Wafer transfer mechanism

Abstract

The utility model discloses a wafer transfer mechanism which comprises a rotating part and a first driving part, the rotating part is rotatably arranged on the side of a feeding and discharging station, and the driving end of the first driving part is connected with the rotating part; a loading part and an unloading part are arranged on the rotating part at intervals in the circumferential direction, the loading part is configured to receive and bear a wafer to be polished, the unloading part is configured to receive and bear the polished wafer, and the first driving part is configured to drive the rotating part to rotate so that the loading part and the unloading part can alternately move to a loading and unloading station; a polishing head mechanism is arranged above the feeding and discharging station. A to-be-polished wafer carried by the loading part located at the loading and unloading station is picked up by the polishing head mechanism; and the unloading part located at the loading and unloading station receives the polished wafer placed by the polishing head mechanism. According to the wafer transfer mechanism, automatic transfer of wafers to be polished and polished wafers is achieved, the transfer stroke of the wafers can be greatly shortened, and the transfer efficiency of the wafers is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of wafer polishing equipment manufacturing, and in particular, relates to a wafer transfer mechanism. Background Art

[0002] During the wafer production process, the wafer usually needs to be polished by polishing equipment to remove the unevenness and contaminants on the wafer surface to achieve high-quality smoothness.

[0003] The current wafer polishing equipment is usually equipped with a polishing area and a loading and unloading area. The polishing area is equipped with a polishing mechanism and a loading and unloading station. The loading and unloading area is independently equipped with a loading transfer mechanism and an unloading transfer mechanism. When loading, the loading robot first moves the wafer to be polished to the loading transfer mechanism, and then the loading transfer mechanism transfers the wafer to be polished to the loading and unloading station; when unloading, the unloading transfer mechanism first moves the polished wafer from the loading and unloading station to a preset position, and then the unloading robot transfers the polished wafer to the water tank in the unloading area for cleaning. Obviously, the existing wafer polishing equipment has a long transfer stroke in the loading and unloading process because the loading transfer mechanism and the unloading transfer mechanism are independently arranged, resulting in low wafer transfer efficiency. Utility Model Content

[0004] The purpose of the present application is to provide a wafer transfer mechanism to solve the problem of low wafer transfer efficiency in existing wafer polishing equipment.

[0005] To achieve this goal, this application adopts the following technical solutions:

[0006] In a first aspect, the present application provides a wafer transfer mechanism, which includes a rotating member and a first driving member, wherein:

[0007] The rotating member is rotatably arranged on the side of the loading and unloading station, and the driving end of the first driving member is connected to the rotating member;

[0008] A loading part and a discharging part are arranged at intervals along the circumferential direction on the rotating member, the loading part is configured to receive and carry the wafers to be polished, and the discharging part is configured to receive and carry the polished wafers, and the first driving member is configured to drive the rotating member to rotate so that the loading part and the discharging part are alternately moved to the loading and unloading stations, and a polishing head mechanism is arranged above the loading and unloading stations;

[0009] The wafer to be polished carried by the loading part located at the loading and unloading station is picked up by the polishing head mechanism;

[0010] The unloading part located at the loading and unloading station receives the polished wafers placed by the polishing head mechanism.

[0011] The wafer transfer mechanism proposed in the present application integrates the loading part and the unloading part on a rotating part, drives the rotating part to rotate through a first driving part, and alternately moves the loading part and the unloading part to the loading and unloading stations, thereby realizing automatic transfer of wafers to be polished and polished wafers, which can greatly shorten the transfer distance of the wafers and improve the transfer efficiency of the wafers.

[0012] Optionally, a cleaning part is also provided on the rotating member along the circumference and located between the loading part and the unloading part. The first driving member is configured to drive the rotating member to rotate so that the loading part, the cleaning part and the unloading part are alternately moved to the loading and unloading stations; the cleaning part is configured to clean the polishing head mechanism located at the loading and unloading stations.

[0013] By arranging a cleaning part on the rotating part, when the cleaning part moves to the loading and unloading station, it can clean the polishing head mechanism at the loading and unloading station to remove impurities on the polishing head of the polishing head mechanism, thereby ensuring the cleanliness of the polishing head and improving the polishing quality of the wafer.

