Power supply module and server

Abstract

The utility model relates to the field of servers, and discloses a power module and a server. The power module comprises a shell, a mainboard assembly, a liquid cooling assembly, a heat conduction element and a liquid leakage detection assembly. An accommodating space is formed in the shell; the main board assembly is fixedly arranged in the containing space and comprises a main board and a plurality of heating devices fixedly arranged on the first surface of the main board. The liquid cooling assembly comprises a liquid cooling plate and a joint connector, and the liquid cooling plate is located in the containing space and located on the sides, away from the main board, of the multiple heating devices; the liquid cooling plate and the mainboard assembly are coupled into an integral structure through the heat conducting element; one end of the joint connector is connected with the liquid cooling plate, and the other end penetrates through the shell and extends out of the shell; and the liquid leakage detection assembly is arranged at the integral structure and / or the joint connector. The power supply module and the server disclosed by the utility model are used for realizing liquid leakage detection while realizing liquid cooling heat dissipation.

Description

Technical Field

[0001] This application relates to the technical field of servers, and particularly to a power module and a server. Background Art

[0002] A Computer Redundant Power Supply (CRPS) power supply is a power supply used in servers. It consists of two power supplies, and a chip controls the power supplies to perform load balancing. One of the power supplies serves as the main power supply, and the other serves as the backup power supply. When the main power supply fails, the backup power supply can immediately take over its work to ensure that the server can still operate normally when the main power supply fails. As the server traffic increases, the requirements for the reliability and stability of the CRPS power supply by the server will become higher and higher. The CRPS power supply generates a large amount of heat under high load or continuous operation, and the traditional air-cooled heat dissipation mode cannot meet the requirements. To achieve better heat dissipation, liquid-cooled heat dissipation technology is applied to the CRPS power supply. Liquid-cooled heat dissipation has high thermal conductivity and heat dissipation efficiency, which can ensure that the CRPS power supply can still maintain a stable operating temperature during long-term and high-load operation, thereby meeting the development needs of the server.

[0003] Liquid-cooled heat dissipation usually uses a coolant to circulate in the liquid-cooled channel for heat dissipation. The coolant can be a fluid such as water, and water has electrical conductivity. Once there is a leak in the liquid-cooled channel and the coolant leaks out and immerses into the power supply or the server interior, there is a risk of damaging electrical components.

[0004] Therefore, while improving the heat dissipation capacity through liquid-cooled heat dissipation, it is necessary to take into account the leak detection of the liquid-cooled channel. Summary of the Utility Model

[0005] This application discloses a power module and a server for achieving liquid-cooled heat dissipation while taking into account leak detection.

[0006] To achieve the above object, this application provides the following technical solutions:

[0007] In a first aspect, an embodiment of this application provides a power module, including: a housing, a main board assembly, a liquid-cooled assembly, a heat conduction element, and a leak detection assembly;

[0008] The housing has an accommodation space inside;

[0009] The main board assembly is fixedly arranged in the accommodation space and includes a main board and a plurality of heat-generating devices fixedly arranged on a first surface of the main board;

[0010] The liquid cooling component includes a liquid cooling plate and a connector. The liquid cooling plate is located within the accommodation space and on the side of the multiple heat-generating devices facing away from the main board. The liquid cooling plate and the main board assembly are coupled into an integral structure through the heat-conducting element. One end of the connector is connected to the liquid cooling plate, and the other end penetrates through the housing and extends outside the housing.

[0011] The liquid leakage detection component is disposed at the integral structure and / or the connector.

[0012] The above power module uses liquid cooling for heat dissipation, improving the heat dissipation efficiency. Specifically, the power module performs liquid cooling on the main board assembly through the liquid cooling component. The liquid cooling plate of the liquid cooling component has a liquid cooling channel inside. One end of the connector is connected to the liquid cooling channel, and the other end protrudes outside the housing, used to provide a coolant such as water for the liquid cooling plate. The connector can be directly connected to the liquid cooling pipeline of an external device such as a server, or an additional liquid cooling pipeline can be connected. The liquid cooling plate and the main board assembly are coupled into an integral structure through the heat-conducting element, avoiding the generation of gaps that would increase the thermal resistance. Through the heat conduction of the heat-conducting element and the convective heat transfer of the coolant, the heat generated by the main board assembly is transferred to the coolant in the liquid cooling plate, and the heat is carried away through the circulating flow of the coolant, realizing spaced liquid cooling heat dissipation. The leakage of the coolant in the liquid cooling plate will cause catastrophic damage to the electrical components of the power module. Therefore, the power module provided in the embodiment of the present application sets up a liquid leakage detection component to monitor the liquid leakage situation in real time. The liquid leakage detection component can be disposed inside the housing of the power module, such as at the integral structure and the part of the connector located inside the housing, or can be disposed outside the housing of the power module, such as the part of the connector protruding outside the housing. The liquid leakage detection component can be directly electrically connected to the main board, or can be electrically connected to an external device of the power module such as a server.

[0013] Therefore, the power module provided in the embodiment of the present application, while achieving efficient liquid cooling heat dissipation, takes into account the real-time monitoring of liquid leakage and takes correct measures in a timely manner for liquid leakage.

