Solid state disk with chip protection structure

Abstract

The utility model provides a solid state disk with a chip protection structure, belongs to the technical field of solid state disk production, and is used for solving the technical problem that the protection effect of an existing solid state disk shell on an internal circuit board is poor. Comprising an upper shell, a circuit board and a lower shell, a heat-conducting metal sheet is fixed above the circuit board, supporting wings are fixed on two sides of the heat-conducting metal sheet, a supporting column is fixed on the lower shell, heat-conducting silica gel sheets are pasted on two sides of the heat-conducting metal sheet, one heat-conducting silica gel sheet abuts against one side of the circuit board, and the other heat-conducting silica gel sheet abuts against the upper shell. A cavity is formed in the heat-conducting metal sheet, an opening is formed in one side of the cavity, a coating rubber sleeve is arranged at the opening of the cavity, and the cavity is filled with heat-conducting silicone grease; according to the solid state disk with the chip protection structure, a deformation space can be provided for the upper shell of the solid state disk while heat is conducted out, impact force generated by the outside is absorbed, and a protection effect is provided for storage particles and chips on the circuit board.

Description

Technical Field

[0001] The utility model belongs to the technical field of solid - state drive production, and relates to a solid - state drive with a chip protection structure. Background Technique

[0002] A solid - state drive is a hard disk made of a solid - state electronic storage chip array, consisting of a control unit and a storage unit. The solid - state drive is completely the same as a common hard disk in terms of interface specifications and definitions, functions, and usage methods. It is widely used in many fields such as military, vehicle - mounted, industrial control, video surveillance, network surveillance, network terminals, electric power, medical treatment, aviation, and navigation equipment. Generally, the solid - state drive is installed inside a computer for storing files.

[0003] For a solid - state drive with a SATA interface, the outer shell protects the internal circuit board. To ensure that the storage particles and chips on the circuit board can dissipate heat, the side of the circuit board with the storage particles and chips fixed thereon needs to be closely attached to the inner side of the outer shell for heat dissipation through the outer shell. When the outer shell falls or is knocked, the inward depression of the outer shell will damage the storage particles and chips on the circuit board, and the protection effect of the outer shell is poor.

[0004] Based on this, we have designed a solid - state drive with a chip protection structure. Content of the Utility Model

[0005] The purpose of the utility model is to address the above - mentioned problems existing in the prior art and propose a solid - state drive with a chip protection structure. The technical problem to be solved by this device is: how to improve the protection effect of the outer shell of the solid - state drive on the storage particles and chips on the circuit board.

[0006] The purpose of the utility model can be achieved by the following technical solutions:

[0007] A solid - state drive with a chip protection structure includes an upper shell, a circuit board, and a lower shell, and the upper shell and the lower shell are fixed by screws. A heat - conducting metal sheet is fixed above the circuit board, and support wings are fixed on both sides of the heat - conducting metal sheet. Support columns are fixed on the lower shell and are aligned with the support wings. Heat - conducting silica gel sheets are pasted on both sides of the heat - conducting metal sheet. One heat - conducting silica gel sheet abuts against the side of the circuit board with the storage particles and chips fixed thereon, and the other heat - conducting silica gel sheet abuts against the inner side of the upper shell. A cavity is formed in the heat - conducting metal sheet, one side of the cavity is open, a covering rubber sleeve is arranged at the opening of the cavity, and heat - conducting silicone grease is filled in the cavity.

[0008] A number of partition bars are arranged in the cavity, and the partition bars are evenly distributed at equal intervals.

[0009] With the above structure, during use, when the upper shell deforms inward, the heat-conducting metal sheet can provide a supporting force to the upper shell, improving the protection of the circuit board. Among them, the spacer can enhance the strength of the heat-conducting metal sheet and has room for deformation, capable of absorbing impact force and not pressing on the circuit board.

[0010] A number of equally spaced heat dissipation fins are fixed on the outer side of the upper shell, and a number of ventilation holes are provided on the heat dissipation fins.

[0011] With the above structure, during use, the heat dissipation fins can improve the heat dissipation effect of the upper shell in the chassis, and the ventilation holes can enhance the air flow between the heat dissipation fins, further improving the heat dissipation effect.

[0012] A number of equally spaced support bars are fixed on the lower shell, and a number of equally spaced small holes are provided on the support bars.

