Material shortage detection mechanism, feeding mechanism and wafer polishing machine

Abstract

The utility model discloses a material shortage detection mechanism, a feeding mechanism and a wafer polisher, the material shortage detection mechanism comprises a base, a bearing part and a first detection assembly, the bearing part is installed on the base, and the bearing part is used for bearing a wafer box containing wafers; the first detection assembly is arranged on one side of the bearing part in a lifting mode, the detection end of the first detection assembly faces the opening side of a wafer box with wafers on the bearing part, and the first detection assembly is used for scanning all grooves in the wafer box on the bearing part from the opening side of the wafer box in the lifting process. Therefore, the material existence condition in all grooves of the wafer box can be detected. According to the material shortage detection mechanism, all the grooves of the wafer box are scanned through the first detection assembly, whether material shortage exists in all the grooves of the wafer box or not is automatically detected at a time, according to the detection result, the carrying mechanism can only carry out feeding operation on the grooves containing wafers in the wafer box, the pause time is shortened, and the detection efficiency is improved. And the feeding efficiency of the wafer is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of wafer polishing equipment, and in particular relates to a material shortage detection mechanism, a material loading mechanism and a wafer polishing machine. Background Art

[0002] During the wafer production process, the wafer usually needs to be polished by polishing equipment to remove the unevenness and contaminants on the wafer surface to achieve high-quality smoothness.

[0003] Wafer boxes are used to place and store wafers, and there are multiple grooves inside the wafer box for supporting wafers. The loading mechanism of current wafer polishing equipment usually uses a dedicated wafer handling robot to take out the wafers in the wafer box one by one and then transport them to the loading station; however, the existing method of detecting material shortage is to install sensors on the wafer handling robot, and perform material detection on the corresponding grooves before picking up the wafers in the wafer box. This detection method has low detection efficiency, and the handling robot needs to stop frequently, which affects the loading efficiency of the wafer. Utility Model Content

[0004] The purpose of the present application is to provide a material shortage detection mechanism to solve the problem that the existing material shortage detection mechanism has low detection efficiency and thus affects the loading efficiency; in addition, another purpose of the present application is to provide a loading mechanism including the material shortage detection mechanism and a wafer polishing machine including the loading mechanism.

[0005] To achieve this goal, this application adopts the following technical solutions:

[0006] In a first aspect, the present application provides a material shortage detection mechanism, which includes a base, a carrier and a first detection component, wherein:

[0007] The carrier is mounted on the base, and the carrier is configured to carry a wafer box containing wafers;

[0008] The first detection component is liftably disposed on one side of the carrier and the detection end of the first detection component is toward the opening side of the wafer box on the carrier on which the wafers are mounted. The first detection component is configured to scan all the grooves in the wafer box on the carrier from the opening side of the wafer box during the lifting process to detect the presence of material in all the grooves of the wafer box.

[0009] The first detection component of the material shortage detection mechanism proposed in the present application scans all the grooves of the wafer box through the opening side of the wafer box, thereby realizing a single-time automatic detection of whether there is a shortage of material in all the grooves of the wafer box. According to the detection result, the transport mechanism can only perform loading operations on the grooves containing wafers in the wafer box, thereby reducing the pause time and improving the loading efficiency of the wafers.

[0010] Optionally, the first detection component includes a first driving member and a detection member, the driving end of the first driving member is connected to the detection member, the first driving member is configured to drive the detection member to rise and fall, and the detection member is configured to scan all grooves in the wafer box on the carrier during the lifting process.

[0011] Through the cooperation of the first driving member and the detection member, automatic scanning and detection of all grooves in the wafer box on the carrier can be completed in a single movement, and the scanning efficiency is high.

[0012] Optionally, the first driving member includes a motor, a transmission assembly, a first lifting member and a connecting member. The driving end of the motor is connected to the first lifting member through the transmission assembly. The first end of the connecting member is connected to the first lifting member. The detection member is installed on the second end of the connecting member. When the motor drives the first lifting member to rise and fall through the transmission assembly, the connecting member and the detection member also rise and fall synchronously.

