Temperature-controllable low-temperature heating device

Abstract

The utility model relates to a temperature-controllable low-temperature heating device which comprises a heat storage module, a heat dissipation module and a control module, and a heating module is arranged between the heat storage module and the heat dissipation module. The heating module comprises a first heating unit used for heating the heat storage module and a second heating unit used for heating or cooling the heat storage module, the first heating unit is connected with the heat storage module, one end of the second heating unit is connected with the heat storage module, and the other end of the second heating unit is connected with the heat dissipation module. The first heating unit, the second heating unit and the heat dissipation module are all connected with the control module; the first temperature sensor and the second temperature sensor are connected with the control module, the first temperature sensor is used for detecting the temperature of the heat storage module, and the second temperature sensor is used for detecting the environment temperature. According to the utility model, no fluid heat storage part is adopted, the all-solid-state design is adopted, the use is portable and convenient, and the temperature control precision and the reliability are high.

Description

Technical Field

[0001] The utility model belongs to the technical field of heating devices, and in particular relates to a temperature-controllable low-temperature heating device. Background Art

[0002] In some industrial production and laboratory operation processes, there are high requirements for low temperature (-20℃~120℃) accuracy, such as maintaining a constant temperature in a specific production area, and accurately adjusting, calibrating or evaluating component performance as needed.

[0003] At present, commonly used heating devices include resistance wire heating devices, water bath heating devices and oil bath heating devices. In order to make the temperature field uniform, the resistance wire heating device uses fluid (such as water or oil, etc.) to evenly distribute the heat under the drive of a circulation pump. However, commonly used heating devices have problems such as low temperature control accuracy, slow system temperature adjustment speed (large thermal inertia of the device), and low work efficiency when performing low-temperature heating and temperature control. It is difficult to use in the scene of fast and high-precision temperature adjustment. In addition, when the temperature needs to be lowered, the commonly used heating device needs a large heat dissipation device and an extra-long waiting time, which makes the heating device as a whole bloated and bulky, with high energy consumption, difficult to adapt to small and compact scenes, and unable to be portable and quickly complete testing, calibration or experimental operations. In addition, the presence of fluid pipelines and circulation pumps makes the heating device less applicable and reliable.

[0004] In view of this, the inventor provides a temperature-controllable low-temperature heating device to solve the above technical problems. Utility Model Content

[0005] The purpose of the utility model is to overcome the shortcomings of the above-mentioned prior art and provide a temperature-controllable low-temperature heating device, which is provided with a first heating unit and a second heating unit with different characteristics to achieve rapid and high-precision heating. The second heating unit is controlled by a control module to reversely transfer heat to the heat sink and the fan speed is controlled to achieve rapid cooling of the low-temperature heating device. The internal temperature and the ambient temperature of the low-temperature heating device are respectively obtained by a first temperature sensor and a second temperature sensor, and high-precision temperature control is achieved through the control module.

[0006] The purpose of the utility model is to solve the problem through the following technical solutions:

[0007] The utility model provides a temperature-controllable low-temperature heating device, comprising a heat storage module, a heat dissipation module and a control module, wherein a heating module is arranged between the heat storage module and the heat dissipation module, wherein the heating module comprises a first heating unit for heating the heat storage module and a second heating unit for heating or cooling the heat storage module, wherein the first heating unit is connected to the heat storage module, one end of the second heating unit is connected to the heat storage module, and the other end is connected to the heat dissipation module, and the first heating unit, the second heating unit and the heat dissipation module are all connected to the control module;

[0008] It also includes a first temperature sensor and a second temperature sensor respectively connected to the control module, the first temperature sensor is used to detect the temperature of the heat storage module, and the second temperature sensor is used to detect the ambient temperature.

[0009] Furthermore, the heat dissipation module includes a heat sink and a fan arranged at one end of the heat sink, and the other end of the heat sink is connected to the second heating unit.

[0010] Furthermore, the fan is connected to a control module.

[0011] Furthermore, the heat storage module is made of alloy material to form a heat storage component.

