Heat dissipation structure and lamp control device

Abstract

The utility model discloses a heat dissipation structure and a lamp control device. The heat dissipation structure comprises a shell, a heat dissipation assembly and a fan. The shell is provided with an air inlet and a first air outlet; the heat dissipation assembly is arranged in the shell and used for being connected with the circuit board, a first air duct and a second air duct are arranged at the heat dissipation assembly and located on the different sides of the heat dissipation assembly, the air inlet end of the first air duct communicates with the air inlet, and the air outlet end of the first air duct communicates with the air inlet end of the second air duct; the air outlet end of the second air duct communicates with the first air outlet, and the air inlet and the first air outlet are located on the side where the air inlet end of the first air duct is located; the fan is used for sucking air from the air inlet so that the air can be exhausted from the first air outlet after passing through the first air duct and the second air duct. According to the heat dissipation structure, the heat exchange coverage area of the heat dissipation assembly can be enlarged, effective heat exchange of the heat dissipation assembly is achieved, the overall temperature of the heat dissipation assembly is made to be balanced, and therefore the heat dissipation effect of the circuit board is improved.

Description

Technical Field

[0001] The utility model relates to lighting equipment, in particular to a heat dissipation structure and a lamp control device. Background Art

[0002] To implement functions such as lighting control and management of lamps, it is usually necessary to set a controller to be electrically connected to the lamps to control the lighting effect, lighting mode, etc. of the lamps. When the controller is working, the circuit board inside it often generates a lot of heat. If the heat on the circuit board cannot be discharged in time, it will accumulate inside the controller. Over time, it will affect the product performance and service life of the controller.

[0003] In the related art, an aluminum alloy radiator connected to the circuit board and a fan for generating an air flow for the radiator are provided. When the circuit board generates heat during operation and transfers the heat to the radiator, the air flow generated by the fan can take away the heat on the radiator, thereby realizing heat dissipation of the circuit board. However, the position of the radiator through which the air flow generated by the fan passes is relatively limited, and effective heat exchange of the radiator cannot be performed, resulting in poor heat dissipation effect for the circuit board. Summary of the Utility Model

[0004] The utility model aims to at least solve one of the technical problems existing in the prior art. For this purpose, the utility model provides a heat dissipation structure and a lamp control device, which can improve the heat dissipation effect of the circuit board.

[0005] According to the heat dissipation structure of the first aspect embodiment of the utility model, it includes:

[0006] A housing, provided with an air inlet and a first air outlet;

[0007] A heat dissipation component, arranged inside the housing, the heat dissipation component is used to be connected to the circuit board, a first air duct and a second air duct are arranged at the heat dissipation component, the first air duct and the second air duct are located on different sides of the heat dissipation component, the air inlet end of the first air duct is communicated with the air inlet, the air outlet end of the first air duct is communicated with the air inlet end of the second air duct, and the air outlet end of the second air duct is communicated with the first air outlet, wherein the air inlet and the first air outlet are located on the side where the air inlet end of the first air duct is located;

[0008] A fan, used to suck air from the air inlet so that the air passes through the first air duct and the second air duct and then is discharged from the first air outlet.

[0009] According to the heat dissipation structure of the embodiment of the utility model, it has at least the following beneficial effects:

[0010] By arranging a first air duct and a second air duct on different sides of the location where the heat dissipation component is located, and connecting the air outlet end of the first air duct to the air inlet end of the second air duct, the ambient air inhaled from the air inlet can enter the second air duct after passing through the first air duct and exchanging heat with the heat dissipation component for the first time at the first air duct, and then exchange heat with the heat dissipation component for the second time at the second air duct, and then be discharged from the first air outlet. In this way, the ambient air entering the interior of the housing can exchange heat with the heat dissipation component twice on different sides, improving the heat exchange coverage range of the heat dissipation component, achieving effective heat exchange of the heat dissipation component, making the overall temperature of the heat dissipation component relatively balanced, and thus improving the heat dissipation effect on the circuit board.

[0011] According to some embodiments of the present invention, the first air duct is located inside the heat dissipation component, and the second air duct is located outside the heat dissipation component.

[0012] According to some embodiments of the present invention, the second air duct surrounds the outer wall of the heat dissipation component.

[0013] According to some embodiments of the present invention, the heat dissipation component includes a radiator, and the radiator includes a heat dissipation part, a first mounting part, and a second mounting part. The first mounting part and the second mounting part are respectively arranged on opposite sides of the heat dissipation part. The first air duct is arranged on the heat dissipation part, and the first mounting part and the second mounting part are respectively used for mounting the circuit board.

