Common optical package

Abstract

A common optical package includes providing an electronic module including a circuit structure having a first side and a second side opposite to each other, an electronic component embedded in the circuit structure or disposed on the first side of the circuit structure, and a photonic component disposed on the second side of the circuit structure. And the photonic element with the optical acting surface is embedded in the circuit structure so as to be electrically connected with the electronic element. Furthermore, a portion of the circuit structure is removed from the first side to form an opening to expose the optical active surface of the photonic element, and the optical element is disposed at the opening of the circuit structure to be bonded to the optical active surface of the photonic element. In addition, a coating layer is formed on the first side of the circuit structure to coat the optical element. Therefore, the electronic element, the photonic element and the optical element can be effectively integrated.

Description

Technical Field

[0001] This application relates to a manufacturing technology for a co - optical package, especially a co - optical package integrating electronic components, photonic components and optical components and its manufacturing method. Background Art

[0002] Co - Packaged Optics (CPO) is an optoelectronic integration solution based on silicon photonics technology, which can integrate photonic components and electronic components in a single package, thereby achieving high - performance and low - power data transmission and processing.

[0003] Silicon photonics technology uses silicon as the substrate material to manufacture optoelectronic components (such as optical waveguides, optical modulators, detectors, etc.). This technology has the following advantages. (1) High integration: Silicon photonics technology can integrate photonic components and electronic components in a single package to reduce the fiber connections and optoelectronic conversion processes required in traditional optoelectronic components. (2) Low cost: Silicon is the main material in the semiconductor industry, and silicon photonics technology can use existing semiconductor manufacturing processes and equipment to reduce production costs. (3) High speed and low latency: Silicon photonics technology can support high - speed data transmission, and the latency of photon transmission is lower than that of traditional electronic transmission.

[0004] In silicon photonics technology, how to effectively introduce and transmit optical signals is crucial. The following are several common methods. (1) Optical coupling: Use technologies such as micro - lenses and grating couplers to couple external optical signals into photonic components, and the optical coupler can achieve efficient entry and exit of optical signals to ensure the integrity of optical signals. (2) Fiber butt - joint: Directly butt - joint the optical fiber to the photonic component, which requires precise alignment and stable connection technology to ensure low - loss and highly reliable optical signal transmission. (3) Internal light source: Integrate a light source inside the photonic chip to reduce the need for external optical coupling and improve the integration and reliability of the system.

[0005] However, although silicon photonics technology can integrate photonic components and electronic components in a single package, how to effectively introduce optical signals to avoid or reduce optical signal loss is an important part of the successful application of silicon photonics technology, and there is still much room for improvement in this part of the technology.

[0006] In addition, the existing technology cannot effectively integrate electronic components, photonic components and optical components through a single module or circuit structure, nor can it embed photonic components in the circuit structure to combine with specially designed optical components, nor can it form a tapered opening in the circuit structure to quickly align the optical component and the photonic component, and even less can it form an inclined surface on the optical component to simultaneously correspond to the photonic component and the optical fiber.

[0007] Therefore, how to overcome any of the above problems of the prior art has become an urgent issue to be solved at present. Summary of the Invention

[0008] In view of the deficiencies of the above prior art, the present application provides a common optical package, including: a circuit structure having opposite first and second sides and an opening formed on the first side of the circuit structure; at least one electronic component embedded in the circuit structure or disposed on the first side of the circuit structure; a photon component embedded in the circuit structure to be electrically connected to at least one electronic component, and the photon component having an optical acting surface exposed from the opening of the circuit structure; an optical component disposed at the opening of the circuit structure, and the optical component being combined with or corresponding to the optical acting surface of the photon component; and a coating layer formed on the first side of the circuit structure and the optical component to coat the optical component through the coating layer.

