Semiconductor high-low temperature damp heat test box

Abstract

The utility model discloses a semiconductor high-low temperature damp heat test chamber, which relates to the technical field of test chambers and comprises a test chamber body and a semiconductor chip, the outer wall of the test chamber body is provided with a communicated refrigerating device, a heating device and a humidifying device are arranged in the test chamber body, and the front end face of the test chamber body is movably connected with a sealing door. A rotary clamping mechanism is arranged on the rear side wall of an inner cavity of the test box body and comprises a fixing box, a rotary driving shaft and two sets of rotating rods are arranged at the front end of the fixing box, U-shaped clamping bases are installed at the bottom ends of the driving shaft and the two sets of rotating rods, the two ends of each set of U-shaped clamping bases are in threaded connection with adjusting bolts, and clamping plates are arranged at the bottoms of the adjusting bolts. And the inner side surface of the clamping plate is attached to the outer wall of the semiconductor chip. And the rotary clamping mechanism can enable the semiconductor wafer to be in all-directional contact with high temperature, low temperature and humidity in the test box, so that the semiconductor wafer is in full contact with high and low temperature humidity and heat, and the test effect of the semiconductor wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of test boxes, in particular to a semiconductor high and low temperature wet heat test box. Background Art

[0002] The high and low temperature humidity test chamber is a test equipment used to simulate the temperature and humidity under different environmental conditions. It can set various high temperature, low temperature, humidity and dry environment to help test the performance and stability of materials or products under extreme conditions. It is widely used in reliability testing of electronic products, automotive parts, semiconductors and other materials to ensure that they perform well in actual use.

[0003] When existing semiconductors are tested in a high and low temperature humidity test chamber, the semiconductors are usually placed directly inside the high and low temperature humidity test chamber, and the bottom of the placed semiconductor will directly fit the inner wall of the high and low temperature humidity test chamber, resulting in the high temperature, low temperature and humidity in the high and low temperature humidity test chamber unable to fully contact the bottom of the semiconductor, resulting in poor test results for the semiconductor. For this reason, we propose a semiconductor high and low temperature humidity test chamber. Utility Model Content

[0004] The utility model aims to provide a semiconductor high and low temperature humidity test chamber to solve the problem in the background art that the bottom of the placed semiconductor cannot fully contact the high temperature, low temperature and humidity in the test chamber, resulting in poor test results.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A semiconductor high and low temperature humidity and heat test chamber comprises a test chamber body and a semiconductor wafer, a pressure relief valve is arranged on the top of the test chamber body, a connected refrigeration device is arranged on the outer wall of the test chamber body, heating devices are installed on the inner walls on both sides of the test chamber body, and a humidifying device is arranged on the inner cavity top wall of the test chamber body, a sealing door is movably connected to the front end surface of the test chamber body, a rotating clamping mechanism is arranged on the rear side wall of the inner cavity of the test chamber body, the rotating clamping mechanism comprises a fixing box, and a rotating drive shaft and two groups of rotating rods are arranged at the front end of the fixing box, U-shaped clamping seats are installed at the bottom ends of the drive shaft and the two groups of rotating rods, adjusting bolts are threadedly connected to both ends of each group of U-shaped clamping seats, a clamping plate is arranged at the bottom of each group of adjusting bolts, and the inner side surface of the clamping plate is in contact with the outer wall of the semiconductor wafer.

[0007] Furthermore: the rotary clamping mechanism also includes a servo motor, which is located on the rear outer wall of the test box body, and the output end of the servo motor is connected to the top of the drive shaft. The outer wall of the drive shaft is sleeved with a driving gear, and the two side walls of the driving gear are meshed and connected with driven gears, and the two groups of driven gears are respectively sleeved on the outer walls of the two groups of rotating rods.

[0008] Furthermore: a bearing plate is provided at the bottom of the test box body, and universal wheels are connected to the four corners of the lower surface of the bearing plate.

[0009] Furthermore: the bottom ends of the driving shaft and the two sets of rotating rods all penetrate the front end surface of the fixed box.

[0010] Furthermore: one side of each set of clamping plates close to the semiconductor chip is embedded with staggered protrusions.