[0013] Through the cooperation of the motor, the transmission assembly, the first lifting member and the connecting member, the driving detection member is lifted and lowered, providing a first driving member with stable and reliable operation.

[0014] Optionally, the transmission assembly includes a transmission screw and a screw nut, the driving end of the motor is connected to the transmission screw, the motor is configured to drive the transmission screw to rotate along its own axis, the screw nut is mounted on the transmission screw, and the first lifting member is connected to the transmission screw through the screw nut.

[0015] Through the cooperation of the transmission lead screw and the lead screw nut, the rotational motion of the motor is converted into the lifting motion of the first lifting member, and the transmission accuracy is high and the stability and reliability are good.

[0016] Optionally, the supporting member is fixed on the base, and a guide member extending toward the connecting member is provided on the supporting member, the first end of the guide member is fixedly connected to the lower end of the supporting member, and a guide hole is provided at the second end of the guide member, and the connecting member passes through the guide hole and rises and falls along the guide hole.

[0017] By setting a guide member and fixing the first end of the guide member on the supporting member, the connecting member passes through the guide hole at the second end of the guide member, thereby achieving lifting and lowering guidance of the connecting member, thereby improving the stability of the detection member during lifting and lowering, which is beneficial to improving the scanning accuracy of the detection member.

[0018] Optionally, a positioning component is provided on the carrying surface of the carrier, and the positioning component is configured to limit the position of the wafer box on the carrier;

[0019] The positioning assembly includes a plurality of positioning pins fixed on the carrying surface of the carrier, and a plurality of positioning holes are opened at the bottom of the wafer box containing the wafers, and each positioning pin corresponds to a positioning hole. After the wafer box containing the wafers is placed on the carrier, the plurality of positioning pins are inserted into the corresponding positioning holes to limit the wafer box containing the wafers on the carrying surface of the carrier.

[0020] Through the cooperation of a plurality of positioning pins and a plurality of positioning holes, the wafer box is limited on the carrier, providing a positioning component with a simple structure, easy implementation and low cost.

[0021] Optionally, a second detection component is disposed on the carrying surface of the carrier, and the second detection component is configured to detect whether the wafer box containing wafers is in place on the carrying surface of the carrier.

[0022] By setting up the second detection component, it is possible to detect whether the wafer box containing wafers on the carrying surface is placed in place, so as to control the operation of the first detection component according to the detection result of the second detection component.

[0023] Optionally, the second detection assembly includes a second lifting member, an elastic reset member and a sensing member, the elastic reset member is installed below the bearing member through a mounting seat, the second lifting member passes through the mounting seat and is slidably installed on the bearing member up and down, a blocking portion is provided on the second lifting member, the blocking portion abuts against the elastic reset member in the mounting seat, the elastic reset member is configured to provide an upward elastic force to the second lifting member via the blocking portion, and the sensing member is installed below the bearing member and is located on the side of the lifting path of the second lifting member;

[0024] After the wafer box containing wafers is placed on the carrying surface, it is pressed against the second lifting member to drive the second lifting member to move downward to the sensing area of ​​the sensing member. The sensing member senses the second lifting member and confirms that a wafer box is placed on the carrying surface of the carrying member.

[0025] By arranging a second lifting member on the carrier so that it can be raised and lowered, and by cooperating with the second lifting member and the sensing member, automatic detection of whether the wafer box on the carrier surface is placed in place is achieved; automatic resetting of the second lifting member is achieved by the elastic resetting member, providing a second detection component with simple structure, low cost and accurate detection.

