Bending-resistant light refraction coupler packaging support, light coupler, circuit board and device thereof
By setting a central limit support sheet in the upper and lower packaging brackets of the optocouple packaging bracket, the problem that the optocouple packaging can easily lead to the collapse of the base island under pressure or vibration is solved, and the ability to resist bending and stress is improved, ensuring the stability of the optocouple.
Patent Information
- Application Number
- CN202421968036.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-14
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2034-08-14
AI Technical Summary
The optocouple package can easily cause the base island to collapse or deform under pressure or vibration, resulting in the photocouple failure.
A flexure-resistant optocoupler packaging bracket is designed. By setting a central limit support piece in the middle of the upper and lower packaging brackets, the overlapping of the limit support piece when connecting the upper and lower packaging brackets is achieved, thereby providing additional support and improving the ability to resist bending and stress.
It effectively prevents the collapse or deformation of the base island caused by pressure or vibration, and ensures that the photocoupler remains stable under various working conditions.
Smart Images
Figure CN222952518U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of optical coupling, and in particular to an anti-bending optical coupling packaging bracket, an optical coupling, a circuit board and a device thereof. Background Art
[0002] Optocoupler (photoelectric coupler), also known as photoelectric isolator, is a device that transmits and isolates electrical signals through optical signals. Its working principle is based on the photoelectric effect, which is the process of converting electrical signals into optical signals and then converting optical signals back into electrical signals.
[0003] Optocoupler packaging is an important electronic packaging technology. It realizes the functions of electrical connection, physical protection and heat dissipation of the circuit by packaging optoelectronic devices in a miniaturized and compact package. The materials, forms, process flow and application fields of optocoupler packaging are rich in technical content. In the packaging process of optocouplers, mechanical support, electrical connection, heat dissipation and other technical functions are realized through brackets. In the packaging process of optocouplers, the base island (i.e. the bottom of the package bracket) may collapse or deform due to pressure or vibration, and the bonding wires of the chips on the upper and lower base islands may contact, resulting in the failure of the optocoupler. Utility Model Content
[0004] The main purpose of the embodiments of the present application is to provide a bending-resistant optocoupler package bracket, an optocoupler, a circuit board and a device thereof, so as to improve the bending and stress resistance of the optocoupler package.
[0005] To achieve the above-mentioned purpose, a first aspect of an embodiment of the present application proposes an anti-bending optical coupler package bracket, comprising an upper package bracket and a lower package bracket, and the anti-bending optical coupler package bracket also includes:
[0006] A central limiting support piece, used for supporting and connecting the upper packaging support and the lower packaging support, the central limiting support piece comprises a first central limiting support piece located in the middle of the upper packaging support and a second central limiting support piece located in the middle of the lower packaging support;
[0007] The first center limiting support piece corresponds to the second center limiting support piece, and when the upper packaging bracket is connected to the lower packaging bracket, the first center limiting support piece overlaps with the second center limiting support piece.
[0008] According to the anti-bending optocoupler packaging bracket provided in some embodiments of the present application, the upper packaging bracket is an IR bracket.
[0009] According to the anti-bending optocoupler packaging bracket provided in some embodiments of the present application, the upper packaging bracket includes a plurality of upper packaging bracket wafer carrying areas arranged equidistantly, and a first center limiting support plate is provided in the middle position of the plurality of upper packaging bracket wafer carrying areas.
[0010] According to the anti-bending optocoupler packaging bracket provided in some embodiments of the present application, the lower packaging bracket is a PT bracket.
[0011] According to the anti-bending optocoupler packaging bracket provided in some embodiments of the present application, the lower packaging bracket includes a plurality of equidistantly arranged lower packaging bracket carrier areas, and a second center limiting support plate is provided in the middle position of the plurality of lower packaging bracket carrier areas.
[0012] According to the anti-bending optocoupler packaging bracket provided in some embodiments of the present application, the number of the first center limiting support plates is equal to the number of the second center limiting support plates.
[0013] According to the anti-bending optocoupler package bracket provided in some embodiments of the present application, the anti-bending optocoupler package bracket also includes an optocoupler package shell.
[0014] To achieve the above-mentioned purpose, a second aspect of an embodiment of the present application proposes an anti-bending optical coupler, and the anti-bending optical coupler includes the anti-bending optical coupler packaging bracket as described in the first aspect of the embodiment of the present application.
[0015] To achieve the above-mentioned purpose, a third aspect of an embodiment of the present application proposes a circuit board with an anti-bending optical coupler, wherein the circuit board includes the anti-bending optical coupler described in the second aspect of an embodiment of the present application.
