Electroplating conductive plate and circuit board electroplating equipment

Abstract

The utility model discloses an electroplating flying bar which comprises a bracket, the copper flat is connected to the bracket and is positioned below the bracket; the guide piece is arranged between the bracket and the copper flat, and the guide piece is provided with a guide surface which faces the bracket and is spaced from the bracket; and the guide surface is inclined from the front side of the copper flat to the rear side of the copper flat along the direction from top to bottom. Therefore, in the electroplating process of the circuit board, when the liquid medicine is sputtered on the bracket and drips downwards along the bracket, the guide surface of the guide piece can receive the liquid medicine dripped from the surface of the bracket and guide the liquid medicine to be discharged from the rear side of the copper flat, so that the risk that the liquid medicine on the surface of the bracket drips downwards to the copper flat can be reduced; therefore, the copper flat can be protected, the risk that the copper flat is corroded due to contamination of liquid medicine is reduced, and the service life of the copper flat can be prolonged. In addition, the utility model further discloses circuit board electroplating equipment with the electroplating conductive bar.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing, in particular to an electroplating femtobar and circuit board electroplating equipment. Background Art

[0002] During the processing of circuit boards, vertical electroplating is usually used for electroplating. Existing circuit board electroplating equipment usually includes a medicine tank and an electroplating flybar. The medicine tank is used to hold the electroplating solution, and the electroplating flybar is used to clamp the circuit board and place the circuit board in the electroplating solution in the medicine tank for electroplating. The electroplating flybar generally includes a bracket, a copper flat and a clamp. The clamp is connected to the copper flat and is located below the copper flat. During electroplating, the circuit board is clamped by the clamp and placed in the medicine tank. After the copper flat is energized, it can be used as a cathode to electrolyze the electroplating solution in the medicine tank to achieve electroplating of the circuit board. Among them, in the process of placing the circuit board into the medicine tank, the solution is easily splashed onto the bracket and dripped down along the bracket to the copper flat, causing the copper flat to be easily corroded due to contamination with the solution, especially at the connection between the clamp and the copper flat, which is extremely easy to accumulate solution. Long-term use will cause irregular corrosion pits on the surface of the copper flat. The appearance of pits not only easily shortens the service life of the copper flat, but also easily causes the circuit board on the clamp to bend and deform. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides an electroplated flybar, which can protect the copper flat and increase the service life of the copper flat.

[0004] The utility model also provides a circuit board electroplating device equipped with the electroplating fob.

[0005] The electroplated flying bar according to the embodiment of the utility model includes: a bracket; a copper flat connected to the bracket and located below the bracket; a guide member arranged between the bracket and the copper flat, the guide member having a guide surface facing the bracket and spaced apart from the bracket; wherein the guide surface is inclined from the front side of the copper flat toward the rear side of the copper flat along a top-to-bottom direction.

[0006] The electroplated Flybar according to the embodiment of the utility model has at least the following beneficial effects:

[0007] By adopting the electroplating flybar of the embodiment of the utility model, a guide member is arranged between the bracket and the copper flat, and the guide member has a guide surface facing the bracket and arranged at a distance from the bracket, and the guide surface is inclined from the front side of the copper flat toward the rear side of the copper flat along the top-to-bottom direction, so that the copper flat can be shielded in the up and down directions. Therefore, during the electroplating process of the circuit board, when the medicine is splashed onto the bracket and drips downward along the bracket, the guide surface of the guide member can receive the medicine dripping from the surface of the bracket and guide the medicine to be discharged from the rear side of the copper flat, so that the risk of the medicine on the surface of the bracket dripping down to the copper flat can be reduced, thereby protecting the copper flat, reducing the risk of corrosion of the copper flat due to contamination by the medicine, and helping to extend the service life of the copper flat.

[0008] According to some embodiments of the present invention, the guide surface includes an arc-shaped surface arranged to be tilted backwards in a direction from top to bottom.

[0009] According to some embodiments of the utility model, the bracket has a first side surface arranged to be tilted backward from top to bottom, the guide surface also includes an inclined surface connected to the arcuate surface, the inclined surface is located below the first side surface and arranged parallel to the first side surface, the arcuate surface is connected to the lower end of the inclined surface and extends backward along the up and down directions to the rear side of the copper flat.

[0010] According to some embodiments of the present invention, the opening of the arc-shaped surface is arranged upward.

