Wet etching wafer cleaning device

Abstract

The utility model discloses a wet etching wafer cleaning device, which comprises a cleaning tank and a wafer, a cavity is arranged in the cleaning tank, a bearing part is rotatably mounted in the cavity, a water storage tank is arranged at the top of the cavity, a plurality of spray heads are fixedly mounted on the lower surface of the water storage tank, and a driving motor is fixedly mounted in the middle of the bottom of the cleaning tank. The output end of the driving motor faces upwards and is fixedly connected with the bottom of the bearing part through a rotating shaft, the bearing part is of an arc-shaped structure, a plurality of parallel arc-shaped clamping grooves are formed in the inner side of the bearing part in the arc-shaped direction at equal intervals, and a plurality of through holes are formed in the positions, located on the two sides of the arc-shaped clamping grooves, of the inner side wall of the bearing part; the wafer cleaning device has the advantages that the consumption of deionized water is reduced by mounting the spraying head and spraying and cleaning the wafer, the bearing part is arranged and the rotating shaft and the driving motor are mounted below the bearing part, so that the bearing part drives the wafer to rotate, the mobility of the deionized water on the surface of the wafer is improved, the cleaning efficiency is improved, the structure is simple, and the practicability is high.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning, in particular to a wet etching wafer cleaning device. Background Art

[0002] A wafer refers to the silicon chip used to make silicon semiconductor integrated circuits. Due to its round shape, it is called a wafer. Various circuit component structures can be processed on the silicon wafer to become IC products with specific electrical functions.

[0003] In the processing procedure of wafers, their surfaces need to be etched, and then the wafers need to be cleaned. The traditional cleaning method generally adopts the quick-drain cleaning technology, which mainly fills the cleaning tank with deionized water quickly and then quickly discharges it. After multiple cycles, the purpose of cleaning the wafers and residual acid is achieved. This cleaning method requires a large amount of deionized water, resulting in high cleaning costs and low cleaning efficiency. Utility Model Content

[0004] The utility model aims to provide a wet etching wafer cleaning device, which can solve the problems of large deionized water consumption, high cleaning cost and low cleaning efficiency in the existing wafer cleaning technology, and has a simple structure and strong practicality.

[0005] To achieve the above-mentioned objectives, the utility model provides the following technical solutions: a wet etching wafer cleaning device, comprising a cleaning tank and a wafer, the cleaning tank being provided with a chamber, a supporting member being rotatably installed in the chamber, a water storage tank being provided at the top of the chamber along the inner wall of the cleaning tank, a plurality of spray heads being fixedly installed on the lower surface of the water storage tank, a driving motor being fixedly installed in the middle of the bottom of the cleaning tank, an output end of the driving motor being upward and fixedly connected to the bottom of the supporting member through a rotating shaft, a drain pipe being fixedly installed at a position of the bottom of the cleaning tank away from the driving motor, an infusion pipe being fixedly installed at a position of the side of the cleaning tank corresponding to the position of the water storage tank, supporting feet being fixedly installed at the edges around the bottom of the cleaning tank, the supporting member being provided with an arc-shaped structure, a plurality of parallel arc-shaped slots being provided at equal intervals on the inner side of the supporting member along the arc-shaped direction, and a plurality of through holes being provided on the inner side wall of the supporting member on both sides of the arc-shaped slots.

[0006] During cleaning, the wafers are arranged vertically on the arc-shaped slots of the carrier, and the drive motor is started to drive the carrier to rotate, thereby driving the wafers to rotate. Deionized water is sprayed from the water tank onto the wafers through the spray head for cleaning. The deionized water and residual acid on the surface of the wafer flow to the bottom of the chamber through the through holes and are then discharged through the drain pipe. When the deionized water in the water tank is insufficient, the deionized water is transported to the water tank through the infusion pipe.

[0007] Preferably, the width of the arc-shaped slot on the carrier is set according to the thickness of the wafer, and the distance between the two ends of the arc-shaped slot is the same as the diameter of the wafer, so that the wafer can be stably clamped on the carrier.

[0008] Preferably, output ends of the plurality of shower heads are all directed toward the carrier.