[0011] Furthermore: a handle is provided on the front outer wall of the sealed door, and a non-slip rubber sleeve is provided on the hand-held end of the handle.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] The operation of the servo motor on the rotary clamping mechanism of the utility model can drive the driving shaft and the driving gear to rotate. Since the driving gear is meshed and connected with the two sets of driven gears, the two sets of rotating rods are rotated. The synchronous rotation of the driving shaft and the two sets of rotating rods drives the semiconductor slices clamped in the three sets of U-shaped clamping seats to rotate, so that the semiconductor slices can be in full contact with the high temperature, low temperature and humidity in the test box. The semiconductor slices are more fully in contact with the high and low temperature and wet heat, thereby improving the effect of the semiconductor slice test; the bearing plate supports the test box, and the test box can be conveniently moved to the use position with the rolling of the four sets of universal wheels, thereby improving its portability. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the structure of the utility model;

[0015] Figure 2 It is a front structural cross-sectional schematic diagram of the utility model;

[0016] Figure 3 It is a cross-sectional schematic diagram of the side connection structure of the test box body and the rotary clamping mechanism of the utility model.

[0017] In the figure: 1. test box body; 2. load-bearing plate; 3. universal wheel; 4. sealing door; 5. pressure relief valve; 6. refrigeration device; 7. heating device; 8. humidification device; 9. rotary clamping mechanism; 900. servo motor; 901. fixing box; 902. driving shaft; 903. driving gear; 904. driven gear; 905. rotating rod; 906. U-shaped clamp seat; 907. adjusting bolt; 908. clamping plate; 10. semiconductor chip. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] Embodiment 1:

[0020] See also Figure 1-3 The utility model provides a technical solution: a semiconductor high and low temperature humidity and heat test chamber, comprising a test chamber body 1 and a semiconductor wafer 10, a pressure relief valve 5 is provided on the top of the test chamber body 1, a connected refrigeration device 6 is provided on the outer wall of the test chamber body 1, a heating device 7 is installed on both sides of the inner wall of the test chamber body 1, and a humidification device 8 is provided on the top wall of the inner cavity of the test chamber body 1; the refrigeration device 6, the heating device 7 and the humidification device 8 are all commonly used technologies in the field of test chambers, and the specific structure and working principle are not described here, and the temperature and humidity in the test chamber body 1 are changed by the refrigeration device 6, the heating device 7 and the humidification device 8, so as to complete the test of the semiconductor;

[0021] The front end face of the test box body 1 is movably connected with a sealing door 4, and the rear side wall of the inner cavity of the test box body 1 is provided with a rotating clamping mechanism 9, which includes a fixed box 901, and the front end of the fixed box 901 is provided with a rotating drive shaft 902 and two sets of rotating rods 905, and the bottom ends of the drive shaft 902 and the two sets of rotating rods 905 are both installed with U-shaped clamping seats 906, and both ends of each set of U-shaped clamping seats 906 are threadedly connected with adjusting bolts 907, and the bottom of each set of adjusting bolts 907 is provided with a clamping plate 908, and the inner side of the clamping plate 908 is in contact with the semiconductor chip. The outer wall of 10 is fitted; by rotating the adjusting bolts 907 at the upper and lower ends of the three sets of U-shaped clamps 906, the adjacent clamping plates 908 are brought close to each other, so that the semiconductor wafer 10 is clamped and fixed. The rotating clamping mechanism 9 can drive the shaft 902 and the two sets of rotating rods 905 to rotate synchronously, thereby driving the semiconductor wafer 10 clamped in the three sets of U-shaped clamps 906 to rotate, so that the semiconductor wafer 10 can be in full contact with the high temperature, low temperature and humidity in the test chamber. The semiconductor wafer 10 is in full contact with the high and low temperature and humidity, thereby improving the effect of the semiconductor wafer 10 test.

[0022] Among them, preferably, the rotary clamping mechanism 9 also includes a servo motor 900, the servo motor 900 is located on the rear outer wall of the test box body 1, and the output end of the servo motor 900 is connected to the top of the driving shaft 902, the outer wall of the driving shaft 902 is sleeved with a driving gear 903, and the two side walls of the driving gear 903 are meshed and connected with driven gears 904, and the two sets of driven gears 904 are respectively sleeved on the outer walls of the two sets of rotating rods 905;

[0023] The fixing box 901 is fixedly installed on the inner wall of the rear side of the test box body 1. The operation of the servo motor 900 can drive the driving shaft 902 and the driving gear 903 fixedly connected to the outer wall to rotate. Since the driving gear 903 is meshed and connected with the two sets of driven gears 904, the two sets of driven gears 904 are respectively fixedly sleeved on the outer walls of the two sets of rotating rods 905, thereby making the driving shaft 902 and the two sets of rotating rods 905 rotate synchronously.