[0026] In the second aspect, the present application also proposes a feeding mechanism, which includes a conveying mechanism and the above-mentioned material shortage detection mechanism:

[0027] The transport mechanism is arranged on one side of the material shortage detection mechanism, and is configured to sequentially pick up wafers from the grooves of the wafer box containing the wafers and transport the picked-up wafers to the loading and unloading stations of the wafer polishing machine;

[0028] The material shortage detection mechanism is configured to detect the presence of material in all grooves of the wafer box after the wafer box containing the wafers is placed in place and before the transport mechanism picks up the first wafer.

[0029] The loading mechanism proposed in the present application realizes automatic loading of wafers through the cooperation of the conveying mechanism and the material shortage detection mechanism; at the same time, the material shortage detection mechanism can complete the automatic detection of whether there is material shortage in all grooves of the wafer box at a single time. According to the detection result, the conveying mechanism can only perform loading operations on the grooves containing wafers in the wafer box, thereby reducing the pause time and improving the loading efficiency of the wafers.

[0030] In a third aspect, the present application further proposes a wafer polishing machine, which includes the above-mentioned loading mechanism, unloading mechanism, polishing platform, turntable, polishing head mechanism and polishing disc mechanism, wherein:

[0031] The polishing platform is provided with a loading and unloading station and at least one polishing station, and each polishing station is provided with a set of polishing disc mechanisms;

[0032] The loading mechanism is configured to move the wafer to be polished to the loading and unloading station, and the unloading mechanism is configured to unload the polished wafer at the loading and unloading station;

[0033] The turntable is rotatably arranged above the polishing platform, at least two groups of polishing head mechanisms are evenly arranged along the circumference and installed on the turntable, and the polishing head mechanisms can be raised and lowered relative to the turntable;

[0034] The turntable drives at least two groups of polishing head mechanisms to rotate synchronously at a preset angle, so that one group of the polishing head mechanisms is opposite to the loading and unloading station to pick up the wafers to be polished on the loading and unloading station or place the polished wafers on the loading and unloading station, while the other polishing head mechanisms and the polishing plate mechanisms cooperate with each other to polish the wafers to be polished picked up by the other polishing head mechanisms.

[0035] The wafer polishing machine proposed in the present application realizes automatic loading, polishing and unloading of wafers through the cooperation of a loading mechanism, an unloading mechanism, a polishing platform, a turntable, a polishing head mechanism and a polishing disc mechanism, and has high polishing efficiency; at the same time, the loading mechanism has a material shortage detection function, which improves the loading efficiency of the wafer and is beneficial to improving the polishing efficiency of the wafer polishing machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 is a schematic diagram of the three-dimensional structure of the material shortage detection mechanism provided in an embodiment of the present application;

[0037] Figure 2 It is another three-dimensional structural schematic diagram of the material shortage detection mechanism provided in the embodiment of the present application;

[0038] Figure 3is a side view schematic diagram of a material shortage detection mechanism provided in an embodiment of the present application;

[0039] Figure 4 It is a schematic diagram of the three-dimensional structure of the feeding mechanism provided in the embodiment of the present application;

[0040] Figure 5 It is a top view schematic diagram of the wafer polishing machine provided in an embodiment of the present application.

[0041] Figures 1 to 5 The following reference numerals are included:

[0042] Base 1;

[0043] Carrying member 2, positioning block 20;

[0044] The first detection component 3, the first driving member 30, the detection member 31, the motor 300, the transmission component 301, the transmission screw 3010, the screw nut 3011, the first lifting member 302, the connecting member 303, and the mounting bracket 304;

[0045] Guide assembly 4, guide rod 40, guide sleeve 41;

[0046] Guide member 5, guide hole 50;

[0047] Positioning assembly 6, positioning pin 60;

[0048] A second detection assembly 7, a second lifting member 70, a sensing member 71, and a mounting seat 72;

[0049] Loading mechanism 80 , conveying mechanism 81 , material shortage detecting mechanism 82 , unloading mechanism 83 , polishing platform 84 , turntable 85 , polishing head mechanism 86 , polishing disc mechanism 87 , loading and unloading stations 88 , polishing station 89 . DETAILED DESCRIPTION

