DFN2510-10L packaging device for enhancing reliability of common-mode circuit

Abstract

The utility model provides a DFN2510-10L packaging device for enhancing the reliability of a common mode circuit, which comprises a plurality of pin groups, each pin group comprises two oppositely arranged pins, and a connecting part made of conductive materials is arranged between the two pins in each group; and the chip is fixed on one pin, and a welding window of the chip is electrically connected with at least one pin in each pin group. According to the utility model, the connection part is arranged between the two corresponding pins, so that the two pins are electrically connected in the device, thereby preventing unstable performance of the common-mode circuit caused by virtual connection and short circuit in the common-mode circuit, improving the reliability of the circuit, and prolonging the service life of the common-mode circuit. And meanwhile, the connection reliability between the pin and the packaging medium is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip packaging, and particularly relates to a DFN2510-10L packaging device for enhancing the reliability of a common-mode circuit. Background Art

[0002] A common-mode circuit is a circuit configuration in which signals generated by two signal sources have equal amplitudes and the same phase. In a common-mode circuit, it is necessary to short-circuit two corresponding solder windows on a circuit board, and then install an electronic device in the common-mode circuit to make the phases of the two signal sources the same. In the prior art, an additional circuit is added between two corresponding pads of DFN2510-10L by means of a flying wire or the like to short-circuit the two. However, in this way, there will be a virtual connection phenomenon between the electronic device and the circuit and between the pins. Moreover, since the circuit is located at the bottom of the device, it is not easy to find after virtual connection or short circuit, resulting in unstable transmission of electrical signals, making the common-mode circuit part of the circuit board unreliable and causing common-mode inductance to occur. Content of the Utility Model

[0003] In view of this, the utility model aims to provide a DFN2510-10L packaging device for enhancing the reliability of a common-mode circuit, so as to enhance the reliability of part of the common-mode circuit.

[0004] To achieve the above object, the technical solution of the utility model is realized as follows:

[0005] A DFN2510-10L packaging device for enhancing the reliability of a common-mode circuit includes multiple groups of pin groups. Each group of pin groups includes two oppositely arranged pins, and a connecting portion made of a conductive material is provided between the two pins in each group;

[0006] A chip is fixed on one of the pins, and the solder windows of the chip are electrically connected to at least one pin in each group of pin groups respectively.

[0007] Further, a packaging medium bonding area formed by semi-etching is provided on the outer edge of each pin.

[0008] Further, the width of the connecting portion is not greater than the width of the packaging medium bonding area.

[0009] Further, in each adjacent two groups of pin groups, the distance between the packaging medium bonding areas of the pins is the same.

[0010] Further, each pin includes a wiring portion and a weak portion formed by inward narrowing at the outer end, and the packaging medium bonding area is arranged on the outer edge of the wiring portion.

[0011] Further, the area of the pins in one set of pin groups is larger than the area of the pins in other pin groups, and the chip is fixed on one of the pins in this pin group.

[0012] Further, the pin group where the pin with the larger area is located is placed in the middle of the packaging device.

[0013] Further, the pin to which the chip is fixed is placed on one side of the packaging device, and the pin connected to the solder window of the chip is placed on the other side of the packaging device.

[0014] Further, the central axis of the connecting portion is parallel to the central axis of the pin, and the central axes of the connecting portion and the pin are not collinear.

[0015] Compared with the prior art, the DFN2510-10L packaging device for enhancing the reliability of the common-mode circuit of the present invention has the following advantages:

[0016] The present invention adopts the method of arranging a connecting portion between two corresponding pins, so that the two pins are electrically connected inside the device, thereby preventing the instability of the performance of the common-mode circuit caused by virtual connection and short connection in the common-mode circuit, improving the reliability of the circuit, and at the same time improving the connection reliability between the pins and the packaging medium;

[0017] By adopting the method of reducing the width of the connecting portion, while ensuring the electrical connection relationship between the two pins, the reliability of the combination of the packaging medium and the pins is further improved;

[0018] By arranging the same spacing between the packaging medium bonding areas, the heat dissipation efficiency of each pin is similar, and the consistency of the device during operation is improved. Description of the Drawings

[0019] The drawings constituting a part of the present invention are used to provide a further understanding of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation to the present invention. In the drawings:

[0020] Figure 1 It is a schematic diagram of the combined structure of the internal frame and the chip of the packaging device

[0021] Figure 2 It is a schematic diagram of the connection between the packaging device and the modified common-mode circuit;

[0022] Figure 3 It is a schematic diagram of the connection between the packaging device and the common-mode circuit before modification;

[0023] Figure 4 It is a schematic diagram of the lead frame structure during the production of the packaging device.

