Heating device for deposition equipment and deposition equipment comprising same
By designing a heating device containing a heat conducting medium in the deposition equipment, the problems of uneven heat distribution and poor heating efficiency of the existing heaters are solved, and uniform heating and efficient heating of the substrate to be deposited are achieved.
Patent Information
- Application Number
- CN202421810570.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-29
- Publication Date
- 2025-06-03
- Estimated Expiration
- 2034-07-29
AI Technical Summary
Existing heat transfers through heat conduction, resulting in uneven heat distribution and poor heating efficiency.
A heating device for a deposition device is designed, including a base and a thermally conductive element. The thermally conductive element includes a cavity, a lower thermally conductive surface, an upper heating surface and a thermally conductive medium. The heat conducting medium receives the heat energy supplied by the heating unit, and distributes the heat energy evenly through heat conduction and heat convection and transfers it to the substrate on the upper heating surface.
The uniform heating of the substrate to be deposited is achieved, the heating efficiency is improved, and the problem of uneven heat distribution is avoided.
Smart Images
Figure CN222935509U_ABST
Abstract
Description
Technical Field
[0001] The present utility model relates to a heating device, and particularly to a heating device for a deposition apparatus and a deposition apparatus including the same. Background Art
[0002] In a deposition process, a substrate to be deposited is usually heated by a heater to facilitate the deposition. The heater in the conventional technology wraps a heating coil with metal or ceramic, and transfers heat energy to the substrate through heat conduction. However, there are problems of uneven heat distribution and poor heating efficiency in transferring heat energy by the heating coil in a heat conduction manner.
[0003] Therefore, how to improve the deficiencies of uneven heat transfer distribution and poor heating efficiency of the heater in the conventional technology is an urgent problem to be solved by those skilled in the art. Summary of the Utility Model
[0004] The main object of the present utility model is to solve the problems of uneven heat transfer distribution and poor heating efficiency in the conventional technology.
[0005] To achieve the above object, the present utility model discloses a heating device for a deposition apparatus, which is disposed in a deposition chamber of a deposition apparatus. The heating device includes a base and a heat conducting element. The base includes a body, a receiving space disposed in the body, and a heating unit disposed in the receiving space. The body has an upper surface located above the receiving space. The heat conducting element is disposed on the base. The heat conducting element includes a cavity attached to the upper surface, an upper heating surface located outside the cavity and for disposing a substrate to be deposited, and a heat conducting medium received in the cavity. The heat conducting medium receives the heat energy supplied by the heating unit, and transfers the heat energy to the substrate on the upper heating surface through heat conduction and heat convection.
[0006] In one embodiment, the heat conducting element is disposed on the base along a vertical direction.
[0007] In one embodiment, the receiving space, the cavity and the substrate are stacked from bottom to top along the vertical direction.
[0008] In one embodiment, the heating unit, the heat conducting medium and the substrate are stacked from bottom to top along the vertical direction.
[0009] In one embodiment, the upper surface extends along a plane direction orthogonal to the vertical direction.
[0010] In one embodiment, the upper heating surface extends along a plane direction orthogonal to the vertical direction.
[0011] To achieve the above object, the present utility model further discloses a deposition device, including a deposition chamber, a base, and a heat conducting element. The base is disposed in the deposition chamber. The base includes a body, a receiving space formed in the body, and a heating unit disposed in the receiving space. The body has an upper surface located above the receiving space. The heat conducting element is disposed on the base. The heat conducting element includes a cavity attached to the upper surface, an upper heating surface located outside the cavity for disposing a substrate to be deposited, and a heat conducting medium received in the cavity. The heat conducting medium receives the heat energy supplied by the heating unit and transfers the heat energy to the substrate on the upper heating surface through heat conduction and heat convection.
[0012] In one embodiment, the deposition device is a physical vapor deposition device, a chemical vapor deposition device, an atomic layer deposition device, a molecular beam epitaxy device, or a pulsed laser deposition device.
[0013] In one embodiment, the receiving space, the cavity, and the substrate are stacked in a vertical direction from bottom to top.
[0014] In one embodiment, the heating unit, the heat conducting medium, and the substrate are stacked in a vertical direction from bottom to top. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic diagram of an embodiment of the present utility model.
[0016]
SYMBOL DESCRIPTION
[0017] 1: Heating device
[0018] 10: Base
[0019] 11: Body
[0020] 111: Upper surface
[0021] 12: Receiving space
[0022] 13: Heating unit
[0023] 20: Heat conducting element
[0024] 21: Cavity
[0025] 211: Space
[0026] 22: Lower heat conducting surface
[0027] 23: Upper heating surface
[0028] 24: Heat conducting medium
[0029] 30: Substrate
[0030] 31: Bottom surface
[0031] 90: Deposition equipment
[0032] 91: Deposition chamber
[0033] 92: Spray head
[0034] 93: Bottom Detailed implementation manners
[0035] The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. Unless otherwise specified in the context, the singular forms "a" and "the" used herein may also include the plural forms.
[0036] The directional terms used herein, such as up, down, left, right, front, back and their derivatives or synonyms, relate to the orientation of the elements in the drawings and do not limit the present utility model, unless otherwise clearly stated in the context.
[0037] Refer to Figure 1 , the present utility model discloses a heating device 1 for a deposition equipment, which is disposed in a deposition chamber 91 of a deposition equipment 90 and under a spray head 92 of the deposition equipment 90. The heating device 1 includes a base 10 and a heat conducting element 20, and the heat conducting element 20 is disposed on the base 10 along a vertical direction (the Y-axis direction in the drawing). In an example, the deposition equipment 90 may be a physical vapor deposition (PVD), chemical vapor deposition (CVD), atomic layer deposition (ALD), molecular beam epitaxy (MBE) equipment or pulsed laser deposition (PLD) equipment or other types of deposition equipment.
