High heat dissipation type LED lamp bead structure

Abstract

The utility model relates to the technical field of LED lamp beads, and discloses a high heat dissipation type LED lamp bead structure which comprises a lamp bead plate, an LED lamp bead module and a heat dissipation assembly. The heat dissipation assembly comprises an upper fin radiator, a semiconductor chilling plate, a lower fin radiator and a locking structure. The top end of the upper fin radiator is provided with an installation groove matched with the lamp bead plate in a clamped and embedded mode. The top end face and the bottom end face of the semiconductor chilling plate are a cold end face and a hot section respectively. The lower end of the upper fin radiator is tightly connected with the cold end surface; the upper end of the lower fin radiator is tightly connected with the hot end surface; the upper fin radiator, the semiconductor chilling plate and the lower fin radiator are connected into a whole through a locking structure. According to the high-heat-dissipation type LED lamp bead structure, the overall heat dissipation efficiency of the high-heat-dissipation type LED lamp bead structure is remarkably improved, the working temperature of an LED lamp bead module is effectively reduced, and therefore the light-emitting efficiency and stability of the high-heat-dissipation type LED lamp bead structure are guaranteed, and the service life of the LED lamp bead module is remarkably prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of LED lamp beads, in particular to a high heat dissipation type LED lamp bead structure. Background Art

[0002] With the rapid development of LED lighting technology, LED lamp beads have been widely used in various lighting products due to their high efficiency, long life, environmental protection and other advantages. However, LED lamp beads will generate a lot of heat during operation. If it cannot be dissipated in time and effectively, it will cause the temperature of the LED chip to rise sharply, which will not only affect the luminous efficiency, but also accelerate the aging of the LED and shorten the service life.

[0003] In order to solve the above problems, the Chinese patent with patent application number CN202220651723.8 discloses a high heat dissipation LED lamp bead, including a circuit board and a plurality of lamp bead diodes arranged on the top surface of the circuit board, a heat dissipation base is snap-connected to the bottom wall of the circuit board, the inner cavity of the heat dissipation base is hollow, and the heat dissipation base is inserted and installed in the installation groove provided on the base, a heat dissipation groove is provided in the middle position of the bottom wall of the installation groove, and a plurality of upper heat dissipation fins and lower heat dissipation fins are evenly arranged in the heat dissipation groove, the upper heat dissipation fins and the lower heat dissipation fins are overlapped up and down, and the upper heat dissipation fins are vertically connected to the bottom wall of the heat dissipation base, the lower heat dissipation fins are inserted and connected in the fin jack provided on the base, and the bottom end of the lower heat dissipation fins extends outward from the base. However, the high heat dissipation LED lamp bead can only rely on the upper heat dissipation fins and the lower heat dissipation fins to dissipate heat naturally, passively, and the heat dissipation effect is poor, and the heat dissipation efficiency needs to be improved. Utility Model Content

[0004] The utility model aims to overcome the problems of the prior art and provides a high heat dissipation type LED lamp bead structure.

[0005] In order to achieve the above purpose, the utility model adopts the following scheme:

[0006] A high heat dissipation LED lamp bead structure, comprising a lamp bead board, an LED lamp bead module and a heat dissipation component; the LED lamp bead module is connected to the lamp bead board; the heat dissipation component comprises:

[0007] An upper fin heat sink, the top of which is provided with a mounting groove adapted to be snap-fitted with the lamp bead board;

[0008] The semiconductor cooling sheet has a top end surface and a bottom end surface which are a cold end surface and a hot end surface respectively; the lower end of the upper fin heat sink is closely connected to the cold end surface;

[0009] A lower fin heat sink, the upper end of which is closely connected to the hot end surface;

[0010] The upper fin heat sink, the semiconductor cooling fin and the lower fin heat sink are connected as a whole through the locking structure.

[0011] Furthermore, the locking structure includes a locking bolt; the upper fin radiator is provided with a first mounting hole opened on the bottom of the mounting groove; the semiconductor refrigeration plate is provided with a second mounting hole passing through the upper and lower ends thereof; the lower fin radiator is provided with a third mounting hole; the locking bolt is adapted to pass through the third mounting hole, the second mounting hole and the first mounting hole in sequence to connect.

[0012] Furthermore, the locking structure also includes an upper positioning ring and a lower positioning ring; the upper positioning ring and the lower positioning ring are respectively connected to the lower edge of the upper fin radiator and the upper edge of the lower fin radiator; the upper end of the semiconductor refrigeration sheet is adapted to be embedded in the upper positioning ring; the lower end of the semiconductor refrigeration sheet is adapted to be embedded in the lower positioning ring.