[0014] Optionally, the cleaning part includes a first base and at least one cleaning brush, the first base is mounted on the rotating member, the polishing head mechanism includes at least one polishing head, each cleaning brush corresponds to a polishing head, and the polishing head can be raised and lowered relative to the loading and unloading station, wherein:

[0015] The cleaning brush is rotatably mounted on the first base, and the cleaning part further comprises a second driving member, a fixed end of the second driving member is mounted on the first base, a driving end of the second driving member is connected to the cleaning brush, and the second driving member is configured to drive the cleaning brush to rotate, and the polishing head to be cleaned is lowered to a preset height to contact the corresponding cleaning brush, and the second driving member drives the cleaning brush to rotate to clean the corresponding polishing head to be cleaned;

[0016] Alternatively, the cleaning brush is fixed on the first base, the polishing head to be cleaned descends to a preset height and contacts the cleaning brush, and the polishing head to be cleaned rotates to perform cleaning.

[0017] By rotatably mounting the cleaning brush on the first base, the second driving member drives the cleaning brush to rotate to clean the polishing head to be cleaned, thereby providing a cleaning unit with good cleaning effect and high cleaning efficiency; by fixing the cleaning brush on the first base, the polishing head to be cleaned contacts the cleaning brush and then rotates to implement cleaning, thereby providing a cleaning unit with simple structure and low cost.

[0018] Optionally, the loading part includes at least one loading mechanism, the loading mechanism includes a second base, a first bearing member and a third driving member, the second base is mounted on the rotating member, a first limiting member for limiting the position of the wafer to be polished in the circumferential direction is arranged on the second base, the first limiting member is arranged on the periphery of the first bearing member, the first bearing member is liftably mounted on the second base, a driving end of the third driving member is connected to the first bearing member, and the third driving member is configured to drive the first bearing member to be lifted and lowered;

[0019] The third driving member drives the first carrier to rise to a high position so as to receive the wafer to be polished through the first carrier;

[0020] The third driving member drives the first carrier to descend to a low position, so that the wafer to be polished on the first carrier automatically falls onto the first limiting member.

[0021] Through the cooperation of the third driving member, the first supporting member and the first limiting member, the wafer to be polished is automatically received and the received wafer is automatically dropped onto the first limiting member, and the action of receiving the wafer is smooth and reliable; at the same time, the wafer to be polished is limited by the first limiting member, thereby ensuring the position accuracy of the wafer to be polished, which is convenient for the subsequent polishing head to pick up the wafer to be polished.

[0022] Optionally, the first carrier is further provided with an adsorption component, and the adsorption component is configured to adsorb and fix the wafer to be polished received by the first carrier on the first carrier;

[0023] The first limiting member is formed with an arc-shaped limiting groove in a direction close to the first supporting member, and the wafer to be polished is limited by the arc-shaped limiting groove after falling onto the first limiting member.

[0024] The wafer to be polished is adsorbed and fixed on the first carrier by the adsorption component, which prevents the wafer to be polished from shifting when following the descent and transportation of the first carrier, and further ensures the position accuracy of the wafer to be polished moved to the loading and unloading station.

[0025] Optionally, the adsorption assembly includes a plurality of adsorption parts arranged at intervals on the first carrier, each adsorption part is provided with at least one adsorption hole, an adsorption cavity connected to all the adsorption holes is provided in the first carrier, the adsorption cavity is connected to an exhaust device, and the exhaust device sucks the air in the adsorption cavity to adsorb and fix the wafer to be polished on the plurality of adsorption parts through the adsorption holes.

[0026] By arranging a plurality of adsorption parts at intervals on the first carrier, each adsorption part has an adsorption hole connected to the adsorption chamber, and the vacuum device sucks the air in the adsorption chamber, the wafer to be polished can be adsorbed and fixed on the plurality of adsorption parts, while the contact area between the wafer to be polished and the first carrier can be reduced, thereby reducing the friction of the wafer to be polished.

[0027] Optionally, the unloading part includes at least one unloading mechanism, which includes a liquid storage tray, a second carrier and a fourth driving member. The liquid storage tray is installed on the rotating member, and the liquid storage tray contains a cleaning liquid for cleaning the polished wafer. The second carrier is installed in the liquid storage tray in a liftable manner. The driving end of the fourth driving member is connected to the second carrier, and the fourth driving member is configured to drive the second carrier to move up and down.

[0028] The fourth driving member drives the second carrier to rise to a high position so as to receive the polished wafer placed by the polishing head mechanism through the second carrier;

[0029] The fourth driving member drives the second carrier to descend to a low position, so that the polished wafer on the second carrier falls into the cleaning liquid in the liquid storage tray.

