Package structure

Abstract

The utility model provides a packaging structure which comprises a flexible substrate, the flexible substrate comprises an upper surface, the flexible substrate can be stretched by external force to define a stretching direction, the upper surface is provided with a plurality of long-strip-shaped smooth parts and a plurality of long-strip-shaped rough parts which are arranged at intervals, the extension direction of the rough part is not parallel to the stretching direction; and the first electronic element is arranged on the upper surface and covers a part of the smooth part and a part of the rough part. According to the packaging structure, the friction force between the first electronic component and the flexible substrate is increased, and the connection strength is increased, so that the stability of the first electronic component arranged on the flexible substrate can be improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a packaging structure. Background Art

[0002] Wearable electronic products need to use flexible soft boards as the base plate to meet ergonomic requirements. However, the flexibility of the soft board poses a problem for the placement of electronic components on the soft board, that is, the stretching deformation of the soft board will cause the electronic components on it to be unable to be stably placed on the soft board.

[0003] refer to Figure 1 , shows a schematic diagram of an existing packaging structure based on a flexible board. Figure 1 As shown in (1) of FIG. 1 , the packaging structure based on the flexible board includes a flexible board 10 and an electronic component 11 disposed on the flexible board 10; Figure 1 As shown in (2), the soft board 10 can be stretched to become longer; Figure 1 As shown in (3), the electronic components 11 on the flexible board 10 may be partially peeled off, lifted or fallen off under the action of tensile behavior and structural stress, and cannot be stably set on the flexible board 10.

[0004] Therefore, for the packaging structure based on the flexible board, how to improve the stability of the electronic components 11 on the flexible board 10 has become a technical problem that needs to be solved urgently. Utility Model Content

[0005] The present application proposes a packaging structure to improve the stability of electronic components on a flexible substrate.

[0006] A packaging structure proposed in this application includes:

[0007] A flexible substrate, the flexible substrate comprising an upper surface, and the flexible substrate can be stretched by an external force to define a stretching direction, the upper surface has a plurality of long strip-shaped smooth portions and a plurality of long strip-shaped rough portions arranged at intervals from each other, and the extending direction of the rough portions is not parallel to the stretching direction;

[0008] The first electronic component is disposed on the upper surface and covers a portion of the smooth portion and a portion of the rough portion.

[0009] In some optional embodiments, an extension direction of the rough portion is perpendicular to the stretching direction.

[0010] In some optional embodiments, a width of the first electronic component in an extension direction of the rough portion is smaller than an extension length of the rough portion.

[0011] In some optional embodiments, the packaging structure further includes a second electronic component disposed on the upper surface and spaced apart from the first electronic component.

[0012] In some optional embodiments, the second electronic component and the first electronic component are electrically connected via the flexible substrate.

[0013] In some optional embodiments, the total area of ​​the rough portions is smaller than the total area of ​​the smooth portions.

[0014] In some optional embodiments, the rough portion is linear.

[0015] In some optional embodiments, the rough portion is curved.

[0016] In some optional embodiments, two ends of the rough portion extend to two sides of the flexible substrate respectively.

[0017] In some optional embodiments, the rough portion has a concave-convex surface formed by grinding.

[0018] In some optional embodiments, a bottom filling glue is provided between the first electronic component and the flexible substrate.

[0019] In some optional embodiments, the first electronic component and the flexible substrate are connected by solder.

[0020] In some optional embodiments, the flexible substrate includes embedded conductive circuits.

[0021] As mentioned above, in order to improve the stability of electronic components arranged on a flexible board, the present application proposes a packaging structure, which is configured by arranging a plurality of long smooth portions and a plurality of long rough portions on the upper surface of a flexible substrate, which are arranged at intervals from each other, and the extension direction of the rough portions is not parallel to the stretching direction of the flexible substrate, and the first electronic component arranged on the flexible substrate covers a portion of the smooth portion and a portion of the rough portion, so that the friction between the first electronic component and the flexible substrate is increased, and the connection strength is increased, thereby improving the stability of the first electronic component arranged on the flexible substrate. During the stretching process of the flexible substrate, the increased friction between the rough portion and the first electronic component is balanced with the structural stress, which can increase the bonding force between the first electronic component and the flexible substrate, and prevent the first electronic component from peeling off, warping or falling off. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

