Polishing device for processing silicon carbide substrate

Abstract

The utility model discloses a polishing device for processing a silicon carbide substrate, which comprises a rack, and a conveying chain plate is arranged on the inner side of the rack. According to the polishing device for silicon carbide substrate machining, a worker or a mechanical arm places a workpiece on the clamping base between the clamping frames, the unpolished workpiece is driven by the conveying chain plate to move towards the inner side of the supporting frame, the clamping frames are in a mutually-away state through the springs at the beginning, and when the clamping base moves to the inner side of the supporting frame, the clamping frames are driven by the conveying chain plate to move towards the inner side of the supporting frame. An iron plate is just aligned with an electromagnet, the electromagnet drives the iron plate to move downwards, the iron plate drives a clamping base through a guide rod to overcome the elasticity of a spring to move downwards, then clamping frames on the two sides are driven by a transmission rod to get close to each other, a workpiece is clamped and fixed, and then the surface of the workpiece is polished through a polishing mechanism; according to the polishing device, workpieces are conveyed through the conveying chain plate, and meanwhile, the workpieces can be automatically fixed, so that the polishing mechanism can continuously work, and the working efficiency of the polishing device is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of polishing devices, in particular to a polishing device for processing silicon carbide substrates. Background Art

[0002] Silicon carbide substrates can be used to manufacture semiconductor devices. Specifically, for example, semiconductor devices such as diodes or transistors can be manufactured by forming a semiconductor layer composed of silicon carbide on a silicon carbide substrate through epitaxial growth and further forming electrodes on the semiconductor layer. During the production process of the silicon carbide substrate, the surface of the silicon carbide substrate needs to be polished.

[0003] In the patent application with authorization publication number CN220179003U and authorization publication date 2023.12.15, entitled "A Polishing Device for Semiconductor Substrate Processing", a device table is included, wherein a motor is fixedly connected to the front end of the device table, and the motor driving end passes through the device table and is fixedly connected to a screw, and the outer diameter of the screw is threadedly connected to a sliding block, and the right end of the sliding block is fixedly connected to a connecting column, and the end of the connecting column away from the sliding block is fixedly connected to a slider. In the utility model, the motor is operated by a corresponding controller, and the screw is driven to rotate by the motor, and the sliding block is driven to move back and forth by the screw, and then the slider is driven to move back and forth through the connection between the sliding block and the connecting column, and the process of driving the card plate to move back and forth by the sliding block and the slider, and the process of limiting and clamping the semiconductor substrate to be polished, and then the process of limiting and clamping substrates of different widths can be carried out, and the applicability of the device is improved.

[0004] Although the existing polishing device for substrate processing has improved the applicability of the device during use, it was found during use that when polishing the substrate, the substrate needs to be fixed first and then polished. After polishing is completed, the polished substrate needs to be removed and replaced with the unpolished substrate. During the substrate replacement process, the polishing mechanism stops working and the polishing device cannot work continuously, which makes the polishing device have low working efficiency and inconvenient to use. Therefore, we proposed a polishing device for silicon carbide substrate processing to solve the above problems. Utility Model Content

[0005] 1. Technical problems to be solved by the utility model:

[0006] The purpose of the utility model is to provide a polishing device for processing a silicon carbide substrate, so as to solve the problems in the current market raised by the above background technology.

[0007] 2. Technical solution:

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a polishing device for processing a silicon carbide substrate, comprising a frame, a conveying chain plate is arranged inside the frame, and a support frame is installed at the middle of the top of the frame, wherein:

[0009] A polishing mechanism is arranged on the inner side of the support frame, a bracket is installed on the middle part of the inner side of the frame, an electromagnet is installed on the top of the bracket, a base is fixedly connected to the outer side of the conveying chain plate at equal distances, the bottoms of both sides of the base are fixedly connected to the conveying chain plate through supporting rods, a clamping seat is arranged on the side of the base away from the conveying chain plate, a T-shaped slide groove is symmetrically opened on the side of the clamping seat away from the base, and a T-shaped slider is arranged in the T-shaped slide groove;

[0010] The side of the T-shaped slider away from the base is fixedly connected to a clamping frame, the side of the base close to the clamping seat is symmetrically rotatably connected to a transmission rod, the end of the transmission rod away from the base is rotatably connected to the T-shaped slider, a guide rod groove runs through the middle of the base, the side of the clamping seat corresponding to the guide rod groove is fixedly connected to a guide rod, a spring is sleeved on the outer side of the guide rod between the clamping seat and the base, and the end of the guide rod away from the clamping seat is fixedly connected to an iron plate.

