Stackable ceramic electronic component setter board

Abstract

The utility model discloses a stackable ceramic electronic component setter board, which comprises a setter board body, a stacking support column and a placement groove, inserting columns are symmetrically arranged at the four corners of the load bearing plate body up and down, and inserting holes are formed in the inserting columns; inserting heads corresponding to the inserting holes are arranged at the two ends of the stacking supporting columns, the inserting heads are inserted into the inserting holes, and the two load bearing plate bodies which are arranged in an up-and-down stacking mode are separated by the stacking supporting columns; caulking grooves are formed in the front surface and the back surface of the load bearing plate body and are uniformly distributed at intervals; clamping grooves are symmetrically formed in the two sides of the embedding groove, inserting strips matched with the clamping grooves are arranged on the two sides of the containing groove, and the inserting strips are clamped into the clamping grooves; the front side and the back side can bear burning, the problem that the middle of the burning bearing plate collapses can be avoided, and the structure of the embedding groove and the containing groove is flexible and can adapt to burning of electronic components of different shapes.

Description

Technical Field

[0001] The utility model relates to the technical field of auxiliary tools for sintering ceramic electronic components, in particular to a stackable bearing plate for ceramic electronic components. Background Art

[0002] Generally, the manufacturing method of ceramic material electronic components is as follows: after adding a sintering agent and a forming agent to ceramic powder, an unfired component is formed, and then the unfired component is placed on a bearing plate and loaded into a sintering furnace, and sintering is carried out while controlling the furnace environment under specified temperature and atmosphere conditions.

[0003] The existing bearing plates have the following problems:

[0004] First: For stackable bearing plates, such as a ceramic bearing plate disclosed in Chinese Patent CN204555699U, the distance between the stacked bearing plates cannot be adjusted.

[0005] Second: The single bearing surface causes the middle part of the bearing plate to be prone to collapse. For example, a ceramic bearing plate disclosed in Chinese Patent CN204555699U has a simple structure of the bottom plate. After bearing heavy objects for a long time, the middle part of the bottom plate is prone to collapse downward. Moreover, the contact area between the bottom plate structure of this patent and ceramic electronic components is large, which will cause uneven firing atmosphere of the electronic components and does not meet the air permeability requirements for the firing of electronic components. Summary of the Utility Model

[0006] The purpose of the utility model is to provide a stackable bearing plate for ceramic electronic components.

[0007] The innovation points of the utility model are as follows: Both the front and back sides of this application can be used for bearing, which can avoid the problem of collapse in the middle of the bearing plate; the adjacent bearing plate bodies of this application are separated by stacking support columns, and the distance between adjacent bearing plates is adjustable; this application designs the structure of an embedded groove and a placement groove. On the one hand, the structure is flexible and can adapt to the firing of electronic components with different shapes. On the other hand, the protrusions provided on the inner wall of the opening of the placement groove can effectively reduce the contact area between the electronic components and the opening of the placement groove while ensuring air permeability.

[0008] To achieve the above-mentioned utility model purpose, the technical solution of the utility model is:

[0009] A stackable ceramic electronic component firing plate, comprising a firing plate body, stacking support columns and placement grooves; plug columns are symmetrically arranged up and down at the four corners of the firing plate body, and plug holes are arranged on the plug columns; plugs corresponding to the plug holes are arranged at both ends of the stacking support columns, and the plugs are inserted into the plug holes, and two firing plate bodies stacked up and down are separated by the stacking support columns; embedding grooves are arranged on both the front and back of the firing plate body, and the embedding grooves are arranged at uniform intervals; clamping grooves are symmetrically arranged on both sides of the embedding grooves, and insertion strips matching the clamping grooves are arranged on both sides of the placement groove, and the insertion strips are snapped into the clamping grooves.

[0010] Further, the top opening of the placement groove is V-shaped or arc-shaped, and convex points are evenly distributed on the inner wall of the opening.

[0011] Further, the length of the placement groove is less than or equal to the length of the embedding groove.

[0012] The beneficial effects of the present utility model are as follows:

[0013] First: The structures of the front and back of this application are the same and can both be fired. By controlling the firing times of the front and back, the problem of the middle collapse of the firing plate caused by single-sided firing can be effectively avoided.

[0014] Second: Stacking support columns are arranged between adjacent firing plate bodies in this application, and the distance between adjacent firing plates can be adjusted by selecting stacking support columns of different heights.

