Optical module with lens and optical system

Abstract

The utility model discloses an optical module with a lens and an optical system, and the optical module with the lens comprises an optical sensor chip packaged by a printed circuit board-spherical grid, a frame disposed outside the optical sensor chip, and an optical lens disposed on the frame above the optical sensor chip. Wherein the magnification factor of the optical lens is the ratio of the transverse length of the optical sensor array of the optical sensor chip to the distance between the outer surfaces of the two side walls of the frame.

Description

Technical Field

[0001] The utility model belongs to the field of machinery, and particularly relates to an optical module and an optical system with a lens.

Background Art

[0002] Existing optical sensors, such as CMOS sensors, usually have a fixed size, and the array size of the image sensors they contain is fixed. Thus, when dealing with measured objects of different sizes, only by adjusting the optical lens paired with the image sensor can the area of the projection of the measured object on the optical sensor array be changed. However, this method will affect the imaging quality on the one hand, and on the other hand, it has high requirements for the optical lens, resulting in a relatively high overall cost. At the same time, due to the fixed size of existing optical sensors, for longitudinally long or large-sized measured objects, it is necessary to move the optical sensor or the measured object to scan the entire measured object to obtain an image of the entire measured object. This method undoubtedly increases the cost of the testing equipment and improves the complexity of the testing process.

Content of the Utility Model

[0003] The purpose of the utility model is to provide an optical module and an optical system with a lens, which can form an optical system by combining multiple optical modules with lenses according to the shape of the measured object, so as to conveniently complete the acquisition of the image of the measured object by using the optical system.

[0004] To achieve the above purpose, the optical module with a lens of the utility model includes an optical sensor chip, a frame arranged outside the optical sensor chip, and an optical lens arranged on the frame above the optical sensor chip. The optical sensor chip is provided with an optical sensor array, and the magnification of the optical lens is the ratio of the horizontal length of the optical sensor array of the optical sensor chip to the distance between the outer surfaces of the two side walls of the frame.

[0005] According to the above main features, the frame includes side walls arranged around the optical sensor chip and a top wall arranged on the upper part. The side walls and the top wall enclose a receiving space, and the top wall is provided with a through hole, and the optical lens is installed in the through hole.

[0006] According to the above main features, the optical sensor chip includes a wafer with an optical sensor array, a carrier plate for carrying the wafer, and solder balls arranged on the back of the carrier plate.

[0007] According to the above main features, a second lens is further arranged between the optical sensor chip and the optical lens. The second lens is arranged in the receiving space and fixed on the frame.

[0008] To achieve the above object, the optical system of the present utility model is formed by combining multiple optical modules. Each of the optical modules includes an optical sensor chip, a frame disposed outside the optical sensor chip, and an optical lens disposed on the frame above the optical sensor chip. The optical sensor chip is provided with an optical sensor array, and the magnification of the optical lens is the ratio of the lateral length of the optical sensor array of the optical sensor chip to the distance between the outer surfaces of the two side walls of the frame.

[0009] According to the above main features, the frame includes side walls disposed around the optical sensor chip and a top wall disposed on the upper part. The side walls and the top wall enclose a receiving space, and the top wall is provided with a through hole, and the optical lens is installed in the through hole.

[0010] According to the above main features, the optical sensor chip includes a wafer having an optical sensor array, a carrier plate for carrying the wafer, and solder balls disposed on the back surface of the carrier plate.

[0011] According to the above main features, a second lens is further provided between the optical sensor chip and the optical lens. The second lens is disposed in the receiving space and fixed on the frame.

[0012] According to the above main features, the optical system includes a main circuit board. Each of the multiple optical modules is closely arranged in a preset shape and is soldered to the main circuit board by a ball grid. And the main circuit board is provided with slots corresponding to the frames of each optical module, and the bottom of the side walls of the frames of each optical module is embedded in the slots.

[0013] Compared with the prior art, the present utility model can block external light by disposing a frame around the optical sensor chip, and can reduce the implementation cost by disposing the optical lens on the frame. And by setting the magnification of the optical lens as the ratio of the lateral length of the optical sensor array of the optical sensor chip to the distance between the outer surfaces of the two side walls of the frame, when combining multiple optical modules to collect images of the object to be measured, directly splicing the partial images of the object to be measured collected by each optical module can obtain the entire image of the object to be measured, thus simplifying the process of collecting the global image of the object to be measured.

BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 Schematic diagram of the structure of the optical module with a lens for implementing the present utility model.

[0015] Figure 2 For multiple Figure 1 Schematic diagram of the structure of the optical system formed by combining the optical modules with lenses shown.

DETAILED DESCRIPTION OF THE INVENTION

[0016] Please refer to Figure 1 , which is a schematic diagram of the structure of an optical module with a lens for implementing the present invention. The optical module with a lens 1 for implementing the present invention comprises an optical sensor chip 10, a frame 11 disposed outside the optical sensor chip 10, and an optical lens 12 disposed on the frame 11 above the optical sensor chip 10, wherein the optical sensor chip 10 is provided with an optical sensor array 100, and the magnification of the optical lens 12 is the ratio of the lateral length D1 of the optical sensor array 100 of the optical sensor chip 10 to the distance D2 between the outer surfaces of the first side wall 110 and the second side wall 111 disposed laterally on the frame 11, as shown in FIG. Figure 1 The optical sensor array 100 of the optical module with lens shown has a transverse length D1 of 7.5 mm, and the distance D2 between the outer surfaces of the first side wall 110 and the second side wall 111 of the frame 11 transversely disposed is 12.7 mm, so the magnification of the optical lens 12 is 7.5 / 12.7=0.59. That is, the optical module 1 with lens can collect an image of a local area of ​​the measured object 5 with a length of D2.

[0017] In a specific implementation, the frame 11 includes side walls (including a first side wall 110 and a second side wall 111 arranged transversely) arranged around the optical sensor chip 10 and a top wall 112 arranged at the top, the side walls and the top wall 112 enclose a receiving space (not numbered), and the top wall 112 is provided with a through hole 113, the optical lens 12 is installed in the through hole 113, and the optical lens 12 adopts a spherical design. Of course, the optical lens 12 can also adopt a non-spherical design, so that the quality of the collected image will be better. In addition, since the receiving space enclosed by the side walls and the top wall 112 is large enough, in order to optimize the performance of the optical imaging system and to optimize the lens, the optical lens 12 can be set as a combination of multiple lenses or a combination of multiple lenses and non-spherical lenses.

[0018] In addition, the optical sensor chip 10 includes a wafer 101 having an optical sensor array 100 (i.e., the wafer 101 not only includes the optical sensor array 100, but also may be provided with other processing circuits, etc.), a carrier board 102 supporting the wafer 101, and solder balls 103 provided on the back of the carrier board 102, i.e., the optical sensor chip 10 adopts a PCB-BGA packaging structure. In addition, the optical module with a lens of the present utility model is also provided with a circuit board 13, and the optical sensor chip 10 is directly soldered to the circuit board 13 through the solder balls 103. Of course, this circuit board 13 is also a circuit board of an electronic device (such as an industrial camera) using the optical module with a lens, i.e., the optical module with a lens does not necessarily need to be provided with a circuit board.

[0019] Furthermore, a second lens (not shown) is provided between the optical word sensor chip 10 and the optical lens 12. The second lens is disposed in the receiving space and fixed to the frame 11.

[0020] Please refer to Figure 2 as shown, for the structural schematic diagram of an optical system formed by combining multiple Figure 1 shown optical modules with lenses. The optical system implementing the present invention is formed by combining multiple optical modules 1 in a set shape. Each of the optical modules 1 has a structure as Figure 1 shown, and includes an optical sensor chip, a frame disposed outside the optical word sensor chip, and an optical lens disposed on the frame above the optical sensor chip. The magnification of the optical lens is the ratio of the lateral length of the optical sensor array of the optical sensor chip to the distance between the outer surfaces of the two side walls of the frame. In this way, seamless splicing of partial images of the measured object 5 collected by multiple optical modules can be achieved.

