Integrated sterilization device

Abstract

The utility model belongs to the technical field of semiconductors, and discloses an integrated sterilization device, which comprises a substrate, the front surface of the substrate is provided with a chip array, the chip array comprises a plurality of adjacent chip units, each chip unit comprises a plurality of chips, and the adjacent chip units have a common boundary; the module cover lens area comprises a peripheral module cover lens area and a central module cover lens area, the peripheral module cover lens area is arranged on the periphery of the array, the central module cover lens area is arranged on a boundary shared by the chip units, and the adjacent chip units share the central module cover lens area; the lens covers the lens area of the module cover; the heat dissipation part comprises a cooling head and a cooling water tank, the cooling head is arranged at the position, corresponding to the array, of the back face of the substrate, and the cooling water tank is communicated with the cooling head. By sharing the boundary between adjacent chip units, the area of the array occupied by the boundary is relatively reduced, and the radiation power of the ultraviolet light source is improved by relatively integrating more chips.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and specifically relates to an integrated sterilization device. Background Art

[0002] In the sterilization problem of industrial water, since industrial water has the characteristic of large water consumption, the sterilization effect can be improved by increasing the ultraviolet radiation power of the sterilization device. More UVC chips can be integrated into one light source to provide higher-power ultraviolet radiation, but the higher-power sterilization device also generates more heat, so the sterilization device has a greater heat dissipation requirement, and it is necessary to consider the heat dissipation problem of integrating multiple UVC chips in a unit area. Utility Model Content

[0003] The present application is proposed based on the above-mentioned requirements of the prior art. The technical problem to be solved by the present application is to provide an integrated sterilization device so that heat can be efficiently dissipated when the sterilization device emits high-power ultraviolet radiation.

[0004] In order to solve the above problems, the technical solution provided in the present application includes: an integrated sterilization device is provided, characterized in that it includes: a substrate, a chip array is arranged on the front side of the substrate, the chip array includes a plurality of adjacently arranged chip units, each chip unit includes a plurality of chips, and adjacent chip units have a common boundary; a module cover lens area, including a peripheral module cover lens area, arranged on the periphery of the chip array; and a central module cover lens area, arranged on the common boundary between the chip units in the chip array, and the central module cover lens area is shared between adjacent chip units; a lens, covering the module cover lens area to transmit the light emitted by the chip array; a heat dissipation part, including a cooling head and a cooling water tank, the cooling head is arranged on the back side of the substrate at a position corresponding to the chip array, and the cooling water tank is connected to the cooling head to circulate cooling liquid between the cooling head and the cooling water tank.

[0005] Preferably, the substrate comprises a copper substrate, the chip array is arranged in the middle of the substrate, and a plurality of positioning holes are arranged on the substrate, and the positioning holes are arranged outside the chip array; the heat dissipation part is positioned on the back of the substrate through the positioning holes and completely covers the area of ​​the chip array. The copper substrate has a stronger thermal conductivity, and the heat dissipation part completely covers the chip array to efficiently conduct the heat on the substrate.

[0006] Preferably, the chip array includes four chip units, the four chip units include a first chip unit and a second chip unit arranged adjacent to each other in a first row, and a third chip unit and a fourth chip unit arranged in a second row adjacent to the first row; wherein the first chip unit and the third chip unit are longitudinally aligned and arranged adjacent to each other, and the second chip unit and the fourth chip unit are longitudinally aligned and arranged adjacent to each other. The shared border saves half of the area of ​​the substrate occupied by the border between adjacent chip units, further reducing the area occupied by the border.

[0007] Preferably, the chip array includes 10 rows of chips arranged in parallel, and each row includes 10 chips connected in series. The parallel connection reduces the chip's demand for driving voltage, and if one chip is damaged, the UVC chips in other paths can still work normally, thereby improving reliability. The series connection reduces the number of wiring between chips.

[0008] Preferably, each chip includes at least one Zener diode, which can stabilize the voltage when the voltage exceeds the maximum operating voltage of the chip, thereby reducing the impact of voltage fluctuations on the chip.