[0009] The present application also provides a method for manufacturing a common optical package, including: providing an electronic module including a circuit structure, at least one electronic component and a photon component, wherein the circuit structure has opposite first and second sides, at least one electronic component is embedded in the circuit structure or disposed on the first side of the circuit structure, the photon component has an optical acting surface and is embedded in the circuit structure to be electrically connected to at least one electronic component; removing a part of the circuit structure from the first side of the circuit structure to form an opening of the circuit structure and expose the optical acting surface of the photon component; disposing an optical component at the opening of the circuit structure to make the optical component combined with or corresponding to the optical acting surface of the photon component; and forming a coating layer on the first side of the circuit structure and the optical component to coat the optical component through the coating layer.

[0010] In the above-mentioned common optical package and its manufacturing method, the circuit structure may have a first circuit layer, a second circuit layer and an insulating layer, the first circuit layer and the second circuit layer are respectively located on the first side and the second side of the circuit structure, the insulating layer is between the first circuit layer and the second circuit layer, and the photon component is embedded in the insulating layer.

[0011] In the above-mentioned common optical package and its manufacturing method, the opening of the circuit structure is a tapered opening, the size of the first end of the opening is larger than the size of the second end of the opening, and the second end of the opening corresponds to the optical acting surface of the photon component.

[0012] In the above-mentioned common optical package and its manufacturing method, the size of one end of the opening of the circuit structure is larger than the size of the optical acting surface of the photon component, and one end of the opening of the circuit structure corresponds to the optical acting surface of the photon component.

[0013] In the foregoing common optical package and its manufacturing method, at least one electronic component may include a first electronic component, a second electronic component, and a third electronic component. The first electronic component is embedded in the circuit structure, and both the second electronic component and the third electronic component are disposed on a first side of the circuit structure.

[0014] In the foregoing common optical package and its manufacturing method, a coating layer may be formed on the first side of the circuit structure, the second electronic component, the third electronic component, and the optical component to coat the second electronic component, the third electronic component, and the optical component through the coating layer.

[0015] In the foregoing common optical package and its manufacturing method, the first electronic component is a bridging component or a bridging chip, the second electronic component is a system-on-chip, the third electronic component is an electronic integrated circuit, and the photon component is a photon chip, a photon integrated circuit, or a silicon photon component.

[0016] In the foregoing common optical package and its manufacturing method, the optical component may have an acting portion that directly contacts the optical acting surface of the photon component, so that the acting portion of the optical component is directly bonded to the optical acting surface of the photon component.

[0017] In the foregoing common optical package and its manufacturing method, the optical component may have an acting portion, and the height of the acting portion of the optical component is greater than the depth of the opening of the circuit structure.

[0018] In the foregoing common optical package and its manufacturing method, the optical component may have an inclined surface that corresponds to both the optical acting surface of the photon component and the optical fiber at the same time, so that the optical signal provided by the optical fiber is transmitted to the optical acting surface of the photon component through the inclined surface of the optical component.

[0019] As can be seen from the above, in the common optical package and its manufacturing method of the present application, it can effectively integrate at least one electronic component (such as the first electronic component, the second electronic component, and / or the third electronic component), a photon component (such as a photon chip), and an optical component through a single electronic module (such as a fan-out embedded bridging module and other packaging modules) or a circuit structure.

[0020] Furthermore, the present application can embed a photon component (such as a photon chip) in the circuit structure and bond the photon component to an optically component with a special design, so as to facilitate reducing / eliminating the deviation in alignment between the optically component (acting portion) and the optical acting surface of the photon component, resulting in loss of optical signals.

[0021] Alternatively, the opening of the circuit structure of the present application may be a tapered opening, so as to facilitate the acting portion of the optical component to be effectively or quickly aligned to the optical acting surface of the photon component through the tapered opening of the circuit structure.

[0022] Alternatively, the optical element of the present application may have an inclined surface to simultaneously correspond to the optical working surface of a photonic element (such as a photonic chip) and an optical fiber, so that the optical signal provided by the optical fiber can be effectively transmitted to the optical working surface of the photonic element through the inclined surface of the optical element.

