Atomization assembly and electronic atomization device

Abstract

The utility model relates to an atomization assembly and an electronic atomization device.The atomization assembly comprises a heating piece and a conductive ejector pin, the heating piece is used for heating an aerosol generating substrate, and the conductive ejector pin is arranged on one side of the heating piece; the conductive ejector pin is provided with at least one contact surface in a protruding mode, and the contact surface is used for the heating piece so that the conductive ejector pin can be electrically connected with the heating piece. According to the atomization assembly, when the pre-pressure towards the heating piece is applied to the conductive ejector pin, the contact resistance of the heating piece is reduced due to the fact that the conductive ejector pin makes contact with the heating piece through the contact face arranged in the protruding mode, the energy loss of the heating piece can be reduced under the condition of constant power, and then the atomization performance of the atomization assembly is improved.

Description

Technical Field

[0001] The present application relates to the field of atomization technology, and in particular to an atomization component and an electronic atomization device. Background Art

[0002] Aerosol is a colloidal dispersion system formed by small solid or liquid particles dispersed and suspended in a gas medium. Since aerosol can be absorbed by the human body through the respiratory system, it provides users with a new alternative absorption method. Atomization device refers to a device that forms an aerosol by heating or ultrasound. Atomizable media include liquid, gel, paste or solid aerosol-generating matrices. Atomizing these media can deliver inhalable aerosols to users, replacing conventional product forms and absorption methods.

[0003] However, in some existing atomization devices, the heating element is powered by the contact between the ejector pin and the heating element, but the contact resistance of the heating element is relatively large, which leads to a large energy loss of the atomization device and affects the atomization performance of the atomization device. Summary of the invention

[0004] Based on this, it is necessary to provide an atomization assembly and an electronic atomization device to address the problem of large contact resistance between the ejector pin and the heating element.

[0005] An atomization assembly comprises a heating element and a conductive ejector pin, wherein the heating element is used to heat an aerosol-generating matrix, and the conductive ejector pin is arranged on one side of the heating element;

[0006] The conductive ejector pin is provided with at least one contact surface, and the contact surface is used for the heating element to electrically connect the conductive ejector pin to the heating element.

[0007] In one embodiment, the conductive pin has a central axis extending in one direction, and a plurality of contact surfaces are convexly provided on the conductive pin. All the contact surfaces are arranged at intervals along the extension direction of the central axis, and each of the contact surfaces is a curved surface circumferentially surrounding the central axis.

[0008] In one embodiment, each of the contact surfaces is a cylindrical surface formed by a straight line parallel to the central axis rotating around the central axis.

[0009] In one of the embodiments, in the radial direction of the conductive ejector pin, the contact surface protrudes outwardly in a direction away from the central axis.

[0010] In one embodiment, each of the contact surfaces is a curved surface formed by a circular arc line rotating around the central axis, and the chord of the circular arc line is parallel to the central axis.

[0011] In one embodiment, each of the contact surfaces includes a first contact surface and a second contact surface that are connected to each other, the first contact surface is a frustum surface formed by an oblique line extending obliquely relative to the central axis and rotating around the central axis, and the second contact surface is a frustum surface formed by an oblique line extending obliquely relative to the central axis and rotating around the central axis.

[0012] In one embodiment, the conductive ejector pin has a central axis extending in one direction, and the contact surface spirally extends from one axial end of the conductive ejector pin around the central axis toward the other axial end of the conductive ejector pin.

[0013] In one embodiment, the conductive pin has a central axis extending in one direction, and a plurality of groups of contact surfaces are convexly provided on the conductive pin. The plurality of groups of contact surfaces are spaced apart along the extension direction of the central axis, and all the contact surfaces in each group of contact surfaces are spaced apart around the central axis.

[0014] In one embodiment, the conductive ejector pin has a central axis extending in one direction, and a plurality of contact surfaces are convexly provided on the conductive ejector pin. All of the contact surfaces are arranged at intervals around the central axis, and each of the contact surfaces extends linearly from one axial end of the conductive ejector pin along the extension direction of the central axis toward the other axial end of the conductive ejector pin.