[0012] Furthermore, a plurality of working grooves are provided on the heat storage component, each of the working grooves is provided with a working pool adapted to the working groove structure, and each of the working pools is located in the corresponding working groove.

[0013] Furthermore, each of the working pools and the corresponding working trough are integrally formed.

[0014] Furthermore, the heat storage component is provided with a groove adapted to the first temperature sensor structure, and the first temperature sensor is arranged in the groove.

[0015] Furthermore, a heat-insulating layer is provided on the outer surface of the heat storage component, and the control module is arranged outside the heat-insulating layer.

[0016] Furthermore, the first heating unit is located between the heat storage component and the thermal insulation layer.

[0017] Furthermore, the control module is an MCU chip.

[0018] The utility model adopts an alloy material with high thermal conductivity to prepare a heat storage module. The heating module is placed at the bottom of the heat storage module. The heat storage module can quickly store the heat transferred by the heating module and conduct it for uniform distribution. The heating module includes a first heating unit and a second heating unit. The first heating unit is used to quickly increase the temperature, and the second heating unit is used to control the temperature accuracy, with a step adjustment of 0.1°C to achieve high-precision temperature regulation. An insulation layer is set on the outer surface of the heat storage module to maintain the set temperature. A first temperature sensor and a second temperature sensor are also set to obtain the temperature of the heat storage module and the ambient temperature in real time for controlling and adjusting the heating module. The bottom of the second heating unit is connected to the heat dissipation module for rapid heat dissipation. The all-solid-state low-temperature heating device of the utility model has a relatively simple structure, is all-solid-state, and has a high degree of integration. It can be made small and compact, and can achieve high-precision temperature regulation.

[0019] Compared with the prior art, the technical solution provided by the utility model has the following beneficial effects:

[0020] 1) The utility model provides a temperature-controllable low-temperature heating device, which can achieve rapid and high-precision heating by setting a first heating unit and a second heating unit with different characteristics. The control module is set to control the second heating unit to reversely transfer heat to the heat sink, and the fan speed is controlled to achieve rapid cooling of the low-temperature heating device and ensure cooling accuracy. A first temperature sensor and a second temperature sensor are also set to obtain the internal temperature of the low-temperature heating device and the ambient temperature respectively. The control module controls the first heating unit, the second heating unit and the fan to work by setting the temperature difference with the heat storage module and the ambient temperature, thereby achieving high-precision closed-loop temperature control. The low-temperature heating device of the utility model has no fluid heat storage components, is a fully solid-state design, is portable and convenient to use, and has high temperature control accuracy and high reliability.

[0021] 2) The utility model provides a temperature-controllable low-temperature heating device, including a heat storage module, which is made of alloy material to form a heat storage component. It has a fast heat storage speed, a small amount of heat storage, a small system thermal inertia, and rapid temperature adjustment, which solves the problem of slow temperature adjustment speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings herein are incorporated into and constitute a part of this specification, and together with the description, are used to explain the principles of the present utility model.

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0024] Figure 1 It is a schematic structural diagram of the temperature-controllable low-temperature heating device of the utility model.

[0025] Among them: 1 is a heat storage module; 2 is a heat dissipation module; 3 is a control module; 4 is a heating module; 5 is a first temperature sensor; 6 is a second temperature sensor; 7 is an insulation layer; 21 is a heat sink; 22 is a fan; 41 is a first heating unit; 42 is a second heating unit. DETAILED DESCRIPTION

[0026] Here, exemplary embodiments will be described in detail, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the utility model. Instead, they are only examples of devices consistent with some aspects of the utility model as detailed in the attached claims.

[0027] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0028] See also Figure 1 The embodiment of the utility model provides a temperature-controllable low-temperature heating device, comprising a heat storage module 1, a heat dissipation module 2 and a control module 3. A heating module 4 is arranged between the heat storage module 1 and the heat dissipation module 2. The heating module 4 comprises a first heating unit 41 for heating the heat storage module 1 and a second heating unit 42 for heating or cooling the heat storage module 1. The first heating unit 41 is connected to the bottom of the heat storage module 1 to directly transfer the generated heat to the heat storage module 1. The top of the second heating unit 42 is connected to the bottom of the heat storage module 1, and the bottom is connected to the heat dissipation module 2. The first heating unit 41, the second heating unit 42 and the heat dissipation module 2 are all connected to the control module 3.