[0009] Preferably, the integrated sterilization device further comprises a dam, which is arranged at the periphery of the peripheral module covering the lens area and is higher than the peripheral module covering the lens area to form a step for positioning and installing the lens. The positioning step can firmly engage the lens.

[0010] Preferably, the lens comprises a quartz glass lens or a sapphire glass lens, so that ultraviolet radiation can pass through the lens for sterilization.

[0011] Preferably, the connection between the cooling head and the cooling water tank includes: the cooling water tank outlet is connected to the cooling head water inlet, and the cooling head outlet is connected to the cooling water tank water inlet to form a pipeline for circulating coolant, and a water pump is provided on the pipeline. The water pump drives the coolant to circulate in the pipeline, and the heat in the sterilization device is transferred to the coolant by cooling the coolant.

[0012] Preferably, the heat dissipation unit includes a fan and a heat sink, wherein the heat sink is arranged adjacent to the fan, and the fan is connected to a power source, and heat is removed from the heat sink by air cooling.

[0013] Preferably, the integrated sterilization device includes a power supply, which includes a power input terminal, a first output terminal and a second output terminal; wherein the first output terminal includes a first positive electrode and a first negative electrode, and the first positive electrode and the first negative electrode are electrically connected to the heat dissipation part; the second output terminal includes a second positive electrode and a second negative electrode, and the second positive electrode and the second negative electrode are electrically connected to the chip array through the electrodes on the substrate. The power supply facilitates centralized control of the start and stop of the sterilization device.

[0014] Compared with the prior art, the utility model adopts an array with multiple chip units, and reduces the area occupied by the boundaries of the array by sharing the boundaries between adjacent chip units, thereby integrating more chips in an area of ​​the same area to increase the radiation power of the ultraviolet light source, thereby improving the sterilization effect of the ultraviolet LED light source. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of this specification or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of this specification. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0016] Figure 1 It is a front view of the integrated sterilization device in a specific embodiment of the utility model;

[0017] Figure 2 It is a cross-sectional view of an integrated sterilization device in a specific embodiment of the utility model;

[0018] Figure 3 It is a circuit diagram of a UVC chip in an integrated sterilization device in a specific embodiment of the utility model;

[0019] Figure 4 It is a cross-sectional view of a cooling head in an integrated sterilization device in a specific embodiment of the utility model;

[0020] Figure 5 It is a top view of the copper sheet of the cooling head in a specific embodiment of the utility model;

[0021] Figure 6 It is a schematic diagram of a cooling water tank and a fan in a specific implementation manner of the utility model;

[0022] Figure 7 It is a schematic diagram of a power supply in a specific implementation manner of the utility model.

[0023] Reference numerals:

[0024] 1. Substrate; 1-1. UVC chip; 1-2. Zener tube; 1-3. Substrate positioning hole; 1-4. Electrode; 2. Module cover lens area; 2-1. Peripheral module cover lens area; 2-2. Center module cover lens area; 2-3. Dam; 2-4. Lens; 3. Heat dissipation; 3-1. Cooling head; 3-1-1. Cooling head water inlet; 3-1-2. Cooling head water outlet; 3-1-3. Copper sheet; 3-1-4. Cooling head positioning hole; 3-2. Cooling water tank; 3-2-1. Cooling water tank outlet; 3-2-2. Cooling water tank inlet; 3-3. Fan; 3-4. Heat sink; 4. Power supply; 4-1. Power input terminal; 4-2. First positive electrode; 4-3. First negative electrode; 4-4. Second positive electrode; 4-5. Second negative electrode. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0026] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection or an integral connection, a mechanical connection, an electrical connection or a direct connection, or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0027] The terms “at the bottom”, “at the top”, and “at the top” as used throughout the text refer to relative positions of components of a device and have nothing to do with their orientation in space.

[0028] To facilitate understanding of the embodiments of the present application, further explanation will be given below with reference to specific embodiments in conjunction with the accompanying drawings. The embodiments do not constitute a limitation on the embodiments of the present application.