[0014] In some embodiments, the liquid leakage detection component being disposed at the integral structure includes:

[0015] The liquid leakage detection component is disposed on the outer side of the integral structure, surrounds the main board, and is electrically connected to the main board. This layout method can detect the liquid leakage outside the integral structure in a timely manner, avoiding damage to the electrical components on the main board caused by liquid leakage.

[0016] And / or, the liquid leakage detection component is arranged on the main board and electrically connected to the main board. This arrangement can timely detect liquid leakage inside the overall structure. When liquid leakage falls onto the main board, it can be detected in time to avoid damage to the electrical components on the main board caused by the liquid leakage; through the electrical connection between the liquid leakage detection component and the main board, the main board can timely take correct measures for the liquid leakage, such as alarming or power-off.

[0017] In some embodiments, the liquid leakage detection component is arranged at the joint connector. The liquid leakage detection component has an electrical connection port for electrically connecting to an external device. This arrangement can detect liquid leakage at the connection between the liquid cooling plate and the joint connector and at the connection between the joint connector and the external liquid cooling pipeline, thereby avoiding damage to the electrical components on the main board caused by the liquid leakage entering the power module, and at the same time avoiding damage to the electrical components inside the external device connected to the power module, such as those inside a server. The liquid leakage detection component has an electrical connection port for electrically connecting to an external device such as a server, which is convenient for the external device such as a server to timely take correct measures, such as alarming, switching to another power supply, or power-off protection, etc.

[0018] In some embodiments, the liquid leakage detection component includes a liquid leakage detection line and / or a liquid leakage sensor. The liquid leakage detection component can be a liquid leakage detection line, which occupies a small space and is convenient for arrangement, and can be wound around an irregular structure. The liquid leakage detection line can be a resistive liquid leakage line or a capacitive liquid leakage line. The liquid leakage detection lines at various places can be connected in series or in parallel for timely detection. Of course, the liquid leakage detection component can also be a liquid leakage sensor, which can sensitively detect the presence of liquid and issue a warning in time to facilitate timely handling of potential liquid leakage problems.

[0019] In some embodiments, the liquid cooling plate includes a heat conducting plate and a liquid cooling pipe. The liquid cooling pipe is embedded in the surface of the heat conducting plate facing the main board, and the side of the liquid cooling pipe facing the main board is flush with the heat conducting plate;

[0020] The liquid cooling pipe includes a liquid inlet and a liquid outlet; both the liquid inlet and the liquid outlet are connected with the joint connector.

[0021] The liquid cooling plate is realized through the structure of embedding the liquid cooling pipe in the heat conducting plate. The liquid cooling pipe is located on the side of the heat conducting plate close to the main board and is flush with the surface of the heat conducting plate, which is convenient for heat transfer between the liquid cooling pipe and the main board assembly. The liquid inlets and outlets of the liquid cooling pipe are both located on the same side of the heat conducting plate, which is convenient for the layout of the liquid cooling pipeline inside the external device connected to the power module and is also convenient for the maintenance of the joint connector. It can be understood that the liquid inlets and outlets of the liquid cooling pipe can also be located on different sides of the heat conducting plate. In this case, an additional liquid cooling pipeline needs to be arranged to connect to the power module through the joint connector.

[0022] In some embodiments, the connector is a quick connector to support electro-hydraulic hot plugging for convenient later maintenance.

[0023] In some embodiments, the multiple heating devices include a first heating device, and the power consumption of the first heating device is greater than that of the remaining heating devices among the multiple heating devices;

[0024] The orthographic projection of the first heating device on the liquid cooling plate is a first projection, and the first projection is located within the area where the liquid cooling pipes are arranged; in the embodiments of the present application, the power supply module reconstructs the design of the heating devices on the main board, so that the liquid cooling pipes on the liquid cooling plate are closest to the position with the largest heat generation of the heating devices on the main board, thereby achieving focused cooling of the place with the largest heat generation. Specifically, the internal high-power devices are arranged according to the positions of the liquid cooling pipes in the liquid cooling plate, which can shorten the heat transfer path and ensure that the liquid cooling plate can dissipate heat from these high-heat-generating devices faster. It can be understood that in this embodiment, the first heating device can be an electrical component or a type of electrical component, mainly distinguished by power consumption from the remaining electrical components.

[0025] Alternatively, the multiple heating devices include a second heating device, and along the normal direction of the main board, the size of the second heating device is larger than that of the remaining heating devices among the multiple heating devices;

[0026] The orthographic projection of the second heating device on the liquid cooling plate is a second projection, and the second projection is located outside the area where the liquid cooling pipes are arranged. An imitation groove adapted to the second heating device is provided on the side of the liquid cooling plate facing the main board.

[0027] In the embodiments of the present application, the power supply module reconstructs the design of the heating devices on the main board, so that the liquid cooling pipes on the liquid cooling plate are closest to the position with the largest heat generation of the heating devices on the main board, thereby achieving focused cooling of the place with the largest heat generation. However, for some large-sized electrical components with low power consumption, they can directly contact the liquid cooling plate for heat dissipation. Due to the limitation of the accommodation space size, the liquid cooling plate adopts an imitation design, and the liquid cooling plate forms a corresponding imitation groove for the second heating device to achieve a perfect fit between the second heating device and the liquid cooling plate. It can be understood that in this embodiment, the second heating device can be an electrical component or a type of electrical component, mainly distinguished by size from the remaining electrical components, such as the second heating device being a capacitor with a large shape and a relatively high flyback transformer.