[0024] Description of the Reference Numerals:

[0025] 1 - pin group; 4 - pins; 41 - encapsulation medium bonding area; 42 - weak part; 43 - wire bonding part; 2 - connection part; 3 - chip. Specific embodiments

[0026] It should be noted that, without conflict, the embodiments in the present invention and the features in the embodiments can be combined with each other.

[0027] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0028] In the description of the present invention, it should be noted that, unless otherwise clearly defined and limited, the terms "mounted", "connected", "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood through specific situations.

[0029] The present invention will be described in detail below with reference to the drawings and in combination with embodiments.

[0030] The DFN2510-10L package device for enhancing the reliability of the common-mode circuit according to the present utility model includes multiple groups of pin groups 1. Each group of pin groups 1 includes two oppositely arranged pins 4, and a connecting portion 2 made of a conductive material is provided between the two pins 4 in each group. In this embodiment, there are five groups of pin groups 1, and the five groups of pin groups 1 are arranged in a line, so that the pins 4 in the package device are arranged in a matrix. In this embodiment, the matrix arrangement is 2×5, and a chip 3 is fixedly provided on one of the pins 4 in one of the pin groups 1. The solder window of the chip 3 is electrically connected to one of the pins 4 in other pin groups 1 by wire bonding. In application, each pin 4 of this package device is connected to each predetermined position point on the circuit board, and the two pins 4 are electrically connected through the connecting portion 2 between the two pins 4, so that a common-mode circuit is formed between two connection points in the circuit. Compared with the existing common-mode circuit, since the connecting portion 2 is inside the package device and no additional processing of the circuit board or the package device is required, and at the same time, when manufacturing a common-mode circuit board with additional processing on the surface, it can also prevent the common-mode interference caused by the incomplete setting of the common-mode circuit on the circuit board resulting in an open circuit or abnormal wiring, so that the current can be conducted through the connecting portion 2 inside the package device, improving the connection reliability of the common-mode circuit.

[0031] In this embodiment, each pin 4 includes a wiring portion and a weak portion 42 formed by the outer end of the wiring portion converging inward. The width of the wiring portion is relatively large. Generally, wire bonding is performed between the solder window on the chip 3 and the pin 4. At the same time, the weak portion 42 enables the pin 4 to be connected to the row lead frame used in production, so as to reduce the connection strength between the pin 4 and the row lead frame, prevent the edge of the pin 4 from curling during the cutting process after packaging, and affect the product. At the same time, since the two frames in this embodiment are connected into a whole through the connecting portion 2, during the wire bonding process, two support points are provided between the edge of each pin 4 and the row lead frame, that is, the weak portion 42 of itself and the weak portion 42 of the other pin 4 in the same pin group 1 are both connected to the row lead frame, improving the stability of the pin 4 during the wire bonding process, and further improving the connection reliability between the pin 4 and the lead. And for the convenience of wire bonding, the pin 4 to which the chip 3 is fixed is placed on one side of the package device, and the pin 4 to which the solder window of the chip 3 is connected is placed on the other side of the package device.

[0032] Optionally, a package medium bonding region 41 is formed by semi-etching at the outer edge of the wiring portion of each pin 4. The thickness of the package medium bonding region 41 is less than that of the pin 4. The package medium can wrap the package medium bonding region 41 and expose one side surface of the pin 4 for electrical connection to a predetermined position on the circuit board. At the same time, the connecting portion 2 is also subjected to semi-etching treatment so that the thickness of the connecting portion 2 is the same as that of the package medium bonding region 41, enabling the package medium to wrap outside the connecting portion 2. In this embodiment, the width of the connecting portion 2 is less than the width of the package medium bonding region 41. While improving the stability of the pin 4, the connecting portion 2 also enhances the material bonding strength between the package medium and the pin 4, preventing the package medium from delaminating and causing the pin 4 to become loose from the package medium.