[0015] An electronic atomization device comprises the above-mentioned atomization assembly, and the electronic atomization device further comprises a battery assembly, wherein the battery assembly is electrically connected to the atomization assembly.

[0016] In the above-mentioned atomization assembly, when pre-pressure is applied to the conductive ejector pin toward the heating element, the conductive ejector pin contacts the heating element through the protruding contact surface, thereby reducing the contact resistance of the heating element. Under the condition of constant power, the energy loss of the heating element can be reduced, thereby improving the atomization performance of the atomization assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of the structure of an electronic atomization device according to an embodiment of the present application.

[0018] Figure 2 for Figure 1 Schematic diagram of the internal structure of the electronic atomization device shown.

[0019] Figure 3 The figure is a schematic diagram of assembling a conductive ejector pin and a heating element in the prior art.

[0020] Figure 4 It is a schematic diagram of assembling the conductive ejector pin and the heating element of the first embodiment of the present application.

[0021] Figure 5 It is a front view of the conductive ejector pin according to the first embodiment of the present application.

[0022] Figure 6 This is a schematic diagram of assembling the conductive ejector pin and the heating element of the second embodiment of the present application.

[0023] Figure 7 It is a front view of a conductive ejector pin according to a second embodiment of the present application.

[0024] Figure 8 It is a schematic diagram of assembling the conductive ejector pin and the heating element of the third embodiment of the present application.

[0025] Fig. 9 FIG. 1 is a schematic diagram of a conductive ejector pin according to a third embodiment of the present application.

[0026] Fig.10 It is a schematic diagram of assembling the conductive ejector pin and the heating element of the fourth embodiment of the present application.

[0027] Fig.11 FIG. 4 is a schematic diagram of a conductive ejector pin according to a fourth embodiment of the present application.

[0028] Fig.12 It is a schematic diagram of assembling the conductive ejector pin and the heating element of the fifth embodiment of the present application.

[0029] Fig.13 FIG. 1 is a schematic diagram of a conductive ejector pin according to a fifth embodiment of the present application.

[0030] Fig.14 This is a schematic diagram of assembling a conductive ejector pin and a heating element according to the sixth embodiment of the present application.

[0031] Fig.15 FIG. 4 is a schematic diagram of a conductive ejector pin according to a sixth embodiment of the present application.

[0032] Fig.16 It is a schematic diagram of assembling the conductive ejector pin and the heating element of the seventh embodiment of the present application.

[0033] Fig.17 FIG. 1 is a schematic diagram of a conductive ejector pin according to a seventh embodiment of the present application.

[0034] Description of reference numerals:

[0035] 100. Electronic atomization device; 20. Atomization assembly; 21. Shell; 212. Liquid storage chamber; 214. Air flow channel; 23. Heater; 232. Base; 234. Heater; 236. Electrode; 25. Conductive ejector pin; 252. Contact surface; 40. Power supply assembly. DETAILED DESCRIPTION

[0036] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0037] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0038] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0039] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0040] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0041] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0042] See also Figure 1 and Figure 2 The embodiment of the present application provides an electronic atomization device 100 for heating an aerosol generating substrate to generate an aerosol for use by a user. The aerosol generating substrate includes, but is not limited to, materials used for medical, health, wellness, and beauty purposes, for example, the aerosol generating substrate is a liquid medicine or oil.

[0043] The electronic atomization device 100 includes an atomization component 20 and a power supply component 40. The atomization component 20 is used to store an aerosol-generating matrix. The power supply component 40 is connected to one end of the atomization component 20 and is electrically connected to the atomization component 20. The atomization component 20 is used to heat the atomized aerosol-generating matrix under the action of the electric energy of the power supply component 40. The aerosol-generating matrix is ​​heated and atomized to generate an aerosol that flows out of the electronic atomization device 100 for the user to take.