[0028] In some embodiments, an annular insulating shim surrounding the main board assembly is provided between the overall structure and the housing. The housing of the power supply module is usually made of metal material. An annular insulating shim is arranged inside the housing and fixed to the overall structure by plastic screws, which can not only prevent short circuits caused by metal but also give a certain structural strength to the inside of the housing.

[0029] In some embodiments, the housing includes an upper housing and a lower housing, and the upper housing and the lower housing are covered to form the accommodating space; a guiding groove is provided on the top plate of the upper housing. To facilitate the assembly with external devices such as servers, along the assembly direction of the power module, a guiding groove is provided on the top of the upper housing of the power module, which can achieve precise assembly.

[0030] In a second aspect, an embodiment of the present application further provides a server, including the power module as described in any one of the embodiments of the first aspect.

[0031] The power module assembled in the server provided by the embodiment of the present application uses liquid cooling for heat dissipation. The joint connector of the liquid cooling plate in the power module can be directly connected to the internal liquid cooling pipeline of the server, realizing the full liquid cooling heat dissipation of the server, ensuring that the server can effectively dissipate heat in a high-load or high-temperature environment, avoiding the performance degradation of the power module and the entire server, and further avoiding failures caused by high temperature. At the same time, the liquid leakage detection component of the power module can be directly compatible with the internal liquid leakage detection system of the server, facilitating the server to take correct measures for liquid leakage. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a schematic structural diagram of a power module provided by an embodiment of the present application;

[0033] Figure 2 is an exploded view of a power module provided by an embodiment of the present application;

[0034] Figure 3 is a schematic diagram of the liquid leakage detection principle of a power module provided by an embodiment of the present application;

[0035] Figure 4 is a schematic structural diagram of a liquid cooling component in a power module provided by an embodiment of the present application;

[0036] Figure 5 is a schematic structural diagram of the upper housing of a power module provided by an embodiment of the present application;

[0037] Figure 6 is a schematic structural diagram of the lower housing and the main board of a power module provided by an embodiment of the present application;

[0038] Icons: 100 - housing; 200 - main board assembly; 300 - liquid cooling assembly; 400 - liquid leakage detection assembly; 500 - annular insulating baffle; 110 - upper housing; 120 - lower housing; 130 - handle; 140 - buckle; 210 - main board; 220 - first heating device; 230 - second heating device; 310 - liquid cooling plate; 320 - connector; 330 - connector seat; 101 - guiding groove; 111 - top plate; 112 - first side plate; 113 - second side plate; 121 - bottom plate; 122 - third side plate; 123 - fourth side plate; 141 - clamping portion; 142 - driving portion; 211 - first interface; 212 - second interface; 231 - flyback transformer; 232 - capacitor; 311 - heat conducting plate; 312 - liquid cooling pipe; 3111 - profiling groove; 3112 - profiling groove. Detailed implementation manners

[0039] First, introduce the application scenario of this application: In the related art, a general redundant power supply mainly uses a small fan to dissipate heat from the entire power supply module. To ensure air circulation, opening structures are provided at the front and rear of the power supply module. The following problems mainly exist:

[0040] 1. The power supply module occupies a small space in the server. Under the premise of the traditional air-cooled heat dissipation method, the fan specifications are basically constant, and the amount of heat that can be taken away is limited. And since the power supply module is located at the end of the server, the air at the air inlet of the power supply module will be preheated by other components of the server, and the temperature will rise significantly, making the power supply module in a high-temperature environment with a very small temperature margin for heat dissipation. As the power consumption of the main components of the server is getting higher and higher, the required power supply power is also getting higher and higher, generating more heat. The temperatures of the components of the power supply module continue to rise with the increase in power consumption. In a high-load or high-temperature environment, if heat cannot be dissipated effectively, it may lead to a decline in the performance of the power supply and the entire system, and even cause failures;

[0041] 2. Opening structures are provided at the front and rear of the power supply module to facilitate the fan to drive air circulation, but this will make it more vulnerable to the influence of dust and other sundries. In a redundant power supply system, the increase in the number of fans will cause more serious accumulation of external dust. This will not only affect the heat dissipation effect, but may also damage the electronic components inside the power supply;

[0042] 3. A large amount of heat generated in the existing air-cooled power supply module needs to be taken out by the fan. The more heat there is, the faster the fan speed and the greater the noise. In a redundant power supply system, since more fans are needed to ensure the heat dissipation effect, the noise problem will be more prominent. This is an obvious disadvantage for application scenarios that require a low-noise environment;

[0043] 4. In the current general trend of all - liquid - cooled data centers, using air - cooling for power modules cannot achieve all - liquid - cooling of data centers.

[0044] Therefore, developing liquid - cooled power modules is an important part in the process of achieving all - liquid - cooling of data centers.

[0045] Based on the above application scenarios, embodiments of the present application provide a power module and a server, which are used to achieve liquid - cooling heat dissipation while taking into account leakage detection.

[0046] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application. Among them, in the description of the embodiments of the present application, unless otherwise specified, " / " means "or". For example, A / B can mean A or B; "and / or" in the text is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone. In addition, in the description of the embodiments of the present application, "a plurality of" means two or more than two.

[0047] Hereinafter, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as implying or suggesting relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more than two.

