Integral monocrystalline silicon substrate processing tool

Abstract

The utility model discloses an integral monocrystalline silicon substrate processing tool which comprises a workbench, the surface of the workbench is provided with a plurality of installation grooves, each installation groove is internally provided with a corresponding bearing plate, and the bearing plates are used for processing and bearing a monocrystalline silicon substrate body; the surface of the bearing plate is of a T-shaped structure, the bearing plate is provided with a plurality of bearing grooves, the bearing grooves are arranged side by side at intervals in the length direction of the bearing plate, and the inclined planes on the two sides of each bearing groove are matched with the inclined plane angle needed by machining of the monocrystalline silicon substrate body. The mounting groove is formed in the workbench, and the bearing plate capable of positioning and adjusting the angle is arranged in the mounting groove, so that after the monocrystalline silicon substrate is pasted on the bearing plate, the monocrystalline silicon substrate does not need to be taken down and pasted again, the processing direction is adjusted in time, and the processing efficiency of the monocrystalline silicon substrate is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of single crystal silicon processing, in particular to a processing tool for shaping single crystal silicon substrates. Background Art

[0002] Monocrystalline silicon is a good semiconductor material, mainly used to make semiconductor components, and is at the forefront of new material development. Monocrystalline silicon is a high-tech resource with great potential that is in urgent need of development and utilization. However, the processing of shaped monocrystalline silicon substrates is quite difficult, especially when the monocrystalline silicon substrates have arms with inclined angles on both sides. The processing angle is quite difficult to grasp and needs to be processed one by one, which makes the processing efficiency very low. At the same time, the processing process will cause the monocrystalline silicon substrate to have quality defects such as edge collapse, cracks, and scratches, which will affect the processing efficiency and processing quality of the monocrystalline silicon substrate. There is an urgent need for a shaped monocrystalline silicon substrate processing tool to assist in the processing of monocrystalline silicon substrates. Utility Model Content

[0003] In view of the above-mentioned defects or deficiencies in the prior art, it is desired to provide a shaped single crystal silicon substrate processing tooling to solve the problems that the existing processing tooling is relatively simple and cannot process single crystal silicon substrates with arms with inclined angles, and the processing angles are quite difficult to control and need to be processed one by one, resulting in very low processing efficiency. At the same time, the processing process will cause the single crystal silicon substrate to have quality defects such as edge collapse, cracks, scratches, etc., affecting the processing efficiency and processing quality of the single crystal silicon substrate.

[0004] According to the technical solution provided in the embodiment of the present application, a shaping single crystal silicon substrate processing tooling includes a workbench, a surface of which is provided with a plurality of mounting grooves, and a corresponding supporting plate is installed in each mounting groove, and the supporting plate is used for processing and supporting the single crystal silicon substrate body;

[0005] The support plate has a T-shaped surface and is provided with a plurality of support grooves, and the plurality of support grooves are arranged in parallel and at intervals along the length direction of the support plate, and the inclined surfaces on both sides of each of the support grooves are adapted to the inclined surface angles required for processing the single crystal silicon substrate body;

[0006] Two positioning rods and two positioning slots, the two positioning rods are installed in parallel and correspondingly at the front and rear ends of the support plate, and the two positioning slots are arranged on the installation slot, and each positioning rod is clamped in the corresponding positioning slot, and the positioning slot is an arc-shaped structure, so that the positioning rod can move along the positioning slot for adjusting the processing angle of the support plate.

[0007] Further, corresponding connecting rods are provided at both ends of several of the supporting plates, and corresponding connecting holes are provided on several of the mounting grooves, so that each of the connecting rods is movably clamped in the connecting holes on the mounting grooves, and fixing grooves are provided on the connecting rods and the connecting holes, and fixing pins are clamped in the fixing grooves for fixing the horizontal position of the supporting plates.

[0008] Further, the bottom of the supporting plate is of an arc-shaped structure, and the upper part of the supporting plate is convexly installed in the mounting groove.

[0009] Further, the supporting plate rotates around the connecting rod as the central position.

[0010] Further, several corresponding fixing grooves are also provided at the front and rear ends of the supporting plate and on the side surface of the workbench, and each of the fixing grooves is used for the clamping and locking of the locking pins.

