Thermal effect comprehensive demonstration platform

Abstract

The utility model relates to a heat effect comprehensive demonstration platform which comprises a demonstration platform main body provided with a semiconductor chip experience area and / or an experiment demonstration control area and / or a semiconductor chip experiment demonstration area. The semiconductor chip experience area is used for a human body or an object to feel the refrigeration and heating process of the semiconductor chip, and the semiconductor chip experience area is divided into a refrigeration experience area and a heating experience area; a user watching demonstration can personally feel the refrigeration temperature and the heating temperature of the semiconductor chip, meanwhile, an object can be placed on the semiconductor chip experience area, such as a container for containing drinks, when the container is placed on the semiconductor chip experience area, cold drinks, hot drinks and the like can be prepared, and the demonstration function of the demonstration table is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of active teaching demonstration, in particular to a thermal effect comprehensive demonstration platform. Background Art

[0002] The semiconductor switches the cooling end and the heating end by changing the direction of the current. At the same time, the semiconductor can form a thermoelectric generator through the temperature difference.

[0003] Although the existing demonstration platform has a thermoelectric power generation demonstration, and users who observe the demonstration can observe it more intuitively, users who observe the demonstration cannot feel the temperature of the thermoelectric power generation sheet. For example, Chinese Patent No. ZL202120751056.6 discloses a new energy power generation education demonstration model, in which the various power generation devices include a solar power generation device, a hand-cranked power generation device, a thermoelectric power generation device, a wireless power transmission device, and a salt water power generation device. Although the new energy power generation education demonstration model has a variety of power generation devices, the thermoelectric power generation device lacks a temperature experience area for users to experience thermoelectric power generation. In addition, the thermoelectric power generation device directly supplies power to the electric load, and does not provide users who observe the demonstration with a power supply experience demonstration, so it needs further improvement. Utility Model Content

[0004] The purpose of the utility model is to provide a comprehensive thermal effect demonstration platform. A semiconductor chip experience area is provided on the demonstration platform body for the human body or objects to experience the cooling and heating processes of the semiconductor chip. Users watching the demonstration can personally feel the cooling temperature and heating temperature of the semiconductor chip. At the same time, objects can be placed on the semiconductor chip experience area, such as a container for drinking products. When the container is placed on the semiconductor chip experience area, cold drinks and hot drinks can be prepared, thereby improving the demonstration function of the demonstration platform.

[0005] The purpose of the utility model is achieved in this way:

[0006] A thermal effect comprehensive demonstration platform, comprising a demonstration platform body provided with a semiconductor chip experience area and / or an experimental demonstration control area and / or a semiconductor chip experimental demonstration area;

[0007] The semiconductor chip experience area is used for the human body or objects to experience the cooling and heating process of the semiconductor chip. The semiconductor chip experience area is divided into a cooling experience area and a heating experience area. Users watching the demonstration can personally feel the cooling and heating temperatures of the semiconductor chip. At the same time, objects can be placed on the semiconductor chip experience area, such as containers for drinks. When the containers are placed on the semiconductor chip experience area, cold drinks and hot drinks can be prepared, etc., to improve the demonstration function of the demonstration table.

[0008] The experimental demonstration control area is used for manual operation by human body and triggering the semiconductor chip experimental demonstration area for demonstration;

[0009] The semiconductor chip experimental demonstration area is provided with a semiconductor power generation chip that generates current through temperature difference, and a subsequent load electrically connected to the semiconductor power generation chip. The number of subsequent loads is one or more, and the multiple subsequent loads are electrically connected in series in sequence to realize multi-stage linkage loads in the semiconductor chip experimental demonstration area, providing users observing the demonstration with a power supply experience demonstration feeling, thereby enhancing the user's sense of experience demonstration.