[0048] Figure 1 FIG. 16 is a three - dimensional perspective view of a power module provided by an embodiment of the present application. Figure 2 FIG. 18 is an exploded view of the power module. As Figures 1 to 2 shown, the power module includes: a housing 100, a main - board assembly 200, a liquid - cooling assembly 300, and a heat - conducting element. The housing 100 has an accommodation space inside.

[0049] The main - board assembly 200 is fixedly arranged in the accommodation space and includes a main board 210 and a plurality of heating devices fixedly arranged on the first surface of the main board 210; one end of the main board 210 extends out of the housing 100 to form a first interface 211 for signal connection with external devices such as a server; exemplarily, the first interface 211 can be a gold - finger socket. When the power module is installed in the server, the gold - finger socket is plugged into the server to achieve electrical connection.

[0050] The liquid cooling component 300 includes a liquid cooling plate 310 and a connector 320. The liquid cooling plate 310 is located within the accommodation space and on the side of the plurality of heat generating devices facing away from the main board 210; that is to say, the heat generating devices are located between the liquid cooling plate 310 and the main board 210. All the heat generating devices are fixedly arranged on the first surface of the main board 210. The other surface of the liquid cooling plate 310 is in direct or indirect contact with the heat generating devices to form a heat conduction path, and the indirect contact can be achieved through heat conducting elements such as heat conducting gaskets or heat conducting gels. The liquid cooling plate 310 and the main board assembly 200 are coupled into an integral structure through a heat conducting element, and specifically, it can be achieved by the method of vacuum perfusion of heat conducting gel; one end of the connector 320 is connected to the liquid cooling plate 310, and the other end penetrates through the housing 100 and extends outside the housing 100 for connection to an external liquid cooling pipeline. The external liquid cooling pipeline can be a liquid cooling pipeline of an external device connected to the power module, such as a liquid cooling pipeline inside a server, or a liquid cooling pipeline specifically set for the power module.

[0051] Figure 3 This is the schematic diagram of the liquid leakage detection of the power module in the embodiment of the present application. Refer to Figure 3 , the power module further includes a liquid leakage detection component 400. The liquid leakage detection component 400 is arranged at the integral structure and / or the connector 320 for detecting the liquid leakage condition at the liquid cooling plate 310 and the connector 320, so as to avoid damage to the main board 210, the electrical components on the main board 210, and the electrical components of the external devices connected to the power module caused by liquid leakage.

[0052] The above power module adopts liquid cooling for heat dissipation to improve the heat dissipation efficiency. Specifically, the power module cools down the main board assembly 200 through the liquid cooling component 300. The liquid cooling plate 310 of the liquid cooling component 300 has a liquid cooling channel inside. One end of the joint connector 320 is connected to the liquid cooling channel, and the other end protrudes outside the housing 100 for providing a coolant such as water to the liquid cooling plate 310. The joint connector 320 can be directly connected to the liquid cooling pipe 312 of an external device such as a server, or can be connected to an additional liquid cooling pipe 312. The liquid cooling plate 310 and the main board assembly 200 are coupled into an integral structure through a heat conducting element to avoid generating gaps that cause an increase in thermal resistance. Through the heat conduction of the heat conducting element and the convective heat transfer of the coolant, the heat generated by the main board assembly 200 is transferred to the coolant in the liquid cooling plate 310, and the heat is taken away through the circulating flow of the coolant, realizing spaced liquid cooling heat dissipation. The leakage of the coolant in the liquid cooling plate 310 will cause catastrophic damage to the electrical components of the power module. Therefore, the power module provided by the embodiment of the present application is provided with a liquid leakage detection component 400 to monitor the liquid leakage situation in real time. The liquid leakage detection component 400 can be arranged inside the housing 100 of the power module, such as at the integral structure and the part of the joint connector 320 located inside the housing 100, or can be arranged outside the housing 100 of the power module, such as the part of the joint connector 320 protruding outside the housing 100. The liquid leakage detection component 400 can be directly electrically connected to the main board 210, or can be electrically connected to an external device of the power module such as a server.

[0053] Therefore, on the basis of realizing efficient liquid cooling heat dissipation, the power module provided by the embodiment of the present application takes into account the real-time monitoring of liquid leakage and takes correct measures in a timely manner for the liquid leakage.

[0054] In some embodiments, the arrangement of the liquid leakage detection component 400 at the integral structure includes:

[0055] The liquid leakage detection component 400 is arranged on the outer side surface of the integral structure, and is arranged around the main board 210 and electrically connected to the main board 210; this arrangement method can detect the liquid leakage outside the integral structure in a timely manner and avoid the damage of the liquid leakage to the electrical components on the main board 210;

[0056] And / or, the liquid leakage detection component 400 is arranged on the main board 210 and electrically connected to the main board 210. This arrangement method can detect the liquid leakage inside the integral structure in a timely manner. When the liquid leakage falls onto the main board 210, it can be detected in a timely manner to avoid the damage of the liquid leakage to the electrical components on the main board 210; by electrically connecting the liquid leakage detection component 400 to the main board 210, the main board 210 can take correct measures in a timely manner for the liquid leakage, such as alarming or power-off.

