Chip aging device

Abstract

The utility model belongs to the technical field of laser processing, and more particularly relates to a chip aging device, the chip aging device provided by the embodiment of the utility model comprises a base, a cover plate and a light receiving water cooling piece, the base is provided with a limiting piece, the limiting piece is provided with a plurality of limiting holes for placing chips, the cover plate is arranged on the base in a covering manner, and the light receiving water cooling piece is arranged on the cover plate. The cover plate comprises a plurality of conductive electrode plates, the electrode plates are used for abutting against the chips on the limiting pieces to electrify the chips, the light receiving and cooling assembly comprises a light receiving piece and a first cooling piece, the light receiving piece is arranged on one side of the base to receive light emitted by the chips, and the first cooling piece is arranged on the other side of the base to cool the chips. And the first cooling member is connected with the light receiving member to dissipate heat of the light receiving member. According to the invention, aging testing can be carried out on batch chips, and the working efficiency is improved.

Description

Technical Field

[0001] The present application belongs to the field of laser processing technology, and more specifically, relates to a chip aging device. Background Art

[0002] With the rapid development of science and technology in recent years, the semiconductor laser industry has become a pillar supporting the development of laser-related industries. Its industrial chain covers upstream basic raw materials, chip manufacturing and testing, midstream packaging technology and device manufacturing, testing and analysis, and downstream laser system integration and application industries. High-reliability and long-life semiconductor lasers have become a common demand in the industry, and the test aging life of lasers plays a very important role in the production of semiconductor lasers.

[0003] At present, the test process of aging test of laser chips is to perform aging test on a single chip. If aging test is performed on batches of chips, it will take a long time and the work efficiency will be low. Utility Model Content

[0004] The embodiment of the present application provides a chip aging device, which can perform aging tests on batches of chips, thereby improving work efficiency.

[0005] The technical solution adopted in the embodiment of the present application is: to provide a chip aging device, including:

[0006] The base is provided with a limiting member, and the limiting member is provided with a plurality of limiting holes for placing the chip;

[0007] A cover plate, which is disposed on the base, and includes a plurality of conductive electrode sheets, and the electrode sheets are used to abut against the chip on the limiting member to energize the chip;

[0008] The light collecting and cooling assembly comprises a light collecting member and a first cooling member. The light collecting member is arranged on one side of the base to receive the light diverged by the chip. The first cooling member is connected to the light collecting member to dissipate heat from the light collecting member.

[0009] Optionally, the light receiving component includes a plurality of reflective surfaces, which are arranged opposite to the light through hole, and are used to change the direction of the laser to prevent the laser from being reflected onto the chip, and the first cooling component is connected to a side of the light receiving component close to the reflective surface.

[0010] Optionally, the light receiving component includes a plurality of light receiving cavities, each of which is provided with a light through hole for light emitted by the chip, and the reflective curved surface is arranged on the inner wall of the light receiving cavity, and the reflective curved surface is arranged opposite to the light through hole.

[0011] Optionally, the light-collecting cooling assembly further includes a light-blocking member, which is rotatably disposed on the light-collecting member. The light-blocking member may be covered on the cover plate to block the gap between the cover plate and the light-collecting member to prevent light generated by the chip during the aging test from being exposed.

[0012] Optionally, a first protrusion and a second protrusion are provided on the electrode sheet, and the chips on the limiting member are connected in series by abutting against two adjacent chips on the limiting member through the first protrusion and the second protrusion.

[0013] Optionally, the cover plate also includes a mounting piece and a plurality of pressure block assemblies, the electrode sheet is inserted into a side of the mounting piece close to the chip, the first protrusion and the second protrusion on the electrode sheet extend out of the mounting piece, a limiting groove is provided on the mounting piece, the pressure block assembly is installed in the limiting groove of the mounting piece and abuts against the electrode sheet, and the pressure block assembly is used to push the first protrusion and the second protrusion of the electrode sheet toward the chip so that the first protrusion and the second protrusion abut against two adjacent chips on the limiting piece.

[0014] Optionally, the pressure block assembly includes a pressure block body, an elastic member and an adjusting thread member, the pressure block body is installed in a limiting groove of the mounting member, the adjusting thread member is passed through the pressure block body and the mounting member, the adjusting thread member is threadedly connected to the base, and the two ends of the elastic member are respectively abutted against the adjusting thread member and the pressure block body.