[0013] With the above structure, the support bars provide a supporting effect on the circuit board and separate the lower shell from the circuit board at the same time. When the lower shell is impacted or squeezed and deforms inward, there is sufficient deformation space to provide buffering, and the circuit board will not be damaged. Moreover, the small holes enable the support bars to be compressed, further providing a buffering effect.

[0014] A rubber strip is provided on the support bar and abuts against the circuit board.

[0015] With the above structure, there are multiple solder joints on the side of the circuit board close to the lower shell. The rubber strip can prevent short circuits between the multiple solder joints and prevent damage to the solid-state drive.

[0016] Compared with the prior art, the solid-state drive with the chip protection structure has the following advantages:

[0017] 1. Through the heat-conducting metal sheet, heat-conducting silicone grease, and the coated rubber sleeve, it is possible to provide a deformation space for the upper shell of the solid-state drive while conducting heat, absorb the impact force generated externally, and provide a protective effect on the storage particles and chips on the circuit board.

[0018] 2. Through the support bars and rubber strips, the lower shell is separated from the circuit board, the circuit board is supported, and there is an inner concave space, capable of absorbing the impact force from the outside. Moreover, the rubber strip can prevent short circuits of the solder joints on the lower side of the circuit board and prevent damage to the solid-state drive. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a three-dimensional structural schematic diagram of the present invention;

[0020] Figure 2 is a disassembled structural schematic diagram of the present invention;

[0021] Figure 3It is a schematic structural diagram of the lower shell in the present utility model;

[0022] Figure 4 It is a schematic structural diagram of the heat-conducting metal sheet in the present utility model.

[0023] In the figure: 1. Upper shell; 2. Circuit board; 3. Lower shell; 4. Heat-conducting metal sheet; 5. Support wing; 6. Support column; 7. Cavity; 8. Coated rubber sleeve; 9. Heat-conducting silica gel sheet; 10. Partition strip; 11. Heat-dissipating fin; 12. Ventilation hole; 13. Support strip; 14. Small hole; 15. Rubber strip. Detailed implementation manners

[0024] The technical solutions of this patent will be further described in detail below in conjunction with the specific implementation manners.

[0025] The embodiments of this patent are described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain this patent and should not be construed as a limitation of this patent.

[0026] In the description of this patent, it should be understood that the orientation or positional relationships indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing this patent and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of this patent.

[0027] In the description of this patent, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", "connection", "setting" should be understood in a broad sense. For example, it can be fixedly connected and set, or detachably connected and set, or integrally connected and set. For those of ordinary skill in the art, the specific meanings of the above terms in this patent can be understood according to specific circumstances.

[0028] Please refer to Figures 1-4, this embodiment provides a solid-state drive with a chip protection structure, including an upper shell 1, a circuit board 2, and a lower shell 3. The upper shell 1 and the lower shell 3 are fixed by screws. A heat-conducting metal sheet 4 is fixed above the circuit board 2, and support wings 5 are fixed on both sides of the heat-conducting metal sheet 4. Support columns 6 are fixed on the lower shell 3, and the support columns 6 are aligned with the support wings 5. Heat-conducting silicone sheets 9 are pasted on both sides of the heat-conducting metal sheet 4. One of the heat-conducting silicone sheets 9 abuts against the side of the circuit board 2 where storage particles and chips are fixed, and the other heat-conducting silicone sheet 9 abuts against the inner side of the upper shell 1. A cavity 7 is formed in the heat-conducting metal sheet 4. One side of the cavity 7 is open, and a covering rubber sleeve 8 is arranged at the opening of the cavity 7, and heat-conducting silicone grease is filled in the cavity 7.

[0029] A number of partition strips 10 are arranged in the cavity 7, and the partition strips 10 are evenly distributed; during use, when the upper shell 1 deforms inward, the heat-conducting metal sheet 4 can provide a supporting force for the upper shell 1, improving the protection of the circuit board 2. Among them, the partition strips 10 can improve the strength of the heat-conducting metal sheet 4 and have a space for deformation, capable of absorbing impact force and not pressing on the circuit board 2.

[0030] A number of evenly distributed heat dissipation fins 11 are fixed on the outer side of the upper shell 1, and a number of ventilation holes 12 are formed in the heat dissipation fins 11; during use, the heat dissipation fins 11 can improve the heat dissipation effect of the upper shell 1 in the chassis, and the ventilation holes 12 can improve the air flow between the heat dissipation fins 11, further improving the heat dissipation effect.

