Wafer film pasting detection device

Abstract

The utility model provides a wafer film pasting detection device, which is provided with a base, a support mechanism and a detector, a tray is arranged on the base, the tray is used for bearing a wafer, a wafer pasting ring is pasted on the edge of the wafer, the support comprises a mounting frame, the mounting frame is suspended above the tray, and the detector is arranged on the mounting frame. The tray is arranged on the mounting rack, the detector is arranged on the mounting rack and suspended above the tray, and the detector can provide emergent light to a fixed position of the tray and detect reflected light so as to judge whether a film of a wafer is within a standard range. By detecting the intensity of the reflected light at the fixed position of the wafer, the positions of the wafer patch ring and the film layer of the film-pasted wafer are detected in real time, the deviation condition of the film layer is found in time, and the quality and the accuracy of a product are greatly improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductors, and in particular to a wafer film attachment detection device. Background Art

[0002] The back-side process of the wafer mainly includes: (1) Film pasting: applying a protective film to the front-side device of the wafer before grinding; (2) Taiko thinning: grinding the back side of the wafer with a diamond grinding wheel (retaining a ring of about 3 mm original thickness at the edge to support the wafer); (3) Film peeling: after grinding, using ultraviolet light to cure the front protective film and hot melt adhesive to remove the front protective film; (4) Back-side silicon etching: removing the rough grinding lines on the back side of the wafer by silicon etching, effectively reducing the contact resistance; (5) Back-side implantation: implanting specific ions into the target area on the back side of the wafer to change the material properties; (6) Laser annealing: performing laser rapid annealing on the back side of the wafer after ion implantation (such as silicon-based IGBT wafer) to achieve activation depth and effectively repair the lattice structure damaged by ion implantation; (7) Back-side metal sputtering: using physical vapor deposition (PVD) to deposit metal on the back side of the wafer. (8) Vacuum mounting: The dicing tape, iron ring, and Taiko-thinned wafer are bonded together by vacuum pumping and labeled with a barcode (Lot ID) for easy identification by the packaging factory; (9) Wafer ring removal: A diamond blade is used to cut and remove the wafer ring around the edge of the Taiko-thinned wafer; (10) Wafer dicing: A diamond blade is used to divide the wafer into individual chips.

[0003] During the vacuum lamination step, it is easy for the film layer to be attached unevenly but missed in the production line, which can lead to problems such as film wrinkles and abnormal adhesion between the film layer and the iron ring in subsequent processes.

[0004] A wafer film attaching detection device is provided to detect the position of a wafer attaching ring and a film in real time during the film attaching process, and to promptly discover the deviation of the film layer, which can greatly improve the quality and accuracy of the product. Utility Model Content

[0005] The technical problem to be solved by the utility model is to provide a wafer film mounting detection device, which is used to detect the position of the wafer mounting ring and the film during the film mounting process and timely discover the deviation of the film layer.

[0006] In order to solve the above problems, the utility model provides a wafer film detection device, including: a base, the base is provided with a tray, the tray is used to carry the wafer, and the edge of the wafer is attached with a wafer bonding ring; a support mechanism, the support mechanism includes a mounting frame, and the mounting frame is suspended above the tray; a detector, installed on the mounting frame and suspended above the tray, the detector can provide outgoing light to a fixed position of the tray and detect reflected light to determine whether the film of the wafer is within a standard range.

[0007] In some embodiments, the wafer film detection device also includes a laser light source for providing laser to the detector; and a fiber optic amplifier, which is arranged in the optical path of the laser light source and / or the detector and is used to amplify the outgoing light and / or the reflected light.

[0008] In some embodiments, the wafer film attachment detection device further includes an alarm light for issuing an alarm when the detector determines that the film attachment of the wafer is outside a standard range.

[0009] In some embodiments, the alarm light includes a green light and a red light. The green light is on when the detector determines that the film of the wafer is within a standard range, and the red light is on when the detector determines that the film of the wafer is outside the standard range.

[0010] In some embodiments, the wafer bonding ring is an iron ring.

[0011] In some embodiments, the wafer film attachment detection device includes a plurality of the detectors, and the plurality of the detectors are distributed along the circumferential direction of the wafer.

[0012] In some embodiments, the number of the detectors is 3 or 4.

[0013] In some embodiments, the bracket mechanism further includes a support frame, which is respectively connected to the base and the mounting frame, and is used to support the mounting frame.

[0014] In some embodiments, the mounting frame is two connecting rods, and one end of each connecting rod is connected to the supporting frame.

[0015] In some embodiments, the mounting frame is a V-shaped connecting rod, and both ends of the V-shaped connecting rod are respectively connected to the supporting frame.

