Thin TEC refrigeration test bench with refrigeration liquid path

Abstract

The utility model relates to a thin TEC refrigeration test bench with a refrigeration liquid path, which aims to solve the technical problem that the whole base station is overcooled when the cooling system of the current base station refrigerates, and comprises a test bench base and a TEC semiconductor refrigeration element, the TEC semiconductor refrigeration element is embedded in an embedding cavity formed in the top side of the test bed base; a condensate channel is formed in the test bed base, and a condensate inlet and a condensate outlet are formed in the side ends, corresponding to the two ends of the condensate channel, of the test bed base respectively; a condensate channel is formed in the test bed base, a normal-temperature liquid channel is formed in the portion, on the outer ring of the condensate channel, of the test bed base, and a normal-temperature liquid inlet and a normal-temperature liquid outlet are formed in the portions, corresponding to the side ends of the test bed base, of the two ends of the normal-temperature liquid channel respectively. And the whole test bench base is prevented from being overcooled.

Description

Technical Field

[0001] The utility model relates to the technical field of refrigeration testing, in particular to a thin TEC refrigeration testing platform with a refrigeration liquid circuit. Background Art

[0002] TEC semiconductor refrigeration elements can provide a 20° temperature difference between the upper and lower surfaces. For the temperature required by the experiment, the cooling system of the base can be used to pre-cool it, and then cooling can be achieved through the temperature difference transmitted by the TEC semiconductor refrigeration element.

[0003] However, the cooling system of the base may cause the entire base to be overcooled while cooling, thus affecting its use.

[0004] In view of this, we propose a thin TEC refrigeration test bench with a refrigeration liquid circuit. Utility Model Content

[0005] The purpose of the utility model is to overcome the deficiencies of the prior art, meet actual needs, and provide a thin TEC refrigeration test bench with a refrigeration liquid circuit to solve the technical problem that the cooling system of the current base station will cause the entire base station to be overcooled while refrigerating, thus affecting the use.

[0006] In order to achieve the purpose of the utility model, the technical solution adopted by the utility model is: designing a thin TEC refrigeration test bench with a refrigeration liquid circuit, including a test bench base and a TEC semiconductor refrigeration element;

[0007] Test bench base;

[0008] The TEC semiconductor refrigeration element is embedded in an embedding cavity opened on the top side of the test bench base;

[0009] A condensate channel is provided in the test bench base, and a condensate inlet and a condensate outlet are provided at the side ends of the test bench base corresponding to both ends of the condensate channel, respectively, and the condensate inlet and the condensate outlet are respectively connected to the condensate channel;

[0010] Among them, a normal temperature liquid channel is opened in the test bench base of the outer circle of the condensate channel, and a normal temperature liquid inlet and a normal temperature liquid outlet are respectively opened at the side ends of the test bench base corresponding to the two ends of the normal temperature liquid channel, and the normal temperature liquid inlet and the normal temperature liquid outlet are respectively connected to the normal temperature liquid channel.

[0011] Preferably, an aluminum alloy heat conducting sheet is arranged on the top side of the TEC semiconductor refrigeration element.

[0012] Preferably, the TEC semiconductor refrigeration element is covered with a heat-insulating shell, and the heat-insulating shell is embedded in the embedding cavity;

[0013] Wherein, the middle opening of the heat-insulating shell is embedded with the protrusion in the middle of the aluminum alloy heat-conducting plate.

[0014] Preferably, a heat-insulating groove is provided in the test bench base between the condensate channel and the normal-temperature liquid channel.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] 1. The utility model provides a condensate channel and a normal temperature liquid channel, and has the advantages of backflow of minus 30 degree refrigerant liquid through the condensate channel and backflow of normal temperature liquid through the normal temperature liquid channel, thereby avoiding the overcooling of the entire test bench base, and solving the problem that the cooling system of the base may cause the entire base to be overcooled while cooling, thus affecting the use.

[0017] 2. The utility model has the advantage of better protection by providing a heat-insulating shell to cover the aluminum alloy heat-conducting sheet and the TEC semiconductor refrigeration element, leaving only a special area for experiments.

[0018] 3. The utility model has the advantages of reducing heat conduction through the heat insulation groove by arranging the heat insulation groove, and the mutual influence degree between the liquid in the condensate liquid channel and the normal temperature liquid channel is small. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall exploded structure of the utility model;

[0020] Figure 2 This is a schematic diagram of the cross-sectional structure of the middle section of the test bench base of the utility model;

[0021] Figure 3 This is a schematic diagram of the cross-sectional structure of the bottom section of the test bench base of the utility model;

[0022] Figure 4 This is a schematic diagram of the longitudinal cross-sectional structure of the test bench base of the utility model;

[0023] In the figure: 1. Test bench base; 2. TEC semiconductor refrigeration element; 3. Aluminum alloy heat conducting sheet; 4. Heat insulation shell;

[0024] 101. Embedded cavity; 102. Condensate inlet; 103. Condensate outlet; 104. Normal temperature liquid inlet; 105. Normal temperature liquid outlet; 106. Normal temperature liquid channel; 107. Insulation groove; 108. Condensate channel. DETAILED DESCRIPTION

[0025] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0026] Example 1: Thin TEC refrigeration test bench with refrigeration liquid circuit, see Figures 1 to 4, including a test bench base 1 and a TEC semiconductor refrigeration element 2;