[0023] Or, the present application can protect the second electronic element, the third electronic element, and / or the optical element, etc. from being damaged through the coating layer, and can also use the coating layer to prevent the optical element from being damaged and affecting the coupling efficiency between the optical element and the photonic element (such as a photonic chip). Description of the Drawings

[0024] Figures 1A to 1F It is a schematic cross-sectional view of the manufacturing method of an embodiment of the common optical package of the present application.

[0025] Figures 2A to 2B It is a schematic cross-sectional view of the line structure having a tapered opening in another embodiment of the common optical package of the present application.

[0026] Figure 3 It is a schematic cross-sectional view of the optical element having a working part with a larger height in yet another embodiment of the common optical package of the present application.

[0027] Description of the Main Component Symbols

[0028] 1 Common optical package

[0029] 1a Electronic module

[0030] 10 Line structure

[0031] 10a First side

[0032] 10b Second side

[0033] 11 First line layer

[0034] 12 Second line layer

[0035] 13 First conductive element

[0036] 14 Second conductive element

[0037] 15 Third conductive element

[0038] 16 Insulating layer

[0039] 17 Opening

[0040] 20 First electronic element

[0041] 21 Second electronic element

[0042] 22 Third electronic element

[0043] 23 First conductor

[0044] 24 Second conductor

[0045] 25 Third conductor

[0046] 26 Bonding layer

[0047] 27 Underfill

[0048] 30 Photonic component

[0049] 31 Optical acting surface

[0050] 40 Optical element

[0051] 41 Acting part

[0052] 42 Inclined plane

[0053] 50 Coating layer

[0054] 60 Substrate

[0055] 61 Solder ball

[0056] 70 Laser

[0057] 71 Optical fiber

[0058] Dimensions A, B

[0059] Height C

[0060] Depth D

[0061] Optical signal L Specific implementation mode

[0062] The following describes the implementation mode of the present application through specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification.

[0063] It should be noted that the structures, ratios, sizes, etc. shown in the attached drawings of this specification are only used to cooperate with the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions that the present application can be implemented. Therefore, they do not have technical substantive significance. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present application can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present application. At the same time, the terms such as "upper", "lower", "one", "two", "first", "second", "third", etc. cited in this specification are only for the convenience of clear narration, and are not used to limit the scope that the present application can be implemented. The change or adjustment of their relative relationships, without substantial change in the technical content, should also be regarded as the scope that the present application can be implemented.

[0064] Figures 1A to 1F This is a schematic cross-sectional view of the manufacturing method of the co-optical package 1 of the present application, and this co-optical package 1 can also be referred to as a co-optical package structure or a co-packaged optics (CPO) structure, etc. At the same time, the "at least one" described in the present application represents more than one (such as one, two or three), and the "multiple" represents more than two (such as two, three, four or more than ten).

[0065] As Figure 1A shown, a single electronic module 1a including a circuit structure 10, at least one electronic component (such as a first electronic component 20, a second electronic component 21 and / or a third electronic component 22), and a photon component 30 (such as a photon chip), etc. is provided, such as a packaging module like a fan-out embedded bridge (FO-EB) module.

[0066] In one embodiment, the circuit structure 10 defines opposite first side 10a and second side 10b and has a first circuit layer 11, a second circuit layer 12, and an insulating layer 16, etc.

[0067] In one embodiment, the first side 10a and the second side 10b can be the upper side and the lower side of the circuit structure 10 respectively, and the first circuit layer 11 and the second circuit layer 12 can be formed on the first side 10a and the second side 10b of the circuit structure 10 respectively.

[0068] In one embodiment, the insulating layer 16 can be between the first circuit layer 11 and the second circuit layer 12, and the first circuit layer 11 and the second circuit layer 12 are formed on the upper surface and the lower surface of the insulating layer 16 respectively, so as to cover the first electronic component 20 (such as a bridging chip), the photon component 30 (such as a photon chip), etc. through the insulating layer 16.

[0069] Furthermore, at least one electronic component can include a first electronic component 20, a second electronic component 21 and / or a third electronic component 22, etc., and at least one electronic component can be embedded in the circuit structure 10 or disposed on the first side 10a of the circuit structure 10.