[0015] Third: The structures of the embedding grooves and the placement grooves are designed in this application. On the one hand, the structure is flexible and can adapt to the firing of electronic components of different shapes. On the other hand, the raised portions arranged on the inner wall of the opening of the placement groove can effectively reduce the contact area between the electronic components and the opening of the placement groove while ensuring air permeability. Description of the Drawings

[0016] Figure 1 It is a schematic structural diagram of the present utility model.

[0017] Figure 2 is Figure 1 The enlarged view of part A in

[0018] In the figure: 10 is the firing plate body, 11 is the plug column, 12 is the plug hole, 13 is the embedding groove, 13.1 is the clamping groove, 20 is the stacking support column, 21 is the plug, 30 is the placement groove, 31 is the insertion strip, 32 is the convex point. Detailed Embodiment

[0019] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the drawings.

[0020] A stackable ceramic electronic component firing plate, comprising a firing plate body 10, stacking support columns 20 and placement grooves 30; plug columns 11 are symmetrically arranged up and down at the four corners of the firing plate body 10, and plug holes 12 are arranged on the plug columns 11; plugs 21 corresponding to the plug holes 12 are arranged at both ends of the stacking support columns 20; the plugs 21 are inserted into the plug holes 12, and two stacked firing plate bodies 10 are separated by the stacking support columns 20; embedding grooves 13 are arranged on both the front and back of the firing plate body 10, and the embedding grooves 13 are arranged at equal intervals; clamping grooves 13.1 are symmetrically arranged on both sides of the embedding grooves 13, and plugging strips 31 matching the clamping grooves 13.1 are arranged on both sides of the placement grooves 30, and the plugging strips 31 are snapped into the clamping grooves 13.1.

[0021] Further, the front and back structures of the firing plate body 10 are the same, and both sides can be fired. By controlling the firing times of the front and back sides, the problem of the middle collapse of the firing plate caused by single-sided firing can be effectively avoided.

[0022] Further, the distance between adjacent firing plate bodies 10 during stacking can be controlled by the stacking support columns 20.

[0023] Further, the top opening of the placement groove 30 is V-shaped or arc-shaped, and convex points 32 are evenly distributed on the inner wall of the opening. Of course, the shape of the opening is not limited to V-shaped or arc-shaped.

[0024] Further, the structure of the embedding groove 13 inserted with the placement groove 30 is flexible and convenient to insert on the one hand, and can adapt to the firing of electronic components of different shapes. On the other hand, the convex points 32 arranged on the inner wall of the opening of the placement groove 30 can effectively reduce the contact area between the electronic components and the opening of the placement groove 30 while ensuring air permeability.

[0025] Further, the length of the placement groove 30 is less than or equal to the length of the embedding groove 13.

[0026] Further, placement grooves 30 with different opening shapes can be selected according to the shape, length, etc. of the electronic components. And if the length of the placement groove 30 is less than the length of the embedding groove 13, two or more placement grooves 30 can be arranged along the length direction in the same embedding groove 13, and the shapes of the openings of these placement grooves 30 can be the same or different.

[0027] The described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

Claims

1. A stackable ceramic electronic component setter, characterized in that: The invention comprises a support plate body (10), a stacking support column (20) and a placement groove (30); plug-in columns (11) are symmetrically arranged at the four corners of the support plate body (10), and a plug-in hole (12) is arranged on the plug-in column (11); plugs (21) corresponding to the plug-in hole (12) are arranged at both ends of the stacking support column (20); the plugs (21) are inserted into the plug-in hole (12), and two support plate bodies (10) stacked up and down are separated by the stacking support column (20); embedding grooves (13) are arranged on the front and back sides of the support plate body (10), and the embedding grooves (13) are evenly spaced; snap-in grooves (13.1) are symmetrically arranged on both sides of the embedding groove (13), and plug-in strips (31) matching the plug-in grooves (13.1) are arranged on both sides of the placement groove (30), and the plug-in strips (31) are snap-fitted into the snap-in grooves (13.1).

2. A stackable ceramic electronic component setter according to claim 1, characterized in that: The top opening of the placement groove (30) is V-shaped or arc-shaped, and the inner wall of the opening is evenly distributed with protrusions (32).

3. A stackable ceramic electronic component setter according to claim 1 or 2, characterized in that: The length of the placement groove (30) is less than or equal to the length of the embedding groove (13).

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