[0011] According to some embodiments of the utility model, at least one set of connecting structures is arranged between the guide member and the bracket, and the connecting structure includes a first connecting part and a second connecting part that can cooperate with a detachable connection, wherein the first connecting part is arranged on the bracket and the second connecting part is arranged on the guide member.

[0012] According to some embodiments of the present invention, in the connection structure, one of the first connection part and the second connection part is provided with a card slot, and the other is provided with a card connection part that can be engaged with the card slot.

[0013] According to some embodiments of the utility model, a connecting piece is provided between the copper flat plate and the bracket, and the connecting piece is installed on the bracket and connected to the copper flat plate.

[0014] According to some embodiments of the present utility model, the upper end of the connecting member has two clamping parts arranged opposite to each other, the bracket is inserted between the two clamping parts, and the two clamping parts are connected to each other and cooperate to clamp the bracket.

[0015] According to some embodiments of the present invention, the number of the guide members is at least two, all the guide members are arranged at intervals along the length direction of the bracket, and one connecting member is provided between every two adjacent guide members.

[0016] According to the circuit board electroplating equipment of the embodiment of the utility model, there is provided an electroplating fob of any one of the above-mentioned embodiments.

[0017] The circuit board electroplating equipment according to the embodiment of the utility model has at least the following beneficial effects:

[0018] By adopting the circuit board electroplating equipment of the embodiment of the utility model, the electroplating flybar is provided with a guide member located between the bracket and the copper flat, and the guide member can shield the copper flat in the up and down directions. Therefore, during the electroplating process of the circuit board, when the liquid medicine is splashed onto the bracket and drips downward along the bracket, the guide surface of the guide member can receive the liquid medicine dripping from the surface of the bracket and guide the liquid medicine to be discharged from the rear side of the copper flat, so that the liquid medicine on the surface of the bracket can be prevented from dripping downward to the copper flat, thereby protecting the copper flat and reducing the risk of corrosion of the copper flat due to contamination by the liquid medicine, thereby facilitating the normal progress of the electroplating process of the circuit board, and reducing the risk of bending and deformation of the circuit board due to corrosion of the copper flat during the electroplating process, which is beneficial to ensuring the processing quality of the circuit board and reducing the scrap rate of the circuit board production.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0021] Figure 1 A schematic diagram of an electroplated Flybar according to an embodiment of the utility model;

[0022] Figure 2 It is a partial schematic diagram of the electroplated Flybar according to an embodiment of the utility model;

[0023] Figure 3 A schematic diagram of a guide member of an electroplated Flybar according to an embodiment of the utility model;

[0024] Figure 4 It is a side view of the electroplated flying target according to an embodiment of the utility model.

[0025] Reference numerals:

[0026] The bracket 100, the first side surface 110, the second side surface 120, the connecting member 130, and the clamping portion 131;

[0027] Copper flat 200;

[0028] A guide member 300, a guide surface 310, a curved surface 311, and an inclined surface 312;

[0029] The connecting structure 400 , the first connecting portion 410 , the clamping portion 411 , the second connecting portion 420 , and the clamping slot 421 . DETAILED DESCRIPTION

[0030] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0031] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0032] In the description of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0033] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0034] Reference Figures 1 to 4 An embodiment of the utility model provides an electroplating flybar, which includes a bracket 100, a copper flat 200 and a guide 300. The copper flat 200 is connected to the bracket 100 and is located below the bracket 100. The guide 300 is arranged between the guide 300 and the copper flat 200. The guide 300 has a guide surface 310 facing the bracket 100 and arranged at a distance from the bracket 100, wherein the guide surface 310 is inclined from the front side of the copper flat 200 to the rear side of the copper flat 200 along the direction from top to bottom.

[0035] By adopting the electroplating flying bar of the embodiment of the utility model, a guide member 300 is arranged between the bracket 100 and the copper flat 200, and the guide member 300 has a guide surface 310 facing the bracket 100 and arranged at a distance from the bracket 100, and the guide surface 310 is inclined from the front side of the copper flat 200 to the rear side of the copper flat 200 along the top-to-bottom direction, that is, the size of the guide surface 310 in the front-to-back direction is greater than the size of the copper flat 200 in the front-to-back direction, so that the copper flat 200 can be shielded in the up-down direction. Therefore, during the electroplating process of the circuit board, when the liquid medicine is splashed onto the bracket 100 and along the bracket 1 00 drips downward, the guide surface 310 of the guide member 300 can receive the medicine dripping from the surface of the bracket 100 and guide the medicine to be discharged from the rear side of the copper flat 200, thereby preventing the medicine on the surface of the bracket 100 from dripping downward to the copper flat 200, thereby protecting the copper flat 200 and reducing the risk of corrosion of the copper flat 200 due to contamination by the medicine, which is not only beneficial to extending the service life of the copper flat 200, but also can reduce the risk of bending and deformation of the circuit board due to corrosion of the copper flat 200 during the electroplating process, which is beneficial to ensuring the processing quality of the circuit board and reducing the scrap rate of the circuit board production.