[0057] In some embodiments, the liquid leakage detection component 400 is disposed at the joint connector 320. The liquid leakage detection component 400 has an electrical connection port for electrically connecting to an external device. This arrangement can detect liquid leakage at the connection between the liquid cooling plate 310 and the joint connector 320 and at the connection between the joint connector 320 and the external liquid cooling pipeline, thereby preventing the leaked liquid from entering the power module and damaging the electrical components on the main board 210. At the same time, it can also prevent the leaked liquid from damaging the electrical components of external devices connected to the power module, such as those inside a server. The liquid leakage detection component 400 has an electrical connection port for electrically connecting to an external device such as a server, facilitating the external device such as a server to take correct measures in a timely manner, such as alarming, switching to another power source, or power-off protection, etc.

[0058] In some embodiments, the liquid leakage detection component 400 includes a liquid leakage detection line and / or a liquid leakage sensor. The liquid leakage detection component 400 can be a liquid leakage detection line, which occupies a small space and is convenient to arrange. It can be wound around an irregular structure. The liquid leakage detection line can be a resistive liquid leakage line or a capacitive liquid leakage line. The liquid leakage detection lines at various locations can be connected in series or parallel for timely detection. Of course, the liquid leakage detection component 400 can also be a liquid leakage sensor, which can sensitively detect the presence of liquid and issue a warning in a timely manner to handle potential liquid leakage problems in a timely manner.

[0059] The resistive liquid leakage detection technology is a relatively simple leakage detection method, and its working principle is based on the conductivity of the liquid. When the liquid contacts two parallel conductive tracks (resistance wires) laid in the potential leakage area, a conductive path will be formed, resulting in a change in the circuit resistance. The detection system determines whether leakage has occurred by monitoring the change in the resistance value. This method is applicable to liquids that can conduct electricity, such as water or other electrolyte solutions.

[0060] The capacitive liquid leakage detection technology is an efficient detection method based on the principle of capacitance change. Such detection systems usually include a capacitance sensor and corresponding signal processing components. Its working principle is as follows:

[0061] 1. Capacitance principle: The capacitance sensor consists of two conductive plates. When there is a dielectric (such as air) between them, the formed capacitance is small. Once a liquid invades between the two plates, since the dielectric constant of the liquid is much larger than that of air, it will cause a significant increase in the capacitance value.

[0062] 2. Detection mechanism: The system continuously monitors the change in the capacitance value. When liquid leakage occurs in the detection area, the sudden increase in capacitance will be detected by the detection circuit and trigger an alarm signal. The capacitive detection has high sensitivity, fast response speed, can adapt to various liquid types, and is not easily affected by external interferences such as dust.

[0063] In a possible implementation, a liquid leakage disaster tolerance detection mechanism is provided inside the power module. The liquid leakage of the liquid cooling pipes 312 in the liquid cooling plate 310 will cause catastrophic damage to the power devices. Therefore, a detection device for liquid leakage alarm is adopted in the power module. A resistive liquid leakage detection line is used, but not limited to it. It can also be a capacitive liquid leakage detection line, etc. Exemplarily, a liquid leakage detection terminal is installed on the main board 210 inside the power module; alternatively, a liquid leakage detection line is arranged between the main board 210 and the liquid cooling plate 310, and the liquid leakage detection line is electrically connected to the main board 210; alternatively, a liquid leakage detection line and a liquid leakage sensor are arranged outside the overall structure after vacuum perfusion and around the circuit board for timely detection, and an anti-interference structure such as an anti-interference circuit or a physical anti-interference structure is designed. The anti-interference circuit can be a shielding circuit composed of electrical components; the physical anti-interference structure can be a specific anti-interference shielding part.

[0064] In a possible implementation, a liquid leakage disaster tolerance detection mechanism is provided outside the power module. A liquid leakage line is arranged near the connector 320 and is connected in series and parallel with the liquid leakage detection line on the liquid cooling plate 310 in an external device such as a server. The following takes the server as an example to introduce the hierarchical processing logic for liquid leakage:

[0065] The liquid leakage alarm is divided into three levels in total, where: the first-level alarm is that any liquid leakage sensor or liquid leakage detection line detects liquid leakage, and the liquid leakage signal is transmitted to the baseboard management controller (BMC) of the server for alarm in the first time; the second-level alarm is that when any liquid leakage sensor or liquid leakage detection line detects liquid leakage and the liquid leakage duration lasts for more than 60S, the server switches the power supply to another power module; the third-level alarm is that when two liquid leakage sensors or liquid leakage detection lines detect liquid leakage, or the liquid leakage duration lasts for more than 120S, the power module loses power and enters protection.

[0066] Figure 4 The structural schematic diagram of a liquid cooling component 300 in the embodiment of the present application is as Figure 4 shown. The liquid cooling plate 310 includes a heat conduction plate 311 and liquid cooling pipes 312. The liquid cooling pipes 312 are embedded in the surface of the heat conduction plate 311 facing the main board 210, and the side of the liquid cooling pipes 312 facing the main board 210 is flush with the heat conduction plate 311; the liquid cooling pipes 312 include a liquid inlet and a liquid outlet; both the liquid inlet and the liquid outlet are connected with a connector 320.

