Cathode hanger and electroplating process device
By designing a protective mechanism in the cathode hanger to cover part of the metal surface of the conductive mechanism, the problems of corrosion and impurity deposition of the conductive ring during the electroplating process are solved, and the plating quality and service life of the hanger are improved.
Patent Information
- Application Number
- CN202421627869.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-10
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2034-07-10
AI Technical Summary
The conductive ring is exposed to the plating solution for a long time during the electroplating process, which leads to corrosion and impurity deposition, affecting the conductivity and plating quality.
A cathode hanging tool is designed to cover part of the metal surface of the conductive mechanism through a protective mechanism, reducing contact with the plating solution and preventing impurities from deposition.
It improves the stability of current transmission, extends the service life of the mount, and ensures the quality and uniformity of the electroplating process.
Smart Images
Figure CN222961597U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor product installation, and particularly to a cathode fixture and an electroplating process device. Background Art
[0002] An electroplating fixture is a tool used in the electroplating process, mainly for fixing the workpiece to be plated in the process tank for electroplating, enabling the workpiece to receive the deposition of metal ions in the electroplating solution and ensuring the uniformity and stability of the electroplating process.
[0003] As the core component of the electroplating fixture, the conductive ring mainly functions to transmit current from the power source to the workpiece to be plated. The conductive ring is usually made of metal materials. Although it has good electrical conductivity, since it is immersed in the electroplating solution for a long time, the chemical substances in the electroplating solution will corrode the metal surface of the conductive ring, reducing the service life of the fixture. At the same time, the precipitated impurities deposited on the metal surface of the conductive ring will affect the conductivity of the conductive ring, making the electroplating current distribution uneven, and thus affecting the electroplating efficiency and the uniformity of the electroplating layer.
[0004] Therefore, how to provide a fixture that ensures electroplating quality is a technical problem that those skilled in the art urgently need to solve. Utility Model Content
[0005] This application provides a cathode fixture and an electroplating process device. By covering part of the metal surface of the conductive mechanism with a protection mechanism, the contact between the conductive mechanism and the chemical substances in the electroplating solution during electroplating is reduced, the precipitation of excessive impurities that affect the conductivity of the conductive mechanism is avoided, the stability of current transmission is improved, and at the same time, the service life of the fixture is also increased.
[0006] In a first aspect, a cathode fixture is provided, including:
[0007] A main body, at least one conductive structure provided on the main body, and a protection mechanism;
[0008] The conductive structure includes a conductive mechanism; part of the conductive mechanism is embedded in the main body, and the other part extends in a direction away from the main body to form a side wall; the protection mechanism is arranged around the circumference of the conductive mechanism and covers the part of the conductive mechanism embedded in the main body.
[0009] Specifically, the conductive mechanism includes a conductive ring;
[0010] The protection mechanism includes a protection ring;
[0011] The protection ring and the conductive ring are matched.
[0012] Preferably, the protection ring includes a number of limiting blocks arranged in a direction away from the main body, configured to limit the position of the workpiece to be plated when the workpiece to be plated is placed at the top of the side wall.
[0013] Preferably, the cathode fixture further includes: a seal;
[0014] The body includes a plurality of convex structures;
[0015] The conductive ring surrounds the convex structure, and a preset space is defined between the two;
[0016] The seal is disposed in the preset space and configured to block the workpiece to be plated.
[0017] Specifically, the convex structure has a connection structure configured such that when the workpiece to be plated is placed at the top of the side wall, the workpiece to be plated is connected to the convex structure through the connection structure, so that the workpiece to be plated and the top of the side wall are in close contact.
[0018] Specifically, the conductive ring includes a plurality of connection columns extending along the radial direction of the conductive ring;
[0019] The protective ring includes a plurality of grooves matching the connection columns;
[0020] When the protective ring is disposed on the conductive ring, the grooves and the connection columns cooperate.
[0021] Specifically, the conductive structure further includes a first conductive member, and the first conductive member includes a first part and a second part which are electrically connected;
[0022] The first part is strip-shaped and is embedded in the body;
[0023] The second part surrounds the periphery of the conductive mechanism, is embedded in the body, and a part of it extends in the direction close to the conductive mechanism and is connected to the connection column.
[0024] Specifically, the conductive structure further includes a second conductive member;
[0025] A part of the second conductive member is embedded in the body and is connected to the first part, and is configured to connect to an external power supply.