[0016] The above technical scheme, by setting a base, a bracket mechanism, and a detector, the base is provided with a tray, the tray is used to carry the wafer, the edge of the wafer is affixed with a wafer bonding ring, the bracket includes a mounting frame, the mounting frame is suspended above the tray, the detector is installed on the mounting frame and suspended above the tray, the detector can provide outgoing light to the fixed position of the tray and detect the reflected light to determine whether the film of the wafer is within the standard range. The above scheme is based on the difference in light reflection intensity of different materials. By detecting the reflected light intensity at the fixed position of the wafer, the position of the wafer bonding ring and the film layer of the wafer after film bonding is detected in real time, the film layer deviation is discovered in time, and the quality and accuracy of the product are greatly improved.

[0017] It should be understood that the above general description and the detailed description below are only exemplary and explanatory and cannot limit the present invention. The techniques, methods and devices known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the techniques, methods and devices should be considered as part of the authorization specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments of the utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 It is a structural schematic diagram of a wafer film attachment detection device provided by the first embodiment of the utility model;

[0020] Figure 2 It is a schematic diagram of the case where the outgoing light of the detector provided in the first embodiment of the utility model irradiates the surface of the wafer;

[0021] Figure 3 It is a structural schematic diagram of a wafer film attachment detection device provided by the second embodiment of the utility model;

[0022] Figure 4 It is a schematic diagram of the case where the outgoing light of the detector provided in the second embodiment of the present utility model irradiates the surface of the wafer. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Please refer to Figure 1-2 , Figure 1 It is a schematic diagram of the structure of the wafer film detection device provided by the first embodiment of the utility model. Figure 2 It is a schematic diagram of the case where the outgoing light of the detector provided in the first embodiment of the utility model irradiates the surface of the wafer.

[0025] like Figure 1 As shown, the wafer film detection device includes: a base 11, a support mechanism 12, and a detector 13. Among them, a tray 111 is arranged on the base 11, and the tray 111 is used to carry the wafer 10, and the edge of the wafer 10 is attached with a wafer bonding ring 19; the support mechanism 12 includes a mounting frame 121, and the mounting frame 121 is suspended above the tray 111; the detector 13 is installed on the mounting frame 121 and suspended above the tray 111, and the detector 13 can provide outgoing light to a fixed position located at the tray 111 and detect the reflected light to determine whether the film of the wafer is within the standard range. The standard range is a specific standard for determining the position of the film layer of the wafer on the surface of the wafer.

[0026] In this embodiment, the wafer film attachment detection device further includes a laser light source, and the laser light source is used to provide laser to the detector 13 .

[0027] In this embodiment, the wafer 10 is formed by thinning the wafer, the wafer bonding ring, and the adhesive blue film. The wafer bonding ring 19 is used to support the wafer itself in the subsequent process, and the wafer bonding ring 19 is an iron ring.

[0028] Continue reading Figure 1, the support mechanism 12 includes a mounting frame 121, and the mounting frame 121 is two parallel connecting rods, and the plane where the two connecting rods are located is parallel to the tray 111. The support mechanism 12 also includes a support frame 122, and the support frame 122 is connected to the base 11, and is used to support and fix the mounting frame 121. In this embodiment, the support frame 122 is two columns perpendicular to the base 11, one end of the column is fixed to the base 11, and the other end of the column is fixedly connected to one end of the connecting rod, so that the connecting rods are arranged in parallel and located above the tray 111. In this embodiment, one end of the connecting rod is connected to the top of one of the columns by screws to realize the connection between the mounting frame 121 and the support frame 122. Each of the connecting rods has two extensions, and each of the extensions is equipped with a detector 13.

[0029] In some embodiments, the mounting frame 121 and the supporting frame 122 are composed of an integrally formed connecting frame, a portion of the connecting frame is fixed to the base 11 , and another portion of the connecting frame is located above the tray 111 and can be used to install the detector 13 .

[0030] The detector 13 is a reflective detection element, and includes a light projector for emitting outgoing light and a light receiver for receiving reflected light. The detector 13 emits outgoing light to a fixed position on the tray 111. Therefore, when the wafer 10 is placed on the tray 111 in the same manner, the light point of the outgoing light of the detector 13 is fixed at the position of the surface of the wafer 10. The outgoing light is red light.

[0031] The wafer film attaching detection device includes a plurality of detectors 13, and the plurality of detectors 13 are distributed along the circumferential direction of the wafer 10. The detectors 13 provide outgoing light to a fixed position in the circumferential direction of the wafer 10 and receive reflected light.