[0070] In one embodiment, the first electronic component 20 (such as a bridging chip) can be embedded in the insulating layer 16 of the circuit structure 10 and joined or fixed to the second circuit layer 12 through a bonding layer 26, and the first electronic component 20 (such as a bridging chip) can be electrically connected to the second electronic component 21 (such as a system-on-chip), the third electronic component 22 (such as an electronic integrated circuit), and the photon component 30 (such as a photon chip), etc. respectively through a plurality of first conductive elements 13 and the first circuit layer 11.

[0071] In addition, a plurality of second conductive elements 14 may be embedded in the insulating layer 16 to electrically connect the first wiring layer 11 and the second wiring layer 12.

[0072] In an embodiment, the second electronic component 21 (such as a system-on-chip) may be disposed on the first side 10a of the wiring structure 10, so that the second electronic component 21 (such as a system-on-chip) is sequentially electrically connected to the first electronic component 20 (such as a bridge chip), the third electronic component 22 (such as an electronic integrated circuit), and the photon component 30 (such as a photon chip) through a plurality of first conductors 23 and the first wiring layer 11.

[0073] In an embodiment, the third electronic component 22 (such as an electronic integrated circuit) may also be disposed on the first side 10a of the wiring structure 10, so that the third electronic component 22 (such as an electronic integrated circuit) is sequentially electrically connected to the first electronic component 20 (such as a bridge chip), the second electronic component 21 (such as a system-on-chip), and the photon component 30 (such as a photon chip) through a plurality of second conductors 24 and the first wiring layer 11.

[0074] In an embodiment, an underfill 27 may be formed between the second electronic component 21 (such as a system-on-chip) and the first side 10a (the first wiring layer 11) of the wiring structure 10, and an underfill 27 may also be formed between the third electronic component 22 (such as an electronic integrated circuit) and the first side 10a (the first wiring layer 11) of the wiring structure 10 to coat and protect the plurality of first conductors 23 and the plurality of second conductors 24 through the underfill 27. A plurality of third conductors 25 may be formed on the second side 10b or the second wiring layer 12 of the wiring structure 10.

[0075] In addition, the photon component 30 (such as a photon chip) may be embedded in the insulating layer 16 of the wiring structure 10 and electrically connected to the first wiring layer 11 and the second wiring layer 12 through a plurality of third conductive elements 15, and further electrically connected to at least one electronic component (such as the first electronic component 20, the second electronic component 21, and / or the third electronic component 22). The photon component 30 (such as a photon chip) may have an optical active surface 31, and the optical active surface 31 of the photon component 30 may face the first side 10a or the first wiring layer 11 of the wiring structure 10.

[0076] In an embodiment, the first wiring layer 11 or the second wiring layer 12 may be a redistribution layer (RDL), etc. The first conductive element 13, the third conductive element 15, the first conductor 23, the second conductor 24, or the third conductor 25 may be a conductive bump, a conductive contact, a solder ball, a tin ball, etc. The second conductive element 14 may be a conductive post, etc. The insulating layer 16 may be a dielectric layer, etc. The bonding layer 26 may be a bonding colloid, an adhesive layer, etc. The underfill 27 may be a bottom fill material, a packaging layer, etc.

[0077] In one embodiment, the first electronic component 20 can be a bridge component or a bridge chip, etc., the second electronic component 21 can be a System on a Chip (SoC), etc., the third electronic component 22 can be an Electrical Integrated Circuit (EIC), and the photon component 30 can be a photon chip (such as a silicon photon chip), a Photonic Integrated Circuit (PIC), a silicon photon component, etc.

[0078] As Figure 1B shown, using various removal techniques such as etching or drilling, and aiming at the position of the optical acting surface 31 of the photon component 30 (such as a photon chip), a part of the circuit structure 10 is removed from the first side 10a of the circuit structure 10 to form an opening 17 in the circuit structure 10, exposing the optical acting surface 31 of the photon component 30.