[0011] Preferably, the polishing mechanism includes an electric slide rail, an electric slide rail is arranged on the inner top of the support frame, an electric slider is arranged at the bottom of the electric slide rail for transverse sliding, a hydraulic rod is symmetrically installed at the bottom of the electric slider, a lifting frame is installed at the telescopic end of the hydraulic rod, a motor is installed in the middle of the bottom end of the lifting frame, and a polishing head is installed at the shaft end of the motor.

[0012] Preferably, the electric slide rail is arranged perpendicular to the conveying direction of the conveying chain plate.

[0013] Preferably, the transmission rods on the base are distributed in an eight-shaped shape, and the base is transmission-connected with the T-shaped slider via the transmission rods.

[0014] Preferably, the guide rod is in the shape of a rectangular column, and the outer dimensions of the guide rod are consistent with the inner dimensions of the guide rod groove.

[0015] Preferably, the iron plate is a cylinder, and the outer diameter of the iron plate is larger than the inner dimension of the guide rod groove.

[0016] 3. Beneficial effects:

[0017] By adopting the technical solution provided by the utility model, compared with the prior art, the polishing device for processing silicon carbide substrates of the utility model has the following specific contents:

[0018] (1) The staff or the robot arm places the workpiece on the clamping seat between the clamping frames, and drives the unpolished workpiece toward the inner side of the support frame through the conveyor chain plate. At the beginning, the clamping frames are in a state of being away from each other through the spring. When the clamping seat moves to the inner side of the support frame, the iron plate is just aligned with the electromagnet, and the electromagnet drives the iron plate to move downward, so that the iron plate drives the clamping seat to overcome the spring force and move downward through the guide rod, and then drives the clamping frames on both sides to approach each other through the transmission rod to clamp and fix the workpiece. After that, the surface of the workpiece is polished by the polishing mechanism, and the workpiece is transported by the conveyor chain plate. At the same time, the workpiece can be automatically fixed, so that the polishing mechanism can work continuously, which effectively improves the working efficiency of the polishing device.

[0019] (2) When the iron plate and the electromagnet are misaligned, the base and the clamping seat are moved away from each other through the spring, and the T-shaped sliders on both sides are driven away from each other through the transmission rod, thereby driving the clamping frames to move away from each other. When the iron plate and the electromagnet are aligned, the electromagnet generates suction on the iron plate, so that the iron plate drives the clamping seat to move toward the base, thereby driving the clamping frames to move closer to each other. At the same time, the movement of the clamping seat can be guided by the guide rod and the guide rod groove, and then the workpiece can be clamped and released automatically through this clamping mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of the utility model;

[0021] Figure 2 This is a side view of the three-dimensional structure of the utility model;

[0022] Figure 3 This is a schematic diagram of the cross-sectional structure of the frame of the utility model;

[0023] Figure 4 It is a schematic diagram of the cross-sectional structure of the clamping seat of the utility model.

[0024] In the figure: 1. frame; 2. conveyor chain plate; 3. support frame; 4. electric slide rail; 5. electric slider; 6. hydraulic rod; 7. lifting frame; 8. motor; 9. polishing head; 10. bracket; 11. electromagnet; 12. base; 13. support rod; 14. clamping seat; 15. T-shaped slide groove; 16. T-shaped slider; 17. clamping frame; 18. transmission rod; 19. guide rod groove; 20. guide rod; 21. spring; 22. iron plate. DETAILED DESCRIPTION

[0025] In order to facilitate the understanding of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "page", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0027] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0028] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed", "provided with", etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. Example

[0029] See also Figures 1 to 4 The polishing device for processing silicon carbide substrates includes a frame 1, a conveying chain plate 2 is arranged inside the frame 1, and a support frame 3 is installed at the middle of the top of the frame 1, wherein:

[0030] A polishing mechanism is arranged inside the support frame 3, a bracket 10 is installed in the middle of the inner side of the frame 1, an electromagnet 11 is installed on the top of the bracket 10, a base 12 is fixedly connected to the outer side of the conveying chain plate 2 at equal distances, the bottoms of both sides of the base 12 are fixedly connected to the conveying chain plate 2 through support rods 13, a clamping seat 14 is arranged on the side of the base 12 away from the conveying chain plate 2, a T-shaped slide groove 15 is symmetrically opened on the side of the clamping seat 14 away from the base 12, and a T-shaped slider 16 is arranged in the T-shaped slide groove 15;