[0014] According to some embodiments of the present invention, the heat dissipation component further includes a first cover body and a second cover body. The first cover body covers the first mounting part and forms a first sealed space, and the second cover body covers the second mounting part and forms a second sealed space. The second air duct is arranged outside the first cover body and the second cover body.

[0015] According to some embodiments of the present invention, the heat dissipation structure further includes a diversion baffle. The diversion baffle is arranged on the side where the air outlet end of the first air duct is located, and the diversion baffle is spaced from the air outlet end of the first air duct. The diversion baffle is used to guide the air from the air outlet end of the first air duct to the air inlet end of the second air duct.

[0016] According to some embodiments of the present invention, the housing is further provided with a second air outlet, and the second air outlet is closer to the air inlet end of the second air duct than the first air outlet.

[0017] According to some embodiments of the present invention, the heat dissipation structure further includes a diversion cover. The diversion cover is arranged between the air inlet and the air inlet end of the first air duct. The diversion cover is provided with a diversion groove, and the two ends of the diversion groove are respectively communicated with the air inlet and the air inlet end of the first air duct. The diversion groove is used to guide the air from the air inlet into the first air duct.

[0018] According to some embodiments of the present utility model, a blower is disposed between an air inlet and a flow guiding cover, and seals are provided between the air inlet and the blower, between the blower and the flow guiding cover, and between the flow guiding cover and the intake end of the first air duct.

[0019] A lamp control device according to an embodiment of the second aspect of the present utility model includes:

[0020] A circuit board and a heat dissipation structure according to any one of the above embodiments, and the circuit board is mounted on the heat dissipation assembly.

[0021] Additional aspects and advantages of the present utility model will be given in part in the following description, will become apparent in part from the following description, or will be understood through the practice of the present utility model. Description of the Drawings

[0022] The following further describes the present utility model in conjunction with the drawings and embodiments, where:

[0023] Figure 1 is a three-dimensional structure diagram of the lamp control device provided by the embodiment of the present utility model;

[0024] Figure 2 is Figure 1 a structural exploded view of the heat dissipation structure of the lamp control device shown;

[0025] Figure 3 is Figure 1 a sectional view of the heat dissipation structure of the lamp control device shown along the A-A direction, where the dashed line part with an arrow indicates the air flow direction;

[0026] Figure 4 is Figure 2 a three-dimensional structure diagram of the heat dissipation assembly of the heat dissipation structure shown;

[0027] Figure 5 is Figure 4 a three-dimensional structure diagram of the heat dissipation assembly shown;

[0028] Figure 6 is Figure 5 a sectional view of the radiator of the heat dissipation assembly shown along the B-B direction;

[0029] Figure 7 is Figure 3 a partial enlarged view at C of, where the dashed line part with an arrow indicates the air flow direction;

[0030] Figure 8 is Figure 3 a partial enlarged view at D of, where the dashed line part with an arrow indicates the air flow direction.

[0031] Reference Signs:

[0032] Lamp control device 100;

[0033] Heat dissipation structure 10;

[0034] Housing 11; base 111; middle shell 112; upper cover 113; air inlet 1101; first air outlet 1102, second air outlet 1103;

[0035] Heat dissipation component 12; radiator 121; heat dissipation part 1211; heat sink 12111; first mounting part 1212; second mounting part 1213; first cover 122; second cover 123; first air duct 1201; second air duct 1202;

[0036] Fan 13;

[0037] Flow guiding baffle 14;

[0038] Flow guiding cover 15; flow guiding groove 1501;

[0039] Circuit board 20. Specific implementation manner

[0040] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present utility model, and should not be construed as a limitation to the present utility model.

[0041] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as up, down, front, back, left, right, etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model.

[0042] In the description of the present utility model, the meaning of several is more than one, the meaning of multiple is more than two, greater than, less than, exceeding, etc. are understood as not including the present number, and above, below, within, etc. are understood as including the present number. If the first and second are described only for the purpose of distinguishing technical features, they should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or the sequence of the indicated technical features.

[0043] In the description of the present utility model, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present utility model in combination with the specific content of the technical solution.

[0044] In the description of the present utility model, the descriptions referring to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0045] In the related art, the heat dissipation structure of a lamp control device includes a housing, a radiator, and a fan. The radiator is built into the housing, and a circuit board for realizing circuit functions is installed on the radiator. The housing is provided with a heat dissipation air duct and an air inlet and an air outlet located at both ends of the heat dissipation air duct respectively. The radiator is located on the heat dissipation air duct, and the fan is arranged at the air inlet. During operation, the heat generated by the circuit board is transferred to the radiator. The fan sucks ambient air from the air inlet. When the air passes through the radiator on the heat dissipation air duct, it exchanges heat with the radiator to form hot air and is discharged through the air outlet. This way of using a single air duct structure for heat exchange of the radiator has limited heat dissipation effect.