[0050] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0051] In the production process of wafers, it is usually necessary to polish the wafers with polishing equipment to remove the unevenness and contaminants on the surface of the wafers and make them smooth with high quality. Wafer boxes are used to place and store wafers, and there are multiple grooves inside the wafer boxes for supporting wafers. The loading mechanism of current wafer polishing equipment usually uses a dedicated wafer handling robot to take out the wafers in the wafer box one by one and then transport them to the loading station; however, the existing method of detecting material shortage is to install sensors on the wafer handling robot, and before picking up the wafers in the wafer box, the corresponding grooves are checked for material. This detection method has low detection efficiency, and the handling robot needs to stop frequently, which affects the loading efficiency of the wafer.

[0052] Therefore, this application proposes a material shortage detection mechanism, please refer to Figure 1 As shown, a material shortage detection mechanism provided in an embodiment of the present application includes a base 1, a carrier 2 and a first detection component 3, wherein: the carrier 2 is installed on the base 1, and the carrier 2 is configured to carry a wafer box containing wafers; the first detection component 3 is liftably arranged on one side of the carrier 2 and the detection end of the first detection component 3 is facing the opening side of the wafer box containing wafers on the carrier 2, and the first detection component 3 is configured to scan all grooves in the wafer box on the carrier 2 from the opening side of the wafer box during the lifting process to detect the presence of material in all the grooves of the wafer box.

[0053] It can be seen that the first detection component 3 of the material shortage detection mechanism proposed in the present application scans all the grooves of the wafer box through the opening side of the wafer box, thereby realizing a single-time automatic detection of whether there is a shortage of material in all the grooves of the wafer box. According to the detection result, the conveying mechanism can only perform loading operations on the grooves containing wafers in the wafer box, thereby reducing the pause time and improving the loading efficiency of the wafers.

[0054] As an embodiment, the first detection component 3 includes a first driving member 30 and a detection member 31, the driving end of the first driving member 30 is connected to the detection member 31, the first driving member 30 is configured to drive the detection member 31 to rise and fall, and the detection member 31 is configured to scan all grooves in the wafer box on the carrier 2 during a single lifting process.

[0055] It can be seen that, through the cooperation between the first driving member 30 and the detecting member 31 , automatic scanning and detection of all grooves in the wafer box on the carrier 2 can be completed in a single lift, and the scanning efficiency is high.

[0056] See also Figure 1 and Figure 2 As shown, as an embodiment, the first driving member 30 includes a motor 300, a transmission assembly 301, a first lifting member 302 and a connecting member 303. The driving end of the motor 300 is connected to the first lifting member 302 through the transmission assembly 301. The first end of the connecting member 303 is connected to the first lifting member 302. The detection member 31 is installed on the second end of the connecting member 303. When the motor 300 drives the first lifting member 302 to rise and fall through the transmission assembly 301, the connecting member 303 and the detection member 31 are also lifted and fallen synchronously.

[0057] It can be seen that, through the cooperation of the motor 300, the transmission assembly 301, the first lifting member 302 and the connecting member 303, the driving detection member 31 is lifted and lowered, providing a first driving member 30 with stable and reliable operation.

[0058] As an embodiment, the transmission assembly 301 includes a transmission screw 3010 and a screw nut 3011. The driving end of the motor 300 is connected to the transmission screw 3010. The motor 300 is configured to drive the transmission screw 3010 to rotate along its own axis. The screw nut 3011 is mounted on the transmission screw 3010. The first lifting member 302 is connected to the transmission screw through the screw nut 3011.