[0026] A second aspect provides an electroplating process device, including:
[0027] A process tank filled with electroplating solution;
[0028] An anode carrier;
[0029] The cathode fixture provided in the first aspect;
[0030] Both the anode carrier and the cathode fixture are disposed in the process tank and immersed in the electroplating solution;
[0031] When the anode carrier is connected to the positive pole of an external power supply and the cathode fixture is connected to the negative pole of the external power supply, an electroplating transition region is formed between the anode carrier and the cathode fixture.
[0032] Preferably, the electroplating process device further includes:
[0033] The shielding plate is disposed in the electroplating transition region and configured to shield some ions generated by the electroplating operation.
[0034] According to the specific embodiments provided in the present application, the following technical effects are disclosed:
[0035] In the technical solution of the present application, a cathode fixture and an electroplating process device are provided. The cathode fixture includes: a body, at least one conductive structure disposed on the body, and a protection mechanism; the conductive structure includes a conductive mechanism; a part of the conductive mechanism is embedded in the body, and the other part extends in a direction away from the body to form a side wall; the protection mechanism is disposed around the circumference of the conductive mechanism and covers the part of the conductive mechanism embedded in the body. In this solution, the protection mechanism is used to cover the part of the conductive mechanism embedded in the body, which can prevent the electroplating solution and the conductive mechanism from contacting for a long time during the electroplating process, and prevent impurities from precipitating at the connection between the conductive mechanism and the cathode fixture body after reaction, reducing the accumulation of impurities, avoiding excessive impurities from affecting the conductivity of the conductive mechanism, improving the stability of current transmission, and ensuring the quality of electroplating. BRIEF DESCRIPTION OF THE DRAWINGS
[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.
[0037] Figure 1 is one of the schematic diagrams of the cathode fixture provided by the embodiment of the present application;
[0038] Figure 2 is another schematic diagram of the cathode fixture provided by the embodiment of the present application;
[0039] Figure 3 is a schematic cross-sectional view of the cathode fixture provided by the embodiment of the present application;
[0040] Figure 4 is one of the schematic diagrams of the electroplating process device provided by the embodiment of the present application;
[0041] Figure 5 is another schematic diagram of the electroplating process device provided by the embodiment of the present application.
[0042] Reference numerals: 10, body; 21, conductive ring; 210, annular side wall; 211, connecting column; 22, protective ring; 220, limiting block; 30, seal; 40, convex structure; 400, screw hole; 50, first part; 60, second part; 70, conductive plug; 100, workpiece to be plated; 1000, cathode fixture; 2000, anode carrier; 3000, shielding plate. Detailed implementation manners
[0043] Some embodiments of the present application will be described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principle of the present application and are not intended to limit the protection scope of the present application.
[0044] As described in the background art, the conductive ring is usually made of a metal material. Since it is immersed in the electroplating solution for a long time, the chemical substances in the electroplating solution will corrode the metal surface of the conductive ring, reducing the service life of the fixture. At the same time, the impurities precipitated after the reaction between the conductive ring and the electroplating solution are deposited on the metal surface of the conductive ring, which will affect the conductivity of the conductive ring, making the electroplating current distribution uneven and affecting the electroplating efficiency and the uniformity of the electroplating layer.
[0045] To solve the above problems, the core of the present application is to provide a cathode fixture and an electroplating process device to improve the stability of current transmission and ensure the quality of electroplating.
[0046] Embodiment 1
[0047] Embodiment 1 of the present application provides a cathode fixture, as Figure 1 and Figure 3 shown, including: a body 10, at least one conductive structure provided on the body 10, and a protection mechanism; the conductive structure includes a conductive mechanism; a part of the conductive mechanism is embedded in the body 10, and the other part extends in a direction away from the body 10 to form a side wall; the protection mechanism is arranged around the circumference of the conductive mechanism and covers the part of the conductive mechanism embedded in the body 10.
[0048] Among them, the conductive mechanism is used to transmit current to the workpiece to be plated 100 when the workpiece to be plated 100 is placed on it. The design of partially embedding the conductive mechanism into the main body 10 enhances the stability of the connection structure between the conductive mechanism and the main body 10. The side wall formed by the other part matches the shape and size of the workpiece to be plated 100, which helps to form a stable conductive surface between the conductive mechanism and the workpiece to be plated 100, enabling the current to be evenly transmitted to the workpiece to be plated 100, ensuring the uniformity of the electroplated layer formed on the workpiece to be plated 100, and improving the quality of electroplating. The protection mechanism covers the part where the conductive mechanism is embedded in the main body 10, which can prevent the electroplating solution from reacting with the conductive mechanism and precipitating impurities at the connection between the conductive mechanism and the main body 10, so as to reduce the influence of impurities on the electroplating process. At the same time, due to the covering and protection of the protection mechanism, the corrosion rate of the conductive mechanism by the electroplating solution will be reduced, which helps to maintain the conductivity of the conductive mechanism and ensure the stability of the electroplating process.