[0030] Through the cooperation of the liquid storage tray, the second carrier and the fourth driving member, the polished wafer placed by the polishing head mechanism can be automatically received, and the received polished wafer can be automatically dropped into the cleaning liquid in the liquid storage tray, thereby realizing the transportation and cleaning of the polished wafer, ensuring that the polished wafer is always in a wet state, the transportation process is stable and reliable, and the cleaning efficiency is high.

[0031] Optionally, the discharge portion further includes a liquid supply mechanism, which is disposed on the peripheral side of the liquid storage pan and is configured to automatically supply cleaning liquid into the liquid storage pan.

[0032] By providing a liquid supply mechanism, the cleaning liquid is automatically supplied to the liquid storage tray, which is beneficial to improving the cleaning efficiency of the discharge part.

[0033] Optionally, the second carrier includes a lifting member and a plurality of supporting members, the lifting member is liftably arranged at the bottom of the liquid storage tray, the driving end of the fourth driving member is connected to the lifting member, the plurality of supporting members are configured to receive and carry the polished wafers placed by the polishing head mechanism, the plurality of supporting members are installed on the lifting member and penetrate into the liquid storage tray, and the joints between the plurality of supporting members and the liquid storage tray are sealed.

[0034] A plurality of supporting members are used to receive and carry the polished wafer placed by the polishing head mechanism, and then a lifting member is used to drive the plurality of supporting members to rise and fall, thereby providing a second supporting member with a simple structure, low cost and low friction to the polished wafer.

[0035] Optionally, a plurality of circumferentially arranged second limiting members are provided in the liquid storage tray, the second limiting members are located at the periphery of the second supporting member, and the second limiting members are configured to limit the polished wafer in the circumferential direction.

[0036] By arranging a second limiting member in the liquid storage tray, the polished wafer is limited in the circumferential direction, thereby ensuring the position accuracy of the polished wafer and facilitating the subsequent unloading robot to pick up the polished wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a schematic diagram of the three-dimensional structure of the wafer transfer mechanism provided in an embodiment of the present application;

[0038] Figure 2 is a schematic top view of a wafer transfer mechanism provided in an embodiment of the present application;

[0039] Figure 3 It is a schematic diagram of the three-dimensional structure of the loading mechanism of the wafer transfer mechanism provided in an embodiment of the present application;

[0040] Figure 4 is a cross-sectional schematic diagram of a loading mechanism of a wafer transfer mechanism provided in an embodiment of the present application;

[0041] Figure 5 It is a schematic diagram of the three-dimensional structure of the unloading mechanism of the wafer transfer mechanism provided in an embodiment of the present application from a first perspective;

[0042] Figure 6 It is a schematic diagram of the three-dimensional structure from a second perspective of the unloading mechanism of the wafer transfer mechanism provided in an embodiment of the present application.

[0043] Figures 1 to 6 The following reference numerals are included:

[0044] Wafer transfer mechanism 10: rotating member 11, loading part 12, loading mechanism 120, second base 1200, first bearing member 1201, third driving member 1202, first limiting member 1203, arc limiting groove 1204, adsorption part 1205, adsorption hole 1206, adsorption chamber 1207, unloading part 13, unloading mechanism 130, liquid storage tray 1300, second bearing member 1301, fourth driving member 1302, lifting member 1303, supporting member 1304, second limiting member 1305, liquid supply mechanism 131, cleaning part 14, first base 140, cleaning brush 141;

[0045] The loading and unloading area 20 includes a first material storage section 21 , a first conveying mechanism 22 , a second material storage section 23 , and a second conveying mechanism 24 . DETAILED DESCRIPTION

[0046] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0047] During the wafer production process, the wafer usually needs to be polished by polishing equipment to remove the unevenness and contaminants on the wafer surface to achieve high-quality smoothness.

[0048] The current wafer polishing equipment is usually equipped with a polishing area and a loading and unloading area. The polishing area is equipped with a polishing mechanism and a loading and unloading station. The loading and unloading area is independently equipped with a loading transfer mechanism and an unloading transfer mechanism. When loading, the loading robot first moves the wafer to be polished to the loading transfer mechanism, and then the loading transfer mechanism transfers the wafer to be polished to the loading and unloading station; when unloading, the unloading transfer mechanism first moves the polished wafer from the loading and unloading station to a preset position, and then the unloading robot transfers the polished wafer to the water tank in the unloading area for cleaning. Obviously, the existing wafer polishing equipment has a long transfer stroke in the loading and unloading process because the loading transfer mechanism and the unloading transfer mechanism are independently arranged, resulting in low wafer transfer efficiency.