[0016] To achieve the above-mentioned purpose, a fourth aspect of an embodiment of the present application proposes a device with an anti-bending optical coupler, and the device includes the circuit board described in the third aspect of an embodiment of the present application.
[0017] The present application proposes an anti-bending optical coupler packaging bracket, an optical coupler, a circuit board and a device thereof. The anti-bending optical coupler packaging bracket includes a first center-limiting support sheet located in the middle of an upper packaging bracket and a second center-limiting support sheet located in the middle of a lower packaging bracket. The first center-limiting support sheet corresponds to the second center-limiting support sheet. When the upper packaging bracket is connected to the lower packaging bracket, the first center-limiting support sheet and the second center-limiting support sheet overlap. By overlapping the first center-limiting support sheet and the second center-limiting support sheet, when the upper packaging bracket and the lower packaging bracket are connected, the overlapped first center-limiting support sheet and the second center-limiting support sheet can provide support for the bracket, improve the anti-bending and anti-stress capabilities of the optical coupler packaging bracket, prevent base island collapse or deformation due to pressure or vibration during the packaging process or use, and ensure that the optocoupler can remain stable under various working conditions. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a structural schematic diagram of an optocoupler packaging bracket;
[0019] Figure 2 A schematic structural diagram of an anti-bending optical coupler packaging bracket provided in an embodiment of the present application;
[0020] Figure 3a A schematic structural diagram of an anti-bending optical coupler packaging bracket provided in an embodiment of the present application;
[0021] Figure 3b A schematic structural diagram of an anti-bending optical coupler packaging bracket provided in an embodiment of the present application;
[0022] Figure 4 A schematic structural diagram of a bending-resistant optocoupler packaging bracket provided in an embodiment of the present application. DETAILED DESCRIPTION
[0023] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0024] It should be noted that, although the functional modules are divided in the device schematic diagram and the logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. The terms "first", "second", etc. in the specification, claims and the above drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.
[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application.
[0026] Optocoupler (photoelectric coupler) is an electric-optical-electrical conversion device that uses light as a medium to transmit electrical signals. It plays an important role in various circuits and systems and has good electrical insulation and anti-interference capabilities. With the continuous advancement of technology, the types and application areas of optocouplers are also expanding. Optocouplers include a light source and a photoreceiver. By connecting an electrical signal to the input end of the optocoupler, the light source emits light. When the light is irradiated on the packaged photoreceiver, a photocurrent is generated due to the photoelectric effect, which is drawn out from the output end of the photoreceiver, realizing the electric-optical-electrical conversion.
[0027] Optocoupler packaging is an important electronic packaging technology. It realizes the functions of electrical connection, physical protection and heat dissipation of circuits by packaging optoelectronic devices in a miniaturized and compact package. The packaging of optocouplers includes: ceramic base and packaging materials. The ceramic base, as the basis, has good insulation performance and mechanical strength, which can ensure the electrical isolation and reliability of the optocoupler. The packaging materials usually include plastics, metals, etc. These materials need to have good insulation, corrosion resistance, high temperature resistance and other characteristics to protect the circuits and chips inside the optocoupler.
[0028] Infrared emitting diode (IR), also known as infrared emitting tube or infrared light emitting diode, is a light emitting device that can directly convert electrical energy into near-infrared light (invisible light) and radiate it. Infrared emitting diode is made of PN junction made of materials with high infrared radiation efficiency (such as gallium arsenide GaAs, gallium aluminum arsenide GaAlAs, etc.). When a forward bias is applied, current is injected into the PN junction to excite infrared light. The central wavelength of its spectral power distribution is usually between 830 and 950nm, and the half-peak bandwidth is about 40nm, which is a narrowband distribution and can be sensed by ordinary CCD black and white cameras.
[0029] The phototransistor (PT), also known as a photosensitive transistor, is a transistor with three electrodes, but the base is not led out, only the collector and emitter are led out, and the base serves as a light receiving window. The basic structure of the phototransistor is the same as that of an ordinary transistor, with two PN junctions. It is equivalent to connecting a photodiode between the base and collector of the transistor, and the current of the photodiode is equivalent to the base current of the transistor. When light shines on the base (light receiving window) of the phototransistor, photogenerated electron-hole pairs are generated. Under the action of the bc junction electric field, electrons drift to the collector, and holes move to the base, causing the base potential to increase. Under the action of an external voltage between c and e (c is +, e is -), a large number of electrons are injected from the emitter. Except for a few that recombine with holes at the base, a large number of electrons are collected by the collector through the extremely thin base to become output photocurrent.