[0029] The first temperature sensor 5 and the second temperature sensor 6 are respectively connected to the control module 3. The first temperature sensor 5 is used to detect the temperature of the heat storage module 1, and the second temperature sensor 6 is used to detect the ambient temperature. Specifically, the first temperature sensor 5 and the second temperature sensor 6 transmit the detected temperature to the control module 3.

[0030] Specifically, in this embodiment, the first heating unit 41 is a ceramic heating element (such as a PTC ceramic heating plate) with a power of 100 W and a size of 10 mm×10 mm×4 mm.

[0031] Further, the heat dissipation module 2 includes a heat sink 21 and a fan 22 disposed at the bottom of the heat sink 21, and the top of the heat sink 21 is connected to the bottom of the second heating unit 42. The fan 22 is connected to the control module 3, and the control module 3 is used to control the power of the fan 22.

[0032] Specifically, the second heating unit 42 is a heating and cooling bidirectional working element (such as a semiconductor Peltier module), which has a small heating power but high control accuracy and can achieve 0.1°C step adjustment. The heating power is 50W, the reverse power is -30W, and the size is 40mm×40mm×5mm.

[0033] The control module 3 sets a set temperature according to the working requirements. The control module 3 intelligently controls the first heating unit 41, the second heating unit 42 and the fan 22 according to the set temperature, the internal temperature of the low-temperature heating device, the ambient temperature and a specific algorithm to achieve high-precision closed-loop temperature control.

[0034] Furthermore, the heat storage module 1 is made of alloy material to form a heat storage component, which has high thermal conductivity and can quickly and evenly conduct heat to the entire heat storage component to achieve a uniform temperature field. Compared with liquid water, the heat storage component has a smaller specific heat capacity and a smaller heat storage capacity, and can achieve rapid temperature adjustment, so that the thermal inertia of the entire low-temperature heating device is small. Specifically, in this embodiment, 5A type aluminum alloy is selected, and its density is 2.7g / cm 3 , specific heat capacity is 1000J / (Kg·K), thermal conductivity is 237W / m·K, and size is 60mm×60mm×20mm.

[0035] Furthermore, the heat storage element is provided with a plurality of working grooves, each of which is provided with a working pool adapted to the working groove structure, each of which is located in the corresponding working groove, and each of which is integrally formed with the corresponding working groove, and the working pool is used to place test samples or test components to achieve constant temperature in a local area or calibrate test components. Specifically, the material of the working pool is the same as the material of the heat storage element.

[0036] Furthermore, a groove matching the structure of the first temperature sensor 5 is provided on the heat storage component, and the first temperature sensor 5 is arranged in the groove to detect the temperature of the heat storage component.

[0037] Furthermore, a heat preservation layer 7 is provided on the outer surface of the heat storage element, and the control module 3 is provided outside the heat preservation layer 7. The heat preservation layer 7 is used to reduce the heat dissipation rate of the low-temperature heating device, maintain its temperature constant, and reduce energy consumption.

[0038] Furthermore, the first heating unit 41 is located between the heat storage component and the thermal insulation layer 7 .

[0039] Furthermore, the control module 3 is an MCU chip, preferably an ARM MCU chip (microcontroller of ARM architecture).

[0040] In this embodiment, the low-temperature heating device further includes an alarm module, which is connected to the control module 3. When the temperature of the heat storage module 1 and the ambient temperature both exceed the corresponding set temperatures, the control module 3 controls the alarm module to sound an alarm.