[0015] Optionally, the pressure block body includes a clamping portion and a connecting portion, the clamping portion is connected to the connecting portion, a clamping hole is provided in the limiting groove of the mounting member, the connecting portion of the pressure block body is provided in the limiting groove, and the clamping portion of the pressure block body is clamped in the clamping hole, the adjusting thread member is passed through the connecting portion and the limiting groove, and one end of the elastic member abuts against the connecting portion.

[0016] Optionally, the pressure block body also includes a first abutment portion and a second abutment portion, the first abutment portion and the second abutment portion are connected to the connecting portion and extend out of the limiting groove, and the first abutment portion and the second abutment portion are respectively used to abut with the first protrusion portion and the second protrusion portion on two adjacent electrode sheets.

[0017] Optionally, an axle pin is provided on the base, and a shaft sleeve is provided on the mounting member, and the shaft sleeve is sleeved with the axle pin.

[0018] Optionally, a second cooling element is provided at the bottom of the base.

[0019] The chip aging device provided in the embodiment of the present application has the beneficial effect that: the chip aging device in the embodiment of the present application places a plurality of chips on the limiting member on the base, and then covers the base with a cover plate, and the electrode sheet on the cover plate conducts electricity to the chip on the limiting member, thereby realizing the aging test of batches of chips and improving the work efficiency;

[0020] Furthermore, the light receiving component of the light receiving cooling assembly can receive the laser emitted during the chip aging test. The temperature of the light receiving component rises after receiving the laser emitted by the chip. The first cooling component can dissipate heat for the light receiving component. This ensures the temperature stability of the aging test environment, prevents the ambient temperature from affecting the chip aging test, and improves the test accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0022] Figure 1 A schematic diagram of the three-dimensional structure of a chip aging device provided in an embodiment of the present application;

[0023] Figure 2 A top view of a chip aging device provided in an embodiment of the present application;

[0024] Figure 3 For along Figure 2 Cross-sectional structural diagram of the middle DD line;

[0025] Figure 4 A schematic diagram of the three-dimensional structure of the cover plate used in the embodiment of the present application;

[0026] Figure 5 for Figure 4 A local enlarged schematic diagram at B;

[0027] Figure 6 A top view of the cover plate used in the embodiment of the present application;

[0028] Figure 7 For along Figure 6 The cross-sectional structure diagram along the AA line;

[0029] Figure 8 A schematic diagram of the three-dimensional structure of the base used in the embodiment of the present application;

[0030] Fig. 9 A side view of the light receiving member used in the embodiment of the present application;

[0031] Fig.10 For along Fig. 9 Cross-sectional structural diagram along the CC line.

[0032] Among them, the reference numerals in the figure are:

[0033] 1. Base;

[0034] 11. Limiting member; 12. Axle pin; 13. Second cooling member;

[0035] 2. Cover plate;

[0036] 21, electrode sheet; 211, first protrusion; 212, second protrusion;

[0037] 22, mounting part; 221, limiting groove; 222, clamping hole; 223, shaft sleeve;

[0038] 23. Press block assembly; 231. Press block body; 232. Elastic member; 233. Adjusting thread member;

[0039] 2311, clamping portion; 2312, connecting portion; 2313, first abutting portion; 2314, second abutting portion;

[0040] 3. Light collecting and cooling components;

[0041] 31. light receiving member; 32. first cooling member; 33. light blocking member;

[0042] 311. light-through hole; 312. reflective curved surface; 313. light-collecting cavity. DETAILED DESCRIPTION

[0043] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0044] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0045] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0046] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0047] See also Figure 1 , Figure 2 and Figure 3 , the chip aging device provided in the embodiment of the present application is now described. The chip aging device provided in the embodiment of the present application includes a base 1, a cover plate 2 and a light-collecting water-cooling component. Among them, a limiting member 11 is provided on the base 1, and a plurality of limiting holes are provided on the limiting member 11 to place the chip. The cover plate 2 is covered on the base 1, and the cover plate 2 includes a plurality of conductive electrode sheets 21, and the electrode sheets 21 are used to abut against the chip on the limiting member 11 to energize the chip. The light-collecting cooling component 3 includes a light-collecting member 31 and a first cooling member 32. The light-collecting member 31 is provided on one side of the base 1 to receive the light diverged by the chip, and the first cooling member 32 is connected to the light-collecting member 31 to dissipate heat from the light-collecting member 31.

[0048] The chips in the embodiments of the present application can be connected in series or in parallel for electrical conduction.

