Liquid cooling system and battery pack

Abstract

The utility model provides a liquid cooling system and a battery pack, the liquid cooling system is used for the battery pack, the battery pack comprises at least one battery cell group, the liquid cooling system comprises at least one supporting liquid cooling plate and a top liquid cooling plate, and each supporting liquid cooling plate is used for supporting the bottom of the corresponding battery cell group and cooling the battery cell group. The top liquid cooling plate is located on the at least one supporting liquid cooling plate and used for cooling the tops of the corresponding battery cell sets, and meanwhile the thickness of the supporting liquid cooling plates is larger than that of the top liquid cooling plate. According to the liquid cooling system provided by the utility model, the space occupancy rate of the liquid cooling plate and the battery cell group can be reduced through the stacked design, and on the basis, the thickness of the supporting liquid cooling plate is set to be greater than that of the top liquid cooling plate, so that the supporting liquid cooling plate not only provides a cooling function for the battery cell group, but also provides a cooling function for the battery cell group. And the supporting liquid cooling plate can be ensured to have enough structural strength to support the battery cell group, so that the stability of the whole structure is ensured.

Description

Technical Field

[0001] The utility model relates to the field of batteries, and particularly to a liquid cooling system and a battery pack. Background Art

[0002] At present, the application of electric household vehicles has been relatively common. With the development of the electric vehicle industry and in order to meet future commercial needs, electric commercial vehicles such as electric trucks may appear in the future. The power required to operate an electric commercial vehicle is greater than that required to operate the current electric household vehicle. Therefore, the number of battery packs included in an electric commercial vehicle is larger. Correspondingly, a better cooling system is also required to be applicable to scenarios with a larger number of battery packs as described above. Summary of the Utility Model

[0003] An embodiment of the utility model provides a liquid cooling system and a battery pack, which can solve the problem of insufficient heat dissipation capacity of the cooling system when there are more battery packs.

[0004] In a first aspect, an embodiment of the utility model provides a liquid cooling system for a battery pack. The battery pack includes at least one battery cell group. The liquid cooling system includes:

[0005] At least one supporting liquid cooling plate, each supporting liquid cooling plate is used to support the bottom of the corresponding battery cell group and cool the battery cell group; and

[0006] A top liquid cooling plate, located above at least one supporting liquid cooling plate, is used to abut against the top of the corresponding battery cell group and cool the battery cell group;

[0007] Wherein, the thickness of the supporting liquid cooling plate is greater than the thickness of the top liquid cooling plate.

[0008] In one embodiment, 1.4 ≤ T1 / T2 ≤ 2; wherein, T1 is the thickness of the supporting liquid cooling plate, and T2 is the thickness of the top liquid cooling plate.

[0009] In one embodiment, the supporting liquid cooling plate is provided with a first flow channel for circulating a cooling medium, the top liquid cooling plate is provided with a second flow channel for circulating a cooling medium, 0.4 ≤ H1 / T1 ≤ 0.57, 0.52 ≤ H2 / T2 ≤ 0.6; wherein, H1 is the height of the first flow channel, and H2 is the height of the second flow channel.

[0010] In one embodiment, the top liquid cooling plate is provided with a second flow channel for circulating a cooling medium. The top liquid cooling plate includes a base plate and a connecting plate. The base plate and the connecting plate are connected to enclose the second flow channel, 2 ≤ H2 / T3 ≤ 3, 2.5 ≤ H2 / T4 ≤ 3.75; wherein, T3 is the thickness of the base plate, T4 is the thickness of the connecting plate, and H2 is the height of the second flow channel.

[0011] In one embodiment, the liquid cooling system further includes a pipeline structure. The support liquid cooling plate is provided with a first flow channel for circulating a cooling medium, and the top liquid cooling plate is provided with a second flow channel for circulating the cooling medium. The first flow channel is connected to the second flow channel through the pipeline structure. The pipeline structure includes at least one main pipeline component and at least one water nozzle. One end of each water nozzle is connected to the second flow channel of the top liquid cooling plate through the corresponding main pipeline component, and the other end of each water nozzle is connected to the first flow channel of the corresponding support liquid cooling plate.

[0012] In one embodiment, the water nozzle is an integrally formed structure.

[0013] In one embodiment, one end of the top liquid cooling plate extends beyond one end of at least one support liquid cooling plate in the length direction of the top liquid cooling plate; each main pipeline component is connected to the bottom surface of one end of the top liquid cooling plate and is also connected to the top surface of one end of the corresponding support liquid cooling plate through the corresponding water nozzle.