[0041] The processing process of the control module 3 of the low temperature heating device is as follows:

[0042] First, the low-temperature heating device is turned on, and the temperature of the heat storage module 1 is detected by the first temperature sensor 5. When it is detected that the temperature of the heat storage module 1 is higher than the set temperature preset by the control module 3, the second heating unit 42 works in reverse to transfer the heat to the heat sink 21 for heat dissipation. During the heat dissipation process, the control module 3 determines the current temperature difference. If the temperature difference is large, the heat storage module 1 will obtain the ambient temperature through the second temperature sensor 6 as a reference to determine the operating power of the fan 22 to ensure the heat dissipation efficiency. If the temperature difference is small, the fan 22 will reduce its speed and then stop.

[0043] When it is detected that the temperature of the heat storage module 1 is lower than the set temperature preset by the control module 3, the control module 3 determines the current temperature difference. If the temperature difference is large, the first heating unit 41 is started to quickly heat the temperature to a temperature close to the set temperature, and then the first heating unit 41 is turned off and the second heating unit 42 is started at the same time to heat in steps of 0.1°C until the set temperature is reached; if the temperature difference is small, the second heating unit 42 is started to heat in steps of 0.1°C until the set temperature is reached.

[0044] In order to illustrate the temperature control effect of the present invention, the present invention makes the following calculations through specific data and formulas:

[0045] When the ambient temperature is 20°C and the set temperature is 50°C, the internal temperature of the low-temperature heating device is the same as the ambient temperature. After the low-temperature heating device is turned on, the control module 3 determines that the internal temperature of the low-temperature heating device is lower than the set temperature and the temperature difference is large. At this time, the first heating unit 41 is started and heated to about 49°C. The start time of the first heating unit 41 is t 1 Ignoring the working tank and other structures on the heat storage unit, then:

[0046]

[0047] At this time, the first heating unit 41 stops, and the second heating unit 42 starts at the same time. The start time of the second heating unit 42 is t 2 ,but:

[0048]

[0049] It can be seen that the total time for the heating module 4 to heat to the set temperature is 5.99s.

[0050] in:

[0051] P 1 represents the power of the first heating unit 41, 100W;

[0052] P 2 represents the power of the second heating unit 42, 50W;

[0053] Q 铝 Indicates the amount of heat absorbed in the aluminum material;

[0054] c 铝 represents the specific heat capacity of aluminum;

[0055] m 铝 Indicates the mass of aluminum;

[0056] ΔT represents the temperature difference.

[0057] The heat storage element evenly distributes the heat, and the heat generated by the heating module 4 is transferred from the bottom of the heat storage element to the top, with a distance of 20 mm. Since the total heating time is 5.99 seconds, it is sufficient to ensure that the heat that can be transferred by the heat storage element within 5.99 seconds is greater than the heat generated by the heating module 4 to meet the requirements.

[0058] According to the formula

[0059]

[0060] in:

[0061] Q is the area passed per unit time A = 0.0036m 2 of calories;

[0062] ΔT is the temperature difference, i.e. 20-50 = -30°C;

[0063] d is the distance or thickness between two points, 0.02m;

[0064] K is thermal conductivity, 237W / m·K.

[0065] According to the calculation results, the heat transfer power per unit time is 1279.8W, so the heat transfer power in 5.99s is 7666W, which is much greater than the power P of heating module 4. 1 and P 2 , that is, during the heating time, the heat storage component can evenly distribute the heat generated by the heating module 4.

[0066] When the temperature of the heat storage element reaches the set temperature, the first temperature sensor 41 transmits information to the control module 3, and the control module 3 controls the heating module 4 to stop working. Since the thermal insulation layer 7 cannot completely isolate heat loss, when the temperature measured by the first temperature sensor 41 is lower than the set temperature, the control module 3 will reopen the heating module 4 and reheat the heat storage element to the set temperature to achieve temperature closed-loop control.