[0010] The semiconductor chip experience area includes a fixed seat embedded on the top surface of the demonstration platform body, on which a corresponding semiconductor chip is provided with an escape position, and on which a temperature transfer member is provided for covering the escape position and placing a human hand or an object; during the cooling and heating process of the semiconductor chip, the temperature is transferred to the temperature transfer member. Users watching the demonstration only need to place their hands on the temperature transfer member to feel the cooling and heating temperatures of the semiconductor chip.

[0011] A heat dissipation element acting on the semiconductor chip and a heat dissipation fan acting on the heat dissipation element are provided inside the main body of the demonstration platform corresponding to the semiconductor chip experience area, which help to dissipate the heat of the semiconductor chip. A heat conductor is provided on the semiconductor chip, and the heat conductor cooperates with the heat dissipation element and the heat dissipation fan. The heat conductor absorbs the heat of the semiconductor chip and transfers it to the heat dissipation element, and the heat dissipation fan dissipates the heat from the heat dissipation element.

[0012] A control circuit board for connecting to a power source is arranged inside the demonstration platform body, and the semiconductor chip and the cooling fan are electrically connected to the control circuit board.

[0013] The experimental demonstration control area includes an operating module arranged on the demonstration platform body and electrically connected to the control circuit board. The operating module is a touch control display screen, operating buttons or operating knobs. The display screen can demonstrate the thermal conversion efficiency of semiconductor temperature difference power generation.

[0014] The demonstration platform body is provided with an enclosure for enclosing a semiconductor chip experimental demonstration area. The enclosure is fixedly or detachably installed on the demonstration platform body. An observation position for observation is provided on the top of the enclosure. The observation position is an open observation opening. Alternatively, a transparent glass panel is provided on the observation position, and the glass panel covers the observation position for user observation convenience.

[0015] The enclosure includes an inseparable first baffle, a second baffle, a third baffle and a fourth baffle, which enclose a semiconductor chip experimental demonstration area; or, the enclosure includes a first baffle, a second baffle, a third baffle and a fourth baffle, wherein a rotating connection portion and a locking portion with an unlocked state and an unlocked state are provided between two adjacent baffles, and the two adjacent baffles are opened and closed by rotating the rotating connection portion and the locking portion, and the enclosure protects the electrical components of the semiconductor chip experimental demonstration area. When the enclosure is detachably installed on the demonstration platform body, it is convenient for the later maintenance of the electrical components of the semiconductor chip experimental demonstration area.

[0016] A first semiconductor power generation chip placed on a first heating seat is provided on the semiconductor chip experimental demonstration area, and a cooling element is provided on the first semiconductor power generation chip;

[0017] A second semiconductor power generation chip placed on a second heating seat is also provided on the semiconductor chip experimental demonstration area, an electric cooling element is provided on the second semiconductor power generation chip, and an electric load is also provided on the semiconductor chip experimental demonstration area;

[0018] The first semiconductor power generation chip is electrically connected to the electric cooling element, and the second semiconductor power generation chip is electrically connected to the electric load;

[0019] The two ends of the first semiconductor power generation chip have a temperature difference through the first heating seat and the cooling element, and generate current to power the electric cooling element. The two ends of the second semiconductor power generation chip have a temperature difference through the second heating seat and the electric cooling element, and generate current to power the electric load. The electric cooling element and the electric load form the rear-stage load of the semiconductor chip experimental demonstration area.

[0020] The first heating seat and the second heating seat are both provided with heat insulation seats on the outside, and the heat insulation seats are provided with corresponding space-avoiding limit grooves on the heating seats to prevent the heat of the heating seats from being transferred to the demonstration platform body to prevent scalding of the human body;

[0021] Heat insulation is provided on the outer sides of the first semiconductor power generation chip and the second semiconductor power generation chip. The heat insulation is heat insulation cotton to prevent the heat of the first semiconductor power generation chip and the second semiconductor power generation chip from diffusing outwards.

[0022] The first heating seat and the second heating seat are respectively electrically connected to a control circuit board connected to a power source.