[0014] In one embodiment, the pipeline structure further includes at least one through-wall joint. One end of each through-wall joint is connected to the corresponding main pipeline component, and the other end of the through-wall joint is used to pass through the side plate of the battery pack housing to connect to an external cooling medium source; the through-wall joint includes two abutting portions located on both sides of the side plate, and the two abutting portions respectively abut against both sides of the side plate.

[0015] In one embodiment, the support liquid cooling plate is an extruded profile, and the top liquid cooling plate is a stamped profile.

[0016] In a second aspect, an embodiment of the present invention provides a battery pack, including the liquid cooling system as in the first aspect.

[0017] The present invention provides a liquid cooling system and a battery pack. The liquid cooling system is used for a battery pack, and the battery pack includes at least one battery cell group. The liquid cooling system includes at least one support liquid cooling plate and a top liquid cooling plate. Among them, each support liquid cooling plate is used to support the bottom of the corresponding battery cell group and cool the battery cell group. The top liquid cooling plate is located above at least one support liquid cooling plate and is used to abut against the top of the corresponding connecting plate battery cell group and cool the connecting plate battery cell group. At the same time, the thickness of the support liquid cooling plate is greater than the thickness of the top liquid cooling plate. Through the stacked design, the liquid cooling system can reduce the space occupancy rate of the liquid cooling plate and the battery cell group. On this basis, setting the thickness of the support liquid cooling plate to be greater than the thickness of the top liquid cooling plate enables the support liquid cooling plate to not only provide a cooling effect for the battery cell group but also ensure that the support liquid cooling plate has sufficient structural strength to provide a supporting effect for the battery cell group to ensure the stability of the overall structure. Compared with the single-sided cooling of the battery cell group in the related art, the cooling system in this embodiment has a higher heat dissipation efficiency, and the heat distribution of each battery cell group is more uniform, that is, the temperature difference between the top and bottom of the battery cell group is smaller, which can well ensure the safety of the battery cell group. Description of the Drawings

[0018] To more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present utility model. For those skilled in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0019] Figure 1 It is a schematic structural diagram of the liquid cooling system provided by the embodiment of the present utility model;

[0020] Figure 2 is Figure 1 a schematic structural diagram of the hidden side plate of the liquid cooling system in

[0021] Figure 3 is Figure 2 a schematic structural diagram of the pipeline structure 120 in

[0022] Figure 4 is Figure 1 a top view of

[0023] Figure 5 is Figure 4 a sectional view of

[0024] Figure 6 is Figure 2 a schematic structural diagram of the supporting liquid cooling plate 110 in

[0025] Figure 7 is Figure 6 a top view of

[0026] Figure 8 is Figure 7 a sectional view of

[0027] Figure 9 is Figure 8 an enlarged view of part D in

[0028] Figure 10 is Figure 2 a schematic structural diagram of the top liquid cooling plate 120 in

[0029] Figure 11 is Figure 10 a top view of

[0030] Figure 12 is Figure 11 a sectional view of

[0031] Figure 13 is Figure 12 an enlarged view of part B in

[0032] Explanation of reference numerals:

[0033] 100, Liquid cooling system; 110, Support liquid cooling plate; 111, First flow channel; 120, Top liquid cooling plate; 121, Second flow channel; 122, Substrate; 123, Connection plate; 130, Pipeline structure; 131, Main pipeline assembly; 132, Water nozzle; 133, Wall-piercing joint; 200, Battery cell group; 300, Side plate. Detailed implementation manners

[0034] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention. In addition, it should be understood that the specific implementation manners described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention. In the present invention, unless otherwise stated, the orientation words such as "upper" and "lower" generally refer to the upper and lower in the actual use or working state of the device, specifically the drawing direction in the accompanying drawings; and "inner" and "outer" refer to the outline of the device.