[0049] Therefore, this application proposes a wafer transfer mechanism, see Figure 1 As shown, a wafer transfer mechanism 10 provided in an embodiment of the present application includes a rotating member 11 and a first driving member (not shown in the figure), the rotating member 11 is rotatably arranged on the side of the loading and unloading station, and the driving end of the first driving member is connected to the rotating member 11; a loading portion 12 and a unloading portion 13 are arranged on the rotating member 11 at intervals along the circumferential direction, the loading portion 12 is configured to receive and carry wafers to be polished, and the unloading portion 13 is configured to receive and carry polished wafers, and the first driving member is configured to drive the rotating member 11 to rotate so that the loading portion 12 and the unloading portion 13 are alternately moved to the loading and unloading station, and a polishing head mechanism is arranged above the loading and unloading station; the wafers to be polished carried by the loading portion 12 located at the loading and unloading station are picked up by the polishing head mechanism; the unloading portion 13 located at the loading and unloading station receives the polished wafers placed by the polishing head mechanism.

[0050] Specifically, the first driving member includes a first motor and a first transmission assembly. The first end of the first transmission assembly is connected to the rotating shaft of the first motor, and the second end of the first transmission assembly is connected to the rotating member 11. The driving end of the first motor drives the rotating member 11 to rotate through the first transmission assembly. The first transmission assembly adopts any conventional gear transmission or synchronous belt transmission, which will not be described in detail here.

[0051] It can be seen that the wafer transfer mechanism 10 proposed in the present application integrates the loading part 12 and the unloading part 13 on the rotating part 11, drives the rotating part 11 to rotate through the first driving part, and alternately moves the loading part 12 and the unloading part 13 to the loading and unloading stations, thereby realizing the automatic transfer of wafers to be polished and polished wafers, which can greatly shorten the transfer distance of the wafers and improve the transfer efficiency of the wafers.

[0052] As an embodiment, a cleaning portion 14 is also provided on the rotating member 11 along the circumferential direction and is located between the loading portion 12 and the unloading portion 13. The first driving member is configured to drive the rotating member 11 to rotate so that the loading portion 12, the cleaning portion 13 and the unloading portion 14 are alternately moved to the loading and unloading stations; the cleaning portion 14 is configured to clean the polishing head mechanism located at the loading and unloading stations.

[0053] It can be seen that by arranging the cleaning part 14 on the rotating part 11, when the cleaning part 14 moves to the loading and unloading station, it can clean the polishing head mechanism at the loading and unloading station to remove impurities on the polishing head of the polishing head mechanism, thereby ensuring the cleanliness of the polishing head and being beneficial to improving the polishing quality of the wafer.

[0054] See also Figure 1 and Figure 2 As shown, as an embodiment, the cleaning part 14 includes a first base 140 and at least one cleaning brush 141, the first base 140 is mounted on the rotating member 11, the polishing head mechanism includes at least one polishing head, each cleaning brush 141 corresponds to a polishing head, the polishing head can be raised and lowered relative to the loading and unloading station, the cleaning brush 141 is rotatably mounted on the first base 140, the cleaning part 14 also includes a second driving member (not shown in the figure), the fixed end of the second driving member is mounted on the first base 140, the driving end of the second driving member is connected to the cleaning brush 141, the second driving member is configured to drive the cleaning brush 141 to rotate, the polishing head to be cleaned descends to a preset height to contact the corresponding cleaning brush 141, and the second driving member drives the cleaning brush 141 to rotate to clean the corresponding polishing head to be cleaned.

[0055] Specifically, the second driving member includes a second motor and a second transmission assembly. The first end of the second transmission assembly is connected to the rotating shaft of the second motor, and the second end of the second transmission assembly is connected to the cleaning brush 141. The driving end of the second motor drives the cleaning brush 141 to rotate through the second transmission assembly. The second transmission assembly adopts either conventional gear transmission or synchronous belt transmission, which will not be described in detail here.

[0056] It can be seen that by rotatably mounting the cleaning brush 141 on the first base 140, the second driving member drives the cleaning brush 141 to rotate to clean the polishing head to be cleaned, thereby providing a cleaning portion 14 with good cleaning effect and high cleaning efficiency.

[0057] Specifically, the cleaning part 14 includes two cleaning brushes 141, which are rotatably mounted on the first base 140 at an interval, and the second driving member drives the two cleaning brushes 141 to rotate synchronously to simultaneously clean the two polishing heads to be cleaned, thereby improving the cleaning efficiency of the polishing heads.