[0009] Preferably, a connecting block is fixedly installed at the bottom of the carrier, the connecting block is fixedly connected to one end of the rotating shaft, and the other end of the rotating shaft passes through the bottom of the cleaning tank and is fixedly connected to the driving motor. The driving motor drives the rotating shaft to rotate, the rotating shaft drives the connecting block to rotate, and the connecting block drives the carrier to rotate.

[0010] Preferably, the rotating shaft is rotatably connected to the bottom of the cleaning tank in a sealed manner to prevent the deionized water from leaking out of the cleaning tank along the side wall of the rotating shaft.

[0011] Preferably, the carrier and the inner wall of the cleaning tank are coated with an anti-corrosion layer to prevent residual acid on the surface of the wafer from corroding the equipment.

[0012] Compared with the prior art, the utility model adopts the above technical solution and has the following technical effects:

[0013] The utility model provides a carrier, and opens a plurality of slots on the carrier, so that multiple wafers can be placed on the carrier, and the multiple wafers can be cleaned at the same time; a water tank is installed on the top of the chamber, and a plurality of spray heads are installed at the bottom of the water tank, and deionized water is sprayed through the spray heads to clean the wafers, without consuming a large amount of deionized water, thereby reducing the cleaning cost; a rotating shaft and a driving motor are installed at the bottom of the carrier, so that the driving motor drives the wafers to rotate when cleaning, thereby increasing the fluidity of the deionized water on the surface of the wafer and improving the cleaning efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a front cross-sectional schematic diagram of the utility model;

[0015] Figure 2 It is a structural schematic diagram of the bearing member of the utility model.

[0016] Explanation of the reference numerals: 1. cleaning tank; 2. chamber; 3. carrier; 4. water tank; 5. spray head; 6. driving motor; 7. rotating shaft; 8. drainage pipe; 9. infusion pipe; 10. wafer; 11. arc-shaped slot; 12. through hole; 13. connecting block; 14. support foot. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0018] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the effects and purposes that can be achieved by this application.

[0019] See also Figure 1-2 The utility model provides a technical solution: it includes a cleaning tank 1 and a wafer 10, wherein a chamber 2 is arranged in the cleaning tank 1, a bearing member 3 is rotatably installed in the chamber 2, a water storage tank 4 is arranged on the top of the chamber 2 along the inner wall of the cleaning tank 1, a plurality of spray heads 5 are fixedly installed on the lower surface of the water storage tank 4, a driving motor 6 is fixedly installed in the middle of the bottom of the cleaning tank 1, the output end of the driving motor 6 is upward and fixedly connected to the bottom of the bearing member 3 through a rotating shaft 7, a drainage pipe 8 is fixedly installed at a position of the bottom of the cleaning tank 1 away from the driving motor 6, a liquid infusion pipe 9 is fixedly installed on the side of the cleaning tank 1 corresponding to the position of the water storage tank 4, legs 14 are fixedly installed on the edges of the bottom of the cleaning tank 1, the bearing member 3 is arranged in an arc structure, a plurality of parallel arc grooves 11 are opened at equal intervals on the inner side of the bearing member 3 along the arc direction, and a plurality of through holes 12 are opened on the inner side wall of the bearing member 3 on both sides of the arc groove 11.

[0020] The width of the arc-shaped slot 11 on the carrier 3 is set according to the thickness of the wafer 10 , and the distance between the two ends of the arc-shaped slot 11 is the same as the diameter of the wafer 10 .

[0021] The output ends of the plurality of spray heads 5 are all directed toward the carrier 3 .

[0022] A connecting block 13 is fixedly mounted on the bottom of the carrier 3 , the connecting block 13 is fixedly connected to one end of the rotating shaft 7 , and the other end of the rotating shaft 7 passes through the bottom of the cleaning tank 1 and is fixedly connected to the driving motor 6 .

[0023] The rotating shaft 7 is rotatably connected to the bottom of the cleaning tank 1 in a sealed manner.

[0024] The inner wall of the carrier 3 and the cleaning tank 1 are coated with an anti-corrosion layer.