[0036] It can be understood that the guide surface 310 is inclined from the front side of the copper flat 200 to the rear side of the copper flat 200 along the top-to-bottom direction, which specifically means that in the front-to-back direction, the upper end of the guide surface 310 is located at the front side of the copper flat 200, and the lower end of the guide surface 310 is located at the rear side of the copper flat 200. Among them, the horizontal height of the upper end of the guide surface 310 should be higher than the horizontal height of the copper flat 200, and the horizontal height of the lower end of the guide surface 310 can be higher than the horizontal height of the copper flat 200, or lower than the horizontal height of the copper flat 200 or flush with the horizontal height of the copper flat 200. The utility model does not make any specific limitation on this. It only needs that the lower end of the guide surface 310 is located at the rear side of the copper flat 200 in the front-to-back direction to guide the liquid medicine to be discharged from the rear side of the copper flat 200.

[0037] It is understandable that, referring to Figures 1 to 4 , the number of guide members 300 is five, and the five guide members 300 are arranged in sequence along the length direction of the copper flat 200, thereby shortening the length of a single guide member 300 and facilitating the production and processing of the guide member 300. Of course, in order to better prevent the liquid medicine on the surface of the bracket 100 from dripping down to the copper flat 200, the number of guide members 300 can also be set to one, and the length of a single guide member 300 can be set to be greater than or equal to the length of the copper flat 200. Therefore, the number of guide members 300 can be one, two, three, four, five, six or more, and the utility model does not make specific restrictions on this.

[0038] It can be understood that when the circuit board is electroplated by the electroplating flybar of the embodiment of the utility model, the circuit board is specifically fixed on the clamp of the copper flat, wherein the clamp is connected to the copper flat and is located below the copper flat, so that the circuit board can be clamped by the clamp and placed in the potion tank, and the copper flat can be used as a cathode to electrolyze the electroplating potion in the potion tank after being energized, thereby achieving electroplating of the circuit board. The structure of the clamp connected to the copper flat belongs to the conventional technical means in the field, and the utility model will not be described in detail.

[0039] Reference Figures 1 to 4 In some embodiments, the guide surface 310 includes an arcuate surface 311 arranged to be tilted backward along a direction from top to bottom.

[0040] In the above structure, by setting an arc surface 311 that is tilted backward from top to bottom, the guide surface 310 is made smoother, so that the flow of medicine on the arc surface 311 is smoother, which is conducive to better guiding the medicine to flow backward and be discharged from the rear side of the copper flat 200.

[0041] Reference Figures 1 to 4 In some embodiments, the bracket 100 has a first side surface 110 arranged to be tilted backward from top to bottom, and the guide surface 310 also includes an inclined surface 312 connected to the arc surface 311. The inclined surface 312 is located below the first side surface 110 and is arranged parallel to the first side surface 110. The arc surface 311 is connected to the lower end of the inclined surface 312 and extends backward along the up and down direction to the rear side of the copper flat 200.

[0042] In the above structure, since the first side surface 110 of the bracket 100 is arranged to tilt backward from top to bottom, it can also guide the medicine on the surface of the bracket 100, guiding the medicine on the surface of the bracket 100 to flow backward along the up and down directions and then drip onto the guide surface 310 of the guide member 300. By setting an inclined surface 312 connected to the arc surface 311, the inclined surface 312 is located below the first side surface 110 and arranged parallel to the first side surface 110, thereby being able to well receive the medicine dripping directly from the first side surface 110, and the arc surface 311 is connected to the lower end of the inclined surface 312 and extends backward along the up and down direction to the rear side of the copper flat 200, thereby being able to well receive the medicine dripping from the lower end of the first side surface 110 and the medicine dripping downward from other side surfaces of the bracket 100, thereby being able to better prevent the medicine on the surface of the bracket 100 from dripping downward to the copper flat 200, thereby being able to better protect the copper flat 200 and reduce the risk of corrosion of the copper flat 200 due to contamination with the medicine, which is not only beneficial to extending the service life of the copper flat 200, but also can reduce the risk of bending and deformation of the circuit board due to corrosion of the copper flat 200 during the electroplating process, which is beneficial to ensuring the processing quality of the circuit board and reducing the scrap rate of the circuit board production.