[0023] Figure 1 It is a structural schematic diagram of an existing packaging structure based on a flexible board;

[0024] Figure 2 is a schematic diagram of a longitudinal cross-sectional structure of an embodiment of a packaging structure according to the present application;

[0025] Figure 3 is based on Figure 2 A partial enlarged view of an embodiment of the packaging structure shown;

[0026] Figure 4 is based on Figure 2 A top view of an embodiment of the packaging structure shown;

[0027] Figure 5-8 They are schematic top views of the flexible substrate according to several different embodiments;

[0028] Fig. 9 is a schematic diagram of manufacturing steps of an embodiment of a packaging structure according to the present application.

[0029] Description of reference numerals / symbols:

[0030] 10-flexible board; 11-electronic components;

[0031] 20-flexible substrate; 200-upper surface; f1-stretching direction; 201-smooth part; 202-rough part; 21-first electronic component; 22-second electronic component; 23-solder; 24-bottom filling glue;

[0032] 30 - sub-substrate; 31 - conductive circuit; 32 - opening; 33 - conductive hole; 40 - grinding device.

[0033] ASE Confidential / Security-B DETAILED DESCRIPTION

[0034] The specific implementation methods of the present application are described below in conjunction with the accompanying drawings and embodiments. Through the contents recorded in this specification, those skilled in the art can easily understand the technical problems solved by the present application and the technical effects produced. It is understood that the specific embodiments described herein are only used to explain the relevant inventions and creations, rather than to limit the inventions and creations. In addition, for the convenience of description, only the parts related to the relevant inventions and creations are shown in the accompanying drawings.

[0035] It should be readily understood that the meanings of “on,” “over,” and “over” in this application should be interpreted in the broadest manner, so that “on” not only means “directly on something,” but also means “on something” including the presence of intermediate components or layers therebetween.

[0036] Additionally, for ease of description, spatially relative terms such as "below," "beneath," "lower," "above," "upper," etc. may be used herein to describe the relationship of one element or component to another element or component illustrated in the drawings. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.

[0037] The term "layer" as used herein refers to a material portion including an area with a certain thickness. The layer can extend over the entire lower or upper structure, or can have a degree less than the range of the lower or upper structure. In addition, the layer can be a region of a homogeneous or inhomogeneous continuous structure, and its thickness is less than the thickness of the continuous structure. For example, the layer can be located between the top surface and the bottom surface of the continuous structure or between any pair of horizontal planes therebetween. The layer can extend horizontally, vertically and / or along a tapered surface. A substrate can be a layer, one or more layers can be included therein, and / or one or more layers can be present thereon, above and / or below. A layer can include multiple layers. For example, a semiconductor layer can include one or more doped or undoped semiconductor layers, and can have the same or different materials.

[0038] The term "substrate" as used herein refers to a material on which subsequent material layers are added. The substrate itself may be patterned. The material added on top of the substrate may be patterned or may remain unpatterned. In addition, the substrate may include a variety of semiconductor materials, such as silicon, silicon carbide, gallium nitride, germanium, gallium arsenide, indium phosphide, etc. Alternatively, the substrate may be made of a non-conductive material, such as glass, plastic, or sapphire wafer, etc. Further alternatively, the substrate may have a semiconductor device or circuit formed therein.

[0039] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of the specification are only used to match the contents recorded in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of the present application, so they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects and purposes that can be achieved by the present application, should still fall within the scope of the technical content disclosed in the present application. At the same time, the terms such as "on", "first", "second" and "one" quoted in this specification are only for the convenience of narration, and are not used to limit the scope of the implementation of the present application. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the present application without substantially changing the technical content.

