Vacuum formic acid furnace

Abstract

The utility model relates to the technical field of vacuum furnaces, in particular to a vacuum formic acid furnace which comprises a second gate valve, a third gate valve, a fourth gate valve, a fifth gate valve, a cooling plate assembly, a second preheating area, a welding area and a cooling area. The inlet end of the first preheating area is provided with the first gate valve, the inlet end of the second preheating area is provided with the second gate valve, the outlet end of the second preheating area is provided with the third gate valve, the inlet end of the welding area is provided with the third gate valve, the outlet end of the welding area is provided with the fourth gate valve, and the inlet end of the cooling area is provided with the fourth gate valve. The fifth gate valve is arranged at the outlet end of the cooling area, the cooling plate assembly is arranged in the cooling area, and a plurality of air outlet holes are formed in the upper portion of the cooling plate assembly. The cooling uniformity of the power semiconductor is good, and the cooling effect is good.

Description

Technical Field

[0001] The utility model relates to the technical field of vacuum furnaces, in particular to a vacuum formic acid furnace. Background Art

[0002] A vacuum gate valve is a valve used to isolate a vacuum pipeline and block the airflow, and is an important vacuum component. When semiconductor chips are packaged, it needs to be carried out in a vacuum environment, which can generally be achieved by using a vacuum reflow soldering furnace. The vacuum reflow soldering furnace is provided with multiple temperature zones, which are divided into a preheating zone, a soldering zone and a cooling zone. Among them, the preheating zone is protected by nitrogen and is not a completely low-oxygen environment; the soldering zone is a vacuum environment. After the chip is soldered, the door connecting the soldering zone and the cooling zone is opened, and the chip enters the cooling zone from the soldering zone. At the same time, the door connecting the soldering zone and the preheating zone is opened, and the preheated chip is sent into the soldering zone for soldering. The existing vacuum sintering furnace has poor cooling effect on the welding of power semiconductors, thus affecting the packaging and welding quality of power semiconductors. Summary of the Invention

[0003] The utility model provides a vacuum formic acid furnace to solve the problems of poor cooling uniformity and cooling effect of power semiconductors in the prior art.

[0004] The utility model provides a vacuum formic acid furnace, which includes a second gate valve, a third gate valve, a fourth gate valve, a fifth gate valve, a cooling plate assembly, a second preheating zone, a soldering zone and a cooling zone; the second gate valve is arranged at the inlet end of the second preheating zone, the third gate valve is arranged at the outlet end of the second preheating zone, the third gate valve is arranged at the inlet end of the soldering zone, the fourth gate valve is arranged at the outlet end of the soldering zone, the fourth gate valve is arranged at the inlet end of the cooling zone, the fifth gate valve is arranged at the outlet end of the cooling zone, the cooling plate assembly is arranged inside the cooling zone, and a plurality of air outlet holes are arranged on the upper part of the cooling plate assembly.

[0005] According to the vacuum formic acid furnace of the utility model, the cooling plate assembly includes a plurality of grooves, multiple groups of convex blocks and a plurality of cooling sealing plates. The convex blocks are evenly arranged in the grooves, and the cooling sealing plates are used to seal the grooves.

[0006] According to the vacuum formic acid furnace of the utility model, it further includes a first gate valve and a first preheating zone. The first preheating zone is arranged in the previous working station area of the second preheating zone. The first gate valve is arranged at the inlet end of the first preheating zone, and the second gate valve is arranged at the outlet end of the first preheating zone.

[0007] According to the vacuum formic acid furnace of the utility model, it further includes a lifting mechanism, and the lifting mechanism is arranged below the cooling zone.

[0008] The vacuum formic acid furnace according to the present utility model further includes a driving wheel and a guiding wheel, and the driving wheel and the guiding wheel are arranged on both inner sides of the first preheating zone, the second preheating zone, the welding zone and the cooling zone.

[0009] The vacuum formic acid furnace according to the present utility model further includes a transmission mechanism, and the transmission mechanism is arranged on both outer sides of the first preheating zone, the second preheating zone, the welding zone and the cooling zone, and the transmission mechanism drives the driving wheel.