[0031] A clamping frame 17 is fixedly connected to the side of the T-shaped slider 16 away from the base 12, and a transmission rod 18 is symmetrically rotatably connected to the side of the base 12 close to the clamping seat 14. The end of the transmission rod 18 away from the base 12 is rotatably connected to the T-shaped slider 16. A guide rod groove 19 runs through the middle of the base 12. A guide rod 20 is fixedly connected to the side of the clamping seat 14 corresponding to the guide rod groove 19. A spring 21 is sleeved on the outer side of the guide rod 20 between the clamping seat 14 and the base 12. An iron plate 22 is fixedly connected to the end of the guide rod 20 away from the clamping seat 14;

[0032] The staff or the robot arm places the workpiece on the clamping seat 14 between the clamping frames 17, and drives the unpolished workpiece to move toward the inner side of the support frame 3 through the conveying chain plate 2. The clamping frames 17 are initially in a state of being away from each other through the spring 21. When the clamping seat 14 moves to the inner side of the support frame 3, the iron plate 22 is just aligned with the electromagnet 11, and the electromagnet 11 drives the iron plate 22 to move downward, so that the iron plate 22 drives the clamping seat 14 to overcome the elastic force of the spring 21 and move downward through the guide rod 20, and then drives the clamping frames 17 on both sides to approach each other through the transmission rod 18, so as to clamp and fix the workpiece, and then grind the surface of the workpiece through the polishing mechanism, and convey the workpiece through the conveying chain plate 2. At the same time, the workpiece can be automatically fixed, so that the polishing mechanism can work continuously, which effectively improves the working efficiency of the polishing device.

[0033] See also Figures 1 to 4 The polishing mechanism includes an electric slide rail 4, an electric slide rail 4 is arranged on the inner top of the support frame 3, an electric slider 5 is arranged on the bottom of the electric slide rail 4 for horizontal sliding, a hydraulic rod 6 is symmetrically installed at the bottom of the electric slider 5, a lifting frame 7 is installed at the telescopic end of the hydraulic rod 6, a motor 8 is installed in the middle of the bottom end of the lifting frame 7, and a polishing head 9 is installed on the shaft end of the motor 8. The electric slide rail 4 is arranged perpendicular to the conveying direction of the conveying chain plate 2. When the workpiece moves to the inner side of the support frame 3, the motor 8 is driven downward by the hydraulic rod 6, and the motor 8 drives the polishing head 9 to rotate. When the polishing head 9 contacts the surface of the workpiece, the surface of the workpiece is polished, and the polishing head 9 can be moved laterally through the electric slide rail 4 and the electric slider 5 (the electric slide rail 4 and the electric slider 5 are existing commonly used sliding structures, so this scheme directly quotes them), and the workpiece can be driven to move longitudinally through the conveying chain plate 2, so as to facilitate the polishing of the workpiece surface.

[0034] See also Figures 1 to 4 The transmission rod 18 on the base 12 is distributed in an eight-shaped shape, and the base 12 is connected to the T-shaped slider 16 through the transmission rod 18. The guide rod 20 is a rectangular column, and the outer size of the guide rod 20 coincides with the inner size of the guide rod groove 19. The iron plate 22 is a cylinder, and the outer diameter of the iron plate 22 is larger than the inner size of the guide rod groove 19. When the iron plate 22 is misaligned with the electromagnet 11, the base 12 and the clamping seat 14 are moved away from each other by the spring 21, and the T-shaped sliders 16 on both sides are driven away from each other by the transmission rod 18, and then the clamping frame 17 is driven away from each other. When the iron plate 22 is aligned with the electromagnet 11, the electromagnet 11 generates suction on the iron plate 22, so that the iron plate 22 drives the clamping seat 14 to move toward the base 12, and then drives the clamping frame 17 to approach each other. At the same time, the movement of the clamping seat 14 can be guided by the guide rod 20 and the guide rod groove 19, and then the clamping mechanism can automatically complete the clamping and release of the workpiece.

[0035] Working principle: When using the polishing device for processing silicon carbide substrates, Figures 1 to 4 As shown, first, the staff or the robot arm places the workpiece on the clamping seat 14 between the clamping frames 17, and drives the unpolished workpiece to move toward the inner side of the support frame 3 through the conveying chain plate 2. At the initial stage, the clamping frames 17 are in a state of being away from each other through the spring 21. When the clamping seat 14 moves to the inner side of the support frame 3, the iron plate 22 is just aligned with the electromagnet 11, and the electromagnet 11 drives the iron plate 22 to move downward, so that the iron plate 22 drives the clamping seat 14 to overcome the elastic force of the spring 21 and move downward through the guide rod 20, and then drives the clamping frames 17 on both sides to approach each other through the transmission rod 18, so as to clamp and fix the workpiece, and then grind the surface of the workpiece through the polishing mechanism, and convey the workpiece through the conveying chain plate 2. At the same time, the workpiece can be automatically fixed, so that the polishing mechanism can work continuously, which effectively improves the working efficiency of the polishing device;