[0027] The TEC semiconductor refrigeration element 2 is embedded in the embedding cavity 101 opened on the top side of the test bench base 1. The TEC semiconductor refrigeration element 2 is selected and used by the technicians in this field according to the actual situation. The thickness of the TEC semiconductor refrigeration element 2 is 6mm, and the TEC semiconductor refrigeration element 2 can provide a 20° temperature difference between the upper and lower surfaces. Among them, a condensate channel 108 is opened in the test bench base 1, and the side ends of the test bench base 1 corresponding to the two ends of the condensate channel 108 are respectively opened with a condensate inlet 102 and a condensate outlet 103, and the condensate inlet 102 and the condensate outlet 103 are respectively connected to the condensate channel 108; wherein, a normal temperature liquid channel 106 is opened in the test bench base 1 at the outer circle of the condensate channel 108, and the side ends of the test bench base 1 corresponding to the two ends of the normal temperature liquid channel 106 are respectively opened with a normal temperature liquid inlet 104 and a normal temperature liquid outlet 105, and the normal temperature liquid inlet 104 and the normal temperature liquid outlet 105 are respectively connected to the normal temperature liquid channel 106.

[0028] The utility model provides a condensate channel 108 and a normal temperature liquid channel 106, so that the condensate channel 108 flows back the minus 30 degree refrigerant, and the normal temperature liquid channel 106 flows back the normal temperature liquid, thereby avoiding the overall overcooling of the test bench base 1, and solves the problem that the cooling system of the base may cause the entire base to be overcooled while cooling, thereby affecting the use.

[0029] Specifically, an aluminum alloy heat conducting sheet 3 is arranged on the top side of the TEC semiconductor refrigeration element 2, and the aluminum alloy heat conducting sheet 3 can better dissipate energy.

[0030] Furthermore, the TEC semiconductor refrigeration element 2 is covered with a heat-insulating shell 4 made of polytetrafluoroethylene material, and the heat-insulating shell 4 is embedded in the embedding cavity 101 ; wherein the middle opening of the heat-insulating shell 4 is embedded with the protrusion in the middle of the aluminum alloy heat-conducting sheet 3 .

[0031] The utility model has the advantage of better protection by arranging the heat insulating shell 4 to cover the aluminum alloy heat conducting sheet 3 and the TEC semiconductor refrigeration element 2, leaving only a special area for experiments.

[0032] Furthermore, a heat-insulating groove 107 is provided in the test bench base 1 between the condensate channel 108 and the room-temperature liquid channel 106 , and the width of the heat-insulating groove 107 is 1 mm.

[0033] The utility model has the advantages of reducing heat conduction through the heat insulation groove 107 and having little mutual influence between the liquids in the condensate channel 108 and the normal temperature liquid channel 106 .

[0034] Working principle: The test room needs to be used at minus 50 degrees. A minus 30 degree refrigerant is introduced from the condensate inlet 102 to the condensate channel 108, and a normal temperature liquid is introduced from the normal temperature liquid inlet 104 to the normal temperature liquid channel 106. The minus 30 degree refrigerant is refluxed to the bottom of the TEC semiconductor refrigeration element 2 through the test bench base 1, and the TEC semiconductor refrigeration element 2 is turned on to achieve a minus 50 degree test environment on the upper surface of the TEC semiconductor refrigeration element 2. The aluminum alloy heat conductive sheet 3 transmits energy, which is emitted from the middle opening of the heat insulating shell 4 and the convex fitting in the middle of the aluminum alloy heat conductive sheet 3.

[0035] The embodiments of the present invention disclose preferred embodiments, but are not limited thereto. A person skilled in the art can easily understand the spirit of the present invention based on the above embodiments and make different extensions and changes. However, as long as they do not deviate from the spirit of the present invention, they are all within the protection scope of the present invention.

Claims

1. Thin TEC refrigeration test bench with refrigeration liquid circuit, characterized by: include: Test bench base (1); A TEC semiconductor refrigeration element (2) is embedded in an embedding cavity (101) opened on the top side of the test bench base (1); The test bench base (1) is provided with a condensate channel (108), and the side ends of the test bench base (1) corresponding to the two ends of the condensate channel (108) are respectively provided with a condensate inlet (102) and a condensate outlet (103), and the condensate inlet (102) and the condensate outlet (103) are respectively connected to the condensate channel (108); A normal temperature liquid channel (106) is provided in the test bench base (1) at the outer circle of the condensate channel (108), and a normal temperature liquid inlet (104) and a normal temperature liquid outlet (105) are respectively provided at the side ends of the test bench base (1) corresponding to the two ends of the normal temperature liquid channel (106), and the normal temperature liquid inlet (104) and the normal temperature liquid outlet (105) are respectively connected to the normal temperature liquid channel (106).

2. The thin TEC refrigeration test bench with refrigeration liquid circuit according to claim 1, characterized in that: An aluminum alloy heat conducting sheet (3) is arranged on the top side of the TEC semiconductor refrigeration element (2).

3. The thin TEC refrigeration test bench with refrigeration liquid circuit as claimed in claim 2, characterized in that: The TEC semiconductor refrigeration element (2) is covered with a heat-insulating shell (4), and the heat-insulating shell (4) is embedded in the embedding cavity (101); The middle opening of the heat-insulating shell (4) is engaged with the protrusion in the middle of the aluminum alloy heat-conducting sheet (3).

4. The thin TEC refrigeration test bench with refrigeration liquid circuit according to claim 1, characterized in that: A heat-insulating groove (107) is provided in the test bench base (1) between the condensate channel (108) and the normal-temperature liquid channel (106).

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