[0035] To solve the problem of insufficient heat dissipation capacity of the cooling system in the above-mentioned battery pack, the embodiments of the present invention provide a liquid cooling system 100 for a battery pack, which can be referred to Figure 1 , Figure 2 , Figure 1 is a structural schematic diagram of the liquid cooling system 100 provided by the embodiment of the present invention, Figure 2 is Figure 1 The structural schematic diagram of the liquid cooling system 100 in which the side plate 300 is hidden. The battery pack includes at least one battery cell group 200, and each battery cell group 200 is composed of multiple battery cells. The liquid cooling system 100 includes at least one support liquid cooling plate 110 and a top liquid cooling plate 120. Among them, each support liquid cooling plate 110 is used to support the bottom of the corresponding battery cell group 200 and cool the battery cell group 200. The top liquid cooling plate 120 is located above at least one support liquid cooling plate 110. Among them, a battery cell group 200 is supported by a support liquid cooling plate 110 close to the top liquid cooling plate 120. The top liquid cooling plate 120 is used to abut against the top of the battery cell group 200 and provide a cooling function for it. At the same time, the thickness of the support liquid cooling plate 110 is greater than the thickness of the top liquid cooling plate 120.

[0036] Specifically, it can be referred to Figure 2。In this liquid cooling system 100, a plurality of support liquid cooling plates 110 are stacked with the top liquid cooling plate 120. The top liquid cooling plate 120 is located on one side of the plurality of support liquid cooling plates 110, and a battery cell group 200 is provided between every two adjacent support liquid cooling plates 110. The two adjacent support liquid cooling plates 110 cool the top and bottom of the corresponding battery cell group 200 simultaneously to enhance the cooling effect of the cooling system. The support liquid cooling plate 110 with a relatively large thickness not only provides cooling for the bottom of the corresponding battery cell group 200, but also provides support for the corresponding battery cell group 200. The top liquid cooling plate 120 with a relatively small thickness abuts against the top of the uppermost battery cell group 200 and provides cooling for the top of the uppermost battery cell group 200.

[0037] In this embodiment, through the stacked design between the liquid cooling plate and the battery cell group 200, the space occupancy rate of the two can be reduced. On this basis, the thickness of the support liquid cooling plate 110 is set to be greater than the thickness of the top liquid cooling plate 120, so that the support liquid cooling plate 110 can not only provide cooling for the corresponding battery cell group 200, but also ensure that the support liquid cooling plate 110 has sufficient structural strength to provide support for the corresponding battery cell group 200 to ensure the stability of the overall structure. By arranging the corresponding battery cell group 200 between two adjacent liquid cooling plates, the top and bottom of the battery cell group 200 can be cooled simultaneously. Compared with the related technology in which the battery cell group 200 is cooled only on one side, the cooling system provided in this embodiment has a higher heat dissipation efficiency, and the heat distribution of each battery cell group 200 is relatively uniform, and the temperature difference between the top and bottom of the battery cell group 200 is relatively small, which can well ensure the safety of the battery cell group 200.

[0038] In some embodiments, reference can be made to Figure 2 、 Figure 3 , Figure 3 is Figure 2 a schematic structural diagram of the pipeline structure 120 in Figure 13 . The liquid cooling system 100 further includes a pipeline structure 130. The support liquid cooling plate 110 is provided with a first flow channel 111 for circulating a cooling medium, and the top liquid cooling plate 120 is provided with a second flow channel 121 for circulating a cooling medium. The first flow channel 111 is connected to the second flow channel 121 through the pipeline structure 120. The pipeline structure 130 includes at least one main pipeline component 131 and at least one water nozzle 132. One end of each water nozzle 132 is connected to the second flow channel 121 of the top liquid cooling plate 120 through the corresponding main pipeline component 131 (see Appendix Figure 9 ), and the other end of each water nozzle 132 is connected to the first flow channel 111 of the corresponding support liquid cooling plate 110 (see Appendix

[0039] Specifically, the water nozzle 132 in this embodiment is an integrally formed structure. One end thereof is communicated with the corresponding main pipeline assembly 131, and the other end is communicated with the corresponding support liquid cooling plate 110. In the related art, a male connector is provided on the liquid cooling plate, one end of a female connector is communicated with the male connector, the other end of the female connector is then communicated with one end of a pipeline, and the other end of the pipeline is then communicated with the main pipeline assembly 131. Therefore, compared with the pipeline structure in the related art, the pipeline structure 130 in this embodiment has a simpler structure and occupies less space.

