Internal circulation channel type electroplating basket

Abstract

The utility model provides an internal circulation channel type electroplating basket, which relates to the technical field of electroplating, and comprises a body, the body is a cathode, the body comprises an access port, a circulation cavity channel and a circulation type electroplating cavity, the access port is communicated with the circulation type electroplating cavity, the circulation cavity channel is positioned in the circulation type electroplating cavity, two ends of the circulation cavity channel are communicated with the circulation type electroplating cavity, and the circulation type electroplating cavity is communicated with the circulation type electroplating cavity. The bottom end of the circulation cavity channel is close to the access port and is aligned with the access port; according to the internal circulation channel type electroplating basket, internal circulation type immersion electroplating can be carried out on chip electronic components with small sizes, and the electroplating quality of the components is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating, in particular to an inner circulation channel type electroplating basket. Background Art

[0002] Electroplating technology is widely used in the surface treatment of various metals and chip electronic components. With the continuous development of science and technology, people have higher and higher requirements for electronic terminal products, and the development of future electronic products will inevitably develop towards miniaturization and high reliability. The size of chip electronic components will also become smaller and smaller, only in this way can the requirements of miniaturization of the new generation of electronic products be met. Conventional basic component surface treatment uses vibration plating, barrel plating or centrifugal equipment to achieve nickel plating and tin plating.

[0003] However, the above-mentioned electroplating equipment cannot adapt to the surface treatment of small-sized chip electronic components, or may cause quality problems to the components. The main problems are as follows:

[0004] 1. When the vibration plating equipment is processing small-sized chip electronic components, the product floats or is separated from the medium, resulting in low efficiency or inability to process.

[0005] 2. When the roller plating equipment is processing smaller chip components, the mesh cloth on the outer periphery of the roller must be denser to ensure that the product does not leak out. This results in a large difference in the composition of the solution inside the roller and the solution in the external tank, making it impossible to achieve consistent processing of the product, and even causing serious quality problems.

[0006] 3. When the centrifugal plating equipment is processing chip components, since the chip electronic components are ceramic bodies, they must be rotated at high speed during centrifugal processing to stick the components to the cathode ring through centrifugal force in order to achieve the electroplating process, and this process will cause the chip electronic components.

[0007] Therefore, it is necessary to propose an internal circulation channel electroplating basket to perform internal circulation immersion electroplating on smaller chip electronic components, thereby improving the electroplating quality of the components. Utility Model Content

[0008] In order to solve the above problems, the utility model proposes an internal circulation channel type electroplating basket for performing internal circulation immersion electroplating on chip-type electronic components of smaller size, thereby improving the electroplating quality of the components.

[0009] The utility model is realized by the following technical solutions:

[0010] The present utility model provides an internal circulation channel type electroplating basket, which includes a body. The body serves as a cathode and comprises an inlet, a circulation channel, and a circulating electroplating cavity. The inlet is in communication with the circulating electroplating cavity. The circulation channel is located within the circulating electroplating cavity, and both ends of the circulation channel are in communication with the circulating electroplating cavity. The bottom end of the circulation channel is close to and aligned with the inlet.

[0011] Furthermore, the lower half of the circulating electroplating cavity converges towards the bottom end of the circulation channel.

[0012] Furthermore, a first diversion wall is provided in the lower half of the circulating electroplating cavity, and the first diversion wall is inclined towards the bottom end of the circulation channel.

[0013] Furthermore, a second diversion wall is provided at the bottom end of the circulation channel, and the second diversion wall is parallel to the first diversion wall.

[0014] Furthermore, the upper half of the circulating electroplating cavity diverges towards its two sides.

[0015] Furthermore, an M-shaped diversion part is provided at the top of the circulating electroplating cavity, and the middle of the M-shaped diversion part is aligned with the top end of the circulation channel.

[0016] Furthermore, a third diversion wall is provided on the M-shaped diversion part, and the third diversion wall is inclined towards one side of the circulating electroplating cavity.

[0017] Furthermore, a fourth diversion wall is provided at the top end of the circulation channel, and the fourth diversion wall is parallel to the third diversion wall.

[0018] Furthermore, a through groove is provided on the outer wall of the body, and the through groove is in communication with the upper half of the circulating electroplating cavity.