[0013] Furthermore, the upper fin heat sink comprises a heat-conducting slot body, a heat-conducting wire tube and an upper heat-dissipating fin; the mounting slot is located on the heat-conducting slot body; the upper end of the heat-conducting wire tube is connected to the bottom surface of the heat-conducting slot body and communicates with the inner cavity of the mounting slot;

[0014] A plurality of upper heat dissipation fins are connected to the heat conducting wire tube and are evenly arranged around the central axis of the heat conducting wire tube; the upper end of each upper heat dissipation fin is connected to the bottom surface of the heat conducting trough body; the lower end of the heat conducting wire tube and each upper heat dissipation fin is tightly connected to the cold end surface.

[0015] Furthermore, the lower fin heat sink comprises a base plate and lower heat dissipating fins; a plurality of the lower heat dissipating fins are evenly spaced and arranged on the base plate; and the upper end of each of the lower heat dissipating fins is tightly connected to the hot end surface.

[0016] Furthermore, the upper fin heat sink and the lower fin heat sink are both made of aluminum or aluminum alloy.

[0017] Furthermore, the lower end surface of the lamp bead plate is connected to the heat dissipation assembly by laying a layer of thermal conductive silicone grease.

[0018] Furthermore, the LED lamp bead module is formed by arranging a plurality of LED lamp bead arrays.

[0019] Furthermore, a light cover for covering the LED lamp bead module is adapted and installed on the lamp bead board.

[0020] Compared with the existing technology, the utility model has the following advantages:

[0021] The utility model improves the heat dissipation component on the basis of the lamp bead board, LED lamp bead module and heat dissipation component, and forms a heat dissipation component by arranging an upper fin radiator, a semiconductor refrigeration sheet, a lower fin radiator and a locking structure. The lamp bead board and the LED lamp bead module are installed in the installation groove, and the heat is dissipated to the upper fin radiator. Then the semiconductor refrigeration sheet is used for active cooling, and its cold end surface accelerates the cooling of the upper fin radiator, further accelerates the lamp bead board and the LED lamp bead module, and achieves a good heat dissipation effect. At the same time, the lower fin radiator is used to dissipate the heat of the hot end surface of the semiconductor refrigeration sheet, and the semiconductor refrigeration sheet is protected from heat dissipation, which significantly improves the heat dissipation efficiency of the whole high heat dissipation type LED lamp bead structure, effectively reduces the working temperature of the LED lamp bead module, thereby ensuring its luminous efficiency and stability, and at the same time, reduces heat accumulation, reduces the risk of aging and damage of the LED lamp bead module due to high temperature, and significantly extends the service life of the LED lamp bead module. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0023] Figure 1 It is a three-dimensional structural schematic diagram of the high heat dissipation type LED lamp bead structure of the utility model.

[0024] Figure 2 It is one of the exploded three-dimensional structural schematic diagrams of the high heat dissipation type LED lamp bead structure of the utility model.

[0025] Figure 3 This is the second schematic diagram of the exploded three-dimensional structure of the high heat dissipation LED lamp bead structure of the utility model.

[0026] The figure includes:

[0027] Lamp bead board 1, LED lamp bead module 2, LED lamp bead 21, heat dissipation component 3, upper fin heat sink 31, heat conduction groove body 311, mounting groove 3111, heat conduction wire tube 312, upper heat dissipation fin 313, first mounting hole 314, semiconductor refrigeration plate 32, cold end surface 321, hot end surface 322, second mounting hole 323, lower fin heat sink 33, base plate 331, lower heat dissipation fin 332, third mounting hole 333, locking structure 4, locking bolt 41, upper positioning ring 42, lower positioning ring 43, light cover 5. DETAILED DESCRIPTION