[0058] As another embodiment, the cleaning part 14 includes a first base 140 and at least one cleaning brush 141. The first base 140 is installed on the rotating member 11. The polishing head mechanism includes at least one polishing head. Each cleaning brush corresponds to a polishing head. The polishing head can be raised and lowered relative to the loading and unloading station. The cleaning brush 141 is fixed on the first base 140. The polishing head to be cleaned descends to a preset height and contacts the cleaning brush 141. The polishing head to be cleaned rotates to implement cleaning.

[0059] Specifically, the cleaning brush 141 is fixedly mounted on the first base 140. After the cleaning unit 14 moves to the loading and unloading station, the polishing head located above descends and contacts the cleaning brush 141, and then the polishing head to be cleaned rotates to perform cleaning.

[0060] It can be seen that by fixing the cleaning brush 141 on the first base 140, the polishing head to be cleaned descends and contacts the cleaning brush 141 and then rotates to implement cleaning, thereby providing a cleaning part 14 with a simple structure and low cost.

[0061] Specifically, the cleaning brush 141 may be made of any one of metal, natural wool or artificial fiber, wherein the artificial fiber may be any one of PA, PP, PET or PVC.

[0062] See also Figures 2 to 4 As shown, as an embodiment, the loading part 12 includes at least one loading mechanism 120, and the loading mechanism 120 includes a second base 1200, a first bearing member 1201 and a third driving member 1202. The second base 1200 is installed on the rotating member 11, and a first limiting member 1203 for limiting the position of the wafer to be polished in the circumferential direction is provided on the second base 1200. The first limiting member 1203 is arranged on the periphery of the first bearing member 1201, and the first bearing member 1201 can be lifted and installed on the third driving member 1202. On the second base 1200, the driving end of the third driving member 1202 is connected to the first carrier 1201, and the third driving member 1202 is configured to drive the first carrier 1201 to rise and fall; the third driving member 1202 drives the first carrier 1201 to rise to a high position to receive the wafer to be polished through the first carrier 1201; the third driving member 1202 drives the first carrier 1201 to descend to a low position, so that the wafer to be polished on the first carrier 1201 automatically falls onto the first limiting member 1203.

[0063] Specifically, the third driving member 1202 is a cylinder.

[0064] Specifically, the loading section 12 includes two loading mechanisms 120 that are spaced apart from each other, so as to simultaneously receive and carry two wafers to be polished.

[0065] It can be seen that through the cooperation of the third driving member 1202, the first supporting member 1201 and the first limiting member 1203, the wafer to be polished is automatically received and automatically dropped onto the first limiting member 1203, and the action of receiving the wafer is smooth and reliable; at the same time, the wafer to be polished is limited by the first limiting member 1203, thereby ensuring the position accuracy of the wafer to be polished, which is convenient for the subsequent polishing head to pick up the wafer to be polished.

[0066] As an embodiment, an adsorption component is also provided on the first carrier 1201, and the adsorption component is configured to adsorb and fix the wafer to be polished received by the first carrier 1201 on the first carrier 1201; the first limiting member 1203 is formed with an arc-shaped limiting groove 1204 in the direction close to the first carrier 1201, and the wafer to be polished falls onto the first limiting member 1203 and is limited by the arc-shaped limiting groove 1204.

[0067] It can be seen that the wafer to be polished is adsorbed and fixed on the first carrier 1201 through the adsorption assembly, which avoids the wafer to be polished from shifting when following the descent and transportation of the first carrier 1201, and further ensures the position accuracy of the wafer to be polished moved to the loading and unloading station.

[0068] As an embodiment, the adsorption assembly includes a plurality of adsorption parts 1205 arranged at intervals on the first carrier 1201, each adsorption part 1205 is provided with at least one adsorption hole 1206, and the first carrier 1201 is provided with an adsorption cavity 1207 connected with all the adsorption holes 1206, the adsorption cavity 1207 is connected to an exhaust device, and the exhaust device sucks the air in the adsorption cavity 1207 to adsorb and fix the wafer to be polished on the plurality of adsorption parts 1205 through the adsorption holes 1206.