[0029] The sterilization effect of ultraviolet LED light sources can be improved by increasing the radiation power of ultraviolet light sources. There are many ways to increase the radiation power of ultraviolet light sources. One of the technical solutions is to integrate more UVC chips in a light source to provide higher-power ultraviolet radiation. In order to meet the sterilization requirements, the light source needs to integrate as many UVC chips as possible per unit area, which requires a reasonable UVC chip integration solution to be set up in the light source. In addition, the heat generation problem of integrating multiple UVC chips per unit area also needs to be considered. As the chip integration increases, the heat generation increases significantly, and the heat dissipation of the chip needs to be considered to ensure the normal operation of the light source.

[0030] For at least one of the above purposes, this embodiment provides an integrated sterilization device. The structure of the integrated sterilization device is as follows Figure 1 shown.

[0031] The integrated sterilization device comprises: a substrate 1 , a module cover lens area 2 and a heat dissipation part 3 .

[0032] The substrate 1 is used as a carrier for carrying the UVC chip. Figure 1-Figure 2 As shown, the substrate as a whole can be formed into a flat plate shape. In this specific embodiment, the thickness of the substrate 1 is preferably 0.5mm-2mm, and the material is preferably copper with good thermal conductivity. A plurality of UVC chips are arranged on the front of the substrate 1, and the UVC chips are arranged in an array. In order to improve the integration of the UVC chip, preferably, in this specific embodiment, the chip array formed by the UVC chip includes a plurality of adjacent UVC chip units, each UVC chip unit is provided with a plurality of UVC chips, and the adjacent UVC chip units share the same border, which can reduce the area ratio occupied by the border in the array UVC chip on the unit area of ​​the substrate, so that more UVC chips can be arranged in the area of ​​the same area.

[0033] Furthermore, if Figure 1 As shown, in this specific embodiment, the chip array includes four adjacent UVC chip units. The chip array can be formed into a rectangle and is not limited to being formed into other shapes. Each UVC chip unit is formed into a square.

[0034] Specifically, the chip array includes four chip units, and the four chip units include a first chip unit and a second chip unit that are adjacently arranged in a first row, and a third chip unit and a fourth chip unit that are arranged in a second row that is adjacent to the first row. The first chip unit and the third chip unit are longitudinally aligned and adjacently arranged, and the second chip unit and the fourth chip unit are longitudinally aligned and adjacently arranged. That is, each chip unit shares a border with its two adjacent chip units, saving half of the area of ​​the substrate occupied by the border between adjacent chip units, further reducing the area occupied by the border.

[0035] The UVC chips in the chip array are integrated on the substrate 1 in a 10-in-10 parallel manner, and the chips in adjacent UVC chip units are connected across the units. The circuit connection method of the UVC chip is as follows: Figure 3 As shown. Specifically, every 10 UVC chips are connected in series to form a group, forming a total of 10 groups of series circuits. The series connection method can reduce the number of wiring between chips, and only wiring is required between the chips that need to be connected in series, avoiding complex wiring. Then these 10 groups of series circuits are connected in parallel. The parallel connection method can reduce the chip's demand for driving voltage, and if one UVC chip is damaged, the UVC chips in other paths can still work normally, improving reliability.

[0036] Furthermore, each UVC chip 1-1 is connected to a Zener diode 1-2. When the circuit voltage exceeds the voltage required by the UVC chip under normal working conditions, the chip may be damaged. The Zener diode can stabilize the voltage when the voltage exceeds the maximum working voltage of the chip, reduce the impact of voltage fluctuations, and ensure the normal operation of the chip.

[0037] The module cover lens area 2 is provided on the substrate 1, and the module cover lens area 2 and the substrate 1 form a sealed space to provide a space for accommodating multiple UVC chips. The multiple UVC chips are isolated from the outside world through the sealed space, thereby protecting the circuit structure including the multiple UVC chips from being corroded by external impurities and causing a decrease in circuit performance. The multiple UVC chips are powered on to generate ultraviolet radiation, which passes through the lens to perform sterilization.