[0049] The stopper 11 is mounted on the base 1 by bolts, and can be easily disassembled and assembled. Different types of stoppers 11 can be replaced according to the chip model to adapt to different chips.

[0050] The light receiving element 31 of the light receiving cooling assembly 3 may be a flat heat conducting plate for receiving laser light, and the heat is dissipated by the first cooling element 32 after the temperature of the flat heat conducting plate rises. The first cooling element 32 of the light receiving cooling assembly 3 may be a cooling fan, or a cooling water tank with cooling water flowing therein, the cooling water tank is connected to the light receiving element 31, and a water inlet pipe and a water outlet pipe are respectively provided at both ends of the cooling water tank, the cooling water enters the cooling water tank from the water inlet pipe, passes through the cooling water tank to take away the heat on the light receiving element 31, and finally flows out from the water outlet pipe.

[0051] In the embodiment of the present application, after placing a plurality of chips on the limiting member 11 on the base 1, the cover plate 2 is covered on the base 1. The electrode sheet 21 on the cover plate 2 is conductive to the chips on the limiting member 11, thereby realizing the aging test of batches of chips and improving the work efficiency. The light receiving member 31 of the light receiving cooling assembly 3 can receive the light emitted during the chip aging test. The temperature of the light receiving member 31 rises after receiving the light emitted by the chip. The first cooling member 32 can dissipate heat for the light receiving member 31, thereby ensuring the temperature stability of the aging test environment, preventing the ambient temperature from affecting the chip aging test, and improving the test accuracy.

[0052] See also Figure 3 , Fig. 9 and Fig.10 The light receiving component 31 includes a plurality of reflective curved surfaces 312 , and the reflective curved surfaces 312 are used to change the direction of the laser to prevent the laser from being reflected onto the chip. The first cooling component 32 is connected to a side of the light receiving component 31 close to the reflective curved surfaces 312 .

[0053] The light emitted by the chip during the aging test is not a converged laser beam, but divergent light in different directions. The divergent light changes direction after hitting the reflective surface 312, and the probability of reflecting back to the chip surface is reduced, preventing the temperature of the chip surface from rising due to light reflection.

[0054] The light receiving element 31 includes a plurality of light receiving cavities 313 , each of which is provided with a light through hole 311 for light emitted by the chip. The reflective curved surface 312 is provided on the inner wall of the light receiving cavity 313 , and the reflective curved surface 312 is arranged opposite to the light through hole 311 .

[0055] Each light receiving cavity 313 corresponds to a chip, and the laser emitted by the chip enters the light receiving cavity 313 from the light through hole 311 and is projected onto the reflective curved surface 312 in the light receiving cavity 313. Arranging multiple light receiving cavities 313 can prevent the laser emitted by the chip from being reflected onto adjacent chips. The light through hole 311 can be a round hole or a waist-shaped hole.

[0056] The light-collecting cooling assembly 3 also includes a light-blocking member 33, which is rotatably disposed on the light-collecting member 31. The light-blocking member 33 can be covered on the cover plate 2 to block the gap between the cover plate 2 and the light-collecting member 31 to prevent the light generated by the chip during the aging test from being exposed.

[0057] The light blocking member 33 is a light blocking plate, which is rotatably mounted on the light receiving member 31 through a hinge. During the aging test, the light blocking plate can be rotated above the cover plate 2 to block scattered light during chip aging and prevent the light generated by the chip during the aging test from being exposed.

[0058] See also Figures 4 to 7 The electrode sheet 21 is provided with a first protruding portion 211 and a second protruding portion 212 , and the first protruding portion 211 and the second protruding portion 212 abut against two adjacent chips on the limiting member 11 to connect the chips on the limiting member 11 in series.

[0059] The chip has a positive electrode and a negative electrode. The first protrusion 211 of the electrode sheet 21 abuts against the negative electrode of the chip N, and the second protrusion 212 of the electrode sheet 21 abuts against the positive electrode of the chip P. The chip N is adjacent to the chip P, so that the chips can be connected in series. When the number of chips is n, the number of electrode sheets 21 can be set to n-1. When power is turned on, it is only necessary to turn on the positive electrode of the chip at one end of the limiter 11 and the negative electrode of the chip at the other end of the limiter 11. The series connection of chips can reduce the number of wires and prevent the wires from being entangled.