[0030] Please refer to Figure 1 , is a schematic diagram of the structure of an optocoupler packaging bracket, such as Figure 1 As shown, in the package support structure of the optocoupler, an upper package support 100 and a lower package support 200 are included, and mechanical support and electrical connection are achieved through the upper package support 100 and the lower package support 200.
[0031] In the packaging process of optocouplers, the packaging bracket is used to achieve technical functions such as mechanical support, electrical connection, and heat dissipation. In the packaging process of optocouplers, the base island may collapse or deform due to pressure or vibration, and the bonding wires of the chips on the upper and lower base islands may contact, resulting in the failure of the optocoupler.
[0032] Based on this, the embodiments of the present application propose an anti-bending optocoupler packaging bracket, optocoupler, circuit board and device thereof, which can improve the bending and stress resistance of the optocoupler packaging bracket, prevent the base island from collapsing or deforming due to pressure or vibration during the packaging process or use, and ensure that the optocoupler can remain stable under various working conditions.
[0033] Please refer to Figure 2 , Figure 2 A schematic diagram of the structure of a bending-resistant optical coupling package bracket provided in an embodiment of the present application is shown in FIG. Figure 2 As shown, in the embodiment of the present application, the anti-bending optical coupler package bracket includes an upper package bracket 100 and a lower package bracket 200, wherein the anti-bending optical coupler package bracket also includes:
[0034] The center limiting support plate is used to support and connect the upper packaging bracket and the lower packaging bracket, and the center limiting support plate includes a first center limiting support plate 101 located in the middle position of the upper packaging bracket 100 and a second center limiting support plate 201 located in the middle position of the lower packaging bracket 200.
[0035] It should be noted that, in the embodiment of the present application, the upper packaging bracket 100 is an IR bracket.
[0036] It can be understood that, in the embodiment of the present application, the upper packaging bracket 100 carries the infrared light emitting diode, thereby realizing the emission of infrared rays inside the optocoupler.
[0037] For example, Figure 3a As shown, in the embodiment of the present application, the upper packaging bracket 100 includes a plurality of equidistantly arranged upper packaging bracket carrier areas 102, and a first center limiting support plate 101 is provided in the middle position of the plurality of upper packaging bracket carrier areas 102; each upper packaging bracket carrier area 102 carries a plurality of infrared emitting diodes 103.
[0038] The upper packaging bracket provided in the embodiment of the present application can enable the optical coupler to convert electrical energy into infrared signals.
[0039] It should be noted that, in the embodiment of the present application, the lower packaging bracket 200 is a PT bracket.
[0040] It can be understood that the embodiment of the present application realizes the reception of infrared signals by carrying the photoelectric receiving triode through the lower packaging bracket 200.
[0041] For example, Figure 3b As shown, in the embodiment of the present application, the lower packaging support 200 includes a plurality of equidistantly arranged lower packaging support carrier areas 202, and a second center limiting support plate 201 is provided in the middle position of the plurality of lower packaging support carrier areas 202; each lower packaging support carrier area 202 carries a plurality of photoelectric receiving transistors.
[0042] The lower packaging bracket 200 provided in the embodiment of the present application enables the optical coupler to receive infrared signals.
[0043] It should be noted that in the embodiment of the present application, the first center limiting support piece 101 corresponds to the second center limiting support piece 201. When the upper packaging bracket 100 is connected to the lower packaging bracket 200, the first center limiting support piece 101 and the second center limiting support piece 201 overlap.
[0044] For example, please refer to Figure 4 , is a schematic diagram of the structure of an anti-bending optical coupler packaging bracket provided in an embodiment of the present application, such as Figure 4 As shown, when the upper packaging bracket 100 provided in the embodiment of the present application is connected to the lower packaging bracket 200 , the first center limiting support sheet 101 is overlapped with the second center support sheet 201 , and the infrared emitting diode 103 is connected to the photoelectric receiving transistor 203 .
[0045] The first center limiting support sheet and the second center limiting support sheet are overlapped to improve the bending and stress resistance of the optocoupler packaging bracket, prevent the base island from collapsing or deforming due to pressure or vibration during the packaging process or use, and ensure that the optocoupler can remain stable under various working conditions.
[0046] It should be noted that, in the embodiment of the present application, the number of the first center limiting support pieces 101 is equal to the number of the second center limiting support pieces 201 .