[0038] The module cover lens area 2 includes a peripheral module cover lens area 2-1 and a central module cover lens area 2-2. The peripheral module cover lens area is arranged at the periphery of the chip array. The peripheral module cover lens area 2-1 vertically extends along the substrate away from the substrate to form a rectangular space with an opening. The rectangular space surrounds the chip array formed by the UVC chip 1-1. A lens 2-4 is arranged on the peripheral module cover lens area 2-1. Further, the lens 2-4 is preferably a quartz glass or sapphire lens for penetrating the ultraviolet radiation generated by the UVC chip.

[0039] The central module cover lens area 2-2 is arranged on a common boundary between adjacent chip units. The central module cover lens area 2-2 extends vertically along the substrate 1 in a direction away from the substrate, and the extension size of the central module cover lens area 2-2 is equal to the extension size of the peripheral module cover lens area 2-1. In this specific embodiment, the extension size of the peripheral module cover lens area 2-1 and the central module cover lens area 2-2 is preferably 0.3 mm.

[0040] The central module cover lens area 2-2 is shared between adjacent chip units, and the central module cover lens area 2-2 reduces the area of ​​the substrate occupied by the boundaries between adjacent chip units, so as to reduce the boundary area as much as possible on the substrate 1 with limited size, and provide relatively more area for setting the UVC chip 1-1, so as to encapsulate as many UVC chips as possible, forming a more integrated sterilization device, and further improving the ultraviolet radiation intensity of the sterilization device.

[0041] The lens 2 - 4 has good structural strength and sealing properties under the joint support of the peripheral module cover lens area 2 - 1 and the central module cover lens area 2 - 2 .

[0042] A dam 2-3 is provided on the periphery of the peripheral module cover lens area 2-1, and the dam extends vertically along the substrate 1 in a direction away from the substrate. The extension dimension of the dam 2-3 in this direction is higher than the extension dimension of the peripheral module cover lens area 2-1 in this direction, so as to form a positioning step between the dam 2-3 and the peripheral module cover lens area 2-1, and the height of the positioning step in the vertical direction is adapted to the thickness of the lens 2-4, that is, the upper surface of the lens 2-4 is flush with the upper end surface of the dam 2-3, and the positioning step can firmly engage the lens 2-4. Furthermore, the positioning step and the lens are bonded by inorganic adhesive to form a sealed space to protect the UVC chip 1-1 on the substrate 1 from erosion by external impurities.

[0043] In this specific embodiment, the dimension of the dam 2 - 3 vertically extending away from the substrate 1 is preferably 0.5 mm.

[0044] Furthermore, the material of the peripheral module cover lens area 2-1 is not specifically limited in this specific embodiment, and can be stainless steel, or quartz glass or sapphire lens with good light transmittance, etc., and is not limited to the use of other materials with good thermal conductivity.

[0045] In this specific embodiment, the sterilization device is used for sterilizing industrial water. Since industrial water has the characteristic of large water consumption, in order to meet the sterilization requirements, more UVC chips need to be integrated in the substrate per unit area. As the chip integration increases, the heat generation increases significantly, and the heat dissipation of the chip needs to be considered to ensure the normal operation of the light source.

[0046] Therefore, the back of the substrate 1 is connected to a heat dissipation unit 3 for conducting a large amount of heat generated when the UVC chip 1-1 emits ultraviolet radiation. When these UVC chips generate ultraviolet radiation and generate a large amount of heat, the heat is conducted from the substrate 1 to the heat dissipation unit 3 by heat conduction. Therefore, the material of the substrate 1 is preferably copper with a good thermal conductivity. The thermal conductivity of copper is large, that is, the thermal conductivity of the substrate is stronger, and the heat on the substrate can be efficiently conducted away, preventing heat accumulation from affecting the working performance of the UVC chip set on the substrate to emit ultraviolet radiation.