[0059] Specifically, the motor 300 is arranged below the base 1, and the fixed end of the motor 300 is fixed on the mounting frame 304. A guide assembly 4 is arranged between the mounting frame 304 and the base 1. The guide assembly 4 includes two guide rods 40 on both sides of the symmetrically arranged transmission screw 3010. The lower end of the guide rod 40 is fixed on the mounting frame 304, and the upper end of the guide rod 40 is fixed on the base 1. Two guide sleeves 41 are arranged on the first lifting member 302, and each guide rod 40 passes through a guide sleeve 41 to improve the stability of the lifting of the first lifting member 302.

[0060] It can be seen that, through the cooperation of the transmission screw 3010 and the screw nut 3011, the rotational motion of the motor 300 is converted into the lifting motion of the first lifting member 302, and the transmission accuracy is high and the stability and reliability are good.

[0061] See also Figure 2 and Figure 3 As shown, as an embodiment, the supporting member 2 is fixed on the base 1, and a guide member 5 extending toward the connecting member 303 is provided on the supporting member 2, the first end of the guide member 5 is fixedly connected to the lower end of the supporting member 2, and a guide hole 50 is provided at the second end of the guide member 5, and the connecting member 303 passes through the guide hole 50 and rises and falls along the guide hole 50.

[0062] It can be seen that by setting the guide member 5 and fixing the first end of the guide member 5 on the carrier 2, the connecting member 303 passes through the guide hole 50 at the second end of the guide member 5, thereby realizing the lifting and lowering guidance of the connecting member 303, thereby improving the stability of the detection member 31 during lifting and lowering, which is beneficial to improving the scanning accuracy of the detection member.

[0063] See also Figure 1 and Figure 2 As shown, as an embodiment, a positioning assembly 6 is provided on the bearing surface of the carrier 2, and the positioning assembly 6 is configured to limit the position of the wafer box on the carrier 2; the positioning assembly 6 includes a plurality of positioning pins 60 fixed on the bearing surface of the carrier 2, and a plurality of positioning holes are provided at the bottom of the wafer box containing wafers, and each positioning pin 60 corresponds to a positioning hole. After the wafer box containing wafers is placed on the carrier 2, a plurality of positioning pins 60 are inserted into the corresponding positioning holes to limit the wafer box containing wafers on the bearing surface of the carrier 2.

[0064] Specifically, two positioning blocks 20 are spaced apart on one side of the carrying surface of the carrier 2 , and the wafer box is referenced and positioned by the two positioning blocks 20 when the wafer box is placed, so that the subsequent positioning assembly 6 can limit the position of the wafer box.

[0065] Specifically, three positioning pins 60 are provided, and the three positioning pins 60 are distributed in a triangular shape on the carrying surface of the carrier 2. Corresponding to the three positioning pins 60, three positioning holes are opened at the bottom of the wafer box. Of course, the positioning pins 60 can also be set to two or four, and the number of the positioning pins 60 is not limited here.

[0066] It can be seen that the cooperation of a plurality of positioning pins 60 and a plurality of positioning holes enables the wafer box to be limited on the carrier, and provides a positioning component 6 that is simple in structure, easy to implement, and low in cost.

[0067] See also Figure 1 and Figure 3 As shown, as an embodiment, a second detection component 7 is disposed on the carrying surface of the carrier 2 , and the second detection component 7 is configured to detect whether a wafer box containing wafers is in place on the carrying surface of the carrier 2 .

[0068] It can be seen that the second detection component 7 is provided to detect whether the wafer box containing wafers on the carrying surface is placed in place, so as to control the operation of the first detection component 3 according to the detection result of the second detection component 7.

