High-computing-power AI intelligent core board

Abstract

The utility model discloses a high computing power AI intelligent core board which comprises an intelligent core board body, an auxiliary heat dissipation device is installed on the top of the intelligent core board body, the heat dissipation device is composed of a heat conduction plate and a heat dissipation fan, and the heat dissipation fan is installed on the top of the heat conduction plate. The heat conduction plate is composed of an aluminum nitride heat conduction plate and aluminum nitride heat dissipation fins which are arranged on the top of the aluminum nitride heat conduction plate in a radial mode. The intelligent core board main body can be cooled through the auxiliary heat dissipation device, the heat conduction plate is composed of the aluminum nitride heat conduction plate and the aluminum nitride heat dissipation fins which are arranged on the top of the aluminum nitride heat conduction plate in a radial mode, aluminum nitride has the advantages of insulation and high heat conductivity, and the heat dissipation effect is guaranteed while the heat dissipation efficiency is improved. And the heat dissipation fan is in contact with the power supply contact on the intelligent core board main body through the conductive column, and the intelligent core board main body can supply power to the heat dissipation fan after being electrified.

Description

Technical Field

[0001] The utility model relates to the technical field of AI intelligent core boards, in particular to a high-computing-power AI intelligent core board. Background Art

[0002] As intelligent application scenarios become increasingly diverse, the demand for AI products is increasing. The high-computing-power intelligent vision core board has high computing power, high-definition video processing capabilities, high-bandwidth WIFI6 wireless transmission, and video input and output interfaces. It is very suitable for use in AI vision products in different forms.

[0003] As AI video products are updated and developed faster and faster, in order to shorten the development cycle, save development costs, and reduce development difficulty, more and more companies use outsourced core boards to develop products. High-computing AI intelligent core boards can provide a full set of hardware and software support, providing partners with a full-stack solution, which is very suitable for user needs.

[0004] The AI ​​core board will generate a lot of heat when running at high performance, which will cause the performance of the AI ​​core board to deteriorate. In order to ensure the stable performance of the AI ​​core board, it is necessary to provide the AI ​​core board with a corresponding heat dissipation device. Utility Model Content

[0005] The purpose of the utility model is to provide a high-computing power AI intelligent core board to solve the problems in the prior art.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a high-computing-power AI intelligent core board, comprising an intelligent core board main body, an auxiliary heat dissipation device is installed on the top of the intelligent core board main body, the heat dissipation device is composed of a heat conducting plate and a heat dissipation fan, the heat dissipation fan is installed on the top of the heat conducting plate, the heat conducting plate is composed of an aluminum nitride heat conducting plate and aluminum nitride heat dissipation fins arranged radially on the top of the aluminum nitride heat conducting plate, a mounting groove for accommodating the heat dissipation fan is provided at the center of the aluminum nitride heat dissipation fin, the heat dissipation fan is composed of a silent fan and an air intake seat, the air intake seat is fixed to the bottom of the heat dissipation fan, two conductive columns are fixed on one side of the bottom of the air intake seat, one side of the aluminum nitride heat dissipation fin is provided with an opening adapted to the conductive column, and two power supply contacts are provided on the top of the intelligent core board main body; the intelligent core board main body comprises a processor, a memory module, a storage module, and an interface module; the processor is a CPU, a GPU, a FPGA or an ASIC; the memory module comprises a RAM and a ROM; the storage module is an SSD / NAND Flash; the interface module comprises a PCIe, a USB, an Ethernet port and an HDMI.

[0007] Preferably, a mounting hook is fixed on the side of the aluminum nitride heat conducting plate, and a limiting hook is provided on the top of the smart core board body.

[0008] Preferably, a positioning protrusion is fixed on each of the two sides of the top of the smart core board body.

[0009] Preferably, the mounting hook and the aluminum nitride heat conducting plate are an integrated structure, and the mounting hook is made of aluminum nitride.

[0010] Preferably, the height of the air inlet on the side of the air inlet seat is smaller than the height of the aluminum nitride heat sink fins.