[0069] It can be seen that by arranging a plurality of adsorption parts 1205 at intervals on the first carrier 1201, each adsorption part 1205 is provided with an adsorption hole 1206 connected to the adsorption chamber 1207, and the vacuum device sucks the air in the adsorption chamber 1207, while achieving the adsorption and fixing of the wafer to be polished on the plurality of adsorption parts 1205, the contact area between the wafer to be polished and the first carrier 1201 can be reduced, thereby reducing the friction of the wafer to be polished.

[0070] See also Figure 2 , Figure 5 and Figure 6As shown, as an embodiment, the unloading portion 13 includes at least one unloading mechanism 130, and the unloading mechanism 130 includes a liquid storage tray 1300, a second carrier 1301 and a fourth driving member 1302. The liquid storage tray 1300 is installed on the rotating member 11, and the liquid storage tray 1300 contains a cleaning liquid for cleaning the polished wafer. The second carrier 1301 can be installed in the liquid storage tray 1300 in a liftable manner. The driving end of the fourth driving member 1302 is connected to the second carrier 1301, and the fourth driving member 1302 is configured to drive the second carrier 1301 to rise and fall. The fourth driving member 1302 drives the second carrier 1301 to rise to a high position to receive the polished wafer placed by the polishing head mechanism through the second carrier 1301; the fourth driving member 1302 drives the second carrier 1301 to descend to a low position, so that the polished wafer on the second carrier 1301 falls into the cleaning liquid in the liquid storage tray 1300.

[0071] Specifically, the fourth driving member 1302 is a cylinder.

[0072] Specifically, the unloading portion 13 includes two unloading mechanisms 130 arranged at an interval to simultaneously receive and carry two polished wafers.

[0073] It can be seen that through the cooperation of the liquid storage tray 1300, the second carrier 1301 and the fourth driving member 1302, the polished wafer placed by the polishing head mechanism can be automatically received, and the received polished wafer can be automatically dropped into the cleaning liquid in the liquid storage tray 1300, thereby realizing the transfer and cleaning of the polished wafer. The transfer process is stable and reliable, and the cleaning efficiency is high.

[0074] As an embodiment, the discharge portion 13 further includes a liquid supply mechanism 131 , which is disposed on the peripheral side of the liquid storage tray 1300 and is configured to automatically supply cleaning liquid into the liquid storage tray 1300 .

[0075] Specifically, the liquid supply mechanism 131 includes three liquid supply nozzles evenly arranged and installed on the peripheral side of the liquid storage tray 1300. Each liquid supply nozzle is connected to a liquid supply pump via a liquid supply pipeline. The cleaning liquid is delivered to the liquid supply nozzle via the liquid supply pipeline by the liquid supply pump, and then the cleaning liquid is supplied to the liquid storage tray 1300 by the liquid supply nozzle.

[0076] It can be seen that by providing the liquid supply mechanism 131 , it is possible to automatically supply cleaning liquid to the liquid storage pan 1300 , which is beneficial to improving the cleaning efficiency of the discharge part 13 .

[0077] As an embodiment, the second carrier 1301 includes a lifting member 1303 and a plurality of supporting members 1304. The lifting member 1303 can be lifted and lowered at the bottom of the liquid storage tray 1300. The driving end of the fourth driving member 1302 is connected to the lifting member 1303. The first ends of the plurality of supporting members 1304 are installed on the lifting member 1303. The second ends of the plurality of supporting members 1304 are configured to synchronously cooperate to receive and carry the polished wafers placed by the polishing head mechanism. The plurality of supporting members 1304 are installed on the lifting member 1303 and penetrate into the liquid storage tray 1300. The joints between the plurality of supporting members 1304 and the liquid storage tray 1300 are sealed.

[0078] Specifically, the support member 1304 is a support rod vertically mounted on the lifting member 1303, the top of the support rod is a tapered structure with a small top and a large bottom, the bottom of the support rod is fixedly connected to the lifting member 1303, the support rod passes through the liquid storage tray 1300 and can be raised and lowered relative to the liquid storage tray 1300 driven by the lifting member 1303. While supporting the polished wafer, the contact area with the polished wafer can be reduced, and the pressure of the support member 1304 on the polished wafer can be reduced.

[0079] It can be seen that the polished wafers placed by the polishing head mechanism are received and carried by a plurality of support members 1304, and then the plurality of support members 1304 are driven to rise and fall by the lifting member 1303, providing a second support member 1301 with a simple structure, low cost and low friction to the polished wafers.

[0080] As an embodiment, a plurality of circumferentially arranged second limiting members 1305 are provided in the liquid storage tray 1300. The second limiting members 1305 are located at the periphery of the second carrier 1301. The second limiting members 1305 are configured to limit the polished wafer in the circumferential direction.