[0069] As an embodiment, the second detection component 7 includes a second lifting member 70, an elastic reset member (not shown in the figure) and a sensing member 71. The elastic reset member is installed below the carrier 2 through a mounting seat 72. The second lifting member 70 passes through the mounting seat 72 and can be slid up and down on the carrier 2. A blocking portion is provided on the second lifting member 70, and the blocking portion abuts against the elastic reset member in the mounting seat 72. The elastic reset member is configured to provide an upward elastic force to the second lifting member 70 through the blocking portion. The sensing member 71 is installed below the carrier 2 and is located on the side of the lifting path of the second lifting member 70. After the wafer box containing wafers is placed on the carrying surface, it is pressed against the second lifting member 70 to drive the second lifting member 70 to move downward to the sensing area of ​​the sensing member 71. The sensing member 71 senses the second lifting member 70, which confirms that a wafer box is placed on the carrying surface of the carrier 2.

[0070] Specifically, the elastic reset element adopts a reset spring.

[0071] Specifically, the sensing element 71 is any one of a proximity switch and a micro switch.

[0072] It can be seen that the second lifting member 70 is liftably arranged on the carrier 2, and the cooperation between the second lifting member 70 and the sensing member 71 can realize automatic detection of whether the wafer box on the carrier surface is placed in place; the automatic resetting of the second lifting member 70 is realized by the elastic resetting member, providing a second detection component 7 with simple structure, low cost and accurate detection.

[0073] The material shortage detection mechanism provided in the embodiment of the present application has the following advantages:

[0074] 1) The first detection component 3 can automatically detect whether all the grooves of the wafer box are short of material at a time. According to the detection result, the handling mechanism can only perform the loading operation on the grooves containing wafers in the wafer box, thereby reducing the pause time and improving the loading efficiency of the wafers;

[0075] 2) The guide member 5 can guide the connecting member 303 during the lifting process, thereby ensuring the stability of the detection member 31 during the lifting process and improving the scanning accuracy of the detection member 31;

[0076] 3) The second detection component 7 can detect whether the wafer box containing wafers on the carrying surface is placed in place, so as to control the operation of the first detection component 3 according to the detection result of the second detection component 7.

[0077] Second, see Figure 1 , Figure 4 and Figure 5 As shown, the loading mechanism 80 provided in the embodiment of the present application includes a conveying mechanism 81 and the above-mentioned material shortage detection mechanism 82: the conveying mechanism 81 is arranged on one side of the material shortage detection mechanism 82, and the conveying mechanism 81 is configured to pick up wafers from the grooves of the wafer box containing wafers in sequence and convey the picked-up wafers to the loading and unloading station 88 of the wafer polishing machine; the material shortage detection mechanism 82 is configured to detect the presence of material in all the grooves of the wafer box after the wafer box containing wafers is placed in place and before the conveying mechanism 81 picks up the first wafer.

[0078] Specifically, the loading mechanism 80 includes two sets of material shortage detection mechanisms 82 arranged at intervals, and a conveying mechanism 81 is connected to the two sets of material shortage detection mechanisms 82 to alternately load the wafers in the wafer boxes of the carriers of the two sets of material shortage detection mechanisms 82, which is beneficial to improving the loading efficiency.

[0079] It can be seen that the loading mechanism 80 proposed in the present application realizes automatic loading of wafers through the cooperation of the conveying mechanism 81 and the material shortage detection mechanism 82; at the same time, the material shortage detection mechanism 82 can complete the automatic detection of whether there is material shortage in all the grooves of the wafer box at a single time. According to the detection result, the conveying mechanism 81 can only perform loading operations on the grooves containing wafers in the wafer box, thereby reducing the pause time and improving the loading efficiency of the wafer.

[0080] The specific loading process of the loading mechanism 80 proposed in the embodiment of the present application is as follows:

[0081] 1) placing a wafer box containing wafers on the carrier 2, and the second detection component 7 detects whether the wafer box containing wafers is placed in place;

[0082] 2) If the wafer box is placed in place, the first driving member 30 drives the detection member 31 to move up and down, and scans all the grooves in the wafer box on the carrier 2 to detect whether there is material in all the grooves of the wafer box;

[0083] 3) According to the detection result of the detection unit 31, the transport mechanism 81 picks up the wafers in the wafer box one by one and transports the picked-up wafers to the designated position.