[0010] For the vacuum formic acid furnace according to the present utility model, the transmission mechanism is a roller, a gear, a belt or a chain.

[0011] The vacuum formic acid furnace according to the present utility model further includes an upper heating tube and a lower heating tube; the upper heating tube is arranged inside the upper cover of the sealed cavity of the first preheating zone, the second preheating zone and the welding zone, and the lower heating tube is arranged inside the lower cavity of the first preheating zone, the second preheating zone and the welding zone.

[0012] The vacuum formic acid furnace according to the present utility model further includes a power semiconductor tray assembly, and the power semiconductor tray assembly is arranged inside the second preheating zone, the welding zone and the cooling zone. The power semiconductor tray assembly includes at least one workpiece and a power semiconductor tray. The workpiece is arranged on the power semiconductor tray, and the power semiconductor tray is of a hollow structure.

[0013] For the vacuum formic acid furnace according to the present utility model, the power semiconductor tray includes a tray frame, at least two support legs and at least one workpiece limiting block. The support legs are symmetrically arranged on both sides of the tray frame, and the workpiece limiting block is arranged on both sides of the tray frame. The support legs support the workpiece, and the workpiece limiting block limits and guides the workpiece.

[0014] For the vacuum formic acid furnace according to the present utility model, the first preheating zone is used to provide a vacuum environment, an inert gas environment or a reducing gas environment during the workpiece preheating stage;

[0015] The second preheating zone is used to provide a vacuum environment, an inert gas environment or a reducing gas environment during the workpiece preheating stage;

[0016] The welding zone is used to provide a vacuum environment, an inert gas environment or a reducing gas environment during the workpiece welding stage;

[0017] The cooling zone is used to provide a vacuum environment, an inert gas environment or a reducing gas environment during the workpiece cooling stage.

[0018] The tray of the present utility model is a hollow structure. The workpiece is placed on the tray, and there is an air outlet below each workpiece. Cooling nitrogen is filled in the cooling plate, and the nitrogen comes out from the air outlet holes to cool the workpiece, with good cooling uniformity and good cooling effect. Brief Description of the Drawings

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0020] Figure 1 It is a schematic front view structure diagram of a vacuum formic acid furnace;

[0021] Figure 2 It is a schematic perspective view structure diagram of the cooling zone;

[0022] Figure 3 It is a schematic structure diagram of the lower cavity of the cooling zone;

[0023] Figure 4 It is a schematic perspective view structure diagram of the cooling plate assembly;

[0024] Figure 5 It is a schematic perspective view structure diagram of the cooling plate;

[0025] Figure 6 It is a schematic perspective view structure diagram of the sealing plate;

[0026] Figure 7 It is a schematic perspective view structure diagram of the power semiconductor tray assembly;

[0027] Figure 8 It is a schematic perspective view structure diagram of the power semiconductor tray;

[0028] Reference numerals: 1. First plug valve; 2. Second plug valve; 3. Third plug valve; 4. Fourth plug valve; 5. Fifth plug valve; 6. First preheating zone; 7. Second preheating zone; 8. Welding zone; 9. Cooling zone; 10. Power semiconductor tray assembly; 91. Cooling plate assembly; 92. Upper cover of the sealing cavity; 93. Lower cavity; 94. Lifting mechanism; 95. Guide wheel; 96. Driving wheel; 97. Heat dissipation water tank; 101. Power semiconductor tray; 102. Workpiece; 1011. Tray frame; 1012. Support leg; 1013. Workpiece limiting block; 911. Cooling plate; 912. Nitrogen pipe; 913. Air outlet hole; 914. Protrusion; 915. Groove; 916. Cooling sealing plate. Detailed Embodiments

[0029] The following further describes in detail the embodiments of the present utility model in conjunction with the accompanying drawings and embodiments. The following embodiments are used to illustrate the present utility model, but cannot be used to limit the scope of the present utility model.

[0030] In the description of the embodiments of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present utility model. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0031] In the description of the embodiments of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific situations.

