, in some embodiments, a feed port 11 is provided on one side of the coating chamber 1, and a discharge port 12 is provided on the other side. A hot wire assembly 2 is provided in the upper part of the coating chamber 1, and a transmission device 5 is provided in the lower part of the coating chamber 1; when the carrier plate 6 carrying the silicon wafer enters the feed port 11, it is received by the transmission device 5 and then conveyed to the coating area for coating. After the coating is completed, the transmission device 5 conveys the carrier plate 6 out of the discharge port 12; wherein, the transmission device 5 can be but is not limited to being composed of a plurality of conveyor rollers.

[0044] As Figure 1 shown, in some embodiments, a pair of heat insulation plates 7 are provided in the coating chamber 1, and the two heat insulation plates 7 are respectively located on both sides of the gas distribution chamber 4; the function of the heat insulation plates 7 is to reduce the heat loss in the coating chamber 1.

[0045] In summary, this horizontal hot wire CVD coating device makes the introduced process gas more uniform by setting the gas distribution chamber 4, and at the same time sets the heating plate 3 to preheat the process gas in the gas distribution chamber 4. Finally, by setting the stacked and cross hot wire assemblies 2, the temperature field formed by the hot wire assemblies 2 is made more uniform, thereby avoiding the crystallization and slagging of the process gas in the chamber.

[0046] In this article, when it is mentioned that the first component is located on the second component, this may mean that the first component can be directly formed on the second component, or a third component can be inserted between the first component and the second component. In addition, in the drawings, in order to effectively describe the technical content, the thickness of the components can be exaggerated or reduced.

[0047] In this document, when an element or layer is referred to as being "on," "joined to," "connected to," "attached to," or "coupled to" another element or layer, it can be directly on, joined, connected, attached, or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly joined to," "directly connected to," "directly attached to," or "directly coupled to" another element or layer, there may be no intervening elements or layers. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0048] In this document, example embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as "at least one of..." modify the entire list of elements when following a list of elements, rather than modifying individual elements in the list. For example, the expression "at least one of a, b, and c" should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0049] The terms used herein are only for describing specific exemplary configurations and are not intended to be limiting. As used herein, the singular articles "a," "an," and "the" may also be intended to include the plural forms, unless clearly stated otherwise herein. The terms "comprising," "including," and "having" are inclusive and thus specify the presence of the stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as necessarily requiring them to be performed in the particular order discussed or shown, unless specifically identified as an order of performance. Additional or alternative steps may be employed.

[0050] As used herein, phrases such as "in one embodiment," "according to one embodiment," "in some embodiments," etc., generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Thus, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," etc., are used "as an example, instance, or illustration." Any embodiment, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or superior to other embodiments, aspects, or designs. Instead, the use of the terms "example," "exemplary," etc., is intended to present concepts in a concrete manner.

[0051] It should be noted that like reference numerals and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further definition and explanation thereof is not required in subsequent figures.

[0052] In the description of the embodiments of the present utility model, unless otherwise clearly defined and limited, the terms "mounted", "connected", and "coupled" shall be construed broadly. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model may be understood according to specific circumstances.

[0053] In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present utility model. In addition, terms such as "first", "second" and other numerical terms used herein do not imply an order or sequence unless clearly indicated herein. Thus, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer or section discussed above may be referred to as the second element, component, region, layer or section.

[0054] Spatially relative terms, such as "inner", "outer", "beneath", "below", "lower", "above", "upper", etc., may be used herein for ease of description to describe the relationship of one element or feature to another element or feature as illustrated in the figures. In addition to the orientation depicted in the figures, spatially relative terms are intended to encompass different orientations of the device in use or operation. For example, if the device in the figures is turned over, an element described as "beneath" or "below" other elements or features will then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein are to be interpreted accordingly.

[0055] Based on the above inspiration from the ideal embodiments of the present utility model, through the above description, relevant workers can completely make various changes and modifications within the scope not deviating from the technical idea of this utility model. The technical scope of this utility model is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A horizontal hot wire CVD coating device, characterized in that: include: A coating chamber (1) is provided with a heating plate (3) having a plurality of hot wire assemblies (2), wherein the hot wire assemblies (2) comprise: transverse hot wires (21) and longitudinal hot wires (22); The transverse heating wire (21) and the longitudinal heating wire (22) are stacked and their projections on the heating plate (3) form a cross, so as to improve the uniformity of the temperature field; and A uniform gas chamber (4) is formed between the heating plate (3) and the top surface of the coating chamber (1), and a plurality of uniform gas holes (31) are provided on the heating plate (3) to allow the preheated process gas to enter the temperature field uniformly; The process gas enters the gas homogenizing chamber (4), is preheated by the heating plate (3), passes through the gas homogenizing holes (31), and is subsequently pyrolyzed at high temperature by the hot wire assembly (2) to deposit a coating.

2. The horizontal hot wire CVD coating device according to claim 1, characterized in that: Adjacent rows of hot wire assemblies (2) are arranged in a staggered manner.

3. The horizontal hot wire CVD coating device according to claim 1, characterized in that: The inclination angles of the transverse heating wires (21) are the same; and The inclination angles of the longitudinal heating wires (22) are the same.

4. The horizontal hot wire CVD coating device according to claim 1, characterized in that: A transverse heating wire (21) and a longitudinal heating wire (22) in a heating wire assembly (2) are arranged orthogonally.

5. The horizontal hot wire CVD coating device according to claim 1, characterized in that: The four sides of the heating plate (3) are hoisted on the top of the coating chamber (1) via corresponding fixing blocks (32) to form the uniform air chamber (4).

6. The horizontal hot wire CVD coating device according to claim 5, characterized in that: The gas homogenizing chamber (4) is externally connected to a gas source (8).

7. The horizontal hot wire CVD coating device according to claim 1, characterized in that: The heating wire components (2) are connected in series via conductive sheets and then connected to a power source (9); or Each of the hot wire assemblies (2) is connected to an independent power source (9).

8. The horizontal hot wire CVD coating device according to claim 1, characterized in that: The hot wire assembly (2) further comprises: a hot wire fixing block (23); The hot wire fixing block (23) is arranged on the lower surface of the heating plate (3), and the transverse hot wire (21) and the longitudinal hot wire (22) are both arranged on the hot wire fixing block (23).

9. The horizontal hot wire CVD coating device according to claim 1, characterized in that: The coating chamber (1) is provided with a material inlet (11) and a material outlet (12); The coating chamber (1) is provided with a transmission device (5) and a heat insulation plate (7); wherein The transmission device (5) is suitable for receiving and conveying the carrier plate (6); The two heat insulation plates (7) are respectively located on two sides of the gas homogenizing chamber (4).

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