[0084] It should be noted that after the transport mechanism 81 has taken all the wafers in the wafer box on one set of the material shortage detection mechanism 82 , it will continuously load the wafers in the wafer box on the other set of the material shortage detection mechanism 82 .

[0085] Third, see Figure 5 As shown, the embodiment of the present application also proposes a wafer polishing machine, which includes the above-mentioned loading mechanism 80, unloading mechanism 83, polishing platform 84, turntable 85, polishing head mechanism 86 and polishing disc mechanism 87, wherein: a loading and unloading station 88 and at least one polishing station 89 are arranged on the polishing platform 84, and each polishing station 89 is provided with a group of polishing disc mechanisms 87; the loading mechanism 80 is configured to move the wafer to be polished to the loading and unloading station 88, and the unloading mechanism 83 is configured to unload the wafer polished at the loading and unloading station 88; the turntable 85 is rotatably arranged on Above the polishing platform 84, at least two groups of polishing head mechanisms 86 are evenly arranged along the circumference and installed on the turntable 85, and the polishing head mechanisms 86 can be raised and lowered relative to the turntable 85; the turntable 85 drives at least two groups of polishing head mechanisms 86 to rotate synchronously at a preset angle, so that one group of the polishing head mechanisms 86 is opposite to the loading and unloading station 88 to pick up the wafers to be polished on the loading and unloading station 88 or place the polished wafers on the loading and unloading station 88, and at the same time, the other polishing head mechanisms 86 and the polishing disk mechanisms 87 cooperate with each other to polish the wafers to be polished picked up by the other polishing head mechanisms 86.

[0086] It can be seen that the wafer polishing machine proposed in the present application realizes automatic loading, polishing and unloading of wafers through the cooperation of the loading mechanism 80, the unloading mechanism 83, the polishing platform 84, the turntable 85, the polishing head mechanism 86 and the polishing disk mechanism 87, and has high polishing efficiency; at the same time, the loading mechanism 80 has a material shortage detection function, which improves the loading efficiency of the wafer, and is beneficial to improving the polishing efficiency of the wafer polishing machine.

[0087] The above embodiments are only to illustrate the basic principles and characteristics of the present application. The present application is not limited by the above examples. Without departing from the spirit and scope of the present application, the present application may be subject to various changes and modifications, which are within the scope of the present application to be protected. The scope of protection claimed in the present application is defined by the attached claims and their equivalents.

Claims

1. A material shortage detection mechanism, characterized in that: The material shortage detection mechanism comprises a base, a bearing member and a first detection component, wherein: The carrier is mounted on the base, and the carrier is configured to carry a wafer box containing wafers; The first detection component is liftably disposed on one side of the carrier and the detection end of the first detection component is toward the opening side of the wafer box on the carrier on which the wafers are mounted. The first detection component is configured to scan all the grooves in the wafer box on the carrier from the opening side of the wafer box during the lifting process to detect the presence of material in all the grooves of the wafer box.

2. The material shortage detection mechanism according to claim 1, characterized in that: The first detection component includes a first driving member and a detection member, wherein the driving end of the first driving member is connected to the detection member, the first driving member is configured to drive the detection member to rise and fall, and the detection member is configured to scan all grooves in the wafer box on the carrier during the lifting process.

3. The material shortage detection mechanism according to claim 2, characterized in that: The first driving member includes a motor, a transmission assembly, a first lifting member and a connecting member. The driving end of the motor is transmission-connected to the first lifting member via the transmission assembly. The first end of the connecting member is connected to the first lifting member. The detecting member is mounted on the second end of the connecting member. When the motor drives the first lifting member to rise and fall via the transmission assembly, the connecting member and the detecting member also rise and fall synchronously.