[0033] In the DFN2510-10L package device for enhancing the reliability of the common-mode circuit according to the present utility model, the area of at least one pin 4 is larger than that of the other pins 4, and the chip 3 is fixed on this pin 4 by bonding or other means, enabling this pin 4 to function as a base island. In this embodiment, the pin 4 with a larger area is placed in the middle of the package device, and two groups of pin groups 1 are respectively provided on both sides of it to facilitate wire bonding to the solder window of the chip 3, reducing the pitch difference between the solder window of the chip 3 and the pin 4. In the pin group 1 where the pin 4 with a larger area is located, the width of the connecting portion 2 is the same as the width of the pin 4, and the shape of another pin 4 in this pin group 1 is different from that of the other pins 4 to achieve an anti-fooling effect.

[0034] In the pin group 1 according to the present utility model, in order to cooperate with the connection points in the existing circuit board, each pin 4 corresponds to a welding point in the circuit board. In this embodiment, by setting the central axis of the connecting portion 2 parallel to the central axis of the pin 4 and the central axes of the connecting portion 2 and the pin 4 not being collinear, the distance between the package medium bonding regions 41 in two adjacent pin groups 1 is the same, so that each pin 4 in different pin groups 1 has the same heat dissipation space, ensuring device heat dissipation.

[0035] The position and shape of the pins 4 of the package device according to the present utility model are the same as those of the devices in the existing market, enabling this device to be applied in both the modified and unmodified common-mode circuits, increasing the applicable range of the package device according to the present utility model.

[0036] In this embodiment, the package medium is epoxy resin.

[0037] In the production process of the present utility model, multiple packaging devices are arranged in the same row lead frame for production. In order to quickly determine the positions of the respective packaging devices in the row lead frame, digital marks are provided on two adjacent sides of the row lead frame, so that operators can judge the coordinates of each device on the row lead frame through the digital marks. The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. DFN2510-10L packaged device with enhanced common-mode circuit reliability, characterized by: It comprises a plurality of pin groups, each pin group comprises two pins arranged opposite to each other, and a connecting portion made of a conductive material is provided between the two pins in each group; The chip is fixed on one of the pins, and the soldering window of the chip is electrically connected to at least one pin in each group of pins.

2. The DFN2510-10L packaged device for enhancing common mode circuit reliability according to claim 1, characterized in that: The outer edge of each pin is provided with a packaging medium bonding area formed by half etching.

3. The DFN2510-10L packaged device for enhancing common mode circuit reliability according to claim 2, characterized in that: The width of the connecting portion is not greater than the width of the packaging medium bonding area.

4. The DFN2510-10L packaged device for enhancing common mode circuit reliability according to claim 2, characterized in that: In every two adjacent pin groups, the spacings between the packaging medium bonding areas of the pins are the same.

5. The DFN2510-10L packaged device for enhancing common mode circuit reliability according to claim 2, characterized in that: Each pin comprises a connection portion and a weak portion formed by narrowing inwardly at the outer end, and the packaging medium bonding area is arranged at the outer edge of the connection portion.

6. The DFN2510-10L packaged device for enhancing common mode circuit reliability according to claim 1, characterized in that: The pin area in one of the pin groups is larger than the pin area in the other pin groups, and the chip is fixed on one of the pins in the pin group.

7. The DFN2510-10L packaged device for enhancing common mode circuit reliability according to claim 6, characterized in that: The pin group where the pins with larger areas are located is placed in the middle of the packaging device.

8. The DFN2510-10L packaged device for enhancing common mode circuit reliability according to claim 1 or 6, characterized in that: The pins to which the chip is fixed are placed on one side of the packaging device, and the pins to which the welding windows of the chip are connected are placed on the other side of the packaging device.

9. The DFN2510-10L packaged device for enhancing common mode circuit reliability according to claim 1, characterized in that: The central axis of the connecting portion is parallel to the central axis of the tube pin, and the central axes of the connecting portion and the tube pin are not colinear.

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