[0043] It is understandable that, referring to Figures 1 to 4 The bracket 100 also has a second side surface 120 arranged tilted forward from top to bottom, and the lower end of the second side surface 120 is connected to the lower end of the first side surface 110. Therefore, the second side surface 120 can also guide the medicine on the surface of the bracket 100, guiding the medicine on the rear side surface of the bracket 100 to flow forward in the up-down direction and then drip onto the guide surface 310 of the guide member 300. Specifically, referring to Figures 1 to 4 The projection of the bracket 100 in its length direction is rectangular, and the structure is simple and convenient for production and processing.

[0044] Reference Figures 1 to 4 In some embodiments, the opening of the arc surface 311 is arranged upward.

[0045] In the above structure, by arranging the opening of the arc surface 311 toward the rear side of the bracket 100 , the liquid on the surface of the bracket 100 can be better received.

[0046] It is understandable that, in some embodiments, the opening of the arc surface 311 may also be arranged to face downward, and the present invention does not make any specific limitation to this.

[0047] It is understandable that, in addition to configuring the guide surface 310 as a structure in which the inclined surface 312 and the arc surface 311 are connected to each other, the guide surface 310 may also be directly configured as an inclined plane or an arc-shaped curved surface, and the present invention does not make any specific limitation on this.

[0048] Reference Figures 1 to 4 In some embodiments, the guide member 300 is specifically a guide sheet, that is, the guide member 300 specifically adopts a sheet structure, which can facilitate the production and processing of the guide member 300.

[0049] Reference Figures 1 to 4 In some embodiments, two sets of connection structures 400 are arranged between the guide member 300 and the bracket 100, and the connection structure 400 includes a first connection part 410 and a second connection part 420 that can cooperate with a detachable connection, wherein the first connection part 410 is arranged on the bracket 100, and the second connection part 420 is arranged on the guide member 300.

[0050] By setting a connecting structure 400 between the guide member 300 and the bracket 100, the guide member 300 can be detachably installed on the bracket 100, which not only facilitates the installation of the guide member 300, but also makes it easy to remove the guide member 300 from the bracket 100 for cleaning or maintenance. In addition, by setting two sets of connecting structures 400 between the guide member 300 and the bracket 100, the installation of the guide member 300 can be made more balanced and stable.

[0051] It is understandable that the two sets of connection structures 400 are provided between the guide member 300 and the bracket 100, which is only for Figures 1 to 4 As an exemplary illustration, the number of the connection structures 400 between the guide member 300 and the bracket 100 may be one group, three groups, four groups or more groups in addition to two groups, and the present invention does not make any specific limitation on this.

[0052] It can be understood that the above-mentioned first connecting portion 410 is arranged on the bracket 100, wherein the first connecting portion 410 can be an integrated structure with the bracket 100, or can also be installed on the bracket 100 through other fastening structures, and the present invention does not make specific limitations on this. Similarly, the above-mentioned second connecting portion 420 is arranged on the guide member 300, wherein the second connecting portion 420 can be an integrated structure with the guide member 300, or can also be installed on the guide member 300 through other fastening structures, and the present invention does not make specific limitations on this.

[0053] It is understandable that in order for the medicine on the stent 100 to flow along the connection structure 400 to the guide surface 310 of the guide member 300 , the second connection portion 420 may be specifically disposed on the guide surface 310 of the guide member 300 .

[0054] It is understandable that the guide member 300 is mounted on the bracket 100 via the connecting structure 400. Figures 1 to 4 As an exemplary illustration, in some embodiments, the guide member 300 may also be installed on the copper flat 200, which is not specifically limited in the present invention.

[0055] Reference Figures 1 to 4 In the connection structure 400 , the second connection portion 420 is provided with a card slot 421 , and the first connection portion 410 is provided with a card engaging portion 411 that can be engaged with the card slot 421 .

[0056] In the above structure, since the first connecting member 130 is arranged on the bracket 100 and the second connecting part 420 is arranged on the guide member 300, the guide member 300 can be connected with the clamping part 411 of the first connecting part 410 of the bracket 100 through the clamping groove 421 on the second connecting part 420. The structure is simple and easy to assemble and disassemble, and it can also be convenient for production and processing.