[0046] Please refer to Figures 1 to 3 , an embodiment of the present utility model provides a heat dissipation structure 10, which is applied to a lamp control device 100 and is used for dissipating heat from a circuit board 20 inside the lamp control device 100.

[0047] The heat dissipation structure 10 includes a housing 11, a heat dissipation component 12, and a fan 13. The housing 11 is provided with an air inlet 1101 and a first air outlet 1102. The heat dissipation component 12 is arranged inside the housing 11. The heat dissipation component 12 is used to connect with the circuit board 20. A first air duct 1201 and a second air duct 1202 are provided at the heat dissipation component 12. The first air duct 1201 and the second air duct 1202 are located on different sides of the heat dissipation component 12. The air inlet end of the first air duct 1201 is communicated with the air inlet 1101, the air outlet end of the first air duct 1201 is communicated with the air inlet end of the second air duct 1202, and the air outlet end of the second air duct 1202 is communicated with the first air outlet 1102. Among them, the air inlet and the first air outlet are located on the side where the air inlet end of the first air duct is located. The fan 13 is used to suck air from the air inlet 1101 so that the air passes through the first air duct 1201 and the second air duct 1202 and is discharged from the first air outlet 1102.

[0048] In the embodiment of the present utility model, by arranging a first air duct 1201 and a second air duct 1202 on different sides of the position where the heat dissipation component 12 is located, and the air outlet end of the first air duct 1201 is communicated with the air inlet end of the second air duct 1202, so that the ambient air inhaled from the air inlet 1101 can enter the second air duct 1202 after passing through the first air duct 1201 and performing the first heat exchange with the heat dissipation component 12 at the first air duct 1201, and perform the second heat exchange with the heat dissipation component 12 at the second air duct 1202, and then be discharged from the first air outlet 1102. In this way, the ambient air entering the inside of the housing 11 can perform secondary heat exchange on the heat dissipation component 12 on different sides, improving the heat exchange coverage range of the heat dissipation component 12, realizing effective heat exchange of the heat dissipation component 12, making the overall temperature of the heat dissipation component 12 relatively balanced, thereby improving the heat dissipation effect on the circuit board 20, avoiding heat accumulation at the circuit board 20 due to the heat generated by the circuit board 20 not being discharged in time, and ensuring the working performance and service life of the circuit board 20.

[0049] Please refer to Figure 3 and Figure 4 , in some embodiments, the first air duct 1201 is located inside the heat dissipation component 12, that is, the first air duct 1201 penetrates through the internal structure of the heat dissipation component 12. When the air flow passes through the first air duct 1201, the air flow can perform the first heat exchange with the inner side wall of the heat dissipation component 12; the second air duct 1202 is located outside the heat dissipation component 12, that is, the second air duct 1202 is attached to the outer side wall of the heat dissipation component 12. When the air flow passes through the second air duct 1202, the air flow can perform the second heat exchange with the outer side wall of the heat dissipation component 12. Through the above settings, when the heat of the circuit board 20 is transferred to the inner side and the outer side of the heat dissipation component 12 by heat conduction, the heat dissipation component 12 can respectively dissipate the heat into the air flow of the first air duct 1201 and the second air duct 1202, and the air flow can take it away in time to realize effective heat exchange of the heat dissipation component 12, making the overall temperature of the heat dissipation component 12 relatively balanced and ensuring the heat dissipation effect on the circuit board 20.

[0050] In some embodiments, the second air duct 1202 is arranged around the outer side wall of the heat dissipation component 12, that is, the second air duct 1202 is arranged around the heat dissipation component 12 along the outer peripheral direction of the heat dissipation component 12. The second air duct 1202 covers the outer side wall of the heat dissipation component 12, enabling the heat dissipation component 12 to have a larger outer heat exchange area for heat exchange with the air flow. When the air flow passes through the second air duct 1202, the air flow can perform the second heat exchange with the heat dissipation component 12 around the outer side wall of the heat dissipation component 12, thereby realizing more effective heat exchange of the heat dissipation component 12, improving the heat dissipation effect on the circuit board 20, and making the overall temperature of the heat dissipation component 12 more balanced.

[0051] When the ambient air enters the first air duct 1201 through the air inlet end of the first air duct 1201, the air undergoes a heat exchange with the inner wall of the heat dissipation component 12 to form hot air with lower heat and flows from the air outlet end of the first air duct 1201 to the air inlet end of the second air duct 1202. The hot air also has a certain heat absorption capacity. When the hot air with lower heat flows into the air inlet end of the second air duct 1202, the hot air with lower heat undergoes a secondary heat exchange with the outer wall of the heat dissipation component 12 to form hot air with higher heat and is discharged from the first air outlet 1102.