[0079] As Figure 1C shown, an optical element 40 (such as a lens structure) is disposed at the opening of the circuit structure 10, so that the optical element 40 is combined or corresponds to the optical acting surface 31 of the photon component 30 (such as a photon chip).

[0080] In one embodiment, the optical element 40 (such as a lens structure) can have an acting portion 41 that directly contacts the optical acting surface 31 of the photon component 30 (such as a photon chip), so that the acting portion 41 of the optical element 40 is directly combined with the optical acting surface 31 of the photon component 30.

[0081] In one embodiment, the optical element 40 (such as a lens structure) can have an inclined surface 42 (bevel angle), and the inclined surface 42 (bevel angle) of this optical element 40 can simultaneously / correspond to the optical acting surface 31 of the photon component 30 (such as a photon chip) and the external optical fiber 71 (laser 70) respectively, so that the optical signal L provided by the external laser 70 or optical fiber 71 can be effectively transmitted to the optical acting surface 31 of the photon component 30 via the inclined surface 42 (bevel angle) of the optical element 40 (see Figure 1F ).

[0082] As Figure 1D shown, a cladding layer 50 is formed on the first side 10a (circuit layer 11) of the circuit structure 10, the second electronic component 21 (such as a system-on-chip), the third electronic component 22 (such as an electrical integrated circuit), and the optical element 40 (such as a lens structure), so as to cover and protect the second electronic component 21, the third electronic component 22, and the optical element 40, etc. by the cladding layer 50, and one side (such as the right side) of the optical element 40 is exposed for joining or coupling the optical fiber 71. Thus, the common optical package 1 of the present application can be obtained.

[0083] As Figure 1E shown, a substrate 60 can be disposed on a plurality of third conductors 25 on the second side 10b of the circuit structure 10, and a plurality of solder balls 61 can be formed on the substrate 60.

[0084] As Figure 1F shown, an optical signal L is provided to an optical element 40 (such as a lens structure) by, for example, an external laser 70 and / or an optical fiber 71, so that the optical signal L provided by the laser 70 and / or the optical fiber 71 can be effectively transmitted to the optical action surface 31 of the photon element 30 (such as a photon chip) in sequence via the inclined surface 42 (bevel angle) of the optical element 40 and the action part 41.

[0085] In one embodiment, the optical element 40 can be a lens structure (such as an optical lens), etc., the coating layer 50 can be an insulating protective layer, a packaging layer, a packaging colloid, etc., the substrate 60 can be a circuit board, a carrier plate, a carrier or a carrier substrate having at least one (such as a plurality of) circuit layers, and the laser 70 can be a laser generator or a laser transmitter, etc.

[0086] Therefore, the present application can embed a photon element 30 (such as a photon chip) in the circuit structure 10 of a single electronic module 1a (such as a packaging module of the type of a fan-out embedded bridge module), and combine the photon element 30 with a specially designed optical element 40 (such as a lens structure), so as to facilitate reducing / eliminating the deviation in alignment between the optical element 40 (action part 41) and the optical action surface 31 of the photon element 30, which causes the loss of the optical signal L, and can also enable the optical signal L provided by, for example, the laser 70 and / or the optical fiber 71 to effectively enter (introduce) into the photon element 30 via the optical element 40.

[0087] The present application can effectively integrate at least one electronic element (such as the first electronic element 20, the second electronic element 21 and / or the third electronic element 22), a photon element 30 (such as a photon chip) and an optical element 40 (such as a lens structure) through a single electronic module 1a (such as a packaging module of the type of a fan-out embedded bridge module) or a circuit structure 10, so as to facilitate achieving the purpose of rapid transmission of the optical signal L provided by, for example, the laser 70 and / or the optical fiber 71.

[0088] The optical element 40 (such as a lens structure) of the present application can have a special design of an inclined surface 42 (bevel angle), so that the optical signal L provided by, for example, the laser 70 and / or the optical fiber 71 can be effectively transmitted to the optical action surface 31 of the photon element 30 (such as a photon chip) via the inclined surface 42 (bevel angle) of the optical element 40, and it is also beneficial to reduce the loss of the optical signal L during transmission.