[0032] In this embodiment, the number of the detectors 13 is 4, and the detectors 13 are evenly distributed along the circumference of the wafer 10. Figure 2 As shown, the position of the light spot when the outgoing light of the detector 13 irradiates the surface of the wafer 10 coincides with the detection point 18, and the four detection points 18 are located in the outer edge area of ​​the wafer bonding ring 19 and are evenly distributed along the circumference of the wafer 10. When the reflected light intensity detected by the detection points 18 does not exceed the threshold range, it is considered that the film layer is not biased. The threshold range is the reflected light intensity range obtained based on experimental data.

[0033] In some embodiments, the number of the detectors exceeds 4, for example, the number of the detectors is 5 or 6, the light spots emitted by the detectors are all located in the outer edge area of ​​the wafer patch ring and are evenly distributed along the circumferential direction of the wafer 10, and accordingly, the number of detection points corresponding to the light spots emitted by the detectors increases, making the film layer position detection more accurate.

[0034] In some embodiments, the detectors are not evenly distributed along the circumference of the wafer, but are relatively densely arranged at positions where the film layer is prone to deviation.

[0035] The wafer film detection device also includes an optical fiber amplifier, which is arranged on the optical path of the laser light source and / or the detector, and is used to amplify the emitted light and / or the reflected light. In this embodiment, the laser light source and the optical fiber amplifier are integrated into the same optical fiber device 15, and the detector 13 is connected to the optical fiber device 15 through an optical fiber. After detecting the reflected light, the detector 13 feeds back the signal to the optical fiber device 15.

[0036] In this embodiment, the wafer film attachment detection device further includes an alarm light 16. The alarm light 16 includes a green light and a red light. When the detector 13 determines that the film attachment of the wafer 10 is within the standard range, the green light is on, and when the detector 13 determines that the film attachment of the wafer 10 is outside the standard range, the red light is on. In another embodiment, the alarm light is one, and the detection result is reflected by different ways of lighting the light. When the alarm light flashes continuously, it indicates that the film attachment detection is abnormal.

[0037] The alarm light 16 is connected to the optical fiber device 15, and the optical fiber device 15 sends the feedback signal of the detector 13 to the alarm light 16 to control the on and off of the alarm light 16. Figure 1 As shown, the wafer film attachment detection device further includes a panel connected to the base 11 , and the alarm light 16 is installed on the panel.

[0038] In some embodiments, the warning light 16 may be integrated into the optical fiber device 15 .

[0039] In this embodiment, a plurality of foot cups 17 are provided at the bottom of the base 11, and the foot cups 17 are used to support the base 11. In some embodiments, the foot cups 17 also have an anti-slip function.

[0040] When the wafer filming detection device is used to detect the filming position of the wafer 10, the difference in the material between the wafer surface film layer and the wafer bonding ring 19 is used, that is, the obvious difference in the reflected light intensity between the wafer surface film layer and the wafer bonding ring 19 is used to determine the position of the wafer surface film layer. If the intensity value of the reflected light received by the optical fiber device 15 at any of the detection points 18 obviously exceeds the threshold range of the reflected light intensity of the wafer surface film layer, it means that the reflected light of the abnormal detection point 18 is not reflected by the wafer surface film layer, that is, the film layer on the surface of the wafer 10 does not cover the abnormal detection point 18, and the filming of the wafer 10 is outside the standard range, so it can be determined that the film layer of the wafer 10 is biased.

[0041] Please refer to Figure 3-4 , Figure 3 : is a schematic diagram of the structure of a wafer film attachment detection device provided by the second embodiment of the utility model, Figure 4 It is a schematic diagram of the case where the outgoing light of the detector provided in the second embodiment of the present utility model irradiates the surface of the wafer.

[0042] like Figure 3 As shown, the wafer film detection device includes: a base 21, a support mechanism 22, a detector 23 and a laser light source. Among them, a tray 211 is arranged on the base 21, and the tray 211 is used to carry the wafer 20, and the edge of the wafer 20 is attached with a wafer bonding ring 29; the support mechanism 22 includes a mounting frame 221, and the mounting frame 221 is suspended above the tray 211; the detector 23 is installed on the mounting frame 221 and suspended above the tray 211, and the detector 23 can provide outgoing light to the fixed position of the tray 211 and detect the reflected light to determine whether the film of the wafer is within the standard range. The standard range is a specific standard for judging whether the film position of the wafer is normal.

[0043] In this embodiment, the wafer film attachment detection device further includes a laser light source, and the laser light source is used to provide laser to the detector 23 .