[0049] In an alternative embodiment of the present application, the conductive mechanism and the protection mechanism match each other. The overall shape and size of the conductive mechanism and the protection mechanism can be designed according to the shape and size of the workpiece to be plated. Exemplarily, when the workpiece to be plated is a regular shape, such as a rectangle, the conductive mechanism and the protection mechanism can be correspondingly designed as rectangles to fit the workpiece to be plated; when the workpiece to be plated is an irregular shape, the conductive mechanism and the protection mechanism can also be correspondingly designed as irregular shapes to fit the workpiece to be plated.
[0050] It should be noted that the protection mechanism is made of an insulating material.
[0051] In some embodiments of the present application, the main body of the cathode fixture is made of PVC material to avoid corrosion caused by the reaction of the fixture with the electroplating solution during long-term immersion in the electroplating solution, and the service life of the cathode fixture is extended.
[0052] Embodiment 2
[0053] Based on Embodiment 1, Embodiment 2 of the present application provides the specific structures of the protection mechanism and the conductive mechanism when the workpiece to be plated is disc-shaped.
[0054] Specifically, as Figure 1 and Figure 3 shown, the conductive mechanism includes a conductive ring 21; the protection mechanism includes a protection ring 22; the protection ring 22 and the conductive ring 21 match.
[0055] Among them, when the workpiece to be plated 100 is a circular grinding disc, the conductive mechanism and the protection mechanism are correspondingly designed as rings to fit the grinding disc. At this time, the side wall of the conductive ring 21 is specifically an annular side wall 210.
[0056] Specifically, as Figure 1 and Figure 3As shown, the protection ring 22 includes a number of limiting blocks 220 arranged in a direction away from the main body 10, configured to limit the position of the workpiece 100 to be plated when the workpiece 100 to be plated is placed at the top of the annular side wall 210.
[0057] In some embodiments of the present application, as Figure 1 and Figure 3 shown, when the workpiece 100 to be plated is placed at the top of the annular side wall 210, the limiting block 220 contacts the side surface of the workpiece 100 to be plated, preventing the position of the workpiece 100 to be plated from shifting during the electroplating operation, keeping the workpiece 100 to be plated in the optimal position throughout the electroplating process, and ensuring the process stability and position accuracy of the workpiece 100 to be plated during the electroplating process.
[0058] Embodiment 3
[0059] When the original workpiece to be plated is placed in the conductive ring and immersed in the electroplating solution, the electroplating solution will penetrate between the workpiece to be plated and the conductive ring, resulting in the non-electroplated surface of the workpiece to be plated contacting the electroplating solution for a long time, which has a certain impact on the finished product quality of the workpiece to be plated. Therefore, in Embodiment 3 of the present application, a seal is provided on the basis of Embodiment 2 to prevent the electroplating solution from penetrating between the workpiece to be plated and the conductive ring.
[0060] Preferably, as Figure 3 shown, the cathode fixture further includes: a seal 30; the main body 10 includes a number of convex structures 40; the conductive ring 21 is disposed around the convex structure 40, and a preset space is defined therebetween; the seal 30 is disposed in the preset space and configured to block the workpiece 100 to be plated.
[0061] Specifically, when the workpiece 100 to be plated is placed at the top of the annular side wall 210, the seal 30 is deformed by being squeezed by the workpiece 100 to be plated.
[0062] Among them, the seal 30 being deformed by being squeezed means that the seal 30 maintains good fit with the convex structure 40, the conductive ring 21, and the workpiece 100 to be plated. In this way, during the electroplating process, the electroplating solution will not penetrate into the preset space through the tiny gap between the workpiece 100 to be plated and the annular side wall 210, thereby avoiding the influence of the electroplating solution on the non-electroplated surface of the workpiece 100 to be plated. At the same time, the formation of air bubbles in the preset space is also reduced.
[0063] In some embodiments of the present application, the seal is composed of two superimposed sealing rings to ensure the reliability of the seal.
