Fixing die for testing semiconductor chip

Abstract

The utility model provides a fixing mold for testing a semiconductor chip, and relates to the field of fixing molds, the fixing mold for testing the semiconductor chip comprises a fixing mold body, at least two fixing cavities are formed in the middle of the upper end of the fixing mold body, and fixing holes are formed in the two sides of the upper end of the fixing mold body; the number of the fixing holes is at least four, a fixing block is arranged at the lower end of the fixing die body, and halfpace is arranged at the two ends of the fixing block. When in use, the semiconductor chip fixing die is installed on a detection device through the fixing block, then semiconductor chips are installed in the fixing cavity, the fixing die body is fixed through the fixing holes, and at least two semiconductor chips are detected at the same time through the detection device, so that the detection efficiency can be effectively improved; moreover, the fixing cavity limits the semiconductor chip, so that the semiconductor chip can be prevented from shifting in the detection process.

Description

Technical Field

[0001] The present application relates to the field of fixed molds, and more specifically, to a fixed mold for semiconductor chip testing. Background Art

[0002] When testing SSD flash memory particles, most of them are tested individually, and the probe module used can only test a single particle each time. When testing SSD particles, other structures are often required to limit and fix the SSD particles so that the SSD particles and the probes can make effective and correct contact. This structure is relatively complex and the testing efficiency is low. Summary of the Invention

[0003] The purpose of the embodiments of the present application is to provide a fixed mold for semiconductor chip testing, which can solve the above technical problems.

[0004] The embodiments of the present application provide a fixed mold for semiconductor chip testing, including a fixed mold body. At least two fixed cavities are provided in the middle of the upper end of the fixed mold body. Fixing holes are provided on both sides of the upper end of the fixed mold body, and at least four fixing holes are provided. A fixing block is provided at the lower end of the fixed mold body, and trapezoidal platforms are provided at both ends of the fixing block.

[0005] Preferably, an antistatic layer and an elastic layer are provided in the fixed cavity.

[0006] Preferably, a positioning hole is further provided at the upper end of the fixed mold body. The positioning hole is arranged close to one of the fixing holes and is centrosymmetrically arranged.

[0007] Preferably, a relief portion is provided at the four corners of the fixed cavity, and the relief portion is arc-shaped.

[0008] Preferably, the cross-section of the fixing hole is in a "convex" shape.

[0009] Preferably, the fixed mold body and the fixing block are integrally formed, and reinforcing ribs are provided inside both the fixed mold body and the fixing block.

[0010] Preferably, the depth of the fixed cavity is 2 - 3 mm.

[0011] Advantages of the Utility Model

[0012] The utility model provides a fixed mold for semiconductor chip testing, comprising a fixed mold body, at least two fixed cavities are arranged in the middle of the upper end of the fixed mold body, fixing holes are arranged on both sides of the upper end of the fixed mold body, at least four fixing holes are arranged, a fixed block is arranged at the lower end of the fixed mold body, and steps are arranged at both ends of the fixed block; when the utility model is in use, the utility model is installed on the detection equipment through the fixing block, and then the semiconductor chip is installed in the fixed cavity, and the fixed mold body is fixed through the fixing hole, and at least two semiconductor chips are detected by the detection equipment at the same time, which can effectively improve the detection efficiency, and the fixed cavity of the utility model limits the semiconductor chip, which can prevent the semiconductor chip from shifting during the detection process. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0014] Figure 1 It is a schematic diagram of the structure of the utility model;

[0015] Figure 2 It is a top view of the utility model;

[0016] Figure 3 A top view of the semiconductor chip installed in the utility model;

[0017] Figure 4 It is a cross-sectional view of the utility model.

[0018] The reference numerals are:

[0019] 1. Fix the mold body; 2. Fix the cavity; 3. Fix the hole; 4. Fix the block; 5. Positioning hole; 6. Give way. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0021] Accordingly, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but merely represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the scope of protection of the present application.

[0022] It should be noted that like reference numerals and letters denote like items in the following figures, and thus, once an item is defined in one figure, further definition and explanation thereof are not required in subsequent figures.

[0023] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this application is customarily placed when in use. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present application. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and should not be construed as indicating or implying relative importance.

[0024] In addition, the terms "horizontal", "vertical", "overhanging", etc. do not mean that the components are required to be absolutely horizontal or overhanging, but may be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but may be slightly inclined.