[0060] The cover plate 2 also includes a mounting member 22 and a plurality of pressure block assemblies 23. The electrode sheet 21 is inserted into the mounting member 22 on a side close to the chip. The first protrusion 211 and the second protrusion 212 on the electrode sheet 21 extend out of the mounting member 22. A limiting groove 221 is provided on the mounting member 22. The pressure block assembly 23 is installed in the limiting groove 221 of the mounting member 22 and abuts against the electrode sheet 21. The pressure block assembly 23 is used to push the first protrusion 211 and the second protrusion 212 of the electrode sheet 21 toward the chip so that the first protrusion 211 and the second protrusion 212 abut against two adjacent chips on the limiting member 11.

[0061] A slot is provided on one side of the mounting member 22 close to the chip, and the electrode sheet 21 can be inserted into the slot. The first protrusion 211 and the second protrusion 212 of the motor sheet can be exposed from the mounting member 22 and abut against the chip.

[0062] The pressing block assembly 23 can prevent the chips connected in series from being disconnected due to the first protrusion 211 or the second protrusion 212 of the electrode sheet 21 not being in contact with the chip.

[0063] The pressing block assembly 23 may include an elastic member 232 and an abutment member. The limiting groove 221 of the mounting member 22 may open toward the electrode sheet 21 . The elastic member 232 is installed in the limiting groove 221 and connected to the abutment member. The abutment member is used to abut against the electrode sheet 21 .

[0064] Preferably, the pressure block assembly 23 includes a pressure block body 231, an elastic member 232 and an adjusting thread member 233, the pressure block body 231 is installed in the limiting groove 221 of the mounting member 22, the adjusting thread member 233 is passed through the pressure block body 231 and the mounting member 22, the adjusting thread member 233 is threadedly connected to the base 1, and the two ends of the elastic member 232 are respectively abutted against the adjusting thread member 233 and the pressure block body 231.

[0065] The elastic member 232 may be a spring, and the adjusting screw member 233 may be a screw or a screw rod. The spring is sleeved on the adjusting screw member 233, one end of the spring abuts against the head of the adjusting screw member 233, and the other end of the spring abuts against the pressing block body 231. The cover plate 2 is covered on the base 1, and the electrode sheet 21 on the cover plate 2 is located above the chip on the base 1. When the adjusting screw member 233 on the pressing block assembly 23 is threadedly connected with the threaded hole on the base 1, the head of the adjusting screw member 233 can compress the spring, and the spring pushes the pressing block body 231 to move toward the electrode sheet 21, so that the pressing block body 231 abuts against the electrode sheet 21, and the first protrusion 211 and the second protrusion 212 on the electrode sheet 21 abut against two adjacent chips on the stopper 11, so as to prevent the first protrusion 211 or the second protrusion 212 of the electrode sheet 21 from not abutting against the chip, resulting in a circuit break between the chips connected in series.

[0066] The elastic member 232 may also be an elastic member such as elastic silicone provided between the head of the adjusting screw member 233 and the pressing block body 231 .

[0067] The pressure block body 231 includes a clamping portion 2311 and a connecting portion 2312, the clamping portion 2311 is connected to the connecting portion 2312, a clamping hole 222 is provided in the limiting groove 221 of the mounting member 22, the connecting portion 2312 of the pressure block body 231 is provided in the limiting groove 221, and the clamping portion 2311 of the pressure block body 231 is clamped in the clamping hole 222, the adjusting screw member 233 is passed through the connecting portion 2312 and the limiting groove 221, and one end of the elastic member 232 is in contact with the connecting portion 2312.

[0068] The length direction of the clamping portion 2311 is perpendicular to the length direction of the connecting portion 2312. The clamping portion 2311 is clamped in the clamping hole 222 to prevent the pressing block body 231 from escaping from the limiting groove 221. The connecting portion 2312 and the clamping portion 2311 of the pressing block body 231 do not contact the electrode sheet 21.

[0069] The pressure block body 231 also includes a first abutment portion 2313 and a second abutment portion 2314. The first abutment portion 2313 and the second abutment portion 2314 are connected to the connecting portion 2312 and extend out of the limiting groove 221. The first abutment portion 2313 and the second abutment portion 2314 are respectively used to abut against the first protrusion 211 and the second protrusion 212 on two adjacent electrode sheets 21.

[0070] The first abutting portion 2313 and the second abutting portion 2314 are connected to one end of the connecting portion 2312 away from the clamping portion 2311 . The first abutting portion 2313 and the second abutting portion 2314 are exposed in the limiting groove 221 and can abut against the first protruding portion 211 and the second protruding portion 212 on the electrode sheet 21 .