[0028] The following is a further detailed description of the specific implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0029] like Figures 1 to 3As shown, a high heat dissipation type LED lamp bead structure includes a lamp bead board 1, an LED lamp bead module 2 and a heat dissipation component 3; the LED lamp bead module 2 is connected to the lamp bead board 1; the heat dissipation component 3 includes an upper fin heat sink 31, a semiconductor cooling plate 32, a lower fin heat sink 33 and a locking structure 4. The top of the upper fin heat sink 31 is provided with a mounting groove 3111 adapted to the lamp bead board 1 for embedded installation, so that the lamp bead board 1 and the LED lamp bead module 2 can be stably installed in the mounting groove 3111, and the structural connection is stable and reliable. The top end surface and the bottom end surface of the semiconductor cooling plate 32 are the cold end surface 321 and the hot end surface 322 respectively; wherein, the lower end of the upper fin heat sink 31 is tightly connected to the cold end surface 321; ensure that heat is quickly transferred from the LED lamp bead module 2 to the heat dissipation fins, and heat is dissipated through air convection. The upper end of the lower fin heat sink 33 is closely connected to the hot end surface 322; the lower fin heat sink 33 is designed with a structure that increases the heat conduction area, and its upper end is closely connected to the hot end surface 322 of the semiconductor cooling plate 32, effectively dissipating and conducting the heat to the surrounding environment. The upper fin heat sink 31, the semiconductor cooling plate 32 and the lower fin heat sink 33 are connected to form a whole through the locking structure 4. In this way, the locking structure 4 is closely connected, so that the entire heat dissipation assembly 3 has a compact structure and is easy to be integrated into the LED lamp bead structure for efficient heat dissipation.

[0030] On the basis of the lamp bead board 1, the LED lamp bead module 2 and the heat dissipation component 3, the heat dissipation component 3 is improved, and the heat dissipation component 3 is formed by combining an upper fin heat sink 31, a semiconductor cooling sheet 32, a lower fin heat sink 33 and a locking structure 4, and the lamp bead board 1 and the LED lamp bead module 2 are installed in the installation groove 3111, and the heat is dissipated to the upper fin heat sink 31, and then the semiconductor cooling sheet 32 ​​is used for active cooling, and its cold end surface 321 accelerates the cooling of the upper fin heat sink 31, further accelerating the lamp bead board 1 and the LED lamp bead module 2, achieving a good heat dissipation effect, and at the same time, the lower fin heat sink 33 is also used to dissipate the heat of the hot end surface 322 of the semiconductor cooling sheet 32, and the semiconductor cooling sheet 32 ​​is protected from heat dissipation, which significantly improves the overall heat dissipation efficiency of the high heat dissipation type LED lamp bead structure, effectively reduces the working temperature of the LED lamp bead module 2, thereby ensuring its luminous efficiency and stability, and at the same time, reduces heat accumulation, reduces the risk of aging and damage of the LED lamp bead module 2 due to high temperature, and significantly extends the service life of the LED lamp bead module 2.

[0031] In this embodiment, the locking structure 4 includes a locking bolt 41; the upper fin heat sink 31 is provided with a first mounting hole 314 opened on the bottom of the mounting groove 3111; the semiconductor cooling plate 32 is provided with a second mounting hole 323 penetrating the upper and lower ends thereof; the lower fin heat sink 33 is provided with a third mounting hole 333; the locking bolt 41 is adapted to pass through the third mounting hole 333, the second mounting hole 323 and the first mounting hole 314 in sequence to connect. Preferably, the third mounting hole 333 is a countersunk hole to conveniently hide the bolt head of the locking bolt 41.

[0032] In order to further strengthen the positioning of the structural semiconductor paper sheet and make it stably and reliably connected between the upper fin heat sink 31 and the lower fin heat sink 33, the locking structure 4 also includes an upper positioning ring 42 and a lower positioning ring 43; the upper positioning ring 42 and the lower positioning ring 43 are respectively connected to the lower edge of the upper fin heat sink 31 and the upper edge of the lower fin heat sink 33; the upper end of the semiconductor cooling sheet 32 ​​is adapted to be embedded in the upper positioning ring 42; the lower end of the semiconductor cooling sheet 32 ​​is adapted to be embedded in the lower positioning ring 43. Through the action of the upper positioning ring 42 and the lower positioning ring 43, the structural positioning between the lower end of the upper fin heat sink 31 and the upper end of the semiconductor cooling sheet 32, and between the upper end of the lower fin heat sink 33 and the lower end of the semiconductor cooling sheet 32 ​​is strengthened, and the semiconductor cooling sheet 32 ​​is stably installed between the upper fin heat sink 31 and the lower fin heat sink 33.