[0047] The heat dissipation part 3 includes: a cooling head 3-1, a cooling water tank 3-2, and a fan 3-3. Since there is a gap between the heat dissipation part 3 and the substrate 1, the gap is filled with air, which increases the resistance of heat transfer between the two. Therefore, a thermal conductive silicone grease is arranged between the heat dissipation part 3 and the substrate 1. The thermal conductive silicone grease has a high thermal conductivity and can efficiently conduct the heat in the substrate to the heat dissipation part, thereby preventing the heat from accumulating in the substrate and affecting the performance or life of the UVC chip.

[0048] Since the sterilization device in this specific embodiment integrates more UVC chips, it can generate higher-power ultraviolet radiation, and accordingly the sterilization device generates more heat. The cooling head 3-1 is arranged on the back of the substrate 1, and the cooling head 3-1 is connected to the cooling water tank 3-2 to form a flow pipeline for the coolant. A water pump is arranged on the coolant pipeline to drive the coolant to circulate in the cooling head 3-1, so as to transfer the heat in the sterilization device to the coolant.

[0049] Specifically, the cooling head 3-1 is as follows Figure 4-Figure 5 As shown, the cooling head 3-1 includes: a cooling head water inlet 3-1-1, a cooling head water outlet 3-1-2, a copper sheet 3-1-3 and a cooling head positioning hole 3-1-4.

[0050] The cooling head 3-1 is arranged on the copper sheet 3-1-3, and the copper sheet is adapted to the size of the substrate 1. The cooling head is not only arranged at the corresponding position of the chip array, but also arranged around the chip array, that is, the area where the cooling head is distributed completely covers the area where the chip array is distributed on the substrate.

[0051] The cooling head positioning hole 3-1-4 is aligned with the substrate positioning hole 1-3, and the substrate positioning hole 1-3 vertically penetrates the substrate 1. Preferably, the bolt passes through the positioning hole and cooperates with the nut to lock the substrate and the heat dissipation part 3 together, or the copper sheet 3-1-3 and the frame of the substrate 1 can be locked together by a locking bar.

[0052] The cooling water tank 3-2 includes: a cooling water tank outlet 3-2-1 and a cooling water tank inlet 3-2-2.

[0053] The cooling water tank 3-2 stores coolant, which is driven by the water pump to flow out of the cooling water tank outlet 3-2-1, flow into the cooling head inlet 3-1-1, flow out of the cooling head outlet 3-1-2, and flow into the cooling water tank inlet 3-2-2, completing a cycle of the coolant. The heat in the sterilization device is transferred to the coolant by the circulation of the coolant between the cooling head 3-1 and the cooling water tank 3-2, and the sterilization device is cooled by the coolant cooling method.

[0054] Furthermore, the heat dissipation part 3 also includes a heat sink 3-4, and the heat sink is arranged adjacent to the fan 3-3 to dissipate heat for the sterilization device by air cooling.

[0055] The fan 3-3 is connected to a power source 4, and the power source 4 is as follows. Figure 7 As shown, after the power supply is started, the fan is driven to rotate, and the air forms an airflow to take away the heat from the heat sink, thereby promoting the transfer and dissipation of heat.

[0056] The power supply 4 includes a power input terminal 4-1, a first output terminal and a second output terminal, wherein the first output terminal includes a first positive electrode 4-2 and a first negative electrode 4-3, and the second output terminal includes a second positive electrode 4-4 and a second negative electrode 4-5.

[0057] Specifically, the power input terminal 4 - 1 is connected to 220V mains electricity to provide a power source for the operation of the sterilization device.

[0058] The first output end is electrically connected to the heat dissipation part 3. Specifically, the first positive electrode 4-2 and the first negative electrode 4-3 are connected in parallel to the water pump and the fan, and the sterilization device is cooled by the cooperation of coolant cooling and air cooling. Figure 6 In this specific implementation method, the voltage in the first output terminal connection circuit is limited to 12V.