[0040] As used herein, the terms "substantially," "substantial," "approximately," and "about" are used to indicate and explain minor variations. For example, when used in conjunction with a numerical value, the above terms may refer to a variation range of less than or equal to ±10% of the corresponding numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. As another example, the thickness of a film or layer is "substantially uniform" and may refer to a standard deviation of less than or equal to ±10% of the average thickness of the film or layer, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term "substantially coplanar" may refer to two surfaces that are within tens of microns along the same plane, such as within 50 μm, 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm along the same plane. Two components may be considered "substantially aligned" if, for example, they overlap or overlap within hundreds of microns to several microns, such as within 180 μm, 150 μm, 100 μm, 50 μm, 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm. Two surfaces or components may be considered "substantially perpendicular" if the angle between them is, for example, 90°±10°, such as ±5°, ±4°, ±3°, ±2°, ±1°, ±0.5°, ±0.1°, or ±0.05°. When used in conjunction with an event or situation, the terms "substantially", "substantial", "approximately" and "about" may refer to a situation where the event or situation occurs precisely as well as a situation where the event or situation occurs very approximately. It should also be noted that the longitudinal section corresponding to the embodiment of the present application may be a section corresponding to the direction of the front view, the transverse section may be a section corresponding to the direction of the right view, and the horizontal section may be a section corresponding to the direction of the top view.

[0041] In addition, the embodiments and features in the embodiments of the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0042] refer to Figure 2-4 , Figure 2 is a schematic diagram of a longitudinal cross-sectional structure of an embodiment of a packaging structure according to the present application; Figure 3 is based on Figure 2 A partial enlarged view of an embodiment of the packaging structure shown; Figure 4 is based on Figure 2 A top view of an embodiment of a packaging structure is shown.

[0043] like Figure 2-4 As shown, an embodiment of the packaging structure of the present application includes: a flexible substrate 20 and a first electronic component 21. The flexible substrate 20 includes an upper surface 200, and the flexible substrate 20 can be stretched by an external force to define a stretching direction f1, and the upper surface 200 has a plurality of long strip-shaped smooth portions 201 and a plurality of long strip-shaped rough portions 202 arranged at intervals from each other, and the extension direction of the rough portions 202 is not parallel to the stretching direction f1; the first electronic component 21 is disposed on the upper surface 200, and covers a portion of the smooth portion 201 (e.g., at least one) and a portion of the rough portion 202 (e.g., at least one).

[0044] Here, the first electronic component 21 includes but is not limited to SiP (System in package) devices. SiP devices are single standard packaged devices that combine multiple active electronic components with different functions, such as IC (integrated circuit) bare chips, optional passive components, and other components such as MEMS (Micro-Electro-Mechanical System) or optical components, into a package to achieve certain functions, forming a system or subsystem, which is usually called a micro-system.

[0045] Here, the flexible substrate 20 refers to a substrate with flexibility. Flexibility refers to the property of being deformed after being subjected to external force and not being able to return to its original state after the external force disappears. The flexible substrate 20 can be composed of a conductive material and a dielectric material. The dielectric material may include organic and / or inorganic materials, wherein the organic material may be, for example: polyamide fiber (Polyamide, PA), polyimide (Polyimide, PI), epoxy resin (Epoxy), poly-p-phenylene benzobisoxazole (Poly-p-phenylene benzobisoxazole, PBO) fiber, FR-4 epoxy glass cloth laminate, PP (PrePreg, prepreg material or semi-cured resin, semi-cured sheet), ABF (Ajinomoto Build-up Film), etc., and the inorganic material may be, for example, silicon (Si), glass, ceramic, silicon oxide, silicon nitride, tantalum oxide, etc. The conductive material may include a seed layer and a metal layer. The seed layer may be, for example, titanium (Ti), tungsten (W), nickel (Ni), etc., and the metal layer may be, for example, gold (Au), silver (Ag), aluminum (Al), nickel (Ni), palladium (Pd), copper (Cu) or their alloys.

[0046] Here, the smooth portion 201 and the rough portion 202 may be portions having different degrees of roughness on the upper surface 200 of the flexible substrate 20. Figure 3 For example, the smooth portion 201 may be a relatively smooth portion with low roughness on the upper surface 200 that has not been surface treated, and the rough portion 202 may be a relatively rough portion with high roughness on the upper surface 200 that has been surface treated, and that has been roughened, that is, the roughness of the rough portion 202 is higher than that of the smooth portion 201. For example, the rough portion 202 may have a concave-convex surface formed by grinding.