[0081] Specifically, the second limit member 1305 is a limit rod vertically fixed at the bottom of the liquid storage tray 1300, and the top of the limit rod is a conical structure with a small upper part and a large lower part. After the support member 1304 receives the polished wafer at a high position, the lifting member 1303 drives the support member 1304 to descend. During the descent, the polished wafer enters the limit area surrounded by several second limit members 1305, thereby guiding and adjusting the polished wafer.

[0082] It can be seen that by arranging the second limiting member 1305 in the liquid storage tray 1300, the polished wafer is limited in the circumferential direction, thereby ensuring the position accuracy of the polished wafer and facilitating the subsequent unloading robot to pick up the polished wafer.

[0083] See also Figure 1 and Figure 2 As shown, the working principle of the wafer transfer mechanism provided in the embodiment of the present application is:

[0084] In the initial state, the cleaning part 14 is located at the loading and unloading station, the loading part 12 is located at the loading area, and the unloading part 13 is located at the unloading area. The polishing head mechanism located at the loading and unloading station can be cleaned as needed:

[0085] The loading part 12 receives and carries the wafer to be polished in the loading area, and the first driving member drives the rotating member 11 to rotate by a preset angle, so that the loading part 12 moves to the loading and unloading station, and the polishing head mechanism picks up the wafer to be polished on the loading part 12 and polishes the wafer to be polished;

[0086] After the polishing head mechanism finishes polishing the wafer to be polished, the first driving member drives the rotating member 11 to rotate again by a preset angle, so that the unloading portion 13 moves to the loading and unloading station, and the unloading portion 13 receives the polished wafer placed by the polishing head mechanism;

[0087] After the unloading part 13 receives the polished wafer placed by the polishing head mechanism, the first driving member drives the rotating member 11 to rotate by a preset angle, driving the cleaning part 14 to move to the loading and unloading station, thus completing one transfer of the wafer.

[0088] The wafer transfer mechanism provided in the embodiment of the present application has the following advantages:

[0089] 1) The loading part and the unloading part are integrated on the rotating part, and the rotating part is driven to rotate by the first driving part, and the loading part and the unloading part are alternately moved to the loading and unloading stations, thereby realizing the automatic transfer of the wafers to be polished and the polished wafers, which can greatly shorten the transfer journey of the wafers and improve the transfer efficiency of the wafers.

[0090] 2) By setting up a cleaning unit, the polishing head mechanism at the loading and unloading stations can be cleaned, ensuring the cleanliness of the polishing head, which is beneficial to improving the polishing quality of the wafer.

[0091] 3) It is possible to transfer two wafers at the same time, further improving the wafer transfer efficiency.

[0092] 4) The loading part is provided with an adsorption assembly, which enables the wafer to be polished to be adsorbed and fixed on the first carrier, thereby preventing the wafer to be polished from shifting when following the descent and transportation of the first carrier.

[0093] 5) The unloading part has a cleaning function, and can clean the polished wafers received while receiving the polished wafers.

[0094] The above embodiments are only to illustrate the basic principles and characteristics of the present application. The present application is not limited by the above examples. Without departing from the spirit and scope of the present application, the present application may be subject to various changes and modifications, which are within the scope of the present application to be protected. The scope of protection claimed in the present application is defined by the attached claims and their equivalents.

Claims

1. A wafer transfer mechanism, characterized in that: The wafer transfer mechanism comprises a rotating member and a first driving member, wherein: The rotating member is rotatably arranged on the side of the loading and unloading station, and the driving end of the first driving member is connected to the rotating member; A loading part and a discharging part are arranged at intervals along the circumferential direction on the rotating member, the loading part is configured to receive and carry the wafers to be polished, and the discharging part is configured to receive and carry the polished wafers, and the first driving member is configured to drive the rotating member to rotate so that the loading part and the discharging part are alternately moved to the loading and unloading stations, and a polishing head mechanism is arranged above the loading and unloading stations; The wafer to be polished carried by the loading part located at the loading and unloading station is picked up by the polishing head mechanism; The unloading part located at the loading and unloading station receives the polished wafer placed by the polishing head mechanism.

2. The wafer transfer mechanism according to claim 1, characterized in that: The rotating member is also provided with a cleaning portion located between the loading portion and the unloading portion along the circumferential direction, and the first driving member is configured to drive the rotating member to rotate so that the loading portion, the cleaning portion and the unloading portion are alternately moved to the loading and unloading stations; The cleaning unit is configured to clean the polishing head mechanism located at the loading and unloading station.