[0023] The cooling element is a water-cooled cooling element or a cooling fan electrically connected to the control circuit board;

[0024] The electric cooling element is a cooling fan;

[0025] The electric load is a lamp or a fan;

[0026] When the cooling element is a water-cooled cooling element, the water-cooled cooling element includes a cooling element body provided with a cooling channel, a liquid inlet pipe and a liquid outlet pipe are provided on the cooling element body, the liquid inlet end of the cooling channel is connected to the liquid inlet pipe, the liquid outlet end of the cooling channel is connected to the liquid outlet pipe, the liquid inlet pipe and one end of the liquid outlet pipe are connected to a liquid supply device through a pipeline, the cooling liquid of the liquid supply device returns to the liquid supply device along the liquid inlet pipe, the cooling channel, and the liquid outlet pipe to form a closed internal circulation cooling channel, the liquid supply device includes a water pump, and a box for storing insulating coolant, the cooling liquid circulates and cools the first semiconductor power generation chip.

[0027] The beneficial effects of the utility model are as follows:

[0028] The main body of the demonstration table is provided with a semiconductor chip experience area for the human body or objects to experience the cooling and heating process of the semiconductor chip. Users watching the demonstration can personally feel the cooling and heating temperatures of the semiconductor chip. At the same time, objects can be placed on the semiconductor chip experience area, such as containers for drinking. When the containers are placed on the semiconductor chip experience area, cold drinks and hot drinks can be prepared, etc., thereby improving the demonstration function of the demonstration table.

[0029] The thermal effect comprehensive demonstration platform has temperature difference power generation, which can demonstrate the power supply effect step by step. The first level starts to supply power to the second level fan, and the second level will supply power to the third level load. The second level demonstration cannot skip the first level and directly supply power to the third level. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the three-dimensional structure of a comprehensive thermal effect demonstration platform according to one embodiment of the utility model.

[0031] Figure 2 It is a schematic diagram of the partial assembly and decomposition structure of a thermal effect comprehensive demonstration platform according to one embodiment of the utility model.

[0032] Figure 3 This is a schematic diagram of the assembly and decomposition structure of a semiconductor chip experience area according to an embodiment of the utility model.

[0033] Figure 4 It is a schematic diagram of the cross-sectional structure of a semiconductor chip experimental demonstration area according to an embodiment of the utility model.

[0034] Figure 5 This is a schematic diagram of the exploded structure of the first heating seat, the cooling element, and the first semiconductor power generation chip in one embodiment of the utility model.

[0035] Figure 6 This is a schematic diagram of the exploded structure of the first heating seat, the cooling element, and the first semiconductor power generation chip in another orientation of an embodiment of the utility model.

[0036] Figure 7It is a schematic diagram of the cross-sectional structure of a cooling element according to an embodiment of the utility model. DETAILED DESCRIPTION

[0037] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0038] See also Figure 1-Figure 7 , a thermal effect comprehensive demonstration platform, comprising a demonstration platform body 4 provided with a semiconductor chip experience area 1 and / or an experimental demonstration control area 2 and / or a semiconductor chip experimental demonstration area 3;

[0039] The semiconductor chip experience area 1 is used for a human body or an object to experience the cooling and heating process of the semiconductor chip 6; the semiconductor chip experience area 1 is divided into a cooling experience area and a heating experience area;

[0040] The experimental demonstration control area 2 is used for manual operation by a human body and triggers the semiconductor chip experimental demonstration area 3 for demonstration;

[0041] The semiconductor chip experimental demonstration area 3 is provided with a semiconductor power generation chip that generates current through temperature difference, and a subsequent load electrically connected to the semiconductor power generation chip. The number of subsequent loads is one or more, and the multiple subsequent loads are electrically connected in series in sequence to realize a multi-stage linkage load in the semiconductor chip experimental demonstration area 3.

[0042] In this embodiment, heat dissipation holes are provided on the demonstration platform body 4 .