[0040] In some embodiments, reference may be made to Figure 4 、 Figure 5 , Figure 4 is Figure 1 the top view of Figure 5 is Figure 4 the sectional view of . The pipeline structure 130 includes at least one wall-piercing joint 133. One end of each wall-piercing joint 133 is communicated with the corresponding main pipeline assembly 131, and the other end of the wall-piercing joint 133 is used to pass through the side plate 300 of the battery pack box body to communicate with an external cooling medium source. And the wall-piercing joint 133 includes two abutting parts located on both sides of the side plate 300, and the two abutting parts respectively abut against both sides of the side plate 300.

[0041] In this embodiment, the two abutting parts of the wall-piercing joint 133 abut against both sides of the side plate 300 of the battery pack box body. At the same time, one end of the wall-piercing joint 133 is communicated with the corresponding main pipeline assembly 131, and the other end of the wall-piercing joint 133 is communicated with an external cooling medium source, so that the structural positions among the wall-piercing joint 133, the pipeline structure 130 and the battery pack box body can be kept stable when the cooling system transports the cooling medium.

[0042] In some embodiments, reference may be made to Figure 3 、 Figure 5 . One end of the top liquid cooling plate 120 extends beyond one end of at least one support liquid cooling plate 110 in the length direction of the top liquid cooling plate 120. Each main pipeline assembly 131 is connected to the bottom surface of one end of the top liquid cooling plate 120, and is also connected to the top surface of one end of the corresponding support liquid cooling plate 110 through the corresponding water nozzle 132.

[0043] In this embodiment, by designing one end of the top liquid cooling plate 120 to extend beyond one end of at least one support liquid cooling plate 110 in the length direction of the top liquid cooling plate 120, the main pipeline assembly 131 connected to one end of the top liquid cooling plate 120 can be directly communicated with the bottom surface of one end of the top liquid cooling plate 120, without the need for the main pipeline structure 130 to be communicated with the top surface of the support liquid cooling plate 110 through a bent water nozzle 132 like in the prior art. Therefore, the space occupancy rate is reduced. At the same time, the end of the main pipeline structure 130 connected to the bottom surface of the top liquid cooling plate 120 can also provide a supporting effect for the top liquid cooling plate 120 to maintain the stability of the cooling system structure.

[0044] In some embodiments, reference may be made to Figures 10 to 13 , Figure 10 which Figure 2 is a schematic structural view of the top liquid cooling plate 120 in Figure 11 and Figure 10 is a top view of Figure 12 and Figure 11 is a sectional view of Figure 13 and Figure 12 is an enlarged view of part B in . The top liquid cooling plate 120 is provided with a second flow channel 121 for circulating a cooling medium. The top liquid cooling plate 120 includes a base plate 122 and a connecting plate 123. The base plate 122 and the connecting plate 123 are connected to enclose the second flow channel 121, and 2≤H2 / T3≤3, 2.5≤H2 / T4≤3.75, where T3 is the thickness of the base plate 122, T4 is the thickness of the connecting plate 123, and H2 is the height of the second flow channel 121.

[0045] Specifically, the thickness T3 of the base plate 122 is generally designed to be 1 mm to 1.5 mm, the thickness T4 of the connecting plate 123 is generally designed to be 0.8 mm to 1.2 mm, and the thickness T3 of the base plate 122 needs to be greater than or equal to the thickness T4 of the connecting plate 123. Referring to the above description, the height H2 of the second flow channel 121 is generally 3 mm. If the ratio of the height H2 of the second flow channel 121 to the thickness T3 of the base plate 122 is less than 2, at this time the height H2 of the second flow channel 121 is relatively small. Referring to the above description, it may cause the cooling medium in the second flow channel 121 to not fully contact the heat source, thereby affecting the cooling effect of the top liquid cooling plate 120. At the same time, too small a flow channel height may require a higher-precision manufacturing process, making the manufacturing difficult. When the ratio of the height H2 of the second flow channel 121 to the thickness T3 of the base plate 122 is greater than 3, the thickness of the base plate 122 is relatively small, and it may not be able to withstand the large pressure generated inside the flow channel, resulting in deformation or rupture of the base plate 122. At the same time, too high a flow channel height may lead to a slower flow rate of the cooling medium due to a larger flow channel area, thereby reducing the cooling efficiency and affecting the heat dissipation effect.