3. The wafer transfer mechanism according to claim 2, characterized in that: The cleaning part includes a first base and at least one cleaning brush, the first base is mounted on the rotating member, the polishing head mechanism includes at least one polishing head, each cleaning brush corresponds to a polishing head, and the polishing head can be raised and lowered relative to the loading and unloading station, wherein: The cleaning brush is rotatably mounted on the first base, the cleaning portion further comprises a second driving member, a fixed end of the second driving member is mounted on the first base, a driving end of the second driving member is connected to the cleaning brush, the second driving member is configured to drive the cleaning brush to rotate, the polishing head to be cleaned is lowered to a preset height to contact the corresponding cleaning brush, and the second driving member drives the cleaning brush to rotate to clean the corresponding polishing head to be cleaned; Alternatively, the cleaning brush is fixed on the first base, the polishing head to be cleaned descends to a preset height and contacts the cleaning brush, and the polishing head to be cleaned rotates to perform cleaning.

4. The wafer transfer mechanism according to claim 1, characterized in that: The loading part includes at least one loading mechanism, and the loading mechanism includes a second base, a first bearing member and a third driving member, the second base is mounted on the rotating member, a first limiting member for limiting the position of the wafer to be polished in the circumferential direction is arranged on the second base, the first limiting member is arranged on the periphery of the first bearing member, the first bearing member is liftably mounted on the second base, a driving end of the third driving member is connected to the first bearing member, and the third driving member is configured to drive the first bearing member to be lifted and lowered; The third driving member drives the first carrier to rise to a high position so as to receive the wafer to be polished through the first carrier; The third driving member drives the first supporting member to descend to a low position, so that the wafer to be polished on the first supporting member automatically falls onto the first limiting member.

5. The wafer transfer mechanism according to claim 4, characterized in that: The first carrier is also provided with an adsorption component, and the adsorption component is configured to adsorb and fix the wafer to be polished received by the first carrier on the first carrier; The first limiting member is formed with an arc-shaped limiting groove in a direction close to the first supporting member, and the wafer to be polished is limited by the arc-shaped limiting groove after falling onto the first limiting member.

6. The wafer transfer mechanism according to claim 5, characterized in that: The adsorption assembly includes a plurality of adsorption parts arranged at intervals on the first carrier, each of the adsorption parts is provided with at least one adsorption hole, an adsorption cavity connected to all the adsorption holes is provided in the first carrier, the adsorption cavity is connected to an exhaust device, and the exhaust device sucks the air in the adsorption cavity to adsorb and fix the wafer to be polished on the plurality of adsorption parts through the adsorption holes.

7. The wafer transfer mechanism according to claim 1, characterized in that: The unloading part includes at least one unloading mechanism, which includes a liquid storage tray, a second carrier and a fourth driving member. The liquid storage tray is installed on the rotating member, and the liquid storage tray contains a cleaning liquid for cleaning the polished wafer. The second carrier is installed in the liquid storage tray in a liftable manner. The driving end of the fourth driving member is connected to the second carrier, and the fourth driving member is configured to drive the second carrier to move up and down. The fourth driving member drives the second carrier to rise to a high position so as to receive the polished wafer placed by the polishing head mechanism through the second carrier; The fourth driving member drives the second carrier to descend to a lower position, so that the polished wafer on the second carrier falls into the cleaning liquid in the liquid storage tray.

8. The wafer transfer mechanism according to claim 7, characterized in that: The discharge part further includes a liquid supply mechanism, which is disposed on the peripheral side of the liquid storage pan and is configured to automatically supply the cleaning liquid into the liquid storage pan.

9. The wafer transfer mechanism according to claim 7, characterized in that: The second supporting member includes a lifting member and a plurality of supporting members. The lifting member is liftably arranged at the bottom of the liquid storage tray. The driving end of the fourth driving member is connected to the lifting member. The plurality of supporting members are configured to receive and carry the polished wafers placed by the polishing head mechanism. The plurality of supporting members are installed on the lifting member and penetrate into the liquid storage tray. The joints between the plurality of supporting members and the liquid storage tray are sealed.

10. The wafer transfer mechanism according to claim 7, characterized in that: A plurality of circumferentially arranged second limiting members are provided in the liquid storage tray. The second limiting members are located at the periphery of the second supporting member. The second limiting members are configured to limit the polished wafer in the circumferential direction.

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