[0038] The base 10 includes a body 11, a receiving space 12 and a heating unit 13. The body 11 extends upward from a bottom 93 of the deposition chamber 91 along the vertical direction. In an embodiment, the body 11 is a cylinder. In other embodiments, the body 11 may have other geometric shapes according to the space size of the deposition chamber 91, configuration design, placement position or process requirements. The body 11 has an upper surface 111, and the upper surface 111 extends along a plane direction orthogonal to the vertical direction.
[0039] The receiving space 12 is formed in the body 11 and is used to receive the heating unit 13. The heating unit 13 heats the upper surface 111 through the body 11. The receiving space 12 is located under the upper surface 111 and forms a three-dimensional space along the vertical direction and the plane direction. The heating unit 13 is disposed in the receiving space 12. When heating, the heating unit 13 emits heat energy towards the upper surface 111 and heats the upper surface 111 through the body 11. In this example, the heating unit 13 may be an electric heating wire or a heating lamp.
[0040] The heat conducting element 20 includes a cavity 21, a lower heat conducting surface 22, an upper heating surface 23 and a heat conducting medium 24. The heat conducting element 20 is disposed on the base 10 and contacts the upper surface 111 of the base 10. The lower heat conducting surface 22 is located outside the cavity 21 and is disposed close to the base 10. The upper heating surface 23 is located outside the cavity 21 and is disposed away from the base 10. The lower heat conducting surface 22 and the upper heating surface 23 extend along the planar direction. The lower heat conducting surface 22 contacts and adheres to the upper surface 111 so that the cavity 21 receives the thermal energy emitted from the heating unit 13. The upper heating surface 23 is used for disposing a substrate 30 to be deposited. As shown in the figure, the accommodating space 12, the cavity 21 and the substrate 30 are stacked from bottom to top in the vertical direction. In other words, the heating unit 13, the heat conducting medium 24 and the substrate 30 are also stacked from bottom to top in the vertical direction.
[0041] The heat conducting medium 24 is accommodated within a space 211 of the cavity 21. The thermal energy supplied by the heating unit 13 is transferred from the upper surface 111 to the heat conducting medium 24 in the space 211 via the lower heat conducting surface 22. After receiving the thermal energy, the heat conducting medium 24 evenly disperses the thermal energy through heat conduction and heat convection, and then transfers it to the substrate 30 on the upper heating surface 23 to evenly heat a bottom surface 31 of the substrate 30. The heat conducting medium 24 is a fluid that can withstand high temperatures and can effectively transfer thermal energy. In this example, the heat conducting medium 24 is a heat-resistant oil.
[0042] In summary, the cavity of the heat conducting element of the present utility model is provided with the heat conducting medium, which can directly receive the thermal energy supplied by the heating unit, and the thermal energy is evenly dispersed in the heat conducting medium through heat conduction and heat convection, and then transferred to the substrate via the upper heating surface, achieving the purpose of uniform heating and being beneficial to the subsequent deposition process.
Claims
1. A heating device for a deposition device, arranged in a deposition chamber of a deposition device, characterized in that: include: A base, comprising a body, a containing space formed in the body, and a heating unit disposed in the containing space, wherein the body has an upper surface located above the containing space; as well as A heat-conducting element is disposed on the base, and the heat-conducting element includes a cavity attached to the upper surface, an upper heating surface located outside the cavity and used to set a substrate to be deposited, and a heat-conducting medium accommodated in the cavity. The heat-conducting medium receives the heat energy supplied by the heating unit and transfers the heat energy to the substrate on the upper heating surface through heat conduction and heat convection.
2. The heating device for deposition equipment according to claim 1, characterized in that: The heat conducting element is arranged on the base along a vertical direction.
3. The heating device for deposition equipment according to claim 2, characterized in that: The accommodating space, the cavity and the substrate are stacked from bottom to top along the vertical direction.
4. The heating device for deposition equipment according to claim 2, characterized in that: The heating unit, the heat-conducting medium and the substrate are stacked from bottom to top along the vertical direction.
5. The heating device for deposition equipment according to claim 2, characterized in that: The upper surface is extended along a plane direction orthogonal to the vertical direction.
6. The heating device for deposition equipment according to claim 2, characterized in that: The upper heating surface is extended along a plane direction orthogonal to the vertical direction.
7. A deposition device, characterized in that: include: a deposition chamber; A base is disposed in the deposition chamber, the base comprising a body, a containing space formed in the body, and a heating unit disposed in the containing space, the body having an upper surface located above the containing space; as well as A heat-conducting element is disposed on the base, and the heat-conducting element includes a cavity attached to the upper surface, an upper heating surface located outside the cavity and used to set a substrate to be deposited, and a heat-conducting medium accommodated in the cavity. The heat-conducting medium receives the heat energy supplied by the heating unit and transfers the heat energy to the substrate on the upper heating surface through heat conduction and heat convection.
8. The deposition device according to claim 7, characterized in that: The deposition equipment is a physical vapor deposition equipment, a chemical vapor deposition equipment, an atomic layer deposition equipment, a molecular beam epitaxy equipment or a pulse laser deposition equipment.
9. The deposition device according to claim 7, characterized in that: The accommodating space, the cavity and the substrate are stacked from bottom to top along a vertical direction.
10. The deposition device according to claim 7, characterized in that The heating unit, the heat-conducting medium and the substrate are stacked from bottom to top along a vertical direction.