[0043] The semiconductor chip experience area 1 includes a fixing seat 5 embedded on the top surface of the demonstration platform body 4, on which a corresponding semiconductor chip 6 is provided with an escape position 7, and on which a temperature transfer component 8 for covering the escape position 7 and placing human hands or objects is provided; the semiconductor chip 6 transfers the temperature to the temperature transfer component 8 during the cooling and heating process.

[0044] A heat dissipation element 9 acting on the semiconductor chip 6 and a heat dissipation fan 10 acting on the heat dissipation element 9 are provided inside the demonstration platform body 4 corresponding to the semiconductor chip experience area 1 .

[0045] In this embodiment, a heat conducting member is provided on the fixing seat 5 corresponding to the avoidance position 7, and the heat conducting member is fixed at the bottom of the avoidance position 7 by screws; the semiconductor chip 6 is supported on the top of the heat conducting member, and the heat dissipation element 9 is connected to the heat conducting member; the heat dissipation element 9 is provided with a plurality of heat dissipation channels spaced apart from each other up and down.

[0046] A control circuit board for connecting to a power source is disposed inside the demonstration platform body 4 , and the semiconductor chip 6 and the cooling fan 10 are electrically connected to the control circuit board.

[0047] The experimental demonstration control area 2 includes an operating module 11 which is arranged on the demonstration platform body 4 and electrically connected to the control circuit board. The operating module 11 is a touch control display screen, an operating button or an operating knob.

[0048] The demonstration platform body 4 is provided with an enclosure 12 for enclosing the semiconductor chip experimental demonstration area 3. The enclosure 12 is fixedly or detachably installed on the demonstration platform body 4. An observation position for observation is provided on the top of the enclosure 12; the observation position is an open observation opening; or, a transparent glass panel is provided on the observation position, and the glass panel covers the observation position.

[0049] The enclosure 12 includes an inseparable first baffle 13, a second baffle 14, a third baffle 15 and a fourth baffle 16, and the first baffle 13, the second baffle 14, the third baffle 15 and the fourth baffle 16 enclose the enclosure 12 covering the semiconductor chip experimental demonstration area 3; or, the enclosure 12 includes the first baffle 13, the second baffle 14, the third baffle 15 and the fourth baffle 16, wherein a rotating connection part and a locking part with unlocked and unlocked states are provided between two adjacent baffles, and the two adjacent baffles are opened and closed by rotating the rotating connection part and the locking part.

[0050] The semiconductor chip experimental demonstration area 3 is provided with a first semiconductor power generation chip 18 placed on a first heating seat 17, and a cooling element 19 is provided on the first semiconductor power generation chip 18;

[0051] The semiconductor chip experimental demonstration area 3 is also provided with a second semiconductor power generation chip 21 placed on a second heating seat 20, the second semiconductor power generation chip 21 is provided with an electric cooling element 22, and the semiconductor chip experimental demonstration area 3 is also provided with an electric load 23;

[0052] The first semiconductor power generation chip 18 is electrically connected to the electric cooling element 22 , and the second semiconductor power generation chip 21 is electrically connected to the electric load 23 ;

[0053] The two ends of the first semiconductor power generation chip 18 have a temperature difference through the first heating seat 17 and the cooling element 19 respectively, and generate current to power the electric cooling element 22 to operate. The two ends of the second semiconductor power generation chip 21 have a temperature difference through the second heating seat 20 and the electric cooling element 22 respectively, and generate current to power the electric load 23 to operate; the electric cooling element 22 and the electric load 23 form the rear-stage load of the semiconductor chip experimental demonstration area 3.

[0054] The first heating seat 17 and the second heating seat 20 are both provided with a heat insulation seat 24 on the outside, and the heat insulation seat 24 is provided with a corresponding heating seat with a space-avoiding limit groove 25;

[0055] The first semiconductor power generation chip 18 and the second semiconductor power generation chip 21 are both provided with a heat insulation member 26 on their outer sides, and the heat insulation member 26 is a heat insulation cotton;

[0056] In this embodiment, the heat insulating member 26 is provided with a groove for placing the semiconductor power generation chip.