[0011] In summary, the beneficial effects of the present application are as follows:

[0012] 1. By providing a mounting groove on the workbench and arranging a supporting plate with positionable and adjustable angle in the mounting groove, after the monocrystalline silicon substrate is pasted on the supporting plate, it is not necessary to remove and paste it again, and the processing orientation can be adjusted in time, improving the processing efficiency of the monocrystalline silicon substrate;

[0013] 2. By setting the surface of the supporting plate into a T-shaped structure adapted to the surface after the processing of the monocrystalline silicon, the supporting plate can support the relatively weak arms of the monocrystalline silicon substrate during processing, preventing quality defects such as chipping, cracking, and scratching of the arms during processing, and improving the processing quality of the processing tooling for the monocrystalline silicon substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Other features, objects, and advantages of the present application will become more apparent by reading the detailed description of the non-limiting embodiments with reference to the following drawings:

[0015] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0016] Figure 2 is a schematic diagram of the exploded structure of the present invention;

[0017] Figure 3 is Figure 2 the enlarged view at A in

[0018] Figure 4 is Figure 2 the enlarged view at B in

[0019] Figure 5 is Figure 2 the enlarged view at C in

[0020] Reference numerals in the figure: workbench - 100, installation groove - 101, positioning groove - 102, connection hole - 103, supporting plate - 200, supporting groove - 201, positioning rod - 210, connecting rod - 220, fixing groove - 230, fixing pin - 240. Detailed implementation manners

[0021] The present application will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the relevant utility model and are not intended to limit the utility model. In addition, it should be noted that for the sake of description, only the parts related to the utility model are shown in the drawings.

[0022] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the drawings and embodiments.

[0023] An integer single - crystal silicon substrate processing tooling, comprising a workbench 100, on the surface of which there are provided a plurality of installation grooves 101, and corresponding supporting plates 200 are installed in each of the installation grooves 101. The plurality of supporting plates 200 are used for processing and supporting the single - crystal silicon substrate body; the supporting plate 200 has a T - shaped structure on its surface, and is provided with a plurality of supporting grooves 201. The plurality of supporting grooves 201 are arranged side by side and at intervals along the length direction of the supporting plate 200, and the inclined surfaces on both sides of each supporting groove 201 are adapted to the inclined surface angles required for processing the single - crystal silicon substrate body, and are used for supporting the processing of the arms of the single - crystal silicon substrate to prevent quality defects such as chipping, breakage, and scratches from occurring on the arms during the processing; two positioning rods 210 and two positioning grooves 102. The two positioning rods 210 are installed side by side and correspondingly at the front and rear ends of the supporting plate 200, and the two positioning grooves 102 are provided on the installation groove 101, and each positioning rod 210 is clamped in the corresponding positioning groove 102. The positioning groove 102 is an arc - shaped structure, so that the positioning rod 210 can move along the positioning groove 102, thereby enabling the supporting plate 200 to rotate in the installation groove 101, so as to adjust the processing angle of the supporting plate 200, so that the milling machine can mill the arms on both sides of the single - crystal silicon substrate.

[0024] During the processing of multiple single-crystalline silicon wafers by the processing tooling, the processing personnel paste the multiple single-crystalline silicon wafers to be milled on each of the supporting grooves 201 of several supporting plates 200 on the workbench 100, so that the supporting plates 200 rotate with the screw holes as the center positions, so that the positioning rods 210 fixedly connected to the front and rear ends of the supporting plates 200 move along the arc-shaped positioning grooves 102, and the connection angle between the supporting plates 200 and the installation grooves 101 is adjusted according to the processing needs, so that the multiple single-crystalline silicon wafers can be quickly adjusted in the processing orientation on the supporting plates 200 without being removed again, thereby improving the processing efficiency of the processing tooling for the single-crystalline silicon wafers.

[0025] As a preferred embodiment, please refer to Figure 2 and Figure 3 , corresponding connecting rods 220 are provided at both ends of several supporting plates 200, and corresponding connecting holes 103 are provided on several installation grooves 101, and each connecting rod 220 is movably clamped in the connecting hole 103 on the installation groove 101, and fixing grooves 230 are provided on the connecting rod 220 and the connecting hole 103, and the fixing pin 240 is clamped in the fixing groove 230 for fixing the horizontal position of the supporting plate 200.

[0026] As a preferred embodiment, please refer to Figure 1 and Figure 2 , the bottom of the supporting plate 200 is of an arc-shaped structure, and the upper part of the supporting plate 200 is convexly installed in the installation groove 101, which is convenient for the milling machine to polish the single-crystalline silicon wafer body pasted on the convex supporting plate 200.

[0027] As a preferred embodiment, please refer to Figure 1 and Figure 2 , the supporting plate 200 rotates with the connecting rod 220 as the center position, so as to adjust the processing angle on the surface of the supporting plate 200.