[0064] Specifically, as Figure 1 and Figure 3As shown, the convex structure 40 has a connecting structure configured such that when the workpiece 100 to be plated is placed at the top of the annular sidewall 210, the workpiece 100 to be plated is connected to the convex structure 40 through the connecting structure, so that the workpiece 100 to be plated and the top of the annular sidewall 210 are in close contact.
[0065] In an alternative embodiment of the present application, as Figure 1 and Figure 3 shown, the connecting structure is a threaded hole 400.
[0066] Among them, since the cathode fixture is usually vertically immersed in the electroplating solution, the workpiece 100 to be plated requires a certain external force to be firmly fixed on the cathode fixture, otherwise it will fall off the fixture. By threadedly connecting the workpiece 100 to be plated and the convex structure 40 through the threaded hole 400, the workpiece 100 to be plated can maintain a stable connection with the cathode fixture while being in close contact with the conductive ring 21, enabling the current to be transmitted more evenly to the workpiece 100 to be plated. Further, when the workpiece 100 to be plated is in close contact with the conductive ring 21, the seal 30 will also be squeezed and deformed, preventing the electroplating solution from penetrating through the gap between the workpiece 100 to be plated and the annular sidewall 210, ensuring the quality of electroplating.
[0067] Embodiment 4
[0068] Embodiment 4 of the present application provides the relevant components of the conductive structure and the matching structure of the conductive ring and the protective ring on the basis of Embodiment 3.
[0069] Specifically, as Figure 1 and Figure 3 shown, the conductive ring 21 includes a plurality of connecting columns 211 extending radially along the conductive ring 21; the protective ring 22 includes a plurality of grooves (not shown in the figure) matching the connecting columns 211; when the protective ring 22 is disposed on the conductive ring 21, the grooves cooperate with the connecting columns 211.
[0070] Among them, the connecting columns 211 are used to connect to the structure for transmitting current, and then transmit the current to the conductive ring 21 itself. The grooves cover the corresponding connecting columns 211 when the protective ring 22 is disposed on the conductive ring 21, so as to prevent the connecting columns 211 from contacting the electroplating solution for a long time and generating impurities, which affects the quality of electroplating.
[0071] Specifically, as Figure 1 shown, the conductive structure further includes a first conductive member, and the first conductive member includes an electrically connected first portion 50 and a second portion 60; the first portion 50 is strip-shaped and is embedded in the body 10; the second portion 60 surrounds the periphery of the conductive ring 21 and is embedded in the body 10, and a part of it extends in the direction close to the conductive ring 21 and is connected to the connecting column 211.
[0072] Among them, the first part 50 and the second part 60 form a coherent current transmission network, providing a path for the transmission of current and ensuring the uniformity and stability of the current during the electroplating process.
[0073] In some embodiments of the present application, both the first part and the second part are made of conductive copper plates.
[0074] In some embodiments of the present application, the surfaces of the first part and the second part are both coated with sealant; when the cathode fixture is immersed in the electroplating solution, the first part and the second part are isolated from the electroplating solution through the sealant, so as to avoid the precipitation of impurities after the reaction between the electroplating solution and the first part and the second part, which affects the quality of electroplating.
[0075] Specifically, as Figure 2 shown, the conductive structure further includes a second conductive member; a part of the second conductive member is embedded in the body 10 and connected to the first part 50, and is configured to connect to an external power supply.
[0076] In an alternative embodiment of the present application, as Figure 2 shown, the second conductive member includes a conductive plug 70, a part of which is embedded in the body 10 and connected to the first part 50, and the other part extends in a direction away from the body 10.
[0077] In some embodiments of the present application, the conductive plug is made of brass.
[0078] Embodiment 5
[0079] Embodiment 5 of the present application provides an electroplating process device, as Figure 4 and Figure 5 shown, including: the cathode fixture 1000 provided in Embodiments 1 to 4; the anode carrier 2000; a process tank filled with electroplating solution (not shown in the figure); both the anode carrier 2000 and the cathode fixture 1000 are arranged in the process tank and immersed in the electroplating solution; when the anode carrier 2000 is connected to the positive pole of an external power supply and the cathode fixture 1000 is connected to the negative pole of the external power supply, an electroplating transition zone is formed between the anode carrier 2000 and the cathode fixture 1000.