[0011] Compared with the prior art, the beneficial effects of the utility model are as follows: an auxiliary heat dissipation device is installed on the top of the intelligent core board main body of the utility model, and the intelligent core board main body can be cooled by the auxiliary heat dissipation device. The auxiliary heat dissipation device is composed of a heat conducting plate and a heat dissipation fan. The heat conducting plate is composed of an aluminum nitride heat conducting plate and aluminum nitride heat dissipation fins arranged radially on the top of the aluminum nitride heat conducting plate. After the auxiliary heat dissipation device is installed, the heat conducting plate will be directly attached to the top of the intelligent core board main body. Aluminum nitride has the characteristics of insulation and high thermal conductivity. While ensuring the heat dissipation effect, it can also prevent electric shock. The heat dissipation fan is composed of a silent fan and an air intake seat and is installed at the center of the aluminum nitride heat dissipation fins. The heat dissipation fan contacts the power supply contacts on the intelligent core board main body through a conductive column. After the intelligent core board main body is powered on, it can supply power to the heat dissipation fan, and there is no need to specially prepare a power supply point for the heat dissipation fan.

[0012] The heat sink is installed and fixed by means of the installation hooks on the aluminum nitride heat conducting plate and the limit hooks on the main body of the intelligent core board. The positioning protrusions on the main body of the intelligent core board can play a role in positioning the heat sink. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model from a top view;

[0015] Figure 2 It is a schematic diagram of the overall structure of the utility model when viewed from above;

[0016] Figure 3 It is a structural schematic diagram of the heat conducting plate of the utility model;

[0017] Figure 4 It is a structural schematic diagram of the heat dissipation fan of the utility model;

[0018] Figure 5 It is a structural schematic diagram of the main body of the intelligent core board of the utility model;

[0019] Figure 6 It is a principle diagram of the utility model.

[0020] In the figure: 1. Intelligent core board body; 2. Heat dissipation device; 3. Power supply contact; 4. Heat conduction plate; 5. Cooling fan; 6. Aluminum nitride heat conduction plate; 7. Aluminum nitride cooling fins; 8. Mounting slot; 9. Opening; 10. Mounting hook; 11. Silent fan; 12. Air intake seat; 13. Conductive column; 14. Limiting hook; 15. Positioning protrusion. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the utility model. Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the utility model for which protection is sought, but merely represents the selected embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the utility model.

[0022] See also Figure 1-6 In the embodiment of the utility model, a high-computing-power AI intelligent core board includes an intelligent core board body 1, an auxiliary heat dissipation device 2 is installed on the top of the intelligent core board body 1, the heat dissipation device 2 is composed of a heat conducting plate 4 and a heat dissipation fan 5, the heat dissipation fan 5 is installed on the top of the heat conducting plate 4, the heat conducting plate 4 is composed of an aluminum nitride heat conducting plate 6 and aluminum nitride heat dissipation fins 7 arranged radially on the top of the aluminum nitride heat conducting plate 6, a mounting groove 8 for accommodating the heat dissipation fan 5 is provided at the center of the aluminum nitride heat dissipation fin 7, the heat dissipation fan 5 is composed of a silent fan 11 and an air intake seat 12, the air intake seat 12 is fixed to the bottom of the heat dissipation fan 5, two conductive columns 13 are fixed on one side of the bottom of the air intake seat 12, one side of the aluminum nitride heat dissipation fin 7 is provided with an opening 9 adapted to the conductive column 13, and two power supply contacts 3 are provided on the top of the intelligent core board body 1.

[0023] A mounting hook 10 is fixed on the side of the aluminum nitride heat conducting plate 6, a limiting hook 14 is arranged on the top of the smart core board main body 1, a positioning protrusion 15 is fixed on each side of the top of the smart core board main body 1, the mounting hook 10 and the aluminum nitride heat conducting plate 6 are an integrated structure, and the material of the mounting hook 10 is aluminum nitride.

[0024] The height of the air inlet on the side of the air inlet seat 12 is smaller than the height of the aluminum nitride heat sink fins 7 , so that the air entering the air inlet can be concentrated in the gaps of the aluminum nitride heat sink fins 7 .