[0067] As Figure 4As shown, the liquid cooling plate 310 is realized by the structure of embedding the liquid cooling tube 312 into the heat conducting plate 311. The liquid cooling tube 312 is located on the side of the heat conducting plate 311 close to the main board 210 and is flush with the surface of the heat conducting plate 311, facilitating the heat transfer between the liquid cooling tube 312 and the main board assembly 200. The liquid cooling tube 312 can be a U-shaped tube or an S-shaped tube to extend the path of the coolant in the heat conducting plate 311, thereby prolonging the residence time of the coolant in the liquid cooling tube 312 and improving the heat dissipation efficiency. Figure 4 Only one U-shaped liquid cooling tube is shown in Figure 4 . Both the liquid inlet and the liquid outlet of the liquid cooling tube 312 are located on the same side of the heat conducting plate 311, facilitating the layout of the liquid cooling pipeline in the external device connected to the power module and facilitating the maintenance of the joint connector 320 at the same time. It can be understood that the liquid inlet and the liquid outlet of the liquid cooling tube 312 can also be located on different sides of the heat conducting plate 311. In this case, an additional liquid cooling pipeline needs to be laid out and connected to the power module through the joint connector 320.

[0068] In a possible implementation manner, the manufacturing process of the liquid cooling plate 310 adopts the shallow-buried tube process. After being flattened, the liquid cooling tube 312 and the heat conducting plate 311 are milled simultaneously. The heat conducting plate 311 can be an aluminum plate or an aluminum alloy plate, and the light weight of aluminum is used to play a role in weight reduction and cost control. The liquid cooling tube 312 is a copper tube, and the high thermal conductivity of the copper tube is fully utilized to take away heat, facilitating heat dissipation. The joint connector 320 is communicated with the liquid cooling tube 312 through the joint connecting seat 330. The joint connecting seat 330 can be a copper block. Specifically, the copper tube and the copper block are welded into one body. The copper block has a threaded hole communicated with the copper tube, and the joint connector 320 is threadedly connected to the threaded hole on the copper block, facilitating the replacement and maintenance of the joint connector 320. The copper block and the aluminum alloy plate are welded into one body, and the aluminum alloy plate is nickel-plated, which is easy to weld. The copper tube and the copper block are combined with the aluminum alloy plate to conduct heat, realizing liquid cooling and heat dissipation.

[0069] In some embodiments, the joint connector 320 is a quick connector to support electro-hydraulic hot plugging and facilitate later maintenance. The quick connector is a manual connector, but it is not limited to a manual connector. It can also be a connector locked by an external locking mechanism such as blind plugging and quick connection. The position of the quick connector can be on the same side as the first interface 211 on the main board 210, such as the gold finger, so that the liquid cooling pipeline inside the power module can be coupled with other liquid cooling pipelines inside the external device, sharing the same coolant pipeline. The position of the quick connector can also be on the opposite side of the gold finger of the main board 210, and there is a liquid cooling pipeline of a single power module connected to it.

[0070] In some embodiments, the multiple heat generating devices include a first heat generating device 220, and the power consumption of the first heat generating device 220 is greater than that of the other heat generating devices among the multiple heat generating devices;

[0071] The orthographic projection of the first heating device 220 on the liquid cooling plate 310 is the first projection, and the first projection is located within the layout area of the liquid cooling tubes 312; in the embodiment of the present application, the power supply module reconstructs the heating devices on the main board 210, so that the liquid cooling tubes 312 on the liquid cooling plate 310 are closest to the position with the largest heat generation of the heating devices on the main board 210, thereby achieving focused cooling of the place with the largest heat generation. Specifically, arranging the internal high-power devices according to the positions of the liquid cooling tubes 312 in the liquid cooling plate 310 can shorten the heat transfer path and ensure that the liquid cooling plate 310 can dissipate heat from these high-heat-generation devices faster. It can be understood that in this embodiment, the first heating device 220 can be an electrical component or a type of electrical component, mainly distinguished by power consumption from other electrical components.

[0072] Alternatively, the multiple heating devices include a second heating device 230. Along the normal direction of the main board 210, the size of the second heating device 230 is larger than that of the other heating devices among the multiple heating devices;

[0073] The orthographic projection of the second heating device 230 on the liquid cooling plate 310 is the second projection, and the second projection is located outside the layout area of the liquid cooling tubes 312. A profiling groove adapted to the second heating device 230 is provided on the side of the liquid cooling plate 310 facing the main board 210.

[0074] In the embodiment of the present application, the power supply module reconstructs the heating devices on the main board 210, so that the liquid cooling tubes 312 on the liquid cooling plate 310 are closest to the position with the largest heat generation of the heating devices on the main board 210, thereby achieving focused cooling of the place with the largest heat generation. However, for some large-sized and low-power electrical components, they can directly contact the liquid cooling plate 310 for heat dissipation. Due to the limitation of the accommodation space size, the liquid cooling plate 310 adopts a profiling design, and the liquid cooling plate 310 forms a corresponding profiling groove for the second heating device 230 to achieve a perfect fit between the second heating device 230 and the liquid cooling plate 310. It can be understood that in this embodiment, the second heating device 230 can be an electrical component or a type of electrical component, mainly distinguished by size from other electrical components. For example, the second heating device 230 is a relatively large capacitor 232 and a relatively high flyback transformer 231. As Figure 4 shown, for the relatively high flyback transformer 231, a profiling groove 3111 is provided on the heat conducting plate 311, and for the relatively large capacitor 232, a profiling groove 3112 is provided on the heat conducting plate.