[0047] The present application sets a smooth portion 201 and a rough portion 202 on the upper surface of the flexible substrate 20. Since the roughness of the rough portion 202 is relatively high, the bonding area with the first electronic component 21 is increased, and it is not parallel to the stretching direction f1 of the flexible substrate 20, the friction between the first electronic component 21 and the flexible substrate 20 can be increased, and the connection strength can be increased, thereby improving the stability of the first electronic component 21 set on the flexible substrate 20.

[0048] refer to Figure 4 When the flexible substrate 20 is stretched (stretching direction is as follows Figure 4 ), the first electronic component 21 is easily separated from the flexible substrate 20 in the direction of being stretched (as shown by the solid double-headed arrow in the figure). Figure 4 ), and the rough portion 202 will add a friction force in the opposite direction to the first electronic component 21 (as shown by the hollow arrow in FIG. Figure 4 As shown by the dotted arrow in the figure, the adhesion of the first electronic component 21 on the flexible substrate 20 can be increased, and the first electronic component 21 can be prevented from being partially peeled off, lifted up or falling off on the flexible substrate 20, thereby improving the stability of the first electronic component 21.

[0049] refer to Figure 4 It is worth noting that the extending direction of the rough portion 202 is not parallel to the stretching direction f1, which may mean that the extending direction of at least a portion of the rough portion 202 is not parallel to the stretching direction f1, but forms a certain angle, which may be greater than 0 degrees and less than 180 degrees. The effect of increasing friction will be different depending on the size of the angle.

[0050] refer to Figure 4 In some optional embodiments, the extension direction of the rough portion 202 is perpendicular to the stretching direction f1 (i.e., the angle is 90 degrees or close to 90 degrees, such as 90±1 degrees or 90±2 degrees within 90±3 degrees). At this time, the increase in friction provided by the rough portion 202 reaches the maximum value, which is most conducive to preventing the first electronic component 21 from slipping on the flexible substrate 20, and has the best effect on increasing the stability of the first electronic component 21 on the flexible substrate 20.

[0051] refer to Figure 4 In some optional embodiments, two ends of the rough portion 202 extend to two sides of the flexible substrate 20 respectively.

[0052] refer to Figure 4 In some optional embodiments, the width of the first electronic component 21 in the first direction (ie, the extension direction of the rough portion 202 ) is smaller than the extension length of the rough portion 202 .

[0053] refer to Figure 4 In some optional embodiments, the total area of ​​the rough portions 202 is smaller than the total area of ​​the smooth portions 201 , or in other words, the total width of the rough portions 202 is smaller than the total width of the smooth portions 201 , or in other words, the width of a single rough portion 202 is smaller than the width of a single smooth portion 201 .

[0054] refer to Figure 2 In some optional embodiments, the first electronic component 21 may be soldered on the upper surface 200 of the flexible substrate 20 by means of solder 23. Optionally, the solder 23 may be in the form of a bump or a solder ball.

[0055] refer to Figure 2 In some optional embodiments, a bottom filling glue 24 is further disposed between the bottom surface of the first electronic component 21 and the upper surface 200 of the flexible substrate 20 to protect the solder 23 and play a reinforcing role.

[0056] refer to Figure 2 and Figure 4 In some optional embodiments, the packaging structure of the present application further includes a second electronic component 22, which is disposed on the upper surface 200 and spaced apart from the first electronic component 21. Here, the second electronic component 22 may also be a system-in-package (SIP).

[0057] In some optional embodiments, the second electronic component 22 and the first electronic component 21 are electrically connected via the flexible substrate 20 .

[0058] refer to Figure 5-8 , Figure 5-8 Schematic diagrams of top views of the flexible substrate 20 according to several different embodiments are shown respectively.

[0059] like Figure 5 As shown, the rough portion 202 may be linear, extending in a linear direction, and preferably, the extending direction is perpendicular to the stretching direction f1.

[0060] like Figure 6-8 As shown, the roughness 202 may be curved. Figure 6 As shown, the rough portion 202 may be arc-shaped; Figure 7 As shown, the rough portion 202 may be S-shaped; Figure 8 As shown, the rough portion 202 may also be an irregular curve.

