Vehicle-mounted controller

By vertically installing the cooling fan in the on-board controller and using the heat dissipation fins and heat conduction blocks, the existing on-board controllers have solved the problems of large thickness and low heat dissipation efficiency, achieving a smaller overall thickness and higher heat dissipation efficiency, making it easier for automobile installation and use.

CN222941117UActive Publication Date: 2025-06-03SHANGHAI HANGSHENG IND
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Patent Information

Application Number
CN202421901653.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-07
Publication Date
2025-06-03
Estimated Expiration
2034-08-07

AI Technical Summary

Technical Problem

In the existing vehicle controller, the blowing direction of the fan is parallel to the PCB circuit board, which makes the overall thickness of the vehicle controller relatively large and difficult to facilitate installation and use.

Method used

A vehicle-mounted controller is designed, with the axis of the cooling fan perpendicular to the PCB circuit board, the fan is installed in the housing in a lying flat position, and can be heat-dissipated with heat-dissipation fins and heat-conducting blocks.

Benefits of technology

By combining vertically installed heat dissipation fans and heat dissipation fins, the overall thickness of the on-board controller is reduced, the heat dissipation efficiency is improved, and it is easy to install and use in cars.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of automobiles, in particular to a vehicle-mounted controller, which comprises a shell and a PCB (printed circuit board) fixedly mounted in the shell. Radiating fans are arranged on any side of the PCB at intervals, and the axes of the radiating fans are perpendicular to the PCB. The cooling fan and the PCB are fixedly installed in the shell, and the axis of the cooling fan is kept perpendicular to the PCB, so that the cooling fan can be located on one side of the PCB in a flat posture, and compared with a cooling fan in the current market, the axis of the cooling fan is kept parallel to the PCB, so that the cooling fan has the advantages that the cooling effect is better, and the cooling effect is better. According to the vehicle-mounted controller provided by the embodiment of the utility model, the cooling fan in the vehicle-mounted controller can be used for cooling the PCB in a standing posture, namely, the cooling fan in the current market is used for cooling the PCB in a standing posture, and the thickness of the cooling fan and the thickness of the PCB can be smaller, so that the overall thickness of the vehicle-mounted controller can be smaller, and the vehicle-mounted controller can be conveniently mounted and used in a vehicle.
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Description

Technical Field

[0001] The utility model relates to the technical field of automobiles, and more specifically, to an in-vehicle controller. Background Art

[0002] Generally, a PCB circuit board is provided in an in-vehicle controller, and a control chip is provided on the PCB circuit board to implement corresponding functions. During the use of the in-vehicle controller, the control chip on the PCB circuit board is prone to heat generation. In order to ensure safety and the working efficiency of the control chip, heat dissipation treatment needs to be carried out on the control chip.

[0003] The existing solution for heat dissipation of the control chip is to install a fan in the in-vehicle controller. However, in this solution, the blowing direction of the fan is parallel to the PCB circuit board, that is, the fan is disposed perpendicular to the PCB circuit board as a whole, so that after the fan is installed in the in-vehicle controller, the overall thickness of the in-vehicle controller is relatively large, which is not convenient for the installation and use of the in-vehicle controller in an automobile. Summary of the Utility Model

[0004] In view of the above problems existing in the prior art, the utility model provides an in-vehicle controller.

[0005] In order to solve the above technical problems, the utility model is solved by the following technical solutions:

[0006] An in-vehicle controller includes a housing and a PCB circuit board fixedly installed in the housing; a heat dissipation fan is provided at intervals on either side of the PCB circuit board, and the axis of the heat dissipation fan is perpendicular to the PCB circuit board.

[0007] Preferably, heat dissipation fins are provided in the housing on one side of the PCB circuit board and in contact with the PCB circuit board;

[0008] The heat dissipation fan and the heat dissipation fins are on the same side of the PCB circuit board.

[0009] Preferably, the length direction or width direction of the heat dissipation fins faces the heat dissipation fan.

[0010] Preferably, a heat conduction block is provided between the heat dissipation fins and the PCB circuit board, and the heat conduction block is adhesively connected to the heat dissipation fins and the PCB circuit board respectively through heat conduction glue.