[0032] In the embodiments of the present utility model, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature can be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "below", "beneath" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0033] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the embodiments of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0034] The following combines Figure 1-8 Describe a vacuum formic acid furnace according to an embodiment of the present utility model, which includes a second plug valve 2, a third plug valve 3, a fourth plug valve 4, a fifth plug valve 5, a cooling plate assembly 91, a second preheating zone 7, a welding zone 8, and a cooling zone 9; a second plug valve 2 is provided at the inlet end of the second preheating zone 7, a third plug valve 3 is provided at the outlet end of the second preheating zone 7, a third plug valve 3 is provided at the inlet end of the welding zone 8, a fourth plug valve 4 is provided at the outlet end of the welding zone 8, a fourth plug valve 4 is provided at the inlet end of the cooling zone 9, a fifth plug valve 5 is provided at the outlet end of the cooling zone 9, the cooling plate assembly 91 is arranged inside the cooling zone 9, and a plurality of air outlet holes 913 are arranged on the upper part of the cooling plate assembly 91. The cooling zone 9 includes a sealing cavity upper cover 92 and a lower cavity 93, and the cooling plate assembly 91 is arranged inside the lower cavity 93. A heat dissipation water tank 97 is arranged around the outside of the lower cavity 93. The air outlet holes 913 are arranged below the workpiece 102, and a nitrogen cooling jig blows towards the workpiece 102. An air outlet hole 913 is arranged below each workpiece 102 to cool the workpiece 102.

[0035] In some embodiments, the cooling plate assembly 91 includes a plurality of grooves 915, multiple groups of bumps 914, and a plurality of cooling sealing plates 916. The bumps 914 are evenly arranged in the grooves 915, and the cooling sealing plates 916 are used to seal the grooves 915. The nitrogen pipe 912 fills in cooling nitrogen in the grooves 915, and the nitrogen is evenly arranged in the grooves 915 and comes out from the air outlet 913 to cool the workpiece.

[0036] In some embodiments, it further includes a first plug valve 1 and a first preheating zone 6. The first preheating zone 6 is arranged in the previous station area of the second preheating zone 7. A first plug valve 1 is provided at the inlet end of the first preheating zone 6, and a second plug valve 2 is provided at the outlet end of the first preheating zone 6.

[0037] In some embodiments, a lifting mechanism 94 is further included, and the lifting mechanism 94 is disposed below the cooling zone 9. The lifting mechanism 94 lifts the power semiconductor tray assembly 10. The power semiconductor tray assembly 10 circulates among the first preheating zone 6, the second preheating zone 7, the welding zone 8, and the cooling zone 9.

[0038] In some embodiments, a driving wheel 96 and a guiding wheel 95 are further included, and the driving wheel 96 and the guiding wheel 95 are disposed on both inner sides of the first preheating zone 6, the second preheating zone 7, the welding zone 8, and the cooling zone 9.

[0039] In some embodiments, a transmission mechanism is further included, and the transmission mechanism is disposed on both outer sides of the first preheating zone 6, the second preheating zone 7, the welding zone 8, and the cooling zone 9, and the transmission mechanism drives the driving wheel 96.

[0040] In some embodiments, the transmission mechanism is a roller, a gear, a belt, or a chain.

[0041] In some embodiments, an upper heating tube and a lower heating tube are further included; the upper heating tube is disposed inside the sealed cavity upper cover of the first preheating zone 6, the second preheating zone 7, and the welding zone 8, and the lower heating tube is disposed inside the lower cavity of the first preheating zone 6, the second preheating zone 7, and the welding zone 8.

[0042] In some embodiments, a power semiconductor tray assembly 10 is further included, and the power semiconductor tray assembly 10 is disposed inside the second preheating zone 7, the welding zone 8, and the cooling zone 9. The power semiconductor tray assembly 10 includes at least one workpiece 102 and a power semiconductor tray 101. The workpiece 102 is disposed on the power semiconductor tray 101, and the power semiconductor tray 101 is a hollow structure.