[0052] Specifically, the outer wall of the heat dissipation component 12 is adjacent to and spaced from the inner wall of the housing 11, and the second air duct 1202 is formed between the outer wall of the heat dissipation component 12 and the inner wall of the housing 11. More specifically, the heat dissipation component 12 has four outer walls, and the housing 11 has four inner walls, and the outer walls of each heat dissipation component 12 correspond to the inner walls of each housing 11 one by one, and the second air duct 1202 is formed between the outer walls of the heat dissipation component 12 and the inner wall of the housing 11.

[0053] Optionally, in order to allow the air flow to evenly enter the second air duct 1202 from various points of the air inlet end of the second air duct 1202 after flowing out from the air outlet end of the first air duct 1201, the distances between the outer walls of the heat dissipation component 12 and the corresponding inner walls of the outer shell 11 are equal. In this way, the opening size of the second air duct 1202 surrounded by the air inlet end of the heat dissipation component 12 is uniform, so that the air flow can evenly flow into the second air duct 1202 from the air inlet end of the second air duct 1202, so as to achieve balanced heat dissipation of the outer wall of the heat dissipation component 12.

[0054] It can be understood that when other structures (such as baffles, etc.) are adjacent to the outer wall of the heat dissipation component 12, the outer wall of the heat dissipation component 12 is spaced apart from the other structure, and the second air duct 1202 is formed between the outer wall of the heat dissipation component 12 and the other structure.

[0055] exist Figures 1 to 3In the illustrated embodiment, the different sides of the above-mentioned heat dissipation component 12 refer to the inner side and the outer side of the heat dissipation component 12, that is, the first air duct 1201 and the second air duct 1202 are respectively arranged on the inner side and the outer side of the heat dissipation component 12. It can be understood that in some other embodiments, the different sides of the above-mentioned heat dissipation component 12 refer to other sides of the heat dissipation component 12, not limited to the inner side and the outer side of the heat dissipation component 12. The different sides of the heat dissipation component 12 can also refer to the opposite sides of the heat dissipation component 12. For example, the left side and the right side of the heat dissipation component 12. Specifically, a first air duct 1201 can be formed by an interval between the left outer wall of the heat dissipation component 12 and the corresponding left inner wall of the housing 11, and a second air duct 1202 can be formed by an interval between the right outer wall of the heat dissipation component 12 and the corresponding right inner wall of the housing 11. The air outlet end of the first air duct 1201 and the air inlet end of the second air duct 1202 are both located on the upper side or the lower side of the heat dissipation component 12 and are connected and communicated, and the first air duct 1201 and the second air duct 1202 are separated from each other; for another example, the front side and the rear side of the heat dissipation component 12. Specifically, a first air duct 1201 can be formed by an interval between the front outer wall of the heat dissipation component 12 and the corresponding front inner wall of the housing 11, and a second air duct 1202 can be formed by an interval between the rear outer wall of the heat dissipation component 12 and the corresponding rear inner wall of the housing 11. The air outlet end of the first air duct 1201 and the air inlet end of the second air duct 1202 are both located on the upper side or the lower side of the heat dissipation component 12 and are connected and communicated, and the first air duct 1201 and the second air duct 1202 are separated from each other. The different sides of the heat dissipation component 12 can also refer to the adjacent sides of the heat dissipation component 12. For example, the left side and the front side of the heat dissipation component 12. Specifically, a first air duct 1201 can be formed by an interval between the left outer wall of the heat dissipation component 12 and the corresponding left inner wall of the housing 11, and a second air duct 1202 can be formed by an interval between the front outer wall of the heat dissipation component 12 and the corresponding front inner wall of the housing 11. The air outlet end of the first air duct 1201 and the air inlet end of the second air duct 1202 are both located on the upper side or the lower side of the heat dissipation component 12 and are connected and communicated, and the first air duct 1201 and the second air duct 1202 are separated from each other; for another example, the right side and the rear side of the heat dissipation component 12. Specifically, a first air duct 1201 can be formed by an interval between the right outer wall of the heat dissipation component 12 and the corresponding right inner wall of the housing 11, and a second air duct 1202 can be formed by an interval between the rear outer wall of the heat dissipation component 12 and the corresponding rear inner wall of the housing 11. The air outlet end of the first air duct 1201 and the air inlet end of the second air duct 1202 are both located on the upper side or the lower side of the heat dissipation component 12 and are connected and communicated, and the first air duct 1201 and the second air duct 1202 are separated from each other.