[0080] Among them, the electroplating solution in the process tank contains metal ions for electroplating, which will be deposited on the surface of the workpiece to be electroplated during the electroplating process; the anode carrier 2000 is used to mount the anode material and provide a source of metal ions during the electroplating process. The cathode hanger 1000 is as described in the foregoing embodiments and is used to fix the workpiece to be electroplated. During the electroplating process, the anode carrier 2000 is connected to the positive pole of the power supply, and the cathode hanger 1000 is connected to the negative pole of the power supply. Thus, when an electric current passes through the electroplating process device, an electric field will be formed between the anode and the cathode. Due to the action of the electric field, an electroplating transition zone will be formed between the anode carrier 2000 and the cathode hanger 1000. In this area, the metal ions of the anode will migrate towards the cathode and be reduced and deposited on the surface of the workpiece to be electroplated, forming a uniform electroplating layer.
[0081] In some embodiments of the present application, the anode carrier is made of a titanium alloy material.
[0082] Preferably, as Figure 4 and Figure 5 shown, the electroplating process device further includes: a shielding plate 3000, disposed in the electroplating transition zone and configured to shield some ions generated by the electroplating operation.
[0083] Among them, the shielding plate 3000 can block the surface of the workpiece to be electroplated by unnecessary electro-ions to control the deposition rate and uniformity of the electroplating layer, and at the same time reduce unnecessary physical or chemical reactions. Among them, unnecessary ions refer to ions that do not directly participate in the electroplating reaction or contribute to the formation of the required electroplating layer. These ions may come from impurities in the electroplating solution or by-products of the electroplating process.
[0084] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.
[0085] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present application, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.
[0086] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application.
Claims
1. A cathode hanger, characterized in that: include: A body, at least one conductive structure provided on the body, and a protection mechanism; The conductive structure includes a conductive mechanism; Part of the conductive mechanism is embedded in the body, and the other part extends away from the body to form a side wall; the protective mechanism is arranged around the side wall along the circumference of the conductive mechanism and covers the part of the conductive mechanism embedded in the body.
2. The cathode hanger according to claim 1, characterized in that: The conductive mechanism comprises a conductive ring; The protection mechanism includes a protection ring; The guard ring is matched with the conductive ring.
3. The cathode hanger according to claim 2, characterized in that: The protection ring includes a plurality of limit blocks arranged in a direction away from the main body, and is configured to limit the position of the workpiece to be plated when the workpiece to be plated is placed on the top end of the side wall.
4. The cathode hanger according to claim 3, characterized in that: Also includes: Seals; The body includes a plurality of protruding structures; The conductive ring is disposed around the protruding structure, and a preset space is defined between the two; The sealing member is disposed in the preset space and is configured to block the workpiece to be plated.
5. The cathode hanger according to claim 4, characterized in that: The protruding structure has a connecting structure, and is configured such that when the workpiece to be plated is placed on the top end of the side wall, the workpiece to be plated is connected to the protruding structure through the connecting structure, so that the workpiece to be plated and the top end of the side wall are in close contact.
6. The cathode hanger according to claim 2 or 4, characterized in that: The conductive ring comprises a plurality of connecting posts extending in the radial direction of the conductive ring; The protective ring includes a plurality of grooves matching the connecting posts; When the protection ring is disposed on the conductive ring, the groove and the connecting column cooperate with each other.
7. The cathode hanger according to claim 6, characterized in that: The conductive structure further includes a first conductive member, the first conductive member including a first portion and a second portion that are electrically connected; The first part is in a strip shape and is embedded in the main body; The second part is arranged around the conductive mechanism and embedded in the main body, and a part of the second part extends in a direction close to the conductive mechanism and is connected to the connecting column.
8. The cathode hanger according to claim 7, characterized in that: The conductive structure further includes a second conductive member; A portion of the second conductive member is embedded in the body and connected to the first portion, and is configured to be connected to an external power source.
9. An electroplating process device, characterized in that: include: a process tank containing the plating solution; Anode carrier; The cathode hanger according to any one of claims 1 to 8; The anode carrier and the cathode hanger are both arranged in the process tank and immersed in the electroplating solution; When the anode carrier is connected to the positive pole of an external power source, and the cathode rack is connected to the negative pole of the external power source, an electroplating transition zone is formed between the anode carrier and the cathode rack.
10. The electroplating process device according to claim 9, characterized in that: Also includes: The shielding plate is disposed in the electroplating transition zone and is configured to shield part of the ions generated by the electroplating operation.