[0057] It is understandable that the second connecting portion 420 is provided with a card slot 421, and the first connecting portion 410 is provided with a card connection portion 411 that can be engaged with the card slot 421. Figures 1 to 4As an exemplary illustration, in some embodiments, the first connecting portion 410 may be provided with a card slot 421, and the second connecting portion 420 may be provided with a card connection portion 411 that can be engaged with the card slot 421. At this time, since the first connecting member 130 is provided on the bracket 100 and the second connecting portion 420 is provided on the guide member 300, the guide member 300 can be inserted into the card slot 421 on the first connecting portion 410 of the bracket 100 through the card connection portion 411 of the second connecting portion 420. The structure is simple and easy to assemble and disassemble, and it can also be convenient for production and processing.

[0058] It is understandable that in the above structure, one of the first connection part 410 and the second connection part 420 is provided with a card slot 421, and the other is provided with a card portion 411 that can be engaged with the card slot 421. Among them, the card portion 411 can specifically be a hook or a card block or other card structure that can be engaged with the card slot 421, and the utility model does not make specific limitations on this. In addition, the card portion 411 can be fixed to the first connection part 410 or the second connection part 420 by welding. In addition, the card portion 411 can also be fixed to the first connection part 410 or the second connection part 420 by an integral molding method, or the card portion 411 can also be fixed to the first connection part 410 or the second connection part 420 by a fastening structure such as screws and bolts, and the utility model does not make specific limitations on this.

[0059] It can be understood that, in some embodiments, in order to make the connection between the first connection portion 410 and the second connection portion 420 tighter and more stable, the clamping portion 411 and the clamping slot 421 can be set to be interference fit.

[0060] Reference Figures 1 to 4 The electroplated copper foil further includes at least one connecting member 130 , which is mounted on the bracket 100 and connected to the copper foil 200 .

[0061] In the above structure, the copper flat 200 is installed on the bracket 100 through at least one connecting member 130, thereby making the installation connection between the copper flat 200 and the bracket 100 more stable, thereby facilitating the insertion or removal of the circuit board fixed on the copper flat 200 into or out of the chemical tank during the electroplating process, which is beneficial to improving the movement stability of the circuit board during electroplating.

[0062] Reference Figures 1 to 4 In some embodiments, the upper end of the connecting member 130 has two clamping portions 131 arranged opposite to each other, the bracket 100 is inserted between the two clamping portions 131, and the two clamping portions 131 are connected to each other and cooperate to clamp the bracket 100.

[0063] In the above structure, the connecting member 130 can clamp the bracket 100 through the two clamping parts 131 , so that the connecting member 130 can be firmly installed on the bracket 100 , so that the connecting member 130 is not easy to fall off from the bracket 100 .

[0064] It is understandable that the two clamping parts 131 may be connected by fasteners such as screws and bolts, or the two clamping parts 131 may be connected by a snap-fit ​​structure or other structures, and the present invention does not make any specific limitation on this.

[0065] Reference Figures 1 to 4 In some embodiments, the number of the guide members 300 is five, all of the guide members 300 are arranged at intervals along the length direction of the bracket 100, and a connecting member 130 is provided between every two adjacent guide members 300.

[0066] In the above structure, by setting the number of guide members 300 to five and arranging them at intervals between every two adjacent guide members 300, installation space can be provided for the connecting member 130, that is, a connecting member 130 is arranged between every two adjacent guide members 300, thereby making the connection between the copper flat 200 and the bracket 100 more balanced and stable.

[0067] It is understandable that the number of the guide members 300 is five, which is only for Figures 1 to 4 As an exemplary illustration, in order to provide a connecting member 130 between two adjacent guide members 300, the number of the guide members 300 may be two, three, four, six or more, in addition to five, and the present invention does not specifically limit this.

[0068] It can be understood that, in some embodiments, when the number of guide members 300 is at least two, all guide members 300 are arranged in sequence along the length direction of the copper flat 200, and in the length direction of the copper flat 200, the guide members 300 located at both ends can extend to the two ends of the copper flat 200 accordingly, or the guide members 300 located at both ends can extend to the outside of the two ends of the copper flat 200 accordingly, thereby being able to more comprehensively shield the copper flat 200, further reducing the risk of the medicine on the surface of the bracket 100 dripping down to the copper flat 200, thereby being able to better protect the copper flat 200, reducing the risk of corrosion of the copper flat 200 due to contamination by the medicine, and extending the service life of the copper flat 200.