[0044] Furthermore, the atomization assembly 20 includes a housing 21, a heating element 23, and two conductive ejector pins 25. The housing 21 has a liquid storage chamber 212, an atomization chamber connected to the liquid storage chamber 212, and an air flow channel 214 connecting the atomization chamber and the external atmosphere. The heating element 23 and the conductive ejector pins 25 are both accommodated in the atomization chamber, wherein one conductive ejector pin 25 connects the positive electrode of the heating element 23 with the positive electrode of the power supply assembly 40, and the other conductive ejector pin 25 connects the negative electrode of the heating element 23 with the negative electrode of the power supply assembly 40, thereby forming a complete current loop.

[0045] In this way, the aerosol generating matrix is ​​stored in the liquid storage chamber 212. During the use of the electronic atomization device 100, the aerosol generating matrix in the liquid storage chamber 212 gradually enters the atomization chamber and contacts the heating element 23. The heating element 23 can heat the aerosol generating matrix under the action of the electric energy of the power supply component 40 to generate an aerosol. The aerosol in the atomization chamber can flow out through the air flow channel 214 for the user to take.

[0046] like Figure 4 As shown, the heating element 23 includes a substrate 232, a heating element 234 and an electrode 236. The substrate 232 is a rectangular parallelepiped. Figure 4 The width direction of the substrate 232 is along the X direction. Figure 4 The height direction of the base 232 extends in the Y direction. Figure 4 The substrate 232 is formed of a hard porous structure such as porous ceramics, and has the characteristics of being insulating, high temperature resistant, and chemically stable while being able to absorb and store aerosol to generate a matrix.

[0047] The heating element 234 is disposed on one side surface of the substrate 232 in the width direction. The heating element 234 may be formed by a heating film 234 or a heating wire. The material forming the heating element 234 may be a material with good electrical conductivity such as metal.

[0048] The heating element 23 includes two electrodes 236, one positive and one negative. The two electrodes 236 are both arranged on the surface of one side of the substrate 232 where the heating element 234 is arranged. The two electrodes 236 are located at opposite ends of the heating element 234 in the length direction of the substrate 232, and the two electrodes 236 are electrically connected to the two end portions of the heating element 234 respectively.

[0049] The conductive ejector pin 25 is disposed on one side of the heating element 23 . The conductive ejector pin 25 is provided with a plurality of contact surfaces 252 disposed at intervals. At least part of the contact surfaces 252 contacts the heating element 23 to electrically connect the conductive ejector pin 25 to the heating element 23 .

[0050] When pre-pressure is applied to the conductive ejector pin 25 toward the heating element 23, the contact resistance of the heating element 23 is reduced due to the multiple contact surfaces 252 protruding from the conductive ejector pin 25 contacting the heating element 23. Under the condition of constant power, the energy loss of the heating element 23 can be reduced, thereby improving the atomization performance of the atomization assembly 20.

[0051] In some embodiments, the conductive ejector pin 25 is a columnar structure made of a conductive material such as stainless steel, and the conductive ejector pin 25 has a central axis extending in one direction, and the extension direction of the central axis is parallel to the height direction of the substrate 232. One axial end of the conductive ejector pin 25 protrudes from the lower surface of the substrate 232 and connects to the power supply assembly 40, and the height of the other axial end of the conductive ejector pin 25 is lower than the upper surface of the substrate 232. The lower surface of the substrate 232 refers to the end surface of one side of the substrate 232 close to the power supply assembly 40 in the height direction, and the upper surface of the substrate 232 refers to the end surface of one side of the substrate 232 away from the power supply assembly 40 in the height direction. The conductive ejector pin 25 has an outer cylindrical surface surrounding the central axis, and a part of the outer cylindrical surface protrudes outward to form a contact surface 252, and the position of the contact surface 252 in the axial direction of the conductive ejector pin 25 corresponds to the position of the electrode 236 to contact the electrode 236.