[0021] In specific implementation, the optical system includes a main circuit board 3. Each of the multiple optical modules 1 is closely arranged in a preset shape and welded to the main circuit board 3 through solder balls 103. The main circuit board is provided with slots (not shown) corresponding to the frames 11 of each optical module, and the bottom of the side wall of each frame 11 of the optical module is embedded in the slots. The main circuit board 3 can be a circuit board specifically configured for the optical system or a circuit board of an electronic device (such as an industrial camera) using the optical system.

[0022] Compared with the prior art, the present invention has the following excellent effects: 1. In the present invention, the optical lens and the optical sensor chip are integrated as a whole, so as to adapt to the imaging optimization of the optical system; 2. By setting the magnification of the optical lens as the ratio of the lateral length of the optical sensor array of the optical sensor chip to the distance between the outer surfaces of the two side walls of the frame, seamless splicing of images collected by multiple optical modules is ensured, enabling direct splicing of long-shaped CIS modules without the need for similar triangular splicing, etc. It is more conducive to combining an optical system of a corresponding shape according to the shape of the measured object and completing the acquisition of the image of the measured object, and subsequent image splicing, etc. are not required, thus simplifying the image processing process; 3. The optical sensor chip is packaged using PCB-BGA packaging, which has the advantages of high cost performance and accurate positioning accuracy; 4. The optical system uses lens imaging and has optical isolation between groups, with advantages such as good balance, strong anti-interference ability, and good imaging effect; 5. The optical components have the advantages of easy assembly, high positioning accuracy, controllable processing difficulty, and high cost performance; 6. Due to the good balance of the optical solution, ISP compensation is relatively easy to implement.

[0023] It is understandable that for those of ordinary skill in the art, equivalent substitutions or changes can be made according to the technical solution of the present utility model and its inventive concept, and all such changes or substitutions should fall within the protection scope of the claims appended to the present utility model.

Claims

1. An optical module with a lens, comprising an optical sensor chip, a frame arranged outside the optical sensor chip, and an optical lens arranged on the frame above the optical sensor chip, characterized in that: The optical sensor chip is provided with an optical sensor array, and the magnification of the optical lens is the ratio of the lateral length of the optical sensor array of the optical sensor chip to the distance between the outer surfaces of the two side walls of the frame.

2. The optical module with a lens according to claim 1, wherein: The frame includes side walls arranged around the optical sensor chip and a top wall arranged on the upper part. The side walls and the top wall enclose a receiving space, and the top wall is provided with a through hole, and the optical lens is installed in the through hole.

3. The optical module with a lens according to claim 2, characterized in that: The optical character sensor chip comprises a wafer with an optical sensor array, a carrier board for carrying the wafer, and solder balls arranged on the back side of the carrier board.

4. The optical module with a lens according to claim 3, characterized in that: A second lens is also arranged between the optical sensor chip and the optical lens. The second lens is arranged in the receiving space and fixed on the frame.

5. An optical system, formed by combining a plurality of optical modules, characterized in that: Each of the optical modules includes an optical sensor chip, a frame arranged outside the optical sensor chip, and an optical lens arranged on the frame above the optical sensor chip, and is characterized in that: the optical sensor chip is provided with an optical sensor array, and the magnification of the optical lens is the ratio of the lateral length of the optical sensor array of the optical sensor chip to the distance between the outer surfaces of the two side walls of the frame.

6. The optical system according to claim 5, characterized in that: The frame includes side walls arranged around the optical sensor chip and a top wall arranged on the upper part. The side walls and the top wall enclose a receiving space, and the top wall is provided with a through hole, and the optical lens is installed in the through hole.

7. The optical system according to claim 6, characterized in that: The optical character sensor chip comprises a wafer with an optical sensor array, a carrier board for carrying the wafer, and solder balls arranged on the back side of the carrier board.

8. The optical system according to claim 7, characterized in that: A second lens is also arranged between the optical sensor chip and the optical lens. The second lens is arranged in the receiving space and fixed on the frame.

9. The optical system according to claim 6, characterized in that: The optical system includes a main circuit board, each of the multiple optical modules is closely arranged into a preset shape and is welded to the main circuit board through a spherical grid, and the main circuit board is provided with a groove corresponding to the frame of each optical module, and the bottom of the side wall of the frame of each optical module is embedded in the groove.

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