[0011] Preferably, a limiting plate is provided on the heat dissipation fins, and a limiting groove is provided on the housing; the limiting plate can extend into the limiting groove to realize the fixed installation of the heat dissipation fins in the housing.

[0012] Preferably, a partition board is provided in the housing, and the PCB circuit board and the heat dissipation fan are respectively disposed on both sides of the partition board.

[0013] Preferably, through holes are provided on the partition board, and the heat dissipation fins are in contact with the PCB circuit board through the through holes.

[0014] Preferably, connecting rods are provided on the PCB circuit board and / or the partition board, and the heat dissipation fan is fixedly connected to the connecting rods to achieve a spaced arrangement between the heat dissipation fan and the partition board.

[0015] Preferably, the heat dissipation fan is fixedly connected to the connecting rod by a half-thread bolt to adjust the spacing distance between the heat dissipation fan and the partition board.

[0016] Preferably, a first ventilation opening is provided on the housing and on the side of the heat dissipation fins away from the heat dissipation fan.

[0017] The utility model at least has the following beneficial effects:

[0018] After the heat dissipation fan and the PCB circuit board are both installed and fixed in the housing in this application, the axis of the heat dissipation fan is perpendicular to the PCB circuit board, so that the heat dissipation fan can be in a lying posture on one side of the PCB circuit board. Compared with the axis of the heat dissipation fan on the market at present being parallel to the PCB circuit board, that is, the heat dissipation fan on the market at present dissipates heat from the PCB circuit board in a standing posture, the thickness of the heat dissipation fan plus the thickness of the PCB circuit board in this embodiment can be smaller, and thus the overall thickness of the vehicle-mounted controller can be made smaller, which is convenient for the installation and use of the vehicle-mounted controller in the car. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Shows a perspective view of a vehicle-mounted controller in some embodiments of the present application;

[0020] Figure 2 Shows a schematic diagram of a vehicle-mounted controller with the cover removed in some embodiments of the present application;

[0021] Figure 3 Shows a schematic diagram of the installation of a PCB circuit board in a housing in some embodiments of the present application;

[0022] Figure 4 Shows a schematic diagram of a vehicle-mounted controller with the PCB circuit board removed in some embodiments of the present application;

[0023] Figure 5 Shows a schematic diagram of a heat dissipation fan extracting high-temperature air on the surface of heat dissipation fins and discharging it to the outside of the housing through a second ventilation opening in some embodiments of the present application;

[0024] Figure 6 The cross-sectional view of the vehicle-mounted controller in some embodiments of the present application is shown, and the schematic diagram of the heat dissipation fan extracting the high-temperature air on the surface of the heat dissipation fins and discharging it to the outside of the housing through the second ventilation opening;

[0025] Figure 7 The exploded view of the vehicle-mounted controller in some embodiments of the present application is shown.

[0026] The names of the parts referred to by each numerical label in the drawings are as follows:

[0027] 100, housing; 110, limit groove; 120, partition board; 121, through hole; 130, first ventilation opening; 140, cover plate; 141, second ventilation opening; 200, PCB circuit board; 300, heat dissipation fan; 310, connection hole; 400, heat dissipation fins; 410, heat conduction block; 420, limit plate; 500, connecting rod. Detailed implementation manners

[0028] To further understand the content of the present invention, the present invention will be described in detail in combination with the drawings and embodiments. It should be understood that the embodiments are only for explaining the present invention rather than limiting it.

[0029] As Figure 1-7 shown, this embodiment provides a vehicle-mounted controller, which includes a housing 100. The housing 100 can be fixedly installed on the vehicle by bolts, so that the vehicle-mounted controller can be installed on the vehicle for use; a PCB circuit board 200 and a heat dissipation fan 300 are also fixedly installed in the housing 100. Among them, the heat dissipation fan 300 is arranged on one side of the PCB circuit board 200, and there is a gap between the heat dissipation fan 300 and the PCB circuit board 200, so that there can be a certain gap between the heat dissipation fan 300 and the PCB circuit board 200; further, the axis of the heat dissipation fan 300 is perpendicular to the PCB circuit board 200.