[0052] like Figure 4 , Figure 6 as well as Figure 8 As shown, in some embodiments, all contact surfaces 252 are arranged at intervals along the extension direction of the central axis, and the distances between adjacent contact surfaces 252 may be equal or unequal, and each contact surface 252 is a curved surface circumferentially surrounding the central axis. It can be understood that the specific shape of the contact surface 252 is not limited, and can be set as needed to adjust the contact mode with the electrode 236. Specifically in some embodiments, the contact surface 252 is a cylindrical surface formed by a straight line parallel to the central axis of the conductive ejector 25 rotating around the central axis. In other embodiments, in the radial direction of the conductive ejector 25, the curved surface bulges outward in the direction away from the central axis of the conductive ejector 25.

[0053] like Fig.10 As shown, in some embodiments, the conductive ejector pin 25 is provided with a contact surface 252, which spirally extends from an axial end of the conductive ejector pin 25 close to the upper surface of the substrate 232 around the central axis of the conductive ejector pin 25 toward the other axial end of the conductive ejector pin 25 away from the upper surface of the substrate 232.

[0054] like Fig.11 As shown, in some embodiments, the conductive ejector pin 25 is provided with a plurality of groups of contact surfaces 252, and the plurality of groups of contact surfaces 252 are arranged at intervals along the extension direction of the central axis of the conductive ejector pin 25, and the distances between each two adjacent groups of contact surfaces 252 may be the same or different. All contact surfaces 252 in each group of contact surfaces 252 are arranged at intervals around the central axis of the conductive ejector pin 25, and the distances between each two adjacent contact surfaces 252 in the same group of contact surfaces 252 may be the same or different.

[0055] like Fig.14As shown, in some embodiments, the conductive ejector pin 25 is provided with a plurality of contact surfaces 252, all of which are arranged at intervals around the central axis, and the contact surface 252 extends linearly from one axial end of the conductive ejector pin 25 close to the upper surface of the substrate 232 along the extension direction of the central axis of the conductive ejector pin 25 toward the other axial end of the conductive ejector pin 25 away from the upper surface of the substrate 232, and the distance between two adjacent contact surfaces 252 may be the same or different.

[0056]

[0057] like Figure 3 As shown, the conductive ejector pin 25 in the prior art is generally cylindrical, and the outer cylindrical surface of the conductive ejector pin 25 is a smooth extended cylindrical surface without the raised contact surface 252 of the present application. Specifically, the diameter of the portion of the conductive ejector pin 25 with the outer cylindrical surface is 1.2 mm, and the length of the outer cylindrical surface is 2.25 mm.

[0058] As shown in Table 1-1, during the simulation test, the conductive ejector pin was pre-pressed downward by 0.05 mm in a direction perpendicular to the electrode, and the effective contact area between the outer cylindrical surface of the conductive ejector pin and the electrode was 1.3625 mm², the displacement of the electrode was 0.044 mm, the strain of the electrode was 0.112 mm / mm, the stress of the electrode was 21656 MPa, and the measured resistance of the electrode was 1.3625Ω.

[0059] like Figure 4 and Figure 5 As shown, the first embodiment of the present application provides a conductive ejector pin 25, which has a plurality of contact surfaces 252, all of which are spaced and equidistantly arranged along the extension direction of the central axis of the conductive ejector pin 25, and each contact surface 252 is a cylindrical surface formed by a straight line parallel to the central axis rotating around the central axis. As a preferred embodiment, the distance L1 between two adjacent contact surfaces 252 is 0.15mm-0.35mm, and the width H1 of each contact surface 252 in the axial direction of the conductive ejector pin 25 is 0.35mm.