[0036] When the workpiece moves to the inner side of the support frame 3, the hydraulic rod 6 drives the motor 8 to move downward, and the motor 8 drives the polishing head 9 to rotate. When the polishing head 9 contacts the surface of the workpiece, the surface of the workpiece is polished. The electric slide rail 4 and the electric slider 5 (the electric slide rail 4 and the electric slider 5 are the existing commonly used sliding structures, so this scheme directly quotes them) enable the polishing head 9 to move horizontally, and the conveying chain plate 2 can drive the workpiece to move longitudinally, so as to facilitate the polishing of the workpiece surface. When the iron plate 22 is misaligned with the electromagnet 11, the electric slide rail 4 and the electric slider 5 are the existing commonly used sliding structures, so the electric slide rail 4 and the electric slider 5 are directly quoted in this scheme. The spring 21 causes the base 12 and the clamping seat 14 to move away from each other, and the transmission rod 18 drives the T-shaped sliders 16 on both sides to move away from each other, thereby driving the clamping frame 17 to move away from each other. When the iron plate 22 is aligned with the electromagnet 11, the electromagnet 11 generates suction on the iron plate 22, so that the iron plate 22 drives the clamping seat 14 to move toward the base 12, thereby driving the clamping frame 17 to move closer to each other. At the same time, the guide rod 20 and the guide rod groove 19 can guide the movement of the clamping seat 14, and then the clamping mechanism can automatically complete the clamping and release of the workpiece.

[0037] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0038] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A polishing device for processing a silicon carbide substrate, characterized in that: It comprises a frame (1), a conveying chain plate (2) is arranged inside the frame (1), and a support frame (3) is installed at the middle of the top end of the frame (1), wherein: A polishing mechanism is arranged on the inner side of the support frame (3), a bracket (10) is installed on the middle part of the inner side of the frame (1), an electromagnet (11) is installed on the top of the bracket (10), a base (12) is fixedly connected to the outer side of the conveying chain plate (2) at equal distances, the bottoms of both sides of the base (12) are fixedly connected to the conveying chain plate (2) through support rods (13), a clamping seat (14) is arranged on the side of the base (12) away from the conveying chain plate (2), a T-shaped slide groove (15) is symmetrically opened on the side of the clamping seat (14) away from the base (12), and a T-shaped slider (16) is arranged in the T-shaped slide groove (15); A clamping frame (17) is fixedly connected to a side of the T-shaped slider (16) away from the base (12); a transmission rod (18) is symmetrically rotatably connected to a side of the base (12) close to the clamping seat (14); an end of the transmission rod (18) away from the base (12) is rotatably connected to the T-shaped slider (16); a guide rod groove (19) runs through the middle of the base (12); a guide rod (20) is fixedly connected to a side of the clamping seat (14) corresponding to the guide rod groove (19); a spring (21) is sleeved on the outer side of the guide rod (20) between the clamping seat (14) and the base (12); and an iron plate (22) is fixedly connected to an end of the guide rod (20) away from the clamping seat (14).

2. The polishing device for processing a silicon carbide substrate according to claim 1, characterized in that: The polishing mechanism comprises an electric slide rail (4), the electric slide rail (4) is arranged on the inner top of the support frame (3), an electric slider (5) is arranged at the bottom of the electric slide rail (4) for transverse sliding, a hydraulic rod (6) is symmetrically installed at the bottom of the electric slider (5), a lifting frame (7) is installed at the telescopic end of the hydraulic rod (6), a motor (8) is installed at the middle of the bottom end of the lifting frame (7), and a polishing head (9) is installed at the shaft end of the motor (8).

3. The polishing device for processing a silicon carbide substrate according to claim 2, characterized in that: The electric slide rail (4) is arranged perpendicular to the conveying direction of the conveying chain plate (2).

4. The polishing device for processing a silicon carbide substrate according to claim 1, characterized in that: The transmission rods (18) on the base (12) are distributed in an eight-shaped pattern, and the base (12) is transmission-connected to the T-shaped slider (16) via the transmission rods (18).

5. The polishing device for processing a silicon carbide substrate according to claim 1, characterized in that: The guide rod (20) is in the shape of a rectangular column, and the outer dimensions of the guide rod (20) coincide with the inner dimensions of the guide rod groove (19).

6. The polishing device for processing a silicon carbide substrate according to claim 1, characterized in that: The iron plate (22) is a cylinder, and the outer diameter of the iron plate (22) is greater than the inner dimension of the guide rod groove (19).

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