[0043] In some embodiments, the power semiconductor tray 101 includes a tray frame 1011, at least two support legs 1012, and at least one workpiece limiting block 1013. The support legs 1012 are symmetrically disposed on both sides of the tray frame 1011. The workpiece limiting block 1013 is disposed on both sides of the tray frame 1011. The support legs 1012 support the workpiece 102, and the workpiece limiting block 1013 limits and guides the workpiece 102.

[0044] In some embodiments, the first preheating zone 6 is configured to provide a vacuum environment, an inert gas environment, or a reducing gas environment during the workpiece preheating stage;

[0045] The second preheating zone 7 is configured to provide a vacuum environment, an inert gas environment, or a reducing gas environment during the workpiece preheating stage;

[0046] The welding zone 8 is configured to provide a vacuum environment, an inert gas environment, or a reducing gas environment during the workpiece welding stage;

[0047] The cooling zone 9 is used to provide a vacuum environment, an inert gas environment or a reducing gas environment during the workpiece cooling stage.

[0048] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A vacuum formic acid furnace, characterized in that: It includes a second gate valve, a third gate valve, a fourth gate valve, a fifth gate valve, a cooling plate assembly, a second preheating zone, a welding zone and a cooling zone; the second gate valve is arranged at the inlet end of the second preheating zone, the third gate valve is arranged at the outlet end of the second preheating zone, the third gate valve is arranged at the inlet end of the welding zone, the fourth gate valve is arranged at the outlet end of the welding zone, the fourth gate valve is arranged at the inlet end of the cooling zone, the fifth gate valve is arranged at the outlet end of the cooling zone, the cooling plate assembly is arranged inside the cooling zone, and a plurality of air outlets are arranged on the upper part of the cooling plate assembly.

2. The vacuum formic acid furnace according to claim 1, characterized in that: The cooling plate assembly includes a plurality of grooves, a plurality of groups of protrusions and a plurality of cooling sealing plates. The protrusions are evenly arranged in the grooves, and the cooling sealing plates are used to seal the grooves.

3. The vacuum formic acid furnace according to claim 1, characterized in that: It also includes a first gate valve and a first preheating zone, wherein the first preheating zone is arranged in the upper station zone of the second preheating zone, the first gate valve is arranged at the inlet end of the first preheating zone, and the second gate valve is arranged at the outlet end of the first preheating zone.

4. The vacuum formic acid furnace according to claim 3, characterized in that: It also includes a lifting mechanism, which is arranged below the cooling zone.

5. The vacuum formic acid furnace according to claim 3, characterized in that: It also includes a power wheel and a guide wheel, and the power wheel and the guide wheel are arranged on both sides of the inside of the first preheating zone, the second preheating zone, the welding zone and the cooling zone.

6. The vacuum formic acid furnace according to claim 5, characterized in that: It also includes a transmission mechanism, and the transmission mechanism is arranged on both sides of the outside of the first preheating zone, the second preheating zone, the welding zone and the cooling zone, and the transmission mechanism drives the power wheel.

7. The vacuum formic acid furnace according to claim 6, characterized in that: The transmission mechanism is a roller, a gear, a belt or a chain.

8. The vacuum formic acid furnace according to claim 3, characterized in that: It also includes an upper heating tube and a lower heating tube; the upper heating tube is arranged inside the upper cover of the sealed cavity of the first preheating zone, the second preheating zone and the welding zone, and the lower heating tube is arranged inside the lower cavity of the first preheating zone, the second preheating zone and the welding zone.

9. The vacuum formic acid furnace according to claim 3, characterized in that: It also includes a power semiconductor tray assembly, which is arranged inside the second preheating zone, the welding zone and the cooling zone. The power semiconductor tray assembly includes at least one workpiece and a power semiconductor tray. The workpiece is arranged on the power semiconductor tray, and the power semiconductor tray is a hollow structure.

10. The vacuum formic acid furnace according to claim 9, characterized in that: The power semiconductor tray includes a tray frame, at least two supporting legs and at least one workpiece limiting block. The supporting legs are symmetrically arranged on both sides of the tray frame. The workpiece limiting blocks are arranged on both sides of the tray frame. The supporting legs support the workpiece, and the workpiece limiting blocks limit and guide the workpiece.

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