[0060] As shown in Table 1-1, during the simulation test, the conductive ejector pin 25 is pre-pressed downward in a direction perpendicular to the electrode 236 with a pre-pressing length of 0.05 mm, and the effective contact area between the conductive ejector pin 25 and the electrode 236 is 0.6524 mm², the displacement of the electrode 236 is 0.047 mm, the strain of the electrode 236 is 0.149 mm / mm, the stress of the electrode 236 is 27967 MPa, and the measured resistance of the electrode 236 is 1.0484Ω, which is less than the measured resistance of the electrode in the prior art of 1.3625Ω.

[0061] like Figure 6 and Figure 7As shown, the second embodiment of the present application provides a conductive ejector pin 25, which has a plurality of contact surfaces 252, all of which are spaced and equidistantly arranged along the extension direction of the central axis of the conductive ejector pin 25, and in the radial direction of the conductive ejector pin 25, the contact surfaces 252 protrude outward in the direction away from the central axis. Specifically, each contact surface 252 is a curved surface formed by a circular arc line rotating around the central axis of the conductive ejector pin 25, and the chord of the circular arc line is parallel to the central axis. As a preferred embodiment, the distance L2 between two adjacent contact surfaces 252 is 0.2655 mm, and the width H2 of each contact surface 252 in the axial direction of the conductive ejector pin 25 is 0.1732 mm-0.2345 mm.

[0062] As shown in Table 1-1, during the simulation test, the conductive ejector pin 25 is pre-pressed downward in a direction perpendicular to the electrode 236 with a pre-pressing length of 0.05 mm, and the effective contact area between the conductive ejector pin 25 and the electrode 236 is 0.4087 mm², the displacement of the electrode 236 is 0.044 mm, the strain of the electrode 236 is 0.162 mm / mm, the stress of the electrode 236 is 30554 MPa, and the measured resistance of the electrode 236 is 1.0383 Ω, which is less than the measured resistance of the electrode in the prior art of 1.3625 Ω.

[0063] like Figure 8 and Fig. 9 As shown, the third embodiment of the present application provides a conductive ejector 25, which has a plurality of contact surfaces 252, all of which are spaced and equidistantly arranged along the extension direction of the central axis of the conductive ejector 25, and in the radial direction of the conductive ejector 25, the contact surfaces 252 protrude outward in the direction away from the central axis. Specifically, each contact surface 252 includes a first contact surface 2521 and a second contact surface 2523 connected to each other, the first contact surface 2521 is a frustum formed by a slant line extending obliquely relative to the central axis and rotating around the central axis, and the second contact surface 2523 is a frustum formed by a slant line extending obliquely relative to the central axis and rotating around the central axis. As a preferred embodiment, the distance L3 between two adjacent contact surfaces 252 is 0.2655mm, and the width H3 of each contact surface 252 in the axial direction of the conductive ejector 25 is 0.2345mm-0.4189mm.

[0064] As shown in Table 1-1, during the simulation test, the conductive ejector pin 25 is pre-pressed downward in a direction perpendicular to the electrode 236 with a pre-pressing length of 0.05 mm, and the effective contact area between the conductive ejector pin 25 and the electrode 236 is 0.171 mm², the displacement of the electrode 236 is 0.042 mm, the strain of the electrode 236 is 0.207 mm / mm, the stress of the electrode 236 is 35457 MPa, and the measured resistance of the electrode 236 is 1.0327 Ω, which is less than the measured resistance of the electrode in the prior art of 1.3625 Ω.

[0065] like Fig.10 and Fig.11 As shown, the fourth embodiment of the present application provides a conductive ejector pin 25, the outer circumferential surface of the conductive ejector pin 25 is only provided with a contact surface 252, and the contact surface 252 spirally extends from one axial end of the conductive ejector pin 25 around the central axis toward the other axial end of the conductive ejector pin 25. As a preferred embodiment, the thread width formed by the contact surface 252 is 0.2303 mm, and the thread pitch is 0.0688 mm.