[0075] It should be noted that high thermal conductivity interface materials are filled between the liquid cooling plate 310 and each electrical component on the main board 210, and they are in close contact through a certain amount of extrusion deformation to avoid gaps that would increase the thermal resistance. For other irregular components and smaller components on the main board 210, since their heights are relatively low and they are scattered, the liquid cooling pipeline cannot be directly attached. For these components, the method of vacuum perfusion of thermal conductive gel is adopted, and the thermal conductive gel is filled between each component to achieve heat transfer between each component. The heat is transferred from the high-temperature components to the low-temperature liquid cooling plate 310. Through the above method, the heat conduction problem of components in a small space is solved. After the heat is transferred to the liquid cooling plate 310, it is carried away by the coolant.

[0076] In some embodiments, an annular insulating spacer 500 surrounding the main board assembly 200 is provided between the overall structure and the housing 100. The housing 100 of the power module is usually made of metal material. An annular insulating spacer 500 is provided inside the housing 100, and the annular insulating spacer 500 is fixed to the overall structure by plastic screws, which can not only prevent metal from causing a short circuit but also give a certain structural strength to the inside of the housing 100.

[0077] Figure 5 It is a schematic structural diagram of the upper housing 110 of the power module. Figure 6 It is a schematic structural diagram of the lower housing 120 and some structures of the power module, as Figure 5 and Figure 6 shown. The housing 100 includes an upper housing 110 and a lower housing 120. The upper housing 110 and the lower housing 120 are covered to form an accommodating space; a guiding groove 101 is provided on the top plate 111 of the upper housing 110. In order to facilitate the assembly with external devices such as servers, along the assembly direction of the power module, a guiding groove 101 is provided at the top of the upper housing 110 of the power module, which can achieve precise assembly.

[0078] As Figure 5 shown, the upper housing 110 includes a top plate 111, a first side plate 112, and a second side plate 113. A guiding groove 101 is provided on the top plate 111 of the upper housing 110, which can cooperate with the guiding protrusion on the external device to facilitate the assembly and disassembly of the power module. The first side plate 112 and the second side plate 113 are connected to form an L-shaped structure, and both are connected to the top plate 111. The first side plate 112 and the second side plate 113 are both closed plate bodies without a hollow ventilation area. The connector 320 of the liquid cooling pipe 312 penetrates through the first side plate 112 and is hermetically connected to the first side plate 112 to prevent dust and other sundries from entering the accommodating space from the first side plate 112 or the second side plate 113, thereby affecting the electronic components inside the power module.

[0079] As Figure 6As shown in the figure, the lower housing 120 includes a bottom plate 121, a third side plate 122, and a fourth side plate 123. The third side plate 122 and the fourth side plate 123 are connected to form an L-shaped structure and are both connected to the bottom plate 121. The third side plate 122 and the fourth side plate 123 are both closed plate bodies without any hollow areas, preventing dust and other debris from entering the accommodation space through the third side plate 122 or the fourth side plate 123, thus affecting the electronic devices inside the power module. A handle 130 is connected to the third side plate 122. By means of the handle 130, the entire power module can be pushed, pulled, and lifted, facilitating the disassembly, assembly, and handling of the power module. A second interface electrically connected to the main board 210 is also provided on the third side plate 122 for connection to the municipal circuit. A buckle 140 is provided at one end of the fourth side plate 123 close to the third side plate 122. The buckle 140 includes a clamping portion 141 and a driving portion 142. By moving the driving portion 142, the clamping portion 141 can be extended or retracted from the outer surface of the fourth side plate 123 to achieve the clamping and locking or unlocking with external devices, facilitating installation and disassembly. It should be noted that the main board 210 after vacuum infusion is fixed to the bottom plate 121 by plastic screws to prevent short circuits of the main board 210 caused by metal contact. The second surface of the main board 210 faces the bottom plate 121.

[0080] The power module provided by the embodiment of the present application adopts liquid cooling for heat dissipation. By reconstructing the layout of internal power devices, the devices with high heat generation and power consumption are placed on the same side as the liquid cooling tubes of the liquid cooling plate, shortening the heat transfer path; for devices of different sizes and the overall height requirements of the power supply, the liquid cooling plate adopts a profiling structure to adapt to different internal structures of the power supply; the irregularly shaped devices are combined into one body by means of vacuum infusion with thermal conductive gel, which can achieve a more uniform heat dissipation effect and reduce the temperature gradient, thus ensuring more stable temperature control of the power module during high-load operation; in order to ensure the reliability of liquid cooling for heat dissipation, the power module is also provided with a liquid leakage disaster tolerance detection mechanism, which alarms immediately in case of liquid leakage and enters the power-off protection mode for sudden liquid leakage into the power module, improving the reliability of the power module in use.

[0081] Compared with the power module using air cooling for heat dissipation, the power module in the embodiment of the present application does not need to use a fan, which can significantly reduce system noise. This is particularly important for places that require a low-noise environment. Moreover, the front and rear of the power module are sealed, directly preventing the contact between the hot air inside the server and the electronic devices inside the power module, solving the preheating of the power module by the hot air generated by other components inside the server; at the same time, the sealing avoids dust from partially entering the server inside the power module, providing protection for the internal environment and electronic devices of the server.