[0019] Advantages of the present utility model:

[0020] The present utility model electroplates small-sized chip electronic components by means of the internal circulation flow of electroplating solution. During electroplating, the body is connected to the cathode power supply. The electronic components need to be placed in the circulating electroplating cavity first. The electroplating solution enters from the inlet, then directly flows into from the bottom end of the circulation channel, flows out from the top end of the circulation channel to the circulating electroplating cavity for diversion, and then flows into from the bottom end of the circulation channel again, finally forming an internal circulation flow. The electronic components are electroplated in the circulating electroplating cavity. This is beneficial for the electronic components to be immersed in electroplating and improves the electroplating quality. In summary, the present internal circulation channel type electroplating basket can perform internal circulation type immersion electroplating on small-sized chip electronic components, effectively improving the electroplating quality of the components. Description of the Drawings

[0021] Figure 1 This is a cross-sectional view of the internal circulation channel type electroplating basket of the present utility model;

[0022] Figure 2 This is an overall schematic diagram of the internal circulation channel type electroplating basket of the present utility model.

[0023] The reference numerals are as follows:

[0024] Body 1, inlet 11, circulation channel 12, second diversion wall 121, fourth diversion wall 122, circulating electroplating cavity 13, first diversion wall 131, M-shaped diversion part 132, third diversion wall 1321, through slot 14, lid 15, connecting bolt 151. Specific embodiments

[0025] In order to more clearly and completely illustrate the technical solution of the present utility model, the present utility model will be further described below with reference to the accompanying drawings.

[0026] Please refer to Figure 1 - Figure 2 , the present utility model provides an internal circulation channel type electroplating basket, which includes a body 1. The body 1 is a cathode. The body 1 includes an inlet 11, a circulation channel 12, and a circulating electroplating cavity 13. The inlet 11 is communicated with the circulating electroplating cavity 13. The circulation channel 12 is located inside the circulating electroplating cavity 13. Both ends of the circulation channel 12 are communicated with the circulating electroplating cavity 13. The bottom end of the circulation channel 12 is close to and aligned with the inlet 11. A lid 15 is provided at the top of the body 1. After the lid 15 is opened, electronic components can be placed into the circulating electroplating cavity 13. A connecting bolt 151 for connecting with a cathode wire is provided on the lid 15. The outer wall of the circulation channel 12 is also electrically connected to the connecting bolt 151 through a wire or an internal conductive structure.

[0027] In this embodiment, during electroplating, the body 1 is connected to the cathode power supply and then placed into an electroplating tank filled with electroplating solution. The circulation channel 12 is also connected to the cathode. Before electroplating, multiple electronic components need to be placed in the circulating electroplating cavity 13 first. During electroplating, the electroplating solution enters from the inlet 11, then directly flows into from the bottom end of the circulation channel 12, flows out from the top end of the circulation channel 12 to the circulating electroplating cavity 13 for diversion. Then, a part of the electroplating solution flows out of the external electroplating tank, and another part of the electroplating solution flows into from the bottom end of the circulation channel 12 driven by the electroplating solution flowing in from the inlet 11, finally forming an internal circulation flow. The electronic components are electroplated in the circulating electroplating cavity 13. This is beneficial to the immersion electroplating of electronic components and improves the quality of electroplating;

[0028] In summary, the internal circulation channel type electroplating basket of the present utility model can perform internal circulation immersion electroplating on small-sized chip electronic components, effectively improving the electroplating quality of the components.

[0029] In this embodiment, the lower half of the cyclic electroplating chamber 13 converges towards the bottom end of the flow-through chamber 12, which is conducive to driving the electronic components to flow towards the lower half of the cyclic electroplating chamber 13 when the electroplating solution converges, causing the electronic components to sink.

[0030] In this embodiment, a first diversion wall 131 is provided in the lower half of the cyclic electroplating chamber 13. The first diversion wall 131 inclines towards the bottom end of the flow-through chamber 12, and the first diversion wall 131 serves to guide the electroplating solution to flow obliquely downwards.

[0031] In this embodiment, a second diversion wall 121 is provided at the bottom end of the flow-through chamber 12. The second diversion wall 121 is parallel to the first diversion wall 131. The second diversion wall 121 is used to form a channel for guiding the electroplating solution to flow obliquely downwards with the first diversion wall 131, so as to guide the electroplating solution to flow obliquely downwards.