[0066] As shown in Table 1-1, during the simulation test, the conductive ejector pin 25 is pre-pressed downward in a direction perpendicular to the electrode 236 with a pre-pressing length of 0.05 mm, and the effective contact area between the conductive ejector pin 25 and the electrode 236 is 0.2511 mm², the displacement of the electrode 236 is 0.03 mm, the strain of the electrode 236 is 0.07499 mm / mm, the stress of the electrode 236 is 14278 MPa, and the measured resistance of the electrode 236 is 1.2154 Ω.

[0067] like Fig.12 and Fig.13 As shown, the fifth embodiment of the present application provides a conductive ejector pin 25, which is provided with a plurality of groups of contact surfaces 252, which are spaced and arranged equidistantly along the extension direction of the central axis, and all contact surfaces 252 in each group of contact surfaces 252 are spaced around the central axis, and in the same group of contact surfaces 252, the distance between each contact surface 252 and the contact surface 252 on the adjacent side is greater than the distance between the contact surface 252 on the adjacent other side, and each contact surface 252 is flat. In this way, a plurality of contact surfaces 252 of different sizes are arranged in a matrix.

[0068] As a preferred embodiment, the distance H5 between two adjacent groups of contact surfaces 252 is 0.0936mm-0.2181mm, the distance H6 between two adjacent contact surfaces 252 in the same group is 0.1191mm-0.1845mm, the width L5 of each contact surface 252 in the axial direction of the conductive ejector pin 25 is 0.1732mm-0.2309mm, and the length L6 of each contact surface 252 in the circumferential direction of the conductive ejector pin 25 is 0.1732mm-0.2193mm.

[0069] As shown in Table 1-1, during the simulation test, the conductive ejector pin 25 is pre-pressed downward in a direction perpendicular to the electrode 236 with a pre-pressing length of 0.03 mm, and the effective contact area between the conductive ejector pin 25 and the electrode 236 is 0.1172 mm², the displacement of the electrode 236 is 0.0274 mm, the strain of the electrode 236 is 0.0385 mm / mm, the stress of the electrode 236 is 7341 MPa, and the measured resistance of the electrode 236 is 1.3372 Ω.

[0070] like Fig.14 and Fig.15 As shown, the sixth embodiment of the present application provides a conductive ejector pin 25, the conductive ejector pin 25 is provided with a plurality of contact surfaces 252, all of the contact surfaces 252 are spaced and arranged equidistantly around the central axis of the conductive ejector pin 25, and each contact surface 252 extends linearly from one axial end of the conductive ejector pin 25 along the extension direction of the central axis toward the other axial end of the conductive ejector pin 25. As a preferred embodiment, the distance L7 between two adjacent contact surfaces 252 is 0.0936 mm, and the width H7 of each contact surface 252 is 0.1732 mm-0.2193 mm.

[0071] As shown in Table 1-1, during the simulation test, the conductive ejector pin 25 is pre-pressed downward in a direction perpendicular to the electrode 236 with a pre-pressing length of 0.03 mm, and the effective contact area between the conductive ejector pin 25 and the electrode 236 is 0.1364 mm², the displacement of the electrode 236 is 0.0112 mm, the strain of the electrode 236 is 0.0452 mm / mm, the stress of the electrode 236 is 6376 MPa, and the measured resistance of the electrode 236 is 1.3379 Ω.

[0072] like Fig.16 and Fig.17 As shown, the seventh embodiment of the present application provides a conductive ejector pin 25, which is provided with a plurality of groups of contact surfaces 252, which are arranged at intervals and equidistantly along the extension direction of the central axis of the conductive ejector pin 25, and all contact surfaces 252 in each group of contact surfaces 252 are arranged at intervals and equidistantly around the central axis, and each contact surface 252 is flat. In this way, the plurality of contact surfaces 252 are arranged in a matrix.

[0073] As a preferred embodiment, the distance H5 between two adjacent groups of contact surfaces 252 is 0.1191mm-0.2181mm, the distance H6 between two adjacent contact surfaces 252 in the same group is 0.156mm-0.1191mm, the width L5 of each contact surface 252 in the axial direction of the conductive ejector pin 25 is 0.1559mm-0.2309mm, and the length L6 of each contact surface 252 in the circumferential direction of the conductive ejector pin 25 is 0.1732mm-0.2193mm.