[0033] In this embodiment, the upper fin heat sink 31 includes a heat-conducting trough body 311, a heat-conducting wire tube 312 and upper heat-dissipating fins 313; the mounting groove 3111 is located on the heat-conducting trough body 311; the upper end of the heat-conducting wire tube 312 is connected to the bottom surface of the heat-conducting trough body 311 and is communicated with the inner cavity of the mounting groove 3111; a plurality of upper heat-dissipating fins 313 are connected to the heat-conducting wire tube 312 and are evenly arranged around the central axis of the heat-conducting wire tube 312; the upper end of each of the upper heat-dissipating fins 313 is connected to the bottom surface of the heat-conducting trough body 311; the lower ends of the heat-conducting wire tube 312 and each of the upper heat-dissipating fins 313 are tightly connected to the cold end surface 321. By setting up a heat-conducting trough body 311, a heat-conducting wire tube 312 and an upper heat-dissipating fin 313, the heat-conducting trough body 311 serves as the initial receiving and conducting center of heat, and the carefully designed mounting groove 3111 on its surface provides a solid foundation for the subsequent heat transfer. The heat-conducting wire tube 312 serves as one of the bridges for heat transmission, and its upper end is closely connected to the heat-conducting trough body 311, ensuring that the heat can flow quickly and unimpeded to the next link, and at the same time, it can play a good role as a conductor. To further optimize the heat dissipation efficiency, the multiple upper heat-dissipating fins 313 evenly arranged around the central axis of the heat-conducting wire tube 312, like open wings, greatly increase the heat dissipation area, so that the heat can be quickly dissipated to the surrounding environment. This layout not only ensures the uniform transfer of heat, but also avoids the occurrence of local overheating. Through the carefully designed fin distribution, the upper fin radiator 31 achieves all-round and efficient heat dissipation, effectively improving the overall heat dissipation efficiency. The essence of this design idea is that it is not only a simple increase in the heat dissipation area, but also a precise control and optimization of the heat flow path. At the same time, the heat conducting wire tube 312 and the plurality of upper heat dissipation fins 313 are combined with the cold end surface 321, and the semiconductor refrigeration sheet 32 ​​is actively cooled. The cold end surface 321 accelerates the cooling of the heat conducting wire tube 312 and the plurality of upper heat dissipation fins 313, further accelerating the lamp bead board 1 and the LED lamp bead module 2, and achieving a good heat dissipation effect. Specifically, the first mounting hole is located on the heat conducting slot body 311.

[0034] In this embodiment, the lower fin heat sink 33 includes a base plate 331 and lower heat dissipation fins 332; a plurality of lower heat dissipation fins 331 are evenly spaced and arranged on the base plate 331; the upper end of each lower heat dissipation fin 332 is closely connected to the hot end surface 322. The lower fin heat sink 33 is formed by arranging the base plate 331 and the lower heat dissipation fins 332, and the hot end surface 322 of the semiconductor cooling sheet 32 ​​is dissipated, and the semiconductor cooling sheet 32 ​​is protected from heat dissipation, which is conducive to extending the service life of the structure. Specifically, the third mounting hole is located on the base plate 331.

[0035] In order to make the upper fin radiator 31 and the lower fin radiator 33 have good heat dissipation effect and light structure, the upper fin radiator 31 and the lower fin radiator 33 are both made of aluminum or aluminum alloy.

[0036] In order to enhance the heat transfer effect to the heat dissipation component 3 and accelerate the heat dissipation, a layer of thermal conductive silicone grease is laid between the lower end surface of the lamp bead board 1 and the heat dissipation component 3. By laying a layer of thermal conductive silicone grease between the lower end surface of the lamp bead board 1 and the heat dissipation component 3, it has excellent thermal conductivity, effectively improves the heat transfer efficiency, and accelerates the heat dissipation of the structure.

[0037] In this embodiment, the LED lamp bead module 2 is formed by arranging a plurality of LED lamp beads 21 in an array. By arranging a plurality of LED lamp beads 21 in an array, the LED lamp bead module 2 has a regular shape, a good appearance design, and a good luminous effect. A light cover 5 for covering the LED lamp bead module 2 is adapted and installed on the lamp bead board 1. The light cover 5 has a good focusing effect, emits soft light, and is conducive to protecting the user's eyes.

[0038] It should be noted that the semiconductor refrigeration sheet 32 ​​and thermal grease are universal standard parts or components known to technical personnel in this field, and their structures and principles can be known to technical personnel through technical manuals or through conventional experimental methods. Therefore, the semiconductor refrigeration sheet 32 ​​of the specific implementation of this application will not be described again.