[0046] If the ratio of the height H2 of the second flow channel 121 to the thickness T3 of the connecting plate 123 is less than 2.5, at this time the height H2 of the second flow channel 121 is relatively small compared to the thickness T3 of the connecting plate 123. At this time, the flow velocity and flow rate of the cooling medium are restricted, resulting in poor cooling effect, and at the same time, it also increases the manufacturing difficulty of the connecting plate 123. If the ratio of the height H2 of the second flow channel 121 to the thickness T3 of the connecting plate 123 is greater than 3.75, at this time the height H2 of the second flow channel 121 is relatively large compared to the thickness T3 of the connecting plate 123, which may cause structural rupture and damage during the stamping manufacturing process of the connecting plate 123. At the same time, it will also lead to a lower flow rate of the cooling medium due to the too large volume of the second flow channel 121, resulting in poor cooling effect.

[0047] In some embodiments, reference may be made to Figures 6 to 9 , Figure 6 which Figure 2 is a schematic structural view of the support liquid cooling plate 110 in Figure 7 which Figure 6 is a top view, Figure 8 which Figure 7 is a sectional view, Figure 9 and Figure 8 is an enlarged view of part D in . The support liquid cooling plate 110 is provided with a first flow channel 111 for circulating a cooling medium, and the top liquid cooling plate 120 is provided with a second flow channel 121 for circulating a cooling medium (see Appendix Figure 13 ), and the first flow channel 111 is connected to the second flow channel 121 through the pipeline structure 130 to realize the transmission of the cooling medium. Among them, 0.4 ≤ H1 / T1 ≤ 0.57, 0.52 ≤ H2 / T2 ≤ 0.6, H1 is the height of the first flow channel 111, H2 is the height of the second flow channel 121, T1 is the thickness of the support liquid cooling plate 110, T2 is the thickness of the top liquid cooling plate 120, and the thickness T2 of the top liquid cooling plate 120 is equal to the sum of the thickness T3 of the substrate 122 and the thickness T4 of the connecting plate 123.

[0048] Specifically, referring to the above description, the height of the flow channel plate in the support cooling plate is usually designed to be 4 mm, that is, the height H1 of the first flow channel 111 is 4 mm, and the thickness of the support cooling plate is 7 mm to 10 mm. If the ratio of the height H1 of the first flow channel 111 to the thickness T1 of the support cooling plate is less than 0.4, at this time the height of the first flow channel 111 is relatively low. When the amount of the cooling medium input into the support liquid cooling plate 110 per unit time is certain, it will cause the flow resistance of the cooling medium in the first flow channel 111 to be too large, and at the same time, the manufacturing difficulty of the support liquid cooling plate 110 is relatively high. If the ratio of the height H1 of the first flow channel 111 to the thickness T1 of the support cooling plate is greater than 0.57, at this time the height of the first flow channel 111 is relatively high, which will cause the flow velocity of the cooling medium in the first flow channel 111 to be relatively low. In extreme cases, the cooling medium may not be able to fill the flow channel, resulting in poor cooling effect of the support liquid cooling plate 110. When the ratio of the height H1 of the first flow channel 111 to the thickness T1 of the support cooling plate is 0.4 to 0.57, at this time the manufacturing process of the support liquid cooling plate 110 is relatively simple, and at the same time, the cooling effect of the support liquid cooling plate 110 is also relatively good.

[0049] The thickness of the top liquid cooling plate 120 is usually designed to be 5 mm to 5.7 mm, and the height H2 of the second flow channel 121 is 3 mm. If the ratio of the height H2 of the second flow channel 121 to the thickness T2 of the top liquid cooling plate 120 is less than 0.52, the height of the second flow channel 121 is relatively low at this time. When the amount of the cooling medium input into the top liquid cooling plate 120 per unit time is constant, it will cause the flow rate of the cooling medium in the second flow channel 121 to be too fast, which may cause the cooling medium not to be in full contact with the heat source, thus affecting the cooling effect of the top liquid cooling plate 120. When the ratio of the height H2 of the second flow channel 121 to the thickness T2 of the top liquid cooling plate 120 is greater than 0.6, there is a risk of structural rupture during the stamping manufacturing process of the top liquid cooling plate 120. At the same time, the height of the second flow channel 121 is relatively high, which will cause the flow rate of the cooling medium in the second flow channel 121 to be relatively low, and the cooling effect of the top liquid cooling plate 120 is poor. When the ratio of the height H2 of the second flow channel 121 to the thickness T2 of the top liquid cooling plate 120 is 0.52 to 0.6, the cooling effect of the top liquid cooling plate 120 is better at this time.