[0057] The first heating seat 17 and the second heating seat 20 are respectively electrically connected to a control circuit board connected to a power source.

[0058] The cooling element 19 is a water-cooled cooling element or a cooling fan electrically connected to the control circuit board;

[0059] The electric cooling element 22 is a cooling fan;

[0060] The electric load 23 is a lamp or a fan;

[0061] When the cooling element 19 is a water-cooled cooling element, the water-cooled cooling element includes a cooling element body 27 provided with a cooling channel 30, and a liquid inlet pipe 28 and a liquid outlet pipe 29 are provided on the cooling element body 27. The liquid inlet end of the cooling channel 30 is connected to the liquid inlet pipe 28, and the liquid outlet end of the cooling channel 30 is connected to the liquid outlet pipe 29. One end of the liquid inlet pipe 28 and the liquid outlet pipe 29 are connected to a liquid supply device through a pipeline. The coolant of the liquid supply device returns to the liquid supply device along the liquid inlet pipe 28, the cooling channel 30, and the liquid outlet pipe 29 to form a closed internal circulation cooling channel. The liquid supply device includes a water pump and a box for storing insulating coolant.

[0062] The above is a preferred embodiment of the utility model, which shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. The utility model may have various changes and improvements without departing from the spirit and scope of the utility model, and these changes and improvements fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A thermal effect comprehensive demonstration platform, characterized in that: It comprises a demonstration platform main body (4) provided with a semiconductor chip experience area (1) and / or an experimental demonstration control area (2) and / or a semiconductor chip experimental demonstration area (3); The semiconductor chip experience area (1) is used for a human body or an object to experience the cooling and heating process of the semiconductor chip (6); the semiconductor chip experience area (1) is divided into a cooling experience area and a heating experience area; The experimental demonstration control area (2) is used for manual operation by a human body to trigger the semiconductor chip experimental demonstration area (3) to perform a demonstration; The semiconductor chip experimental demonstration area (3) is provided with a semiconductor power generation chip that generates current through temperature difference, and a rear-stage load electrically connected to the semiconductor power generation chip. The number of the rear-stage loads is one or more, and the plurality of rear-stage loads are electrically connected in series in sequence to realize a multi-stage linkage load of the semiconductor chip experimental demonstration area (3).

2. The thermal effect comprehensive demonstration platform according to claim 1, characterized in that: The semiconductor chip experience area (1) comprises a fixing seat (5) embedded on the top surface of a demonstration platform body (4); a corresponding semiconductor chip (6) is provided on the fixing seat (5); a clearance position (7) is provided on the fixing seat (5); and a temperature transfer member (8) is provided on the fixing seat (5) for covering the clearance position (7) and placing a human hand or an object; the semiconductor chip (6) transfers temperature to the temperature transfer member (8) during cooling and heating.

3. The thermal effect comprehensive demonstration platform according to claim 1 is characterized by: A heat dissipation element (9) acting on the semiconductor chip (6) and a heat dissipation fan (10) acting on the heat dissipation element (9) are provided inside the demonstration platform body (4) corresponding to the semiconductor chip experience area (1).

4. The thermal effect comprehensive demonstration platform according to claim 3 is characterized by: A control circuit board for connecting to a power source is provided inside the demonstration platform body (4), and the semiconductor chip (6) and the cooling fan (10) are electrically connected to the control circuit board.

5. The thermal effect comprehensive demonstration platform according to claim 1 is characterized by: The experimental demonstration control area (2) comprises an operating module (11) arranged on the demonstration platform body (4) and electrically connected to the control circuit board; the operating module (11) is a touch-type control display screen, an operating button or an operating knob.