[0030] It should be noted that after the heat dissipation fan 300 and the PCB circuit board 200 are both installed and fixed in the housing 100, the axis of the heat dissipation fan 300 is perpendicular to the PCB circuit board 200, so that the heat dissipation fan 300 can be in a lying posture on one side of the PCB circuit board 200. Compared with the axis of the heat dissipation fan 300 on the market at present being parallel to the PCB circuit board 200, that is, the heat dissipation fan 300 on the market at present dissipates heat from the PCB circuit board 200 in a standing posture, the thickness of the heat dissipation fan 300 plus the thickness of the PCB circuit board 200 in this embodiment can be smaller, and thus the overall thickness of the vehicle-mounted controller can be made smaller, which is convenient for the installation and use of the vehicle-mounted controller in the vehicle.

[0031] When the vehicle-mounted controller is in the working state, the PCB circuit board 200 will generate a certain amount of heat. During this process, the heat dissipation fan 300 can dissipate the heat of the PCB circuit board 200. Specifically, the blades of the heat dissipation fan 300 will rotate around the axis of the heat dissipation fan 300, thereby generating an air flow in the axial direction of the heat dissipation fan 300. Since the axis of the heat dissipation fan 300 is perpendicular to the PCB circuit board 200, the air flow generated by the heat dissipation fan 300 can act on the PCB circuit board 200. At the same time, the PCB circuit board 200 can block and guide the air flow generated by the heat dissipation fan 300. It can be understood that since there is a gap between the heat dissipation fan 300 and the PCB circuit board 200, the air flow generated at the heat dissipation fan 300 can act on the entire surface of the PCB circuit board 200 through this gap, driving the air flow on the surface of the PCB circuit board 200, and then taking away the heat generated by the PCB circuit board 200, achieving the effect of dissipating the heat of the PCB circuit board 200.

[0032] It can be understood that according to the change of the rotation direction of the blades of the heat dissipation fan 300, the direction of the air flow generated by the heat dissipation fan 300 will also be different. Specifically, when the blades of the heat dissipation fan 300 rotate forward, combined with Figure 5-6 as shown, the air flow generated by the heat dissipation fan 300 flows in the direction away from the PCB circuit board 200. In this state, the air near the entire surface of the PCB circuit board 200 will flow through the gap between the heat dissipation fan 300 and the PCB circuit board 200 towards the heat dissipation fan 300. That is, the air near the entire surface of the PCB circuit board 200 will be extracted by the heat dissipation fan 300 and discharged by the heat dissipation fan 300 in the direction away from the PCB circuit board 200, preferably realizing the air flow on the surface of the PCB circuit board 200 and the discharge of the high-temperature air on the surface of the PCB circuit board 200; when the blades of the heat dissipation fan 300 rotate in reverse, the air flow generated by the heat dissipation fan 300 flows in the direction towards the PCB circuit board 200. In this state, the heat dissipation fan 300 extracts the external air and pushes the air on the entire surface of the PCB circuit board 200 through the gap between the heat dissipation fan 300 and the PCB circuit board 200, thereby realizing the air flow on the entire surface of the PCB circuit board 200 and pushing away the high-temperature air on the surface of the PCB circuit board 200, preferably realizing the heat dissipation of the PCB circuit board 200.

[0033] In some embodiments, heat dissipation fins 400 are provided in the housing 100 of the vehicle-mounted controller. The heat dissipation fins 400 and the heat dissipation fan 300 are on the same side of the PCB circuit board 200, and the heat dissipation fins 400 are in contact with the PCB circuit board 200.

[0034] It can be understood that the heat dissipation fin 400 has better heat conduction efficiency. By arranging the heat dissipation fin 400 in contact with the PCB circuit board 200, when heat is generated on the PCB circuit board 200, the heat on the PCB circuit board 200 can be preferably conducted to the heat dissipation fin 400. Since the heat dissipation fin 400 and the heat dissipation fan 300 are on the same side of the PCB circuit board 200, therefore, while the heat dissipation fan 300 dissipates heat from the PCB circuit board 200, it can also dissipate heat from the heat dissipation fin 400, resulting in better heat dissipation effect.