[0024] Preferably, a carrying plate 2 is provided at the bottom of the test box body 1, and universal wheels 3 are connected to the four corners of the lower surface of the carrying plate 2; the carrying plate 2 supports the test box body 1, and the rolling of the four sets of universal wheels 3 can conveniently move the test box to the use position, thereby improving its portability.

[0025] Preferably, the bottom ends of the driving shaft 902 and the two sets of rotating rods 905 all pass through the front end surface of the fixing box 901 .

[0026] Preferably, each set of clamping plates 908 is embedded with staggered protrusions on one side close to the semiconductor wafer 10 ; the protrusions increase the friction force when in contact with the semiconductor wafer 10 , thereby improving the stability of clamping the semiconductor wafer 10 .

[0027] Embodiment 2:

[0028] Reference Figure 1 This embodiment is different from the first embodiment in that a handle is provided on the front outer wall of the sealing door 4, and the hand-held end of the handle is covered with an anti-slip rubber sleeve; the handle facilitates the opening and closing of the sealing door 4, and the anti-slip rubber sleeve plays an anti-slip role to prevent the hand from slipping when holding the handle.

[0029] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor high and low temperature humidity test chamber, comprising a chamber body (1) and a semiconductor chip (10), wherein a pressure relief valve (5) is provided on the top of the chamber body (1), a connected refrigeration device (6) is provided on the outer wall of the chamber body (1), heating devices (7) are installed on both inner walls of the chamber body (1), and a humidifying device (8) is provided on the inner top wall of the chamber body (1), characterized in that: The front end surface of the test box body (1) is movably connected with a sealing door (4), and the rear side wall of the inner cavity of the test box body (1) is provided with a rotating clamping mechanism (9), and the rotating clamping mechanism (9) includes a fixed box (901), and the front end of the fixed box (901) is provided with a rotating drive shaft (902) and two groups of rotating rods (905), and the bottom ends of the drive shaft (902) and the two groups of rotating rods (905) are both installed with U-shaped clamping seats (906), and both ends of each group of U-shaped clamping seats (906) are threadedly connected with adjusting bolts (907), and the bottom of each group of adjusting bolts (907) is provided with a clamping plate (908), and the inner side surface of the clamping plate (908) is in contact with the outer wall of the semiconductor chip (10).

2. A semiconductor high and low temperature humidity test chamber according to claim 1, characterized in that: The rotary clamping mechanism (9) further comprises a servo motor (900), wherein the servo motor (900) is located on the rear outer wall of the test box body (1), and the output end of the servo motor (900) is connected to the top end of the driving shaft (902).

3. A semiconductor high and low temperature humidity test chamber according to claim 1, characterized in that: The outer wall of the driving shaft (902) is sleeved with a driving gear (903), and the two side walls of the driving gear (903) are meshedly connected with driven gears (904), and the two groups of driven gears (904) are respectively sleeved on the outer walls of the two groups of rotating rods (905).

4. A semiconductor high and low temperature humidity test chamber according to claim 1, characterized in that: A bearing plate (2) is provided at the bottom of the test box body (1), and universal wheels (3) are connected to the four corners of the lower surface of the bearing plate (2).

5. The semiconductor high and low temperature humidity test chamber according to claim 1, characterized in that: The bottom ends of the driving shaft (902) and the two sets of rotating rods (905) all penetrate the front end surface of the fixed box (901).

6. The semiconductor high and low temperature humidity test chamber according to claim 1, characterized in that: A side of each set of clamping plates (908) close to the semiconductor chip (10) is embedded with staggered protrusions.

7. A semiconductor high and low temperature humidity test chamber according to claim 1, characterized in that: The front end outer wall of the sealing door (4) is provided with a handle, and the hand-held end of the handle is covered with an anti-slip rubber sleeve.

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