[0025] Working principle or structural principle: first, place the wafer 10 on the card slot 11 of the carrier 3 in sequence, and then start the driving motor 6, the driving motor 6 drives the rotating shaft 7 and the connecting block 13 to rotate, the connecting block 13 drives the carrier 3 and the wafer 10 to rotate, and then the spray head 5 sprays the deionized water in the water tank 4 onto the surface of the wafer for cleaning. Since the wafer 10 is in a rotating state, the fluidity of the deionized water on the surface of the wafer 10 is increased, and the cleaning efficiency is improved. The deionized water and residual acid flowing down after cleaning flow to the bottom of the chamber 2 through the through hole 12 on the carrier 3, and then discharged through the drain pipe 8. When the deionized water in the water tank 4 is insufficient, it is supplemented through the infusion pipe 9. The device does not need to consume a large amount of deionized water, saves cleaning costs, has a simple structure, and is highly practical.

[0026] So far, the embodiments of the utility model have been described in detail in conjunction with the accompanying drawings. It should be noted that the implementation methods not shown or described in the drawings or the body of the specification are all forms known to ordinary technicians in the relevant technical field and are not described in detail. In addition, the above definitions of each component are not limited to the various specific structures, shapes or methods mentioned in the embodiments, and ordinary technicians in the field can simply change or replace them.

[0027] Those skilled in the art will appreciate that the features described in the various embodiments and / or claims of the present invention may be combined and / or combined in various ways, even if such combinations and / or combinations are not explicitly described in the present invention. In particular, the features described in the various embodiments and / or claims of the present invention may be combined and / or combined in various ways without departing from the spirit and teachings of the present invention. All of these combinations and / or combinations fall within the scope of the present invention.

[0028] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wet etching wafer cleaning device, comprising a cleaning tank (1) and a wafer (10), characterized in that: The cleaning tank (1) is provided with a chamber (2), a bearing member (3) is rotatably mounted in the chamber (2), a water storage tank (4) is provided at the top of the chamber (2) along the inner wall of the cleaning tank (1), a plurality of spray heads (5) are fixedly mounted on the lower surface of the water storage tank (4), a driving motor (6) is fixedly mounted in the middle of the bottom of the cleaning tank (1), an output end of the driving motor (6) is upwardly directed and fixedly connected to the bottom of the bearing member (3) via a rotating shaft (7), and the bottom of the cleaning tank (1) is away from the A liquid discharge pipe (8) is fixedly installed at the position of the driving motor (6); a liquid infusion pipe (9) is fixedly installed at the position of the side of the cleaning tank (1) corresponding to the water storage tank (4); legs (14) are fixedly installed around the edges of the bottom of the cleaning tank (1); the supporting member (3) is arranged as an arc structure; a plurality of parallel arc grooves (11) are provided at equal intervals on the inner side of the supporting member (3) along the arc direction; and a plurality of through holes (12) are provided on the inner side wall of the supporting member (3) on both sides of the arc grooves (11).

2. A wet etching wafer cleaning device according to claim 1, characterized in that: The width of the arc-shaped slot (11) on the carrier (3) is set according to the thickness of the wafer (10), and the distance between the two ends of the arc-shaped slot (11) is the same as the diameter of the wafer (10).

3. The wet etching wafer cleaning device according to claim 1, characterized in that: The output ends of the plurality of spray heads (5) are all directed toward the carrier (3).

4. The wet etching wafer cleaning device according to claim 1, characterized in that: A connecting block (13) is fixedly mounted on the bottom of the carrier (3); the connecting block (13) is fixedly connected to one end of the rotating shaft (7); the other end of the rotating shaft (7) passes through the bottom of the cleaning tank (1) and is fixedly connected to the driving motor (6).

5. A wet etching wafer cleaning device according to claim 4, characterized in that: The rotating shaft (7) is connected to the bottom of the cleaning tank (1) in a sealed rotational manner.

6. The wet etching wafer cleaning device according to claim 1, characterized in that: The inner wall of the carrier (3) and the cleaning tank (1) are both coated with an anti-corrosion layer.

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