[0035] In particular, since the heat dissipation fin 400 is in contact with the PCB circuit board 200, when heat is generated on the PCB circuit board 200, the heat dissipation fin 400 can absorb the heat in a short time and cool down the PCB circuit board 200 in a timely manner, preventing heat from accumulating on the PCB circuit board 200 all the time. Further, since the airflow generated by the heat dissipation fan 300 can act on both the heat dissipation fin 400 and the PCB circuit board 200 at the same time, after the heat dissipation fin 400 absorbs the heat on the PCB circuit board 200, under the action of the heat dissipation fin 400, the contact area with the airflow generated by the heat dissipation fan 300 can be enlarged, making the heat exchange efficiency higher and the heat dissipation effect better.

[0036] In some embodiments, as shown in combination with Figure 2 the heat dissipation fin 400 is arranged with its length direction or width direction facing the heat dissipation fan 300.

[0037] It can be understood that the heat dissipation fin 400 itself is a sheet-like structure with length dimension, width dimension and thickness dimension. Among them, the length and width of the heat dissipation fin 400 form the two largest-area surfaces of the heat dissipation fin 400. In this embodiment, the length direction or width direction of the heat dissipation fin 400 is arranged facing the heat dissipation fan 300, that is, the largest-area surface of the heat dissipation fin 400 extends in the direction facing the heat dissipation fan 300, so that when the heat dissipation fan 300 works, the airflow generated by the heat dissipation fan 300 can act on the largest-area surface of the heat dissipation fin 400, improving the efficiency of the heat dissipation fan 300 in dissipating heat from the heat dissipation fin 400.

[0038] In some embodiments, as shown in combination with Figure 4 and Figure 6-7 a heat conduction block 410 is provided between the heat dissipation fin 400 and the PCB circuit board 200. The heat conduction block 410 is fixedly bonded to the heat dissipation fin 400 and the PCB circuit board 200 respectively through heat-conducting glue, so that the heat dissipation fin 400 can be indirectly in contact with the PCB circuit board 200 through the heat conduction block 410.

[0039] It should be noted that both the heat conduction block 410 and the thermal conductive adhesive have relatively good heat conduction efficiency. When the PCB circuit board 200 generates heat, the heat on the PCB circuit board 200 will first be conducted to the heat conduction block 410, and then further conducted to the heat dissipation fins 400 through the heat conduction block 410.

[0040] Furthermore, it can be further understood that the main reason for the PCB circuit board 200 to generate heat is that the control chip (not shown in the figure) provided thereon generates heat during operation, thereby increasing the temperature of the entire PCB circuit board 200. In order to improve the heat dissipation effect of the PCB circuit board 200, exemplarily, the heat conduction block 410 can be directly bonded and fixed to the control chip through the thermal conductive adhesive, so that the heat dissipation fins 400 can indirectly contact the control chip through the heat conduction block 410. When the control chip generates heat, the heat can be timely transferred to the heat dissipation fins 400 through the heat conduction block 410, and then cooperate with the heat dissipation fan 300 to achieve a better heat dissipation effect.

[0041] In some embodiments, as shown in Figure 7 a limiting plate 420 protruding from the surface of the heat dissipation fins 400 is provided on the heat dissipation fins 400, and a limiting groove 110 is provided on the housing 100 of the vehicle-mounted controller. The limiting plate 420 can extend into the limiting groove 110, so as to realize the fixed installation of the heat dissipation fins 400 in the housing 100.

[0042] Furthermore, the limiting plate 420 and the limiting groove 110 can be in a snap-fit or a bolt-fit. When the limiting plate 420 and the limiting groove 110 are in a snap-fit, after the limiting plate 420 is completely moved into the limiting groove 110, the limiting groove 110 can limit the limiting plate 420, so that the limiting plate 420 cannot move in the limiting groove 110, thereby realizing the fixed connection between the limiting plate 420 and the limiting groove 110, that is, realizing the fixed installation of the heat dissipation fins 400 in the housing 100; when the limiting plate 420 and the limiting groove 110 are in a bolt-fit, after the limiting plate 420 is partially or completely moved into the limiting groove 110, the limiting plate 420 can be fixed in the limiting groove 110 by bolts, so that the relative positions of the limiting plate 420 and the limiting groove 110 are fixed, that is, realizing the fixed installation of the heat dissipation fins 400 in the housing 100.