[0039] In summary, the embodiment of the utility model provides a high heat dissipation type LED lamp bead structure, wherein:

[0040] On the basis of the lamp bead board 1, the LED lamp bead module 2 and the heat dissipation component 3, the heat dissipation component 3 is improved, and the heat dissipation component 3 is formed by combining an upper fin heat sink 31, a semiconductor cooling sheet 32, a lower fin heat sink 33 and a locking structure 4, and the lamp bead board 1 and the LED lamp bead module 2 are installed in the installation groove 3111, and the heat is dissipated to the upper fin heat sink 31, and then the semiconductor cooling sheet 32 ​​is used for active cooling, and its cold end surface 321 accelerates the cooling of the upper fin heat sink 31, further accelerating the lamp bead board 1 and the LED lamp bead module 2, achieving a good heat dissipation effect, and at the same time, the lower fin heat sink 33 is also used to dissipate the heat of the hot end surface 322 of the semiconductor cooling sheet 32, and the semiconductor cooling sheet 32 ​​is protected from heat dissipation, which significantly improves the overall heat dissipation efficiency of the high heat dissipation type LED lamp bead structure, effectively reduces the working temperature of the LED lamp bead module 2, thereby ensuring its luminous efficiency and stability, and at the same time, reduces heat accumulation, reduces the risk of aging and damage of the LED lamp bead module 2 due to high temperature, and significantly extends the service life of the LED lamp bead module 2.

[0041] The above is only a preferred implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present application. These improvements and substitutions should also be regarded as the scope of protection of the present application.

Claims

1. A high heat dissipation LED lamp bead structure, comprising a lamp bead board, an LED lamp bead module and a heat dissipation component; the LED lamp bead module is connected to the lamp bead board; characterized in that: The heat dissipation component comprises: An upper fin heat sink, the top of which is provided with a mounting groove adapted to be snap-fitted with the lamp bead board; The semiconductor cooling sheet has a top end surface and a bottom end surface which are a cold end surface and a hot end surface respectively; the lower end of the upper fin heat sink is closely connected to the cold end surface; A lower fin heat sink, the upper end of which is closely connected to the hot end surface; The upper fin heat sink, the semiconductor cooling fin and the lower fin heat sink are connected as a whole through the locking structure.

2. The high heat dissipation LED lamp bead structure according to claim 1, characterized in that: The locking structure includes a locking bolt; the upper fin heat sink is provided with a first mounting hole opened on the bottom of the mounting groove; the semiconductor refrigeration plate is provided with a second mounting hole passing through the upper and lower ends thereof; the lower fin heat sink is provided with a third mounting hole; the locking bolt is adapted to pass through the third mounting hole, the second mounting hole and the first mounting hole in sequence to connect.

3. The high heat dissipation LED lamp bead structure according to claim 2, characterized in that: The locking structure also includes an upper positioning ring and a lower positioning ring; the upper positioning ring and the lower positioning ring are respectively connected to the lower edge of the upper fin radiator and the upper edge of the lower fin radiator; the upper end of the semiconductor refrigeration sheet is adapted to be embedded in the upper positioning ring; the lower end of the semiconductor refrigeration sheet is adapted to be embedded in the lower positioning ring.

4. The high heat dissipation LED lamp bead structure according to claim 1 or 2, characterized in that: The upper fin heat sink comprises a heat-conducting slot body, a heat-conducting wire tube and an upper heat-dissipating fin; the mounting slot is located on the heat-conducting slot body; the upper end of the heat-conducting wire tube is connected to the bottom surface of the heat-conducting slot body and communicates with the inner cavity of the mounting slot; A plurality of upper heat dissipation fins are connected to the heat conducting wire tube and are evenly arranged around the central axis of the heat conducting wire tube; the upper end of each upper heat dissipation fin is connected to the bottom surface of the heat conducting trough body; the lower end of the heat conducting wire tube and each upper heat dissipation fin is tightly connected to the cold end surface.

5. The high heat dissipation LED lamp bead structure according to claim 1 or 2, characterized in that: The lower fin heat sink comprises a base plate and lower heat dissipating fins; a plurality of lower heat dissipating fins are evenly spaced and arranged on the base plate; the upper end of each lower heat dissipating fin is tightly connected to the hot end surface.

6. The high heat dissipation LED lamp bead structure according to claim 1, characterized in that: The upper fin heat sink and the lower fin heat sink are both made of aluminum or aluminum alloy.

7. The high heat dissipation LED lamp bead structure according to claim 1, characterized in that: The lower end surface of the lamp bead plate is connected to the heat dissipation component by laying a layer of thermal conductive silicone grease.

8. The high heat dissipation LED lamp bead structure according to claim 1, characterized in that: The LED lamp bead module is formed by arranging a plurality of LED lamp bead arrays.

9. The high heat dissipation LED lamp bead structure according to claim 1, characterized in that: The lamp bead plate is adapted to be mounted with a light cover for covering the LED lamp bead module.

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