[0089] The present application can effectively combine a photon component 30 (such as a photon chip) with a specially designed optical component 40 (such as a lens structure), and can also protect the second electronic component 21, the third electronic component 22, and / or the optical component 40, etc. from being damaged through the coating layer 50. The coating layer 50 can also be used to prevent the optical component 40 from being damaged and affecting the coupling efficiency between the optical component 40 and the photon component 30 (such as a photon chip).

[0090] Figures 2A to 2B It is a schematic cross-sectional view of the circuit structure 10 having a tapered opening 17 in another embodiment of the common optical package 1 of the present application.

[0091] In one embodiment, the opening 17 of the circuit structure 10 can be a tapered opening (such as an opening that gets smaller from large), the size A of the first end (such as the upper end) of the opening 17 is greater than the size B of the second end (such as the lower end) of the opening 17, and the second end (such as the lower end) of the opening 17 corresponds to the optical action surface 31 of the photon component 30 (such as a photon chip), which is beneficial for the action part 41 of the optical component 40 (such as a lens structure) to be effectively or quickly aligned to the optical action surface 31 of the photon component 30 (such as a photon chip) through the opening 17 (such as a tapered opening) of the circuit structure 10.

[0092] In one embodiment, the size B of one end (such as the second end) of the opening 17 of the circuit structure 10 can be greater than the size of the optical action surface 31 of the photon component 30 (such as a photon chip), and one end (such as the second end) of the opening 17 corresponds to the optical action surface 31 of the photon component 30 (such as a photon chip), so as to facilitate the action part 41 of the optical component 40 (such as a lens structure) to be effectively aligned to the optical action surface 31 of the photon component 30 (such as a photon chip) through the opening 17 of the circuit structure 10.

[0093] Figure 3 It is a schematic cross-sectional view of the optical component 40 having an action part 41 with a larger height C in another embodiment of the common optical package 1 of the present application.

[0094] In one embodiment, the optical component 40 can have an action part 41, and the height C of the action part 41 of the optical component 40 can be greater than the depth D of the opening 17 of the circuit structure 10, so as to avoid interference when bonding or combining the action part 41 of the optical component 40 to the optical action surface 31 of the photon component 30.

[0095] The present application also provides a co-packaged optics 1, comprising: a circuit structure 10 having opposite first and second sides 10a and 10b and an opening 17 formed in the first side 10a of the circuit structure 10; at least one electronic component embedded in the circuit structure 10 or disposed on the first side 10a of the circuit structure 10; a photonics component 30 embedded in the circuit structure 10 for electrically connecting to at least one electronic component (such as a first electronic component 20, a second electronic component 21, and / or a third electronic component 22), and the photonics component 30 having an optical active surface 31 exposed from the opening 17 of the circuit structure 10; an optical component 40 disposed at the opening 17 of the circuit structure 10, and the optical component 40 being bonded or corresponding to the optical active surface 31 of the photonics component 30; and a cladding layer 50 formed on the first side 10a of the circuit structure 10 and the optical component 40 to encapsulate the optical component 40 through the cladding layer 50.

[0096] In one embodiment, the circuit structure 10 further has a first circuit layer 11, a second circuit layer 12, and an insulating layer 16. The first circuit layer 11 and the second circuit layer 12 are respectively formed on the first side 10a and the second side 10b of the circuit structure 10. The insulating layer 16 is interposed between the first circuit layer 11 and the second circuit layer 12, and the photonics component 30 is embedded in the insulating layer 16.

[0097] In one embodiment, the opening 17 of the circuit structure 10 is a tapered opening. The size A of the first end of the opening 17 is greater than the size B of the second end of the opening 17, and the second end of the opening 17 corresponds to the optical active surface 31 of the photonics component 30.

[0098] In one embodiment, the size B of one end (such as the second end) of the opening 17 of the circuit structure 10 is greater than the size of the optical active surface 31 of the photonics component 30, and one end (such as the second end) of the opening 17 of the circuit structure 10 corresponds to the optical active surface 31 of the photonics component 30.