[0067] When the ambient temperature is 20°C and the set temperature is 0°C, the internal temperature of the low-temperature heating device is the same as the ambient temperature. After the low-temperature heating device is turned on, the control module 3 determines that the internal temperature of the low-temperature heating device is higher than the set temperature, and needs to turn on the second heating unit 42 to work in reverse. According to its maximum cooling power P 3 Calculate for 30W, the time required for cooling is recorded as t 3 ,but

[0068]

[0069] Since the second heating unit 42 works in reverse to transfer the heat in the heat storage element to the heat sink 21, the heat sink 21 further dissipates the heat into the air. The cooling power is 30W, and the heat source power of the heat sink 21 is P 3 30W. According to the heat conduction calculation formula, the required area of ​​the heat sink 21 is

[0070]

[0071] in:

[0072] P 3 Indicates the heat source power, 30W;

[0073] A represents the heat dissipation area of ​​the heat sink 21, in m 2 ;

[0074] α represents the surface heat transfer coefficient, in W / m 2 ℃, value 12.8W / m 2 ℃;

[0075] T represents the maximum temperature of the heat sink 21 when it is stable, which is 25°C;

[0076] T 0 Indicates the surrounding air temperature, 20℃;

[0077] The heat sink 21 should be selected so that its surface area is greater than 0.17m 2 .

[0078] The fan 22 will increase air convection, so that the heat sink 21 will cool down faster, so when installing and using the fan 22, the surface area of ​​the heat sink 21 can be appropriately reduced.

[0079] The above description is only a specific embodiment of the present invention, so that those skilled in the art can understand or implement the present invention. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention.

[0080] It should be understood that the present invention is not limited to the above-described contents, and various modifications and changes can be made without departing from its scope. The scope of the present invention is limited only by the appended claims.

Claims

1. A temperature-controllable low-temperature heating device, characterized in that: The invention comprises a heat storage module (1), a heat dissipation module (2) and a control module (3); a heating module (4) is arranged between the heat storage module (1) and the heat dissipation module (2); the heating module (4) comprises a first heating unit (41) for heating the heat storage module (1) and a second heating unit (42) for heating or cooling the heat storage module (1); the first heating unit (41) is connected to the heat storage module (1); one end of the second heating unit (42) is connected to the heat storage module (1) and the other end is connected to the heat dissipation module (2); the first heating unit (41), the second heating unit (42) and the heat dissipation module (2) are all connected to the control module (3); It also comprises a first temperature sensor (5) and a second temperature sensor (6) respectively connected to the control module (3), wherein the first temperature sensor (5) is used to detect the temperature of the heat storage module (1), and the second temperature sensor (6) is used to detect the ambient temperature.

2. The temperature-controllable low-temperature heating device according to claim 1, characterized in that: The heat dissipation module (2) comprises a heat dissipation fin (21) and a fan (22) arranged at one end of the heat dissipation fin (21); the other end of the heat dissipation fin (21) is connected to a second heating unit (42).

3. The temperature-controllable low-temperature heating device according to claim 2, characterized in that: The fan (22) is connected to the control module (3).

4. The temperature-controllable low-temperature heating device according to claim 1, characterized in that: The heat storage module (1) is made of alloy material to form a heat storage component.

5. The temperature-controllable low-temperature heating device according to claim 4, characterized in that: The heat storage element is provided with a plurality of working grooves, each of which is provided with a working pool adapted to the working groove structure, and each of which is located in the corresponding working groove.

6. The temperature-controllable low-temperature heating device according to claim 5, characterized in that: Each of the working pools and the corresponding working trough are integrally formed.

7. The temperature-controllable low-temperature heating device according to claim 4, characterized in that: The heat storage element is provided with a groove which is compatible with the structure of the first temperature sensor (5), and the first temperature sensor (5) is arranged in the groove.

8. The temperature-controllable low-temperature heating device according to claim 4, characterized in that: A heat-insulating layer (7) is provided on the outer surface of the heat storage component, and the control module (3) is arranged outside the heat-insulating layer (7).

9. The temperature-controllable low-temperature heating device according to claim 8, characterized in that: The first heating unit (41) is located between the heat storage component and the thermal insulation layer (7).

10. The temperature-controllable low-temperature heating device according to claim 1, characterized in that: The control module (3) is an MCU chip.

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