[0056] Please refer to Figure 5 and Figure 6, when it is necessary to implement circuit control for different modules, a single circuit board 20 is difficult to meet different circuit control requirements. Therefore, in some embodiments, the heat dissipation component 12 includes a radiator 121, and the radiator 121 includes a heat dissipation part 1211, a first mounting part 1212, and a second mounting part 1213. The first mounting part 1212 and the second mounting part 1213 are respectively disposed on opposite sides of the heat dissipation part 1211, and a first air duct 1201 is provided in the heat dissipation part 1211. The first mounting part 1212 and the second mounting part 1213 are respectively used for mounting the circuit board 20. By making the first mounting part 1212 and the second mounting part 1213 located on opposite sides of the heat dissipation part 1211 respectively, while increasing the mounting positions of the circuit boards 20, compared with mounting each circuit board 20 on the same side of the heat dissipation part 1211, this embodiment can minimize the space occupied by the two circuit boards 20 as much as possible, allowing the heat dissipation structure 10 to be able to mount different circuit boards 20 to achieve different circuit functions; moreover, the heat generated when each circuit board 20 works can be timely transferred from opposite sides of the heat dissipation part 1211 to the heat dissipation part 1211, and the air flow passing through the first air duct 1201 can exchange heat with the heat dissipation part 1211 and take away the heat on the heat dissipation part 1211, thereby achieving a better heat dissipation effect on each circuit board 20.

[0057] Among them, the first mounting part 1212 and the second mounting part 1213 can respectively mount at least one circuit board 20.

[0058] In some embodiments, the heat dissipation part 1211 includes a plurality of heat dissipation fins 12111. Each heat dissipation fin 12111 is in a long sheet shape. The plurality of heat dissipation fins 12111 are arranged side by side and at intervals. The opposite long side edges of each heat dissipation fin 12111 are respectively connected to the first mounting part 1212 and the second mounting part 1213. The interval spaces between adjacent two heat dissipation fins 12111 form the above-mentioned first air duct 1201, and the first air duct 1201 is arranged along the length direction of the heat dissipation fins 12111. When air flows through the first air duct 1201, it can contact and exchange heat with the opposite side surfaces of each heat dissipation fin 12111. By providing the heat dissipation fins 12111, the heat exchange surface area between the heat dissipation component 12 and the air flow can be increased, thereby accelerating the transfer of heat from the circuit board 20 to the position where the first air duct 1201 is located and ensuring the heat dissipation efficiency of the circuit board 20.

[0059] It can be understood that, in order to increase the surface area of the heat dissipation fins 12111 in contact with the air flow, a plurality of grooves can be provided on the opposite side surfaces of the heat dissipation fins 12111, and the grooves are arranged along the length direction of the heat dissipation fins 12111.

[0060] Of course, the heat sink 12111 can also be in other shapes and is not limited to the above-mentioned long sheet shape. The specific structure of the heat sink 12111 is not limited in the present utility model. For example, the heat sink 12111 can also be in a corrugated shape.

[0061] In some embodiments, both the first mounting portion 1212 and the second mounting portion 1213 are in a plate shape. The first mounting portion 1212 and the second mounting portion 1213 are arranged side by side on opposite sides of the plurality of heat sinks 12111, and each circuit board 20 is mounted on a surface of the corresponding mounting portion facing away from the heat sink 12111. The first mounting portion 1212 and the second mounting portion 1213 arranged in a plate shape can conduct heat transfer with a relatively large area with the circuit board 20, so that the heat generated on the circuit board 20 can be quickly transferred to each heat sink 12111 through the mounting portion.

[0062] Optionally, both the first mounting portion 1212 and the second mounting portion 1213 are perpendicular to the heat sink 12111.

[0063] In some embodiments, a heat conducting member is further included. The heat conducting member connects the radiator 121 and the circuit board 20 and is used for conducting heat between the radiator 121 and the circuit board 20, so that the heat generated when the circuit board 20 works can be timely transferred to the radiator 121.

[0064] Specifically, the heat conducting member includes a first heat conducting pad and a second heat conducting pad. The first heat conducting pad and the second heat conducting pad are respectively arranged on surfaces of the first mounting portion 1212 and the second mounting portion 1213 facing away from each other. The first heat conducting pad connects the first mounting portion 1212 and a corresponding circuit board 20, and the first heat conducting pad is used for conducting heat between the first mounting portion 1212 and the corresponding circuit board 20. The second heat conducting pad connects the second mounting portion 1213 and another corresponding circuit board 20, and the second heat conducting pad is used for conducting heat between the second mounting portion 1213 and the corresponding another circuit board 20.