4. The material shortage detection mechanism according to claim 3, characterized in that: The transmission assembly includes a transmission screw and a screw nut. The driving end of the motor is connected to the transmission screw. The motor is configured to drive the transmission screw to rotate along its own axis. The screw nut is sleeved on the transmission screw. The first lifting member is connected to the transmission screw through the screw nut.

5. The material shortage detection mechanism according to claim 3, characterized in that: The supporting member is fixed on the base, and is provided with a guide member extending toward the connecting member. The first end of the guide member is fixedly connected to the lower end of the supporting member, and the second end of the guide member is provided with a guide hole, and the connecting member passes through the guide hole and rises and falls along the guide hole.

6. The material shortage detection mechanism according to claim 1, characterized in that: A positioning assembly is provided on the carrying surface of the carrier, and the positioning assembly is configured to limit the position of the wafer box on the carrier; The positioning assembly includes a plurality of positioning pins fixed on the carrying surface of the carrier, and a plurality of positioning holes are opened at the bottom of the wafer box containing the wafers, and each positioning pin corresponds to one positioning hole. After the wafer box containing the wafers is placed on the carrier, the plurality of positioning pins are inserted into the corresponding positioning holes to limit the wafer box containing the wafers on the carrying surface of the carrier.

7. The material shortage detection mechanism according to claim 1, characterized in that: A second detection component is disposed on the carrying surface of the carrier, and the second detection component is configured to detect whether the wafer box containing wafers is in place on the carrying surface of the carrier.

8. The material shortage detection mechanism according to claim 7, characterized in that: The second detection assembly includes a second lifting member, an elastic reset member and a sensing member, wherein the elastic reset member is installed below the bearing member through a mounting seat, the second lifting member passes through the mounting seat and is slidably installed on the bearing member up and down, a blocking portion is provided on the second lifting member, the blocking portion abuts against the elastic reset member in the mounting seat, the elastic reset member is configured to provide an upward elastic force to the second lifting member through the blocking portion, and the sensing member is installed below the bearing member and is located on the side of the lifting path of the second lifting member; After the wafer box containing wafers is placed on the carrying surface, it is pressed against the second lifting member to drive the second lifting member to move downward to the sensing area of ​​the sensing member. The sensing member senses the second lifting member and confirms that a wafer box is placed on the carrying surface of the carrier.

9. A feeding mechanism, characterized in that: The feeding mechanism comprises a conveying mechanism and a material shortage detection mechanism as claimed in any one of claims 1 to 8: The transport mechanism is arranged on one side of the material shortage detection mechanism, and is configured to sequentially pick up wafers from the grooves of the wafer box containing wafers and transport the picked-up wafers to the loading and unloading stations of the wafer polishing machine; The material shortage detection mechanism is configured to detect the presence of material in all grooves of the wafer box after the wafer box containing wafers is placed in place and before the transport mechanism picks up the first wafer.

10. A wafer polishing machine, characterized in that: The wafer polishing machine comprises a loading mechanism, an unloading mechanism, a polishing platform, a turntable, a polishing head mechanism and a polishing disc mechanism as claimed in claim 9, wherein: The polishing platform is provided with a loading and unloading station and at least one polishing station, and each polishing station is provided with a group of polishing disc mechanisms; The loading mechanism is configured to move the wafer to be polished to the loading and unloading station, and the unloading mechanism is configured to unload the polished wafer at the loading and unloading station; The turntable is rotatably arranged above the polishing platform, at least two groups of polishing head mechanisms are evenly arranged along the circumference and installed on the turntable, and the polishing head mechanisms can be raised and lowered relative to the turntable; The turntable drives at least two groups of the polishing head mechanisms to rotate synchronously at a preset angle, so that one group of the polishing head mechanisms is opposite to the loading and unloading station to pick up the wafers to be polished on the loading and unloading station or place the polished wafers on the loading and unloading station, and at the same time, the other polishing head mechanisms and the polishing disk mechanisms cooperate with each other to polish the wafers to be polished picked up by the other polishing head mechanisms.

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