[0069] In some embodiments, blocking portions may be provided at both ends of the guide sheet to prevent the liquid medicine on the guide surface 310 from flowing down from both ends of the guide sheet and dripping onto the copper plate 200 .

[0070] It can be understood that in addition to setting the number of guide members 300 to be multiple and setting a connector 130 between two adjacent guide members 300, in some embodiments, the number of connectors 130 can also be set to at least two, and a guide member 300 can be set between every two adjacent connectors 130, thereby making the installation of the copper flat 200 more firm and stable.

[0071] An embodiment of the present invention further provides a circuit board electroplating device, wherein the circuit board electroplating device is provided with an electroplating fob according to any of the above embodiments.

[0072] By adopting the circuit board electroplating equipment of the embodiment of the utility model, the electroplating flybar is provided with a guide member 300 located between the bracket 100 and the copper flat 200, and the guide member 300 can shield the copper flat 200 in the up and down directions. Therefore, during the electroplating process of the circuit board, when the liquid medicine is splashed onto the bracket 100 and drips downward along the bracket 100, the guide surface 310 of the guide member 300 can receive the liquid medicine dripping from the surface of the bracket 100 and guide the liquid medicine to be discharged from the rear side of the copper flat 200, so that the liquid medicine on the surface of the bracket 100 can be prevented from dripping downward to the copper flat 200, thereby protecting the copper flat 200 and reducing the risk of corrosion of the copper flat 200 due to contamination by the liquid medicine, thereby facilitating the normal progress of the electroplating process of the circuit board, and reducing the risk of bending and deformation of the circuit board due to corrosion of the copper flat 200 during the electroplating process, which is conducive to ensuring the processing quality of the circuit board and reducing the scrap rate of the circuit board production.

[0073] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. Electroplating Feiba, characterized in that, include: Bracket (100); A copper flat plate (200), connected to the bracket (100) and located below the bracket (100); A guide member (300) is arranged between the bracket (100) and the copper flat plate (200), wherein the guide member (300) has a guide surface (310) facing the bracket (100) and spaced apart from the bracket (100); The guide surface (310) is inclined from the front side of the copper flat (200) toward the rear side of the copper flat (200) along a direction from top to bottom.

2. The electroplated Flybar according to claim 1, characterized in that: The guide surface (310) comprises an arcuate surface (311) arranged to be inclined backwards in a direction from top to bottom.

3. The electroplated Flybar according to claim 2, characterized in that: The bracket (100) has a first side surface (110) arranged to be inclined backward from top to bottom. The guide surface (310) further comprises an inclined surface (312) connected to the arcuate surface (311); the inclined surface (312) is located below the first side surface (110) and is arranged parallel to the first side surface (110); the arcuate surface (311) is connected to the lower end of the inclined surface (312) and extends backward along the up-down direction to the rear side of the copper flat plate (200).

4. The electroplated Flybar according to claim 2 or 3, characterized in that: The opening of the arc-shaped surface (311) is arranged upward.

5. The electroplated Flybar according to claim 1, characterized in that: At least one set of connection structures (400) is provided between the guide member (300) and the bracket (100), and the connection structure (400) includes a first connection part (410) and a second connection part (420) capable of being detachably connected, wherein the first connection part (410) is provided on the bracket (100), and the second connection part (420) is provided on the guide member (300).

6. The electroplated Flybar according to claim 5, characterized in that: In the connection structure (400), one of the first connection part (410) and the second connection part (420) is provided with a card slot (421), and the other is provided with a card connection part (411) capable of being engaged with the card slot (421).

7. The electroplated Flybar according to claim 1, characterized in that: A connecting piece (130) is provided between the copper flat plate (200) and the bracket (100); the connecting piece (130) is installed on the bracket (100) and connected to the copper flat plate (200).

8. The electroplated Flybar according to claim 7, characterized in that: The upper end of the connecting piece (130) has two clamping parts (131) arranged opposite to each other, the bracket (100) is inserted between the two clamping parts (131), and the two clamping parts (131) are connected to each other and cooperate to clamp the bracket (100).

9. The electroplated Flybar according to claim 7, characterized in that: The number of the guide members (300) is at least two, and all the guide members (300) are arranged at intervals along the length direction of the bracket (100), and one connecting member (130) is provided between every two adjacent guide members (300).

10. Circuit board electroplating equipment, characterized in that: An electroplated flybar as described in any one of claims 1 to 9 is provided.

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