6. The thermal effect comprehensive demonstration platform according to claim 1 is characterized by: A fence (12) for enclosing a semiconductor chip experimental demonstration area (3) is provided on the demonstration platform body (4); the fence (12) is fixedly or detachably mounted on the demonstration platform body (4); an observation position for observation is provided on the top of the fence (12); the observation position is an open observation opening; or a transparent glass panel is provided on the observation position, and the glass panel covers the observation position.

7. The thermal effect comprehensive demonstration platform according to claim 6, characterized in that: The enclosure (12) comprises an inseparable first baffle (13), a second baffle (14), a third baffle (15) and a fourth baffle (16), wherein the first baffle (13), the second baffle (14), the third baffle (15) and the fourth baffle (16) enclose an enclosure (12) that encloses a semiconductor chip experimental demonstration area (3); or, the enclosure (12) comprises a first baffle (13), a second baffle (14), a third baffle (15) and a fourth baffle (16), wherein a rotating connection portion and a locking portion having an unlocked state and an unlocked state are provided between two adjacent baffles, and the two adjacent baffles are opened and closed by rotating the rotating connection portion and the locking portion.

8. The thermal effect comprehensive demonstration platform according to claim 1 is characterized by: A first semiconductor power generation chip (18) placed on a first heating seat (17) is provided on the semiconductor chip experimental demonstration area (3), and a cooling element (19) is provided on the first semiconductor power generation chip (18); The semiconductor chip experimental demonstration area (3) is also provided with a second semiconductor power generation chip (21) placed on a second heating seat (20), the second semiconductor power generation chip (21) is provided with an electric cooling element (22), and the semiconductor chip experimental demonstration area (3) is also provided with an electric load (23); The first semiconductor power generation chip (18) is electrically connected to the electric cooling element (22), and the second semiconductor power generation chip (21) is electrically connected to the electric load (23); The two ends of the first semiconductor power generation chip (18) respectively pass through the first heating seat (17) and the cooling element (19) to have a temperature difference and generate a current for powering the electric cooling element (22) to operate; the two ends of the second semiconductor power generation chip (21) respectively pass through the second heating seat (20) and the electric cooling element (22) to have a temperature difference and generate a current for powering the electric load (23) to operate; the electric cooling element (22) and the electric load (23) form a rear-stage load of the semiconductor chip experimental demonstration area (3).

9. The thermal effect comprehensive demonstration platform according to claim 8, characterized in that: The first heating seat (17) and the second heating seat (20) are both provided with a heat insulation seat (24) on their outer sides, and a corresponding air-avoiding limit groove (25) is provided on the heat insulation seat (24); A heat insulating member (26) is provided on the outer sides of the first semiconductor power generation chip (18) and the second semiconductor power generation chip (21), and the heat insulating member (26) is heat insulating cotton; The first heating seat (17) and the second heating seat (20) are respectively electrically connected to a control circuit board connected to a power source.

10. The thermal effect comprehensive demonstration platform according to claim 8, characterized in that: The cooling element (19) is a water-cooled cooling element or a cooling fan electrically connected to the control circuit board; The electric cooling element (22) is a cooling fan; The electric load (23) is a lamp or a fan; When the cooling element (19) is a water-cooled cooling element, the water-cooled cooling element comprises a cooling element body (27) provided with a cooling channel (30), a liquid inlet pipe (28) and a liquid outlet pipe (29) being provided on the cooling element body (27), a liquid inlet end of the cooling channel (30) being connected to the liquid inlet pipe (28), a liquid outlet end of the cooling channel (30) being connected to the liquid outlet pipe (29), one end of the liquid inlet pipe (28) and the liquid outlet pipe (29) being connected to a liquid supply device through a pipeline, the coolant of the liquid supply device is returned to the liquid supply device along the liquid inlet pipe (28), the cooling channel (30) and the liquid outlet pipe (29) to form a closed internal circulation cooling channel, and the liquid supply device comprises a water pump and a box for storing insulating coolant.

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