[0065] Among them, both the first heat conducting pad and the second heat conducting pad can be heat conducting silicone pads.

[0066] Please refer back Figure 3 and Figure 4, in some embodiments, the heat dissipation component 12 further includes a first cover 122 and a second cover 123. The first cover 122 covers the first mounting portion 1212 to form a first sealed space, and the second cover 123 covers the second mounting portion 1213 to form a second sealed space. The first sealed space and the second sealed space are respectively used to hermetically protect the corresponding circuit board 20 to prevent moisture and the like from entering and causing electrical faults in the circuit board 20, thereby improving the environmental adaptability of the lamp control device 100; the second air duct 1202 surrounds the outer side walls of the first cover 122 and the second cover 123, and the heat generated when the circuit board 20 operates can also be conducted to the cover through the air in the mounting portion or the sealed space. The air flow passing through the second air duct 1202 exchanges heat with the heat dissipation cover and takes away the heat on the heat dissipation cover. By providing the heat dissipation cover, while realizing the hermetic protection of the circuit board 20, the heat exchange surface area between the heat dissipation component 12 and the air at the second air duct 1202 is increased, so that the heat can be transferred from the circuit board 20 to the position where the second air duct 1202 is located, ensuring the heat dissipation efficiency of the circuit board 20.

[0067] Optionally, the distance between each outer side wall of the first cover 122 and each inner side wall of the corresponding housing 11 is L1, and the distance between each outer side wall of the second cover 123 and each inner side wall of the corresponding housing 11 is L2. L1 is equal to L2, so that the air flow can uniformly flow into the second air duct 1202 from the air inlet end of the second air duct 1202 to achieve uniform heat dissipation of the outer side walls of the first cover 122 and the second cover 123.

[0068] Please refer to Figure 7It can be understood that, inside the housing 11, in addition to the first space for accommodating the heat dissipation component 12 and other components for dissipating heat from the circuit board 20, there is also a second space for accommodating other components inside the housing 11. When the first space and the second space communicate with each other, the air flow used for heat exchange with the heat dissipation component 12 will also flow into the second space, resulting in the inability of the air flow to enter the second air duct 1202 in time for the second heat exchange with the heat dissipation component 12. Among them, the second space is located on the side where the air outlet end of the first air duct 1201 is located. Therefore, in some embodiments, the heat dissipation structure 10 further includes a diversion baffle 14. The diversion baffle 14 is arranged on the side where the air outlet end of the first air duct 1201 is located, and the diversion baffle 14 is spaced apart from the air outlet end of the first air duct 1201. The diversion baffle 14 is used to guide the air to flow from the air outlet end of the first air duct 1201 to the air inlet end of the second air duct 1202. When the air flows out from the air outlet end of the first air duct 1201, the diversion baffle 14 can prevent the air from flowing in the direction from the air inlet end to the air outlet end of the first air duct 1201 and away from the air inlet end of the second air duct 1202, so that the air flow flowing out from the first air duct 1201 can flow into the air inlet end of the second air duct 1202 in time and flow towards the side where the air inlet end of the first air duct 1201 is located to be discharged from the first air outlet 1102, ensuring the efficiency of the second heat exchange of the air flow with the heat dissipation component 12.

[0069] Among them, the diversion baffle 14 is hermetically connected to the inner side wall of the housing 11, so that the first space described above is formed on the side of the diversion baffle 14 facing the heat dissipation component 12. After the air entering the housing 11 from the air inlet 1101 flows in this first space, it is discharged from the first air outlet 1102; the other side of the diversion baffle 14 facing away from the heat dissipation component 12 forms the second space described above, and the second space is used to accommodate other components of the lamp control device 100.

[0070] It can be understood that, since the air flow velocity from the air outlet end of the second air duct 1202 to the air inlet end of the second air duct 1202 is slow, after the air in the first air duct 1201 exchanges heat with the heat dissipation component 12 and flows out of the first air duct 1201, the heat carried out with the air is likely to accumulate between the air outlet end of the first air duct 1201 and the air inlet end of the second air duct 1202. Therefore, in some embodiments, the housing 11 is further provided with a second air outlet 1103. The second air outlet 1103 is closer to the air inlet end of the second air duct 1202 than the first air outlet 1102. A part of the air flowing out of the air outlet end of the first air duct 1201 is discharged through the second air duct 1202 and the first air outlet 1102, and another part of the air is discharged through the second air outlet 1103. In this way, a part of the heat carried out by the air flow from the first air duct 1201 can be discharged through the second air outlet 1103 in time, avoiding the accumulation of heat between the air outlet end of the first air duct 1201 and the air inlet end of the second air duct 1202 and affecting the secondary heat exchange of the heat dissipation component 12.