[0050] In some embodiments, please refer to Figure 9 、 Figure 13 , 1.4 ≤ T1 / T2 ≤ 2; wherein, T1 is the thickness of the support liquid cooling plate 110, T2 is the thickness of the top liquid cooling plate 120, and the thickness T2 of the top liquid cooling plate 120 is equal to the sum of the thickness T3 of the substrate 122 and the thickness T4 of the connecting plate 123.

[0051] Specifically, the support liquid cooling plate 110 is usually composed of three layers: a bottom plate, a top plate, and a flow channel plate located between the bottom plate and the top plate. In order to ensure that the support liquid cooling plate 110 has sufficient strength to support the battery cell group 200, the thicknesses of the bottom plate and the top plate are designed to be not less than 1.5 mm and not greater than 3 mm. The height of the flow channel plate in the support liquid cooling plate 110 will affect the flow rate and flow resistance of the cooling medium in the flow channel. When the amount of the cooling medium input into the support liquid cooling plate 110 per unit time is constant, if the height of the flow channel plate is too high, the flow rate of the cooling medium in the flow channel will be relatively low, so the cooling effect of the support liquid cooling plate 110 will be poor. If the height of the flow channel plate is too low, the manufacturing difficulty of the support liquid cooling plate 110 is relatively high. In order to take into account both the manufacturing difficulty of the flow channel plate and the flow rate of the cooling medium, the height of the flow channel plate is designed to be 4 mm. Therefore, the thickness T1 of the support liquid cooling plate 110 is 7 mm to 10 mm. The top liquid cooling plate 120 does not need to support the battery cell group 200. Therefore, to a certain extent, its thickness is relatively thinner than that of the support liquid cooling plate 110. At the same time, in order to ensure that the height of the flow channel in the top liquid cooling plate 120 meets the requirements of the cooling function, the thickness of the support liquid cooling plate 110 is designed to be not less than 5 mm.

[0052] If the ratio of the thickness T1 of the support liquid cooling plate 110 to the thickness T2 of the top liquid cooling plate 120 is less than 1.4, the thickness T1 of the support liquid cooling plate 110 is relatively thin at this time, and the manufacturing difficulty of the support liquid cooling plate 110 is relatively high. If the ratio of the thickness T1 of the support liquid cooling plate 110 to the thickness T2 of the top liquid cooling plate 120 is greater than 2, the height of the flow channel in the support liquid cooling plate 110 is relatively high at this time, so the flow channel area is also relatively large. When the amount of the cooling medium input into the support liquid cooling plate 110 per unit time is constant, it will cause the flow velocity of the cooling medium in the flow channel to be relatively low, and the cooling effect of the support liquid cooling plate 110 is relatively poor. When the ratio of the thickness T1 of the support liquid cooling plate 110 to the thickness T2 of the top liquid cooling plate 120 is between 1.4 and 2, the manufacturing process of the support liquid cooling plate 110 is relatively simple at this time, and the cooling effect of the cooling system is also relatively good.

[0053] In some embodiments, the support liquid cooling plate 110 is an extruded profile, and the top liquid cooling plate 120 is a stamped profile. In this embodiment, the reason for setting the support liquid cooling plate 110 as an extruded profile is that the extruded profile can have relatively high structural strength, so that when the support liquid cooling plate 110 bears the battery cell group 120, it can bear the weight of the battery cell group 120 and ensure that it is not damaged. The top liquid cooling plate 120 does not need to support the battery cell group 120, so it is set as a stamped profile with relatively low strength to reduce the production cost.

[0054] The present invention provides a liquid cooling system 100, which is used for a battery pack and includes at least one support liquid cooling plate 110 and a top liquid cooling plate 120. Among them, each support liquid cooling plate 110 is used to support the bottom of the corresponding battery cell group 200 and cool the battery cell group 200. The top liquid cooling plate 120 is located above at least one support liquid cooling plate 110 and is used to abut and support the top of the battery cell group 200 of a support liquid cooling plate 110 close to the top liquid cooling plate 120. At the same time, it also provides a cooling function for the battery cell group 200. At the same time, the thickness of the support liquid cooling plate 110 is greater than the thickness of the top liquid cooling plate 120. The liquid cooling system 100 can reduce the space occupancy rate of the liquid cooling plate and the battery cell group 200 through a stacked design. On this basis, the thickness of the support liquid cooling plate 110 is set to be greater than the thickness of the top liquid cooling plate 120, so that the support liquid cooling plate 110 not only provides a cooling effect for the battery cell group 200, but also can ensure that the support liquid cooling plate 110 has sufficient strength to provide a supporting effect for the battery cell group 200 to ensure the stability of the overall structure. Compared with the single-sided cooling of the battery cell group 200 in the related art, the cooling system in this embodiment has higher heat dissipation efficiency, and the heat distribution of each battery cell group 200 is more uniform, that is, the temperature difference between the top and the bottom of the battery cell group 200 is relatively small, which can well ensure the safety of the battery cell group 200.