[0031] A number of evenly distributed support strips 13 are fixed on the lower shell 3, and a number of evenly distributed small holes 14 are formed in the support strips 13; the support strips 13 provide a supporting effect for the circuit board 2 and separate the lower shell 3 from the circuit board 2 at the same time. When the lower shell 3 is impacted or squeezed and deforms inward, there is enough deformation space to provide buffering, and the circuit board 2 will not be damaged. Moreover, the small holes 14 enable the support strips 13 to be compressed, further providing a buffering effect.

[0032] A rubber strip 15 is arranged on the support strip 13, and the rubber strip 15 abuts against the circuit board 2; there are multiple solder joints on the side of the circuit board 2 close to the lower shell 3, and the rubber strip 15 can prevent short circuits between the multiple solder joints and prevent the solid-state drive from being damaged.

[0033] In this embodiment, the above fixing methods are all the most commonly used fixed connection methods in the field, such as welding, bolt connection, etc.

[0034] The working principle of the present utility model:

[0035] When using a solid-state drive, the heat of the storage particles and chips with serious heat generation in the solid-state drive will be transferred to the bottom of the heat-conducting metal sheet 4, and then the heat will be transferred to the upper end of the heat-conducting metal sheet 4 with the cooperation of heat-conducting silicone grease. Finally, heat dissipation is carried out through the heat-dissipating fins 11 on the upper shell 1. The heat-conducting silicone grease has good heat conductivity. When the solid-state drive is impacted externally and the upper shell 1 is recessed inward, the recessed part of the upper shell 1 will squeeze the upper end of the heat-conducting metal sheet 4. The two sides of the heat-conducting metal sheet 4 are supported by the support columns 6 and will not squeeze the circuit board 2. The inward depression of the upper end of the heat-conducting metal sheet 4 will squeeze the cavity 7, and the heat-conducting silicone grease will be extruded outward to cover the rubber sleeve 8, which can improve the buffering effect and prevent the circuit board 2 from being damaged by extrusion. Moreover, the spacer 10 can improve the strength of the heat-conducting metal sheet 4 and improve the buffering effect. When the lower shell 3 of the solid-state drive is squeezed and recessed inward, the support strip 13 separates the lower shell 3 from the circuit board 2. When the lower shell 3 is impacted or squeezed and deformed inward, there is enough deformation space to provide buffering and the circuit board 2 will not be damaged. Moreover, the small holes 14 enable the support strip 13 to be compressed, further providing a buffering effect.

[0036] The above describes the preferred embodiments of this patent in detail. However, this patent is not limited to the above embodiments. Within the scope of knowledge possessed by those of ordinary skill in the art, various changes can also be made without departing from the gist of this patent.

Claims

1. A solid state hard disk with a chip protection structure, comprising an upper shell (1), a circuit board (2) and a lower shell (3), wherein the upper shell (1) and the lower shell (3) are fixed by screws, characterized in that: A heat-conducting metal sheet (4) is fixed above the circuit board (2), and support wings (5) are fixed on both sides of the heat-conducting metal sheet (4). A support column (6) is fixed on the lower shell (3), and the support column (6) is aligned with the support wing (5). Heat-conducting silicone sheets (9) are pasted on both sides of the heat-conducting metal sheet (4), one of the heat-conducting silicone sheets (9) is against the side of the circuit board (2) where the storage particles and the chip are fixed, and the other heat-conducting silicone sheet (9) is against the inner side of the upper shell (1). A cavity (7) is provided in the heat-conducting metal sheet (4), one side of the cavity (7) is open, a covering rubber sleeve (8) is provided at the opening of the cavity (7), and the cavity (7) is filled with heat-conducting silicone grease.

2. A solid state hard disk with a chip protection structure according to claim 1, characterized in that: A plurality of spacers (10) are arranged in the cavity (7), and the spacers (10) are distributed at equal intervals.

3. The solid state hard disk with a chip protection structure according to claim 1, characterized in that: A plurality of heat dissipation fins (11) distributed at equal intervals are fixed to the outer side of the upper shell (1), and a plurality of ventilation holes (12) are provided on the heat dissipation fins (11).

4. The solid state hard disk with a chip protection structure according to claim 1, characterized in that: A plurality of support bars (13) distributed at equal intervals are fixed on the lower shell (3), and a plurality of small holes (14) distributed at equal intervals are opened on the support bars (13).

5. The solid state hard disk with a chip protection structure according to claim 4, characterized in that: A rubber strip (15) is provided on the support strip (13), and the rubber strip (15) abuts against the circuit board (2).

Images