[0071] See also Figure 8 The base 1 is provided with an axle pin 12 , and the mounting member 22 is provided with a shaft sleeve 223 , and the shaft sleeve 223 is sleeved with the axle pin 12 .

[0072] The sleeve 223 is sleeved on the shaft pin 12 so that when the cover plate 2 is placed on the base 1, the electrode sheet 21 on the cover plate 2 can be accurately abutted against the positive electrode or negative electrode of the chip. The base 1 can also be connected to the mounting member 22 by bolts.

[0073] A second cooling element 13 is disposed at the bottom of the base 1 .

[0074] The second cooling member 13 may have the same structure as the first cooling member 32 .

[0075] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A chip aging device, It is characterized in that include: The base is provided with a limiting member, and the limiting member is provided with a plurality of limiting holes for placing the chip; A cover plate, which is disposed on the base, and includes a plurality of conductive electrode sheets, and the electrode sheets are used to abut against the chip on the limiting member to energize the chip; The light collecting and cooling assembly comprises a light collecting member and a first cooling member. The light collecting member is arranged on one side of the base to receive the light diverged by the chip. The first cooling member is connected to the light collecting member to dissipate heat from the light collecting member.

2. The chip aging device according to claim 1, It is characterized in that The light receiving component includes a plurality of reflective curved surfaces, and the reflective curved surfaces are used to change the direction of the laser to prevent the laser from being reflected onto the chip. The first cooling component is connected to a side of the light receiving component close to the reflective curved surfaces.

3. The chip aging device according to claim 2, It is characterized in that The light receiving component includes a plurality of light receiving cavities, each of which is provided with a light through hole for light emitted by a chip, and the reflective curved surface is arranged on the inner wall of the light receiving cavity, and the reflective curved surface is arranged opposite to the light through hole.

4. The chip aging device according to claim 1, It is characterized in that The light-collecting cooling assembly also includes a light-blocking member, which is rotatably disposed on the light-collecting member. The light-blocking member can be covered on the cover plate to block the gap between the cover plate and the light-collecting member to prevent the light generated by the chip during the aging test from being exposed.

5. The chip aging device according to any one of claims 1 to 4, It is characterized in that The electrode sheet is provided with a first protrusion and a second protrusion, and the first protrusion and the second protrusion are in contact with two adjacent chips on the limiting member to connect the chips on the limiting member in series.

6. The chip aging device according to claim 5, It is characterized in that The cover plate also includes a mounting member and a plurality of pressure block assemblies, the electrode sheet is inserted into a side of the mounting member close to the chip, the first protrusion and the second protrusion on the electrode sheet extend out of the mounting member, a limiting groove is provided on the mounting member, the pressure block assembly is installed in the limiting groove of the mounting member and abuts against the electrode sheet, and the pressure block assembly is used to push the first protrusion and the second protrusion of the electrode sheet toward the chip so that the first protrusion and the second protrusion abut against two adjacent chips on the limiting member.

7. The chip aging device according to claim 6, It is characterized in that The pressing block assembly includes a pressing block body, an elastic member and an adjusting thread member. The pressing block body is installed in the limiting groove of the mounting member. The adjusting thread member is passed through the pressing block body and the mounting member. The adjusting thread member is threadedly connected to the base. The two ends of the elastic member are respectively abutted against the adjusting thread member and the pressing block body.

8. The chip aging device according to claim 7, It is characterized in that The pressure block body includes a clamping portion and a connecting portion, the clamping portion is connected to the connecting portion, a clamping hole is provided in the limiting groove of the mounting member, the connecting portion of the pressure block body is provided in the limiting groove, and the clamping portion of the pressure block body is clamped in the clamping hole, the adjusting screw member is passed through the connecting portion and the limiting groove, and one end of the elastic member abuts against the connecting portion.

9. The chip aging device according to claim 8, It is characterized in that The pressure block body also includes a first abutment portion and a second abutment portion, the first abutment portion and the second abutment portion are connected to the connecting portion and extend out of the limiting groove, and the first abutment portion and the second abutment portion are respectively used to abut against the first protrusion and the second protrusion on two adjacent electrode sheets.

10. The chip aging device according to claim 6, It is characterized in that The base is provided with an axle pin, the mounting piece is provided with a shaft sleeve, and the shaft sleeve is sleeve-connected with the axle pin.

11. The chip aging device according to any one of claims 1 to 4, It is characterized in that A second cooling element is arranged at the bottom of the base.

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