[0032] In this embodiment, the upper half of the cyclic electroplating chamber 13 diverges towards its two sides. After the electroplating solution flows out from the top end of the flow-through channel 12, it diverges towards the two sides. If the cyclic electroplating chamber 13 is of a circular structure, it diverges equally in all directions towards the sides.

[0033] In this embodiment, an M-shaped diversion part 132 is provided at the top of the cyclic electroplating chamber 13. The middle part of the M-shaped diversion part 132 is aligned with the top end of the flow-through chamber 12. After the electroplating solution flows out from the top end of the flow-through channel 12, it will collide with the middle part of the M-shaped diversion part 132, and the M-shaped diversion part 132 diverts the collided electroplating solution in the inclined directions towards the two sides to guide the electroplating solution to flow into the cyclic electroplating chamber 13.

[0034] In this embodiment, a third diversion wall 1321 is provided on the M-shaped diversion part 132. The third diversion wall 1321 inclines towards one side of the cyclic electroplating chamber 13. When the electroplating solution collides with the M-shaped diversion part 132, the third diversion wall 1321 guides the flow direction of the electroplating solution to guide the electroplating solution to flow towards one side of the cyclic electroplating chamber 13.

[0035] In this embodiment, a fourth diversion wall 122 is provided at the top end of the flow-through chamber 12. The fourth diversion wall 122 is parallel to the third diversion wall 1321. The fourth diversion wall 122 is used to form a diversion channel with the third diversion wall 1321 to guide the electroplating solution to flow towards one side of the cyclic electroplating chamber 13.

[0036] In this embodiment, a through groove 14 is provided on the outer wall of the main body 1. The through groove 14 communicates with the upper half of the circulating electroplating chamber 13. During electroplating, when the electroplating solution circulates in the circulating electroplating chamber 13, a part of the electroplating solution will flow out of the through groove 14 into the external electroplating tank, so as to ensure that the electroplating solution in the circulating electroplating chamber 13 is fresh.

[0037] Of course, the present utility model can also have many other embodiments. Based on this embodiment, other embodiments obtained by those of ordinary skill in the art without any creative work belong to the scope protected by the present utility model.

Claims

1. An internal circulation channel type electroplating basket, comprising a body, the body being a cathode, characterized in that: The main body includes an access port, a flow cavity, and a circulating electroplating cavity. The access port is connected to the circulating electroplating cavity. The flow cavity is located in the circulating electroplating cavity. Both ends of the flow cavity are connected to the circulating electroplating cavity. The bottom end of the flow cavity is close to the access port and aligned with the access port.

2. The inner circulation channel type electroplating basket according to claim 1, characterized in that: The lower half of the circulating electroplating chamber converges toward the bottom end of the flow channel.

3. The inner circulation channel type electroplating basket according to claim 2, characterized in that: The lower half of the circulating electroplating chamber is provided with a first guide wall, and the first guide wall is inclined toward the bottom end of the flow channel.

4. The inner circulation channel type electroplating basket according to claim 3, characterized in that: A second flow guide wall is disposed at the bottom end of the flow cavity, and the second flow guide wall is parallel to the first flow guide wall.

5. The inner circulation channel type electroplating basket according to claim 1, characterized in that: The upper part of the circulating electroplating chamber is split toward both sides thereof.

6. The inner circulation channel type electroplating basket according to claim 5, characterized in that: An M-shaped guide portion is arranged on the top of the circulating electroplating chamber, and the middle portion of the M-shaped guide portion is aligned with the top end of the flow channel.

7. The inner circulation channel type electroplating basket according to claim 6, characterized in that: The M-shaped guide portion is provided with a third guide wall, and the third guide wall is inclined toward one side of the circulating electroplating chamber.

8. The inner circulation channel type electroplating basket according to claim 7, characterized in that: A fourth flow guide wall is disposed at the top of the flow cavity, and the fourth flow guide wall is parallel to the third flow guide wall.

9. The inner circulation channel type electroplating basket according to claim 1, characterized in that: The outer wall of the body is provided with a through groove, and the through groove is connected with the upper part of the circulating electroplating chamber.

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