[0082] In this embodiment, all interfaces and communications in the liquid-cooled power module are compatible with the air-cooled power system, breaking through the technical bottleneck of the cold plate power supply and filling the last shortcoming of the full liquid-cooled solution for rack servers. A quick connector is used to couple with the liquid-cooled pipeline inside the chassis, eliminating the need for a separate liquid supply, reducing costs, and enabling adaptation to full liquid-cooled and full-stack liquid-cooled servers. Under the condition of a fanless full liquid-cooled server, using a liquid-cooled power supply is an inevitable choice, which is of great significance for realizing full liquid-cooled and full-stack liquid-cooled servers. Moreover, the power module provided in the embodiment of the present application has a high degree of adaptability to existing servers, retains the guiding grooves of the air-cooled power module, and enables the free switching between air-liquid power modules, avoiding the modification of the chassis structure and thus improving the operability.

[0083] Liquid cooling usually has higher energy efficiency and can reduce energy consumption. At the same time, by reducing the number and running time of cooling devices, liquid cooling also helps to reduce the overall carbon emissions of the system, conforming to the trend of green computing and sustainable development.

[0084] Therefore, the power module provided in the embodiment of the present application can better control the temperature of the power supply itself, thereby improving the overall power, adapting to servers with higher power, and breaking through the power limit. While providing higher power, the temperature is controlled within a lower range, reducing failures and performance degradation caused by overheating. At the same output power, the lower the temperature of the power module, the smaller the loss and the higher the conversion efficiency.

[0085] In a second aspect, the embodiment of the present application further provides a server, including a power module according to any one of the embodiments in the first aspect.

[0086] The power module assembled in the server provided in the embodiment of the present application uses liquid cooling for heat dissipation. The joint connector of the liquid-cooled plate in the power module can be directly connected to the liquid-cooled pipeline inside the server to achieve full liquid-cooled heat dissipation of the server, ensuring that the server can effectively dissipate heat in high-load or high-temperature environments, avoiding performance degradation of the power module and the entire server, and further avoiding failures caused by high temperature. At the same time, the liquid leakage detection component of the power module can be directly compatible with the liquid leakage detection system inside the server, facilitating the server to take correct measures against liquid leakage.

[0087] Obviously, those skilled in the art can make various modifications and variations to the embodiments of the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application is also intended to include these modifications and variations.

Claims

1. A power module, characterized in that: include: Housing, motherboard assembly, liquid cooling assembly, thermal conductive element and leakage detection assembly; The shell has an accommodating space inside; The mainboard assembly is fixed in the accommodating space, and includes a mainboard and a plurality of heating devices fixed on a first surface of the mainboard; The liquid cooling assembly comprises a liquid cooling plate and a joint connector, wherein the liquid cooling plate is located in the accommodating space and is located on the side of the plurality of heating devices away from the mainboard; the liquid cooling plate and the mainboard assembly are coupled into an integral structure through the heat conducting element; one end of the joint connector is connected to the liquid cooling plate, and the other end passes through the shell and extends out of the shell; The liquid leakage detection component is arranged at the overall structure and / or the joint connector.

2. The power module according to claim 1, characterized in that: The liquid leakage detection component is arranged in the overall structure and includes: The liquid leakage detection component is arranged on the outer side of the overall structure, is arranged around the main board, and is electrically connected to the main board; And / or, the liquid leakage detection component is arranged on the main board and electrically connected to the main board.

3. The power module according to claim 1, characterized in that: The liquid leakage detection component is arranged at the joint connector, and the liquid leakage detection component has an electrical connection port for electrically connecting to an external device.

4. The power module according to claim 1, characterized in that: The liquid leakage detection component includes a liquid leakage detection line and / or a liquid leakage sensor.

5. The power module according to claim 1, characterized in that: The liquid cooling plate comprises a heat conducting plate and a liquid cooling pipe, wherein the liquid cooling pipe is embedded in the surface of the heat conducting plate on the side facing the main board, and the liquid cooling pipe is flush with the heat conducting plate on the side facing the main board; The liquid cooling pipe comprises a liquid inlet and a liquid outlet; the liquid inlet and the liquid outlet are both connected to the joint connector.

6. The power module according to claim 1, characterized in that: The joint connector is a quick connector.

7. The power module according to claim 5, characterized in that: The plurality of heating devices include a first heating device, the power consumption of the first heating device is greater than the power consumption of the remaining heating devices in the plurality of heating devices; The orthographic projection of the first heating device on the liquid cooling plate is a first projection, and the first projection is located in the liquid cooling pipe layout area; Alternatively, the plurality of heat generating devices include a second heat generating device, and along the normal direction of the mainboard, the size of the second heat generating device is larger than the sizes of the remaining heat generating devices in the plurality of heat generating devices; The orthographic projection of the second heating device on the liquid cooling plate is a second projection, and the second projection is located outside the liquid cooling pipe layout area. The liquid cooling plate is provided with a contoured groove adapted to the second heating device on the side facing the mainboard.

8. The power module according to any one of claims 1 to 7, characterized in that: An annular insulating baffle surrounding the mainboard assembly is arranged between the integral structure and the shell.

9. The power module according to any one of claims 1 to 7, characterized in that: The housing comprises an upper housing and a lower housing, and the upper housing and the lower housing are covered to form the accommodating space; a guide groove is arranged on the top plate of the upper housing.

10. A server, characterized in that: Comprising a power module as described in any one of claims 1-9.

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