[0071] It can be understood that the second air outlet 1103 can be entirely located between the flow guiding baffle 14 and the heat dissipation component 12; a part of the second air outlet 1103 can be located between the flow guiding baffle 14 and the heat dissipation component 12, and another part can extend in a direction away from the flow guiding baffle 14 to be opposite to the outer side wall of the heat dissipation component 12; the second air outlet 1103 can also be entirely located at a position opposite to the outer side wall of the heat dissipation component 12, and the second air outlet 1103 is close to the air inlet end position of the second air duct 1202. The above settings of the position of the second air outlet 1103 can all allow a part of the air flowing to the second air duct 1202 to be discharged outwards in time, so as to avoid the accumulation of heat between the air outlet end of the first air duct 1201 and the air inlet end of the second air duct 1202.

[0072] Please refer to Figure 8 , in some embodiments, the heat dissipation structure 10 further includes a flow guiding cover 15. The flow guiding cover 15 is arranged between the air inlet 1101 and the air inlet end of the first air duct 1201. The flow guiding cover 15 is provided with a flow guiding groove 1501. The two ends of the flow guiding groove 1501 are respectively communicated with the air inlet 1101 and the air inlet end of the first air duct 1201. The flow guiding groove 1501 is used to guide the air to enter the first air duct 1201 from the air inlet 1101, so that the ambient air entering from the air inlet 1101 can be centrally transported to the first air duct 1201, improving the stability of the ambient air flowing into the first air duct 1201.

[0073] In some embodiments, along the direction from the air inlet 1101 towards the intake end of the first air duct 1201, the diversion groove 1501 gradually narrows, that is, the cross-sectional area of the diversion groove 1501 gradually decreases. In this way, a relatively large cross-section can be allowed at the air inlet 1101 for the diversion groove 1501 to introduce more ambient air. At the same time, the gradually narrowing diversion groove 1501 can increase the air flow rate within the diversion groove 1501, so that the air flow rate flowing into the first air duct 1201 is also increased. More air contacts the heat dissipation component 12 per unit time and takes away more heat, strengthening the heat exchange process between the air and the heat dissipation component 12 within the first air duct 1201, thereby improving the heat dissipation efficiency of the circuit board 20.

[0074] In some embodiments, the fan 13 is disposed between the air inlet 1101 and the diversion cover 15, and the spaces between the air inlet 1101 and the fan 13, between the fan 13 and the diversion cover 15, and between the diversion cover 15 and the intake end of the first air duct 1201 are sealed. Through the above arrangements, on the one hand, after the air enters from the air inlet 1101, it can only flow into the intake end of the first air duct 1201 through the blade gaps of the fan 13 and the diversion groove 1501 of the diversion cover 15, avoiding the air flowing to other positions after entering from the air inlet 1101 and reducing the heat exchange efficiency with the heat dissipation component 12. On the other hand, it can avoid the generation of air backflow and increase in noise, and prevent the air in the second air duct 1202 from re-entering the first air duct 1201 and reducing the heat exchange efficiency.

[0075] Specifically, the narrower end of the opening of the diversion cover 15 abuts and seals against the end face of the heat dissipation part 1211 at the intake end of the first air duct 1201 to prevent the occurrence of a gap between the diversion cover 15 and the heat dissipation part 1211 and the passage of an air flow; the wider end of the opening of the diversion cover 15 abuts and seals against the end face of the fan 13 facing away from the air inlet 1101 to prevent the occurrence of a gap between the diversion cover 15 and the fan 13 and the passage of an air flow; the base 111 is provided with a flange that surrounds the air inlet 1101, and the flange abuts and seals against the other end of the fan 13 facing the air inlet 1101 to prevent the occurrence of a gap between the fan 13 and the air inlet 1101 and the passage of an air flow.

[0076] In some other embodiments, the fan 13 can also be disposed at other positions, not limited to between the air inlet 1101 and the diversion cover 15. For example, the fan 13 is disposed outside the air inlet 1101, and the fan 13 conveys ambient air from the outside of the air inlet 1101 into the housing 11; or for another example, the fan 13 is disposed at the first air outlet 1102, and when the fan 13 operates, a negative pressure is generated inside the first air outlet 1102, so that the ambient air enters the housing 11 from the air inlet 1101.

[0077] Please refer back Figure 2, in some embodiments, the housing 11 includes a base 111, a middle shell 112, and an upper cover 113. The middle shell 112 has a hollow structure, and the base 111 and the upper cover 113 are respectively installed at both ends of the middle shell 112.