[0043] In some embodiments, a partition plate 120 is provided in the housing 100 of the vehicle-mounted controller. Among them, the PCB circuit board 200 is on one side of the partition plate 120, and the heat dissipation fan 300 and the heat dissipation fins 400 are on the other side of the partition plate 120.

[0044] It should be noted that since the PCB circuit board 200 is electrically connected not only to the control chip but also to a variety of other different types of electronic components that can perform different functions, the protection of the PCB circuit board 200 is particularly important. In this embodiment, through the setting of the isolation board 120, the PCB circuit board 200 can be isolated from the heat dissipation fins 400 and the cooling fan 300, thereby avoiding collisions or scratches between the heat dissipation fins 400 and / or the cooling fan 300 and the PCB circuit board 200, and playing a role in protecting the PCB circuit board 200.

[0045] Of course, due to the presence of the isolation board 120, the PCB circuit board 200 can be on both sides of the isolation board 120 from the heat dissipation fins 400 and the cooling fan 300, which can prevent the staff from touching the PCB circuit board 200 when disassembling and assembling the heat dissipation fins 400 and / or the cooling fan 300, and preferably play a role in protecting the PCB circuit board 200.

[0046] In some embodiments, as shown in Figure 4 and Figure 6-7 , a through hole 121 is provided on the isolation board 120, and the heat dissipation fins 400 can contact the PCB circuit board 200 through the through hole 121. Specifically, the size of the through hole 121 should not be less than the size of the heat conduction block 410. In the installed state, the heat conduction block 410 passes through the through hole 121 and is fixedly bonded to the heat dissipation fins 400 and the PCB circuit board 200 respectively through heat conduction glue, so as to realize the contact between the heat dissipation fins 400 and the PCB circuit board 200.

[0047] Furthermore, the position of the through hole 121 on the isolation board 120 corresponds to the position of the control chip on the PCB circuit board 200, so that the heat conduction block 410 passing through the through hole 121 can be bonded and fixed to the control chip through heat conduction glue, and thus the control chip can be cooled in time.

[0048] In some embodiments, as shown in Figure 2 , a connecting rod 500 is provided on the isolation board 120. One end of the connecting rod 500 is fixedly connected to the isolation board 120, and the cooling fan 300 can be fixedly installed on the other end of the connecting rod 500.

[0049] It can be understood that since the connecting rod 500 has a certain size, fixing the cooling fan 300 on the other end of the connecting rod 500 can form a certain gap between the cooling fan 300 and the isolation board 120, that is, the cooling fan 300 and the PCB circuit board 200 are spaced apart.

[0050] When the cooling fan 300 is in a working state, the airflow generated by the cooling fan 300 will act on the heat dissipation fins 400 through the gap formed between the cooling fan 300 and the isolation plate 120, thereby dissipating heat from the heat dissipation fins 400 to achieve a better heat dissipation effect.

[0051] Furthermore, the other end of the connecting rod 500 and the cooling fan 300 can be connected by plugging, bolting, bonding or other methods, and no special limitation is made thereto.

[0052] Furthermore, the connecting rod 500 can also be arranged on the PCB circuit board 200, so that after the cooling fan 300 is installed on the connecting rod 500, a certain gap can be formed between the cooling fan 300 and the isolation plate 120. No special limitation is made thereto, as long as the above corresponding technical effects and advantages can be achieved.

[0053] In some embodiments, as shown in Figure 2 the cooling fan 300 and the connecting rod 500 are fixedly connected by a half-thread bolt (not shown in the figure). Through the connection of the half-thread bolt, the interval distance between the cooling fan 300 and the isolation plate 120 can be adjusted.