[0028] As a preferred embodiment, please refer to Figure 2 and Figure 5 , corresponding fixing grooves 230 are also provided at the front and rear ends of the supporting plate 200 and the side surface of the workbench 100, and corresponding locking pins are clamped in each fixing groove 230 for adjusting and locking the supporting plate 200, preventing the supporting plate 200 with single-crystalline silicon wafers from rotating during the milling process of the milling machine, and improving the processing efficiency of the processing tooling for the single-crystalline silicon wafers

[0029] The working principle of the present utility model is:

[0030] During the processing of multiple single-crystalline silicon wafers by the processing tooling, the processing personnel paste the multiple single-crystalline silicon wafers to be milled and ground into the respective supporting grooves 201 on several supporting plates 200 on the workbench 100, so that the supporting plates 200 rotate with the connecting rod 220 as the center position, thereby enabling the positioning rods 210 fixedly connected to the front and rear ends of the supporting plates 200 to move along the arc-shaped positioning groove 102, and the rotated supporting plates 200 are fixed by the fixing pins 240 to prevent the supporting plates 200 carrying the single-crystalline silicon wafers from rotating during the milling and grinding process, so that the staff can adjust the connection angle between the supporting plate 200 and the installation groove 101 according to the processing requirements, so that the multiple single-crystalline silicon wafers can be quickly adjusted in the processing orientation on the supporting plate 200 without being taken off again, thereby improving the processing efficiency of the processing tooling for the single-crystalline silicon wafers. At the same time, the surfaces of the several supporting grooves 201 on the supporting plate 200 are set into a T-shaped structure adapted to the surface after the single-crystalline silicon is processed, so that the supporting plate 200 can support the relatively weak arm parts during the processing of the single-crystalline silicon wafers, preventing quality defects such as chipping, breakage, and scratches from occurring on the arms during the processing, and improving the processing quality of the processing tooling for the single-crystalline silicon wafers.

[0031] In summary, the beneficial effects of this application are as follows:

[0032] First, by providing the installation groove 101 on the workbench 100 and arranging the support plate 200 with adjustable positioning angle in the installation groove 101, after the single-crystalline silicon wafer is pasted on the support plate 200, it is not necessary to take it off and paste it again, and the processing orientation can be adjusted in time, improving the processing efficiency of the single-crystalline silicon wafer;

[0033] Second, by setting the surface of the support plate 200 into a T-shaped structure adapted to the surface after the single-crystalline silicon is processed, the support plate 200 can support the relatively weak arm parts during the processing of the single-crystalline silicon wafers, preventing quality defects such as chipping, breakage, and scratches from occurring on the arms during the processing, and improving the processing quality of the processing tooling for the single-crystalline silicon wafers.

[0034] The above description is only the preferred embodiment of this application and the description of the technical principle and other solutions used. At the same time, the scope of the utility model involved in this application is not limited to the technical solutions formed by the specific combination of the above technical features, and should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the inventive concept of the utility model. For example, the technical solutions formed by mutually replacing the above features with the (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A tooling for processing a shaped single crystal silicon substrate, characterized by: It comprises a workbench (100), a surface of which is provided with a plurality of mounting grooves (101), and a corresponding supporting plate (200) is installed in each mounting groove (101), wherein the supporting plate (200) is used for processing and supporting a single crystal silicon substrate body; The support plate (200) has a T-shaped structure on its surface and is provided with a plurality of support grooves (201), and the plurality of support grooves (201) are arranged in parallel and at intervals along the length direction of the support plate (200), and the inclined surfaces on both sides of each of the support grooves (201) are adapted to the inclined surface angles required for processing the single crystal silicon substrate body; Two positioning rods (210) and two positioning grooves (102), the two positioning rods (210) are arranged in parallel and correspondingly installed at the front and rear ends of the support plate (200), and the two positioning grooves (102) are arranged on the installation groove (101), and each positioning rod (210) is clamped in the corresponding positioning groove (102), and the positioning groove (102) is an arc-shaped structure, so that the positioning rod (210) can move along the positioning groove (102) for adjusting the processing angle of the support plate (200).

2. The tooling for processing a shaped single crystal silicon substrate according to claim 1, characterized in that: Corresponding connecting rods (220) are provided at both ends of a plurality of the supporting plates (200), and corresponding connecting holes (103) are provided on a plurality of the mounting grooves (101), so that each of the connecting rods (220) can be movably engaged in the connecting hole (103) on the mounting groove (101), and fixing grooves (230) are provided on the connecting rods (220) and the connecting holes (103), and fixing pins (240) are engaged in the fixing grooves (230) for fixing the supporting plates (200) in a horizontal position.

3. The tooling for processing a shaped single crystal silicon substrate according to claim 1, characterized in that: The bottom of the supporting plate (200) is in an arc-shaped structure, and the upper portion of the supporting plate (200) is installed in the installation groove (101) in a protruding shape.

4. The tooling for processing a shaped single crystal silicon substrate according to claim 1, characterized in that: The supporting plate (200) rotates with the connecting rod (220) as the center.

5. The tooling for processing a shaped single crystal silicon substrate according to claim 1, characterized in that: A plurality of corresponding fixing grooves (230) are also provided at the front and rear ends of the support plate (200) and the side surface of the workbench (100), and each of the fixing grooves (230) is used for locking the locking pin.

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