[0047] It can be understood that in the embodiment of the present application, each first center limiting support plate 101 of the upper packaging bracket 100 corresponds to a second center limiting support plate 201 of the lower packaging bracket 200, so that the number of first center limiting support plates 101 is equal to the number of second center limiting support plates 201, and each first center limiting support plate 101 can be overlapped with its corresponding second center limiting support plate 201 to achieve an anti-stress effect.
[0048] It should be noted that, in the embodiment of the present application, the anti-bending optocoupler packaging bracket also includes an optocoupler packaging shell, and the optocoupler is protected by the optocoupler packaging shell.
[0049] An embodiment of the present application also provides an anti-bending optocoupler, and the circuit board includes the anti-bending optocoupler packaging bracket provided in any embodiment of the present application.
[0050] An embodiment of the present application also provides a circuit board for an anti-bending optocoupler, and the circuit board includes the anti-bending optocoupler provided by any embodiment of the present application.
[0051] An embodiment of the present application also provides a device having an anti-bending optical coupler, and the device includes a circuit board of the anti-bending optical coupler provided in the embodiment of the present application.
[0052] The embodiments described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. Those skilled in the art will appreciate that with the evolution of technology and the emergence of new application scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.
[0053] Those skilled in the art will appreciate that the technical solutions shown in the figures do not constitute a limitation on the embodiments of the present application, and may include more or fewer steps than shown in the figures, or a combination of certain steps, or different steps.
[0054] Those skilled in the art will appreciate that all or some of the steps in the methods disclosed above, and the functional modules / units in the systems and devices may be implemented as software, firmware, hardware, or a suitable combination thereof.
[0055] The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separated, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
[0056] Those skilled in the art will appreciate that all or some of the steps in the methods disclosed above, and the functional modules / units in the systems and devices may be implemented as software, firmware, hardware, or a suitable combination thereof.
[0057] The terms "first", "second", "third", "fourth", etc. (if any) in the specification of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.
[0058] It should be understood that in the present application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.
[0059] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.
[0060] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
[0061] The preferred embodiments of the present disclosure are described above with reference to the accompanying drawings, but the scope of the rights of the present disclosure is not limited thereto. Any modification, equivalent substitution and improvement made by those skilled in the art without departing from the scope and essence of the present disclosure should be within the scope of the rights of the present disclosure.
Claims
1. A bending-resistant optical coupler package bracket, comprising an upper package bracket and a lower package bracket, characterized in that: The anti-bending optical coupler package bracket also includes: A central limiting support piece, used for supporting and connecting the upper packaging support and the lower packaging support, the central limiting support piece comprises a first central limiting support piece located in the middle of the upper packaging support and a second central limiting support piece located in the middle of the lower packaging support; Among them, the first center limiting support piece corresponds to the second center limiting support piece, and when the upper packaging bracket is connected to the lower packaging bracket, the first center limiting support piece and the second center limiting support piece overlap.
2. The anti-bending optical coupler package bracket according to claim 1, characterized in that: The upper packaging bracket is an IR bracket.
3. The anti-bending optical coupler package bracket according to claim 2, characterized in that: The upper packaging support comprises a plurality of upper packaging support wafer loading areas which are arranged at equal intervals, and a first central limiting support piece is disposed at the middle position of each of the plurality of upper packaging support wafer loading areas.
4. The anti-bending optical coupler package bracket according to claim 1, characterized in that: The lower packaging bracket is a PT bracket.
5. The anti-bending optical coupler package bracket according to claim 4, characterized in that: The lower packaging support comprises a plurality of lower packaging support wafer loading areas which are arranged at equal intervals, and a second central limiting support piece is disposed at the middle position of each of the plurality of lower packaging support wafer loading areas.
6. The anti-bending optical coupler package bracket according to claim 1, characterized in that: The number of the first center-limiting support pieces is equal to the number of the second center-limiting support pieces.
7. The anti-bending optical coupler package bracket according to claim 1, characterized in that: The anti-bending optocoupler packaging bracket also includes an optocoupler packaging shell.
8. A bending-resistant optical coupler, characterized in that: The anti-bending optical coupler comprises the anti-bending optical coupler packaging bracket according to any one of claims 1 to 7.
9. A circuit board with an anti-bending optical coupler, characterized in that: The circuit board includes the anti-bending optical coupler described in claim 8.
10. A device with an anti-bending optical coupler, characterized in that: The device comprises the circuit board of claim 9.