[0025] In the description of the present application, it should also be noted that unless otherwise clearly defined and limited, the terms "set", "installed", "connected", "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0026] Such as Figures 1 - 4As shown in the figure, a fixing mold for semiconductor chip testing includes a fixing mold body 1. In the middle of the upper end of the fixing mold body 1, there are at least two fixing cavities 2. On both sides of the upper end of the fixing mold body 1, there are fixing holes 3, and there are at least four fixing holes 3. At the lower end of the fixing mold body 1, there is a fixing block 4, and both ends of the fixing block 4 are provided with trapezoids. When the present utility model is in use, the present utility model is installed on the testing equipment through the fixing block 4. Then, the semiconductor chip is installed in the fixing cavity 2, and the fixing mold body 1 is fixed through the fixing holes 3. The testing equipment simultaneously tests at least two semiconductor chips, which can effectively improve the testing efficiency. Moreover, the fixing cavity 2 of the present utility model limits the semiconductor chip, and can prevent the semiconductor chip from shifting during the testing process.

[0027] As Figures 1 - 4 shown, in this embodiment, an antistatic layer and an elastic layer are provided in the fixing cavity 2. Specifically, the antistatic layer is provided on the elastic layer. The antistatic layer of the present utility model can prevent the interference of static electricity on the testing, and the elastic layer can prevent the semiconductor chip from being scratched by the fixing cavity 2.

[0028] As Figures 1 - 4 shown, in this embodiment, a positioning hole 5 is further provided at the upper end of the fixing mold body 1. The positioning hole 5 is arranged close to one of the fixing holes 3, and the positioning hole 5 is arranged in central symmetry. The positioning hole 5 of the present utility model is used for positioning, preventing the fixing mold body 1 from shifting when installed on the testing equipment, and can effectively improve the testing efficiency.

[0029] As Figures 1 - 4 shown, in this embodiment, at the four corners of the fixing cavity 2, there are provided relief portions 6, and the relief portions 6 are arranged in an arc shape. The relief portions 6 of the present utility model facilitate the installation and removal of the semiconductor chip by a manipulator or manually.

[0030] As Figures 1 - 4 shown, in this embodiment, the cross-section of the fixing hole 3 is arranged in a "convex" shape. Specifically, the fixing hole 3 penetrates through the upper and lower ends of the fixing mold body 1.

[0031] As Figures 1 - 4 shown, in this embodiment, to provide the strength of the present utility model, the fixing mold body 1 and the fixing block 4 are integrally formed, and reinforcing ribs are provided inside both the fixing mold body 1 and the fixing block 4.

[0032] As Figure 4 shown, in this embodiment, the depth of the fixing cavity 2 is 2 - 3 mm. Specifically, the depth is 2.5 mm, and it can also be adjusted according to the thickness of the semiconductor chip.

[0033] The above are only the preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A fixed mold for semiconductor chip testing, characterized in that: It includes a fixed mold body, at least two fixed cavities are arranged in the middle of the upper end of the fixed mold body, fixing holes are arranged on both sides of the upper end of the fixed mold body, at least four fixing holes are arranged, a fixed block is arranged at the lower end of the fixed mold body, and steps are arranged at both ends of the fixed block.

2. A fixed mold for semiconductor chip testing according to claim 1, characterized in that: An antistatic layer and an elastic layer are arranged in the fixed cavity.

3. A fixed mold for semiconductor chip testing according to claim 1, characterized in that: A positioning hole is also provided at the upper end of the fixed mold body. The positioning hole is arranged close to one of the fixing holes and the positioning holes are arranged in a centrally symmetrical manner.

4. A fixed mold for semiconductor chip testing according to claim 1, characterized in that: The four corners of the fixed cavity are provided with giving way portions, and the giving way portions are arranged in an arc shape.

5. A fixed mold for semiconductor chip testing according to claim 1, characterized in that: The cross section of the fixing hole is arranged in a "convex" shape.

6. A fixed mold for semiconductor chip testing according to claim 1, characterized in that: The fixed mold body and the fixed block are integrally formed, and reinforcing ribs are arranged inside the fixed mold body and inside the fixed block.

7. A fixed mold for semiconductor chip testing according to claim 1, characterized in that: The depth of the fixing cavity is 2-3 mm.

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