[0078] The above-mentioned air inlet 1101 is provided on the bottom surface of the base 111, the first air outlet 1102 is provided on the side surface of the middle shell 112 near one end of the base 111, and the second air outlet 1103 is provided on the side surface of the middle shell 112 near the other end of the upper cover 113. In addition, in order to enhance the effect of exhausting air from the air outlet end of the second air duct 1202 to the outside, the first air outlet 1102 is also provided on the side surface of the base 111.

[0079] The above-mentioned diversion baffle 14 is hermetically connected to the inner side wall of the upper cover 113 near one end of the middle shell 112 through a sealing ring, so that the diversion baffle 14, the middle shell 112, and the base 111 enclose the above-mentioned first space for accommodating the heat dissipation component 12, the fan 13, the diversion baffle 14, and the diversion cover 15.

[0080] It can be understood that the structure of the housing 11 can be set according to actual needs, and the present invention does not limit the specific structure of the housing 11.

[0081] The embodiment of the present invention also provides a lamp control device 100, and the lamp control device 100 is used to realize functions such as lighting control and management of the lamp. The lamp control device 100 includes a circuit board 20 and the heat dissipation structure 10 as described in any of the above embodiments, and the circuit board 20 is installed on the heat dissipation component 12.

[0082] Specifically, the number of the circuit boards 20 is two, and the two circuit boards 20 are respectively accommodated in the first cover body 122 and the second cover body 123, and are respectively installed on the first installation part 1212 and the second installation part 1213.

[0083] The lamp control device 100 of the embodiment of the present invention also has the advantages of the above-mentioned heat dissipation structure 10, which will not be elaborated here.

[0084] The above has described the embodiments of the present invention in detail with reference to the drawings, but the present invention is not limited to the above embodiments. Various changes can be made without departing from the gist of the present invention within the knowledge scope of those of ordinary skill in the art. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

Claims

1. A heat dissipation structure, characterized in that: include: A housing having an air inlet and a first air outlet; A heat dissipation component is arranged in the housing, the heat dissipation component is used to connect with the circuit board, a first air duct and a second air duct are arranged at the heat dissipation component, the first air duct and the second air duct are located on different sides of the heat dissipation component, an air inlet end of the first air duct is communicated with the air inlet, an air outlet end of the first air duct is communicated with the air inlet end of the second air duct, and an air outlet end of the second air duct is communicated with the first air outlet, wherein the air inlet and the first air outlet are located on the side where the air inlet end of the first air duct is located; The fan is used to inhale air from the air inlet so that the air passes through the first air duct and the second air duct and then is discharged from the first air outlet.

2. The heat dissipation structure according to claim 1, characterized in that: The first air duct is located on the inner side of the heat dissipation component, and the second air duct is located on the outer side of the heat dissipation component.

3. The heat dissipation structure according to claim 2, characterized in that: The second air duct is disposed around the outer side wall of the heat dissipation component.

4. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation assembly includes a heat sink, which includes a heat dissipation part, a first mounting part, and a second mounting part. The first mounting part and the second mounting part are respectively arranged on opposite sides of the heat dissipation part, the first air duct is arranged in the heat dissipation part, and the first mounting part and the second mounting part are respectively used to install a circuit board.

5. The heat dissipation structure according to claim 4, characterized in that: The heat dissipation assembly also includes a first cover body and a second cover body, the first cover body is disposed on the first mounting portion and forms a first sealed space, the second cover body is disposed on the second mounting portion and forms a second sealed space, and the second air duct is disposed on the outer sides of the first cover body and the second cover body.

6. The heat dissipation structure according to claim 1, characterized in that: It also includes a guide baffle, which is arranged on the side where the air outlet end of the first air duct is located, and the guide baffle is spaced apart from the air outlet end of the first air duct, and the guide baffle is used to guide air from the air outlet end of the first air duct to the air inlet end of the second air duct.

7. The heat dissipation structure according to claim 1, characterized in that: The housing is further provided with a second air outlet, and the second air outlet is closer to the air inlet end of the second air duct than the first air outlet.

8. The heat dissipation structure according to claim 1, characterized in that: It also includes a guide cover, which is arranged between the air inlet and the air inlet end of the first air duct. The guide cover is provided with a guide groove, and the two ends of the guide groove are respectively connected to the air inlet and the air inlet end of the first air duct, and the guide groove is used to guide air from the air inlet into the first air duct.

9. The heat dissipation structure according to claim 8, characterized in that: The fan is arranged between the air inlet and the air guide cover, and the air inlet and the fan, the fan and the air guide cover, and the air guide cover and the air inlet end of the first air duct are sealed.

10. A lighting control device, characterized in that: include: A circuit board and a heat dissipation structure according to any one of claims 1 to 9, wherein the circuit board is mounted on the heat dissipation component.

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