[0074] As shown in Table 1-1, during the simulation test, the conductive ejector pin 25 is pre-pressed downward in a direction perpendicular to the electrode 236 with a pre-pressing length of 0.03 mm, and the effective contact area between the conductive ejector pin 25 and the electrode 236 is 0.0395 mm², the displacement of the electrode 236 is 0.009 mm, the strain of the electrode 236 is 0.0395 mm / mm, the stress of the electrode 236 is 5493 MPa, and the measured resistance of the electrode 236 is 1.3398 Ω.

[0075] The atomizer assembly 20 and the electronic atomizer device 100 of the present application can effectively reduce the contact resistance of the heating element 234 of the heating element 23 by protruding the contact surface 252 on the conductive ejector pin 25. Under the condition of constant power, the energy loss of the atomizer assembly 20 is effectively reduced, and the atomization performance of the electronic atomizer device 100 is improved.

[0076] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0077] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. An atomizing assembly, characterized in that: It comprises a heating element and a conductive ejector pin, wherein the heating element is used to heat the aerosol-generating matrix, and the conductive ejector pin is arranged on one side of the heating element; The conductive ejector pin is provided with at least one contact surface, and the contact surface is used for the heating element to electrically connect the conductive ejector pin to the heating element.

2. The atomizer assembly according to claim 1, characterized in that: The conductive ejector pin has a central axis extending in one direction. The conductive ejector pin is provided with a plurality of contact surfaces. All the contact surfaces are arranged at intervals along the extension direction of the central axis. Each of the contact surfaces is a curved surface circumferentially surrounding the central axis.

3. The atomizer assembly according to claim 2, characterized in that: Each of the contact surfaces is a cylindrical surface formed by a straight line parallel to the central axis rotating around the central axis.

4. The atomizer assembly according to claim 2, characterized in that: In the radial direction of the conductive ejector pin, the contact surface protrudes outwardly in a direction away from the central axis.

5. The atomizing assembly according to claim 4, characterized in that: Each of the contact surfaces is a curved surface formed by a circular arc line rotating around the central axis, and the chord of the circular arc line is parallel to the central axis.

6. The atomizing assembly according to claim 4, characterized in that: Each of the contact surfaces includes a first contact surface and a second contact surface that are connected to each other. The first contact surface is a frustum surface formed by an oblique line extending obliquely relative to the central axis and rotating around the central axis. The second contact surface is a frustum surface formed by an oblique line extending obliquely relative to the central axis and rotating around the central axis.

7. The atomizer assembly according to claim 1, characterized in that: The conductive ejector pin has a central axis extending in one direction, and the contact surface spirally extends from one axial end of the conductive ejector pin around the central axis toward the other axial end of the conductive ejector pin.

8. The atomizer assembly according to claim 1, characterized in that: The conductive ejector pin has a central axis extending in one direction. The conductive ejector pin is provided with a plurality of groups of contact surfaces. The plurality of groups of contact surfaces are arranged at intervals along the extending direction of the central axis. All the contact surfaces in each group of contact surfaces are arranged at intervals around the central axis.

9. The atomizer assembly according to claim 1, characterized in that: The conductive ejector pin has a central axis extending in one direction, and a plurality of contact surfaces are convexly provided on the conductive ejector pin. All the contact surfaces are arranged at intervals around the central axis, and each of the contact surfaces extends linearly from one axial end of the conductive ejector pin along the extension direction of the central axis toward the other axial end of the conductive ejector pin.

10. An electronic atomization device, characterized in that: The electronic atomization device comprises an atomization assembly as described in any one of claims 1 to 9, and further comprises a battery assembly, wherein the battery assembly is electrically connected to the atomization assembly.

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