[0055] An embodiment of the present utility model further provides a battery pack, which includes the above-mentioned liquid cooling system 100. The battery pack has all the advantages of the above-mentioned liquid cooling system 100, which will not be elaborated here.

[0056] The embodiments of the present utility model have been introduced in detail above. Specific examples are used in this article to elaborate on the principle and implementation manner of the present utility model. The description of the above embodiments is only used to help understand the method and its core idea of the present utility model; at the same time, for those skilled in the art, according to the idea of the present utility model, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present utility model.

Claims

1. A liquid cooling system for a battery pack, wherein the battery pack comprises at least one battery cell group, characterized in that: include: At least one supporting liquid cooling plate, each supporting liquid cooling plate is used to support the bottom of the corresponding battery cell group and cool the battery cell group; as well as A top liquid cooling plate, located on at least one of the supporting liquid cooling plates, for abutting against the top of the corresponding battery cell group and cooling the battery cell group; Wherein, the thickness of the supporting liquid cooling plate is greater than the thickness of the top liquid cooling plate.

2. The liquid cooling system according to claim 1, characterized in that: 1.4≤T1 / T2≤2; wherein T1 is the thickness of the supporting liquid cooling plate, and T2 is the thickness of the top liquid cooling plate.

3. The liquid cooling system according to claim 2, characterized in that: The supporting liquid cooling plate is provided with a first flow channel for circulating cooling medium, and the top liquid cooling plate is provided with a second flow channel for circulating cooling medium, 0.4≤H1 / T1≤0.57, 0.52≤H2 / T2≤0.6; wherein H1 is the height of the first flow channel, and H2 is the height of the second flow channel.

4. The liquid cooling system according to claim 1, characterized in that: The top liquid cooling plate is provided with a second flow channel for circulating cooling medium, and the top liquid cooling plate includes a base plate and a connecting plate, the base plate and the connecting plate are connected to enclose the second flow channel, 2≤H2 / T3≤3, 2.5≤H2 / T4≤3.75; wherein T3 is the thickness of the base plate, T4 is the thickness of the connecting plate, and H2 is the height of the second flow channel.

5. The liquid cooling system according to claim 1, characterized in that: It also includes a pipeline structure, the supporting liquid cooling plate is provided with a first flow channel for circulating cooling medium, the top liquid cooling plate is provided with a second flow channel for circulating cooling medium, the first flow channel is connected to the second flow channel through the pipeline structure, the pipeline structure includes at least one main pipeline component and at least one water nozzle, one end of each of the water nozzles is connected to the second flow channel of the top liquid cooling plate through the corresponding main pipeline component, and the other end of each of the water nozzles is connected to the first flow channel of the corresponding supporting liquid cooling plate.

6. The liquid cooling system according to claim 5, characterized in that: The water nozzle is an integrally formed structure.

7. The liquid cooling system according to claim 5, characterized in that: One end of the top liquid cooling plate exceeds one end of at least one of the supporting liquid cooling plates in the length direction of the top liquid cooling plate; each of the main line components is connected to the bottom surface of the one end of the top liquid cooling plate, and is also connected to the top surface of the one end of the corresponding supporting liquid cooling plate through the corresponding water nozzle.

8. The liquid cooling system according to claim 5, characterized in that: The pipeline structure also includes at least one through-wall joint, one end of each of the through-wall joints is connected to the corresponding main pipeline assembly, and the other end of the through-wall joint is used to pass through the side plate of the battery pack box to connect to an external cooling medium source; the through-wall joint includes two abutment portions located on both sides of the side plate, and the two abutment portions respectively abut against both sides of the side plate.

9. The liquid cooling system according to claim 1, characterized in that: The supporting liquid cooling plate is an extruded profile, and the top liquid cooling plate is a stamped profile.

10. A battery pack, characterized in that: Comprising a liquid cooling system as described in any one of claims 1-9.

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