[0059] The second output end is electrically connected to the chip array through the electrodes 1-4 on the substrate 1. Turning on the power supply 4 drives the UVC chip 1-1 to emit ultraviolet radiation for sterilization. The voltage in the connection circuit is limited to 55V-65V, and the current is limited to 3A-5A, which provides electrical energy for the sterilization device to emit ultraviolet radiation.

[0060] When the power input terminal 4 - 1 is connected to the mains, the heat dissipation unit 3 and the sterilization device can be driven to start or stop working at the same time, so as to centrally control the start and stop of the sterilization device.

[0061] The specific implementation methods described above further illustrate the purpose, technical solutions and beneficial effects of the present application in detail. It should be understood that the above description is only the specific implementation method of the present application and is not intended to limit the scope of protection of the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. An integrated sterilization device, characterized in that: include: A substrate, wherein a chip array is arranged on the front side of the substrate, wherein the chip array comprises a plurality of adjacently arranged chip units, each chip unit comprises a plurality of chips, and adjacent chip units have a common boundary; A module cover lens area, including a peripheral module cover lens area, is arranged at the periphery of the chip array; and a central module cover lens region, which is arranged on a boundary shared by chip units in the chip array, and the central module cover lens region is shared by adjacent chip units; A lens, covering the module cover lens area to transmit the light emitted by the chip array; The heat dissipation part includes a cooling head and a cooling water tank. The cooling head is arranged at a position on the back of the substrate corresponding to the chip array. The cooling water tank is connected to the cooling head to circulate cooling liquid between the cooling head and the cooling water tank.

2. An integrated sterilization device according to claim 1, characterized in that: The substrate comprises a copper substrate, the chip array is arranged in the middle of the substrate, and a plurality of positioning holes are also arranged on the substrate, and the positioning holes are arranged on the outside of the chip array; the heat dissipation part is positioned on the back side of the substrate through the positioning holes and completely covers the area of ​​the chip array.

3. The integrated sterilization device according to claim 1, characterized in that: The chip array includes four chip units, and the four chip units include a first chip unit and a second chip unit arranged adjacent to each other in a first row, and a third chip unit and a fourth chip unit arranged in a second row adjacent to the first row; wherein the first chip unit and the third chip unit are longitudinally aligned and arranged adjacent to each other, and the second chip unit and the fourth chip unit are longitudinally aligned and arranged adjacent to each other.

4. An integrated sterilization device according to claim 3, characterized in that: The chip array includes 10 rows of chips connected in parallel, and each row includes 10 chips connected in series.

5. An integrated sterilization device according to claim 4, characterized in that: Each chip includes at least one Zener diode.

6. The integrated sterilization device according to claim 1, characterized in that: The integrated sterilization device further comprises a dam, which is arranged at the periphery of the lens area covered by the peripheral module and has a height higher than the lens area covered by the peripheral module to form a step for positioning and installing the lens.

7. An integrated sterilization device according to claim 6, characterized in that: The lens includes a quartz glass lens or a sapphire glass lens.

8. The integrated sterilization device according to claim 1, characterized in that: The connection between the cooling head and the cooling water tank includes: the cooling water tank outlet is connected to the cooling head water inlet, and the cooling head outlet is connected to the cooling water tank water inlet to form a pipeline for circulating coolant, and a water pump is arranged on the pipeline.

9. The integrated sterilization device according to claim 1, characterized in that: The heat dissipation unit includes a fan and a heat sink, the heat sink is arranged adjacent to the fan, and the fan is connected to a power source.

10. The integrated sterilization device according to claim 1, characterized in that: The integrated sterilization device includes a power supply, which includes a power input terminal, a first output terminal, and a second output terminal; wherein the first output terminal includes a first positive electrode and a first negative electrode, and the first positive electrode and the first negative electrode are electrically connected to the heat dissipation part; the second output terminal includes a second positive electrode and a second negative electrode, and the second positive electrode and the second negative electrode are electrically connected to the chip array through the electrodes on the substrate.

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