[0025] The intelligent core board body 1 includes a processor, a memory module, a storage module, and an interface module; the processor is a CPU, a GPU, a FPGA or an ASIC; the memory module includes a RAM and a ROM; the storage module is an SSD / NAND Flash; the interface module includes a PCIe, a USB, an Ethernet port and an HDMI.

[0026] The working principle of the utility model is as follows: an auxiliary heat sink 2 is installed on the top of the intelligent core board main body 1 of the utility model, and the intelligent core board main body 1 can be cooled by the auxiliary heat sink 2. The auxiliary heat sink 2 is composed of a heat conducting plate 4 and a cooling fan 5. The heat conducting plate 4 is composed of an aluminum nitride heat conducting plate 6 and aluminum nitride heat dissipating fins 7 arranged in a radial arrangement on the top of the aluminum nitride heat conducting plate 6. After the auxiliary heat sink 2 is installed, the heat conducting plate 4 will be directly attached to the top of the intelligent core board main body 1. Aluminum nitride has the characteristics of insulation and high thermal conductivity. While ensuring the heat dissipation effect, it can also prevent electric shock. The cooling fan 5 is composed of a silent fan 11 and an air intake seat 12 and is installed at the center of the aluminum nitride heat dissipating fins 7. The cooling fan 5 contacts the power supply contacts 3 on the intelligent core board main body 1 through the conductive column 13. After the intelligent core board main body 1 is powered on, it is unnecessary to specially prepare a power supply point for the cooling fan 5.

[0027] The heat sink 2 is installed and fixed by means of the installation hook 10 on the aluminum nitride heat conducting plate 6 and the limit hook 14 on the smart core board body 1 , and the positioning protrusion 15 on the smart core board body 1 can play a role in positioning the heat sink 2 .

[0028] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A high computing power AI intelligent core board, comprising an intelligent core board body (1), characterized in that: An auxiliary heat dissipation device (2) is installed on the top of the intelligent core board body (1), the heat dissipation device (2) is composed of a heat conducting plate (4) and a heat dissipation fan (5), the heat dissipation fan (5) is installed on the top of the heat conducting plate (4), the heat conducting plate (4) is composed of an aluminum nitride heat conducting plate (6) and aluminum nitride heat dissipation fins (7) arranged radially on the top of the aluminum nitride heat conducting plate (6), a mounting groove (8) for accommodating the heat dissipation fan (5) is provided at the center of the aluminum nitride heat dissipation fins (7), the heat dissipation fan (5) is composed of a silent fan (11) and an air intake seat (12), the air intake seat (12) is fixed to the bottom of the heat dissipation fan (5), two conductive columns (13) are fixed on one side of the bottom of the air intake seat (12), an opening (9) adapted to the conductive column (13) is provided on one side of the aluminum nitride heat dissipation fin (7), and two power supply contacts (3) are provided on the top of the intelligent core board body (1); The intelligent core board body (1) comprises a processor, a memory module, a storage module, and an interface module.

2. A high computing power AI intelligent core board according to claim 1, characterized in that: The processor is a CPU, a GPU, a FPGA or an ASIC; the memory module includes a RAM and a ROM; the storage module is an SSD / NAND Flash; and the interface module includes a PCIe, a USB, an Ethernet port and an HDMI.

3. A high computing power AI intelligent core board according to claim 1, characterized in that: A mounting hook (10) is fixed on the side of the aluminum nitride heat conducting plate (6), and a limit hook (14) is provided on the top of the intelligent core board body (1).

4. A high computing power AI intelligent core board according to claim 3, characterized in that: A positioning protrusion (15) is fixed on each of the two sides of the top of the intelligent core board body (1).

5. A high computing power AI intelligent core board according to claim 3, characterized in that: The mounting hook (10) and the aluminum nitride heat conducting plate (6) are an integrated structure, and the mounting hook (10) is made of aluminum nitride.

6. A high computing power AI intelligent core board according to claim 1, characterized in that: The height of the air inlet on the side of the air inlet seat (12) is less than the height of the aluminum nitride heat dissipation fins (7).

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