[0061] In addition, the rough portions 202 may be parallel to each other or may not be parallel to each other; the intervals between the rough portions 202 may be the same or different; and the extension lengths of the rough portions 202 may be the same or different.

[0062] refer to Fig. 9 , Fig. 9 is a schematic diagram of manufacturing steps of an embodiment of a packaging structure according to the present application.

[0063] like Fig. 9 As shown, the manufacturing steps of an embodiment of the packaging structure of the present application include:

[0064] Step S1, providing a sub-substrate 30 having a conductive circuit 31, wherein the sub-substrate 30 is flexible;

[0065] Step S2, laminating another sub-substrate 30 on the sub-substrate 30 to form a double-layer structure;

[0066] Step S3, forming an opening 32 on the formed double-layer structure by, for example, a laser drilling process, and the bottom of the opening 32 extends to the conductive line 31;

[0067] Step S4, filling the opening 32 with a conductive and stretchable slurry to form a conductive hole 33 electrically connected to the conductive line 31; at this time, the required flexible substrate 20 is formed;

[0068] Step S5: Grinding the upper surface of the flexible substrate 20 by using a grinding device 40 to form a plurality of rough portions 202 and a plurality of smooth portions 201 (see Figure 2-4 );

[0069] Step S6, disposing a first electronic component 21 and a second electronic component 22 on the flexible substrate 20. Exemplarily, the first electronic component 21 and the second electronic component 22 may be soldered to the flexible substrate 20 via solder 23, and a bottom filling glue 24 may be disposed.

[0070] Although the present application has been described and illustrated with reference to the specific embodiments of the present application, these descriptions and illustrations do not limit the present application. It is clearly understood by those skilled in the art that various changes can be made, and equivalent elements can be substituted in the embodiments without departing from the true spirit and scope of the present application as defined by the appended claims. The illustrations may not necessarily be drawn to scale. Due to variables in the manufacturing process, etc., there may be differences between the technical reproduction in the present application and the actual implementation. There may be other embodiments of the present application that are not specifically described. The description and illustrations should be regarded as illustrative, not restrictive. Modifications may be made to adapt specific circumstances, materials, material compositions, methods or processes to the goals, spirits and scopes of the present application. All such modifications fall within the scope of the appended claims. Although the methods disclosed herein have been described with reference to specific operations performed in a specific order, it should be understood that these operations can be combined, subdivided or reordered to form equivalent methods without departing from the teachings of the present application. Therefore, unless specifically indicated herein, the order and grouping of operations do not limit the present application.

Claims

1. A packaging structure, characterized in that: include: A flexible substrate, the flexible substrate comprising an upper surface, and the flexible substrate can be stretched by an external force to define a stretching direction, the upper surface has a plurality of long strip-shaped smooth portions and a plurality of long strip-shaped rough portions arranged at intervals from each other, and the extending direction of the rough portions is not parallel to the stretching direction; The first electronic component is disposed on the upper surface and covers a portion of the smooth portion and a portion of the rough portion.

2. The packaging structure according to claim 1, characterized in that: An extending direction of the roughness is perpendicular to the stretching direction.

3. The packaging structure according to claim 2, characterized in that: A width of the first electronic component in an extending direction of the rough portion is smaller than an extending length of the rough portion.

4. The packaging structure according to claim 1, characterized in that: The invention also includes a second electronic component which is arranged on the upper surface and spaced apart from the first electronic component.

5. The packaging structure according to claim 4, characterized in that: The second electronic component and the first electronic component are electrically connected via the flexible substrate.

6. The packaging structure according to claim 1, characterized in that: The total area of ​​the rough portions is smaller than the total area of ​​the smooth portions.

7. The packaging structure according to claim 1, characterized in that: Two ends of the rough portion extend to two sides of the flexible substrate respectively.

8. The packaging structure according to claim 1, characterized in that: The rough portion has a concavo-convex surface formed by grinding.

9. The packaging structure according to claim 1, characterized in that: A bottom filling glue is arranged between the first electronic component and the flexible substrate.

10. The packaging structure according to claim 1, characterized in that: The flexible substrate includes embedded conductive circuits.

Images