[0044] In this embodiment, the mounting frame 221 is a V-shaped connecting rod, the bending portion of the V-shaped connecting rod is provided with a detector 23, and the V-shaped connecting rod is also provided with an extension portion, each of which is provided with a detector 23. The detector 23 is a reflective detection element, and the detector 23 includes a projector for emitting outgoing light and a light receiver for receiving reflected light. The detector 23 emits outgoing light to a fixed position located on the tray 211, and then when the wafer 20 is placed on the tray 211 in the same manner, the light spot of the outgoing light of the detector 23 is fixed at the position of the surface of the wafer 20.

[0045] In this embodiment, the V-shaped connecting rod is integrally formed. In another embodiment, the V-shaped connecting rod is formed by connecting two columnar connecting rods.

[0046] The support mechanism 22 further includes a support frame 222, which is connected to the base 21 and used to support the mounting frame 221. Both ends of the V-shaped connecting rod are fixedly connected to the support frame 222, so that the V-shaped connecting rod is located above the tray 211 and the plane where the V-shaped connecting rod is located is parallel to the tray 211. The emitted light is a red light.

[0047] In this embodiment, the number of the detectors 23 is 3. The multiple detectors 23 are evenly distributed along the circumference of the wafer 10 .

[0048] like Figure 4 As shown, the position of the light spot when the outgoing light of the detector 23 irradiates the surface of the wafer 20 coincides with the detection point 28, and the three detection points 28 are located in the outer edge area of ​​the wafer bonding ring 29 and are evenly distributed along the circumferential direction of the wafer 10. When the reflected light intensity detected by the detection point 28 does not exceed the threshold range, it is considered that the film layer is not biased. The threshold range is the reflected light intensity range obtained based on experimental data.

[0049] The above technical scheme, by setting a base, a bracket mechanism, and a detector, the base is provided with a tray, the tray is used to carry the wafer, the edge of the wafer is affixed with a wafer bonding ring, the bracket includes a mounting frame, the mounting frame is suspended above the tray, the detector is installed on the mounting frame and suspended above the tray, the detector can provide outgoing light to the fixed position of the tray and detect the reflected light to determine whether the film of the wafer is within the standard range. The above scheme is based on the difference in light reflection intensity of different materials. By detecting the reflected light intensity at the fixed position of the wafer, the position of the wafer bonding ring and the film layer of the wafer after film bonding is detected in real time, the film layer deviation is discovered in time, and the quality and accuracy of the product are greatly improved.

[0050] It should be noted that, in this document, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion. The various embodiments in this specification are described in a related manner, and the same and similar parts between the various embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0051] The above is only a preferred embodiment of the utility model, and is not intended to limit the protection scope of the utility model. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the utility model, and these improvements and modifications should also be regarded as the protection scope of the utility model.

Claims

1. A wafer film detection device, characterized in that: include: A base, wherein a tray is arranged on the base, and the tray is used to carry a wafer, and a wafer patch ring is attached to the edge of the wafer; A support mechanism, the support mechanism includes a mounting frame, the mounting frame is suspended above the tray; a detector is installed on the mounting frame and suspended above the tray, the detector can provide outgoing light to a fixed position of the tray and detect reflected light to determine whether the film of the wafer is within a standard range.

2. The wafer film attachment detection device according to claim 1, characterized in that: The wafer film attaching detection device also includes: A laser light source, used to provide laser light to the detector; An optical fiber amplifier is arranged in the optical path of the laser light source and / or the detector and is used to amplify the emitted light and / or the reflected light.

3. The wafer film attachment detection device according to claim 1, characterized in that: The wafer film attachment detection device also includes an alarm light, which is used to issue an alarm when the detector determines that the film attachment of the wafer is outside the standard range.

4. The wafer film attachment detection device according to claim 3, characterized in that: The alarm light includes a green light and a red light. When the detector determines that the film of the wafer is within the standard range, the green light is on, and when the detector determines that the film of the wafer is outside the standard range, the red light is on.

5. The wafer film attachment detection device according to claim 1, characterized in that: The wafer patch ring is an iron ring.

6. The wafer film attachment detection device according to claim 1, characterized in that: The wafer film attachment detection device includes a plurality of the detectors, and the plurality of the detectors are distributed along the circumferential direction of the wafer.

7. The wafer film attachment detection device according to claim 6, characterized in that: The number of the detectors is 3 or 4.

8. The wafer film attachment detection device according to claim 1, characterized in that: The bracket mechanism also includes a support frame, which is connected to the base and the mounting frame respectively, and is used to support the mounting frame.

9. The wafer film attachment detection device according to claim 8, characterized in that: The mounting frame is composed of two connecting rods, and one end of each connecting rod is connected to the supporting frame.

10. The wafer film attaching detection device according to claim 8, characterized in that: The mounting frame is a V-shaped connecting rod, and both ends of the V-shaped connecting rod are respectively connected to the supporting frame.

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