[0054] Specifically, a connection hole 310 is provided on the cooling fan 300, and a threaded hole (not shown in the figure) is provided at the second end of the connecting rod 500. Among them, the depth of the connection hole 310 matches the length of the non-threaded section on the half-thread bolt. The half-thread bolt passes through the connection hole 310 through its non-threaded section, and the threaded section of the half-thread bolt is threadedly connected with the threaded hole. By adjusting the depth of the half-thread bolt extending into the threaded hole, the interval distance between the cooling fan 300 and the isolation plate 120 can be adjusted.

[0055] In some embodiments, a first ventilation opening 130 is provided on the housing 100 of the vehicle-mounted controller, and the first ventilation opening 130 is located on the side of the heat dissipation fins 400 away from the cooling fan 300.

[0056] Through the setting of the first ventilation opening 130, when the cooling fan 300 is in a working state, the high-temperature air on the surface of the heat dissipation fins 400 can be discharged outside the housing 100 through the first ventilation opening 130. Similarly, the air outside the housing 100 can also enter the housing 100 through the first ventilation opening 130 and come into contact with the heat dissipation fins 400, which can preferably improve the heat dissipation effect of the heat dissipation fins 400.

[0057] Furthermore, a cover plate 140 is also provided on the housing 100. The cover plate 140 is located on the side of the heat dissipation fan 300 away from the PCB circuit board 200. The provision of the cover plate 140 can protect the heat dissipation fins 400 and the heat dissipation fan 300 inside the housing 100. A second ventilation opening 141 is provided at a position on the cover plate 140 corresponding to the heat dissipation fan 300. The heat dissipation fan 300 can discharge the high-temperature air inside the housing 100 through the second ventilation opening 141, and can also draw the air outside the housing 100 into the housing 100 through the second ventilation opening 141, preferably realizing the heat dissipation treatment of the PCB circuit board 200 inside the housing 100.

[0058] In summary, the above are only the preferred embodiments of the present invention, and all equivalent changes and modifications made according to the scope of the patent application of the present invention shall fall within the scope of the patent of the present invention.

Claims

1. A vehicle-mounted controller, characterized in that: It comprises a shell and a PCB circuit board fixedly installed in the shell; a cooling fan is arranged at intervals on either side of the PCB circuit board, and the axis of the cooling fan is perpendicular to the PCB circuit board.

2. The vehicle-mounted controller according to claim 1, characterized in that: The housing is provided with a heat dissipation fin located on one side of the PCB circuit board and in contact with the PCB circuit board; The heat dissipation fan and the heat dissipation fins are located on the same side of the PCB circuit board.

3. The vehicle-mounted controller according to claim 2, characterized in that: The length direction or the width direction of the heat dissipation fin faces the heat dissipation fan.

4. The vehicle-mounted controller according to claim 2, characterized in that: A heat conduction block is provided between the heat dissipation fins and the PCB circuit board, and the heat conduction block is respectively bonded and connected to the heat dissipation fins and the PCB circuit board through heat conductive adhesive.

5. The vehicle-mounted controller according to claim 2, characterized in that: The heat dissipation fin is provided with a limiting plate, and the housing is provided with a limiting groove; the limiting plate can extend into the limiting groove to achieve fixed installation of the heat dissipation fin in the housing.

6. The vehicle-mounted controller according to any one of claims 2 to 5, characterized in that: An isolation plate is arranged in the shell, and the PCB circuit board and the heat dissipation fan are arranged on two sides of the isolation plate respectively.

7. The vehicle-mounted controller according to claim 6, characterized in that: The isolation plate is provided with a through hole, and the heat dissipation fin is in contact with the PCB circuit board through the through hole.

8. The vehicle-mounted controller according to claim 6, characterized in that: The PCB circuit board and / or the isolation plate are provided with a connecting rod, and the heat dissipation fan is fixedly connected to the connecting rod to achieve a spacing arrangement between the heat dissipation fan and the isolation plate.

9. The vehicle-mounted controller according to claim 8, characterized in that: The heat dissipation fan is fixedly connected to the connecting rod through a half-thread bolt to adjust the spacing distance between the heat dissipation fan and the isolation plate.

10. The vehicle-mounted controller according to claim 2, characterized in that: A first vent is provided on the housing and located on a side of the heat dissipation fin away from the heat dissipation fan.