[0099] In one embodiment, at least one electronic component includes a first electronic component 20, a second electronic component 21, and a third electronic component 22. The first electronic component 20 is embedded in the circuit structure 10, and both the second electronic component 21 and the third electronic component 22 are disposed on the first side 10a of the circuit structure 10.

[0100] In one embodiment, the cladding layer 50 is formed on the first side 10a of the circuit structure 10, the second electronic component 21, the third electronic component 22, and the optical component 40 to encapsulate the second electronic component 21, the third electronic component 22, and the optical component 40 through the cladding layer 50.

[0101] In one embodiment, the first electronic component 20 is a bridging component or a bridging chip, etc., the second electronic component 21 is a system-on-chip (SoC), etc., the third electronic component 22 is an electronic integrated circuit (EIC), etc., and the photon component 30 is a photon chip, a photon integrated circuit (PIC), or a silicon photon component, etc.

[0102] In one embodiment, the optical component 40 has an acting portion 41 that directly contacts the optical acting surface 31 of the photon component 30, so that the acting portion 41 of the optical component 40 is directly bonded to the optical acting surface 31 of the photon component 30.

[0103] In one embodiment, the optical component 40 has an acting portion 41, and the height C of the acting portion 41 of the optical component 40 is greater than the depth D of the opening 17 of the circuit structure 10.

[0104] In one embodiment, the optical component 40 has an inclined surface 42 that corresponds to the optical acting surface 31 of the photon component 30 and the optical fiber 71 simultaneously / respectively, so that the optical signal L provided by the optical fiber 71 is transmitted to the optical acting surface 31 of the photon component 30 through the inclined surface 42 of the optical component 40.

[0105] In summary, the common optical package 1 and its manufacturing method of the present application at least have the following features, advantages or technical effects.

[0106] First, the present application can effectively integrate at least one electronic component (such as the first electronic component 20, the second electronic component 21, and / or the third electronic component 22), the photon component 30 (such as a photon chip), and the optical component 40 (such as a lens structure) through a single electronic module 1a (such as a packaging module like a fan-out embedded bridging module) or the circuit structure 10, so as to facilitate achieving the purpose of rapid transmission of the optical signal L provided by, for example, the laser 70 and / or the optical fiber 71.

[0107] Second, the present application can embed the photon component 30 (such as a photon chip) in the circuit structure 10 and combine the photon component 30 with a specially designed optical component 40 (such as a lens structure), so as to facilitate reducing / eliminating the deviation in alignment between the optical component 40 (acting portion 41) and the optical acting surface 31 of the photon component 30, which may cause loss of the optical signal L, and also enable the optical signal L provided by, for example, the laser 70 and / or the optical fiber 71 to effectively enter (be introduced into) the photon component 30 through the optical component 40.

[0108] III. The opening 17 of the circuit structure 10 of the present application can be a tapered opening. The size A of the first end of the opening 17 is larger than the size B of the second end of the opening 17, and the second end of the opening 17 corresponds to the optical action surface 31 of the photon element 30 (such as a photon chip), which is conducive to the action part 41 of the optical element 40 (such as a lens structure) being effectively or quickly aligned to the optical action surface 31 of the photon element 30 through the opening 17 (such as a tapered opening) of the circuit structure 10.

[0109] IV. The size B of the second end (such as the lower end) of the opening 17 of the circuit structure 10 of the present application can be larger than the size of the optical action surface 31 of the photon element 30 (such as a photon chip), so as to facilitate the action part 41 of the optical element 40 (such as a lens structure) being effectively aligned to the optical action surface 31 of the photon element 30 through the opening 17 of the circuit structure 10.

[0110] V. The optical element 40 (such as a lens structure) of the present application can have an inclined surface 42 (bevel angle) to simultaneously / correspond to the optical action surface 31 of the photon element 30 (such as a photon chip) and the external optical fiber 71 (laser 70) respectively, so that the optical signal L provided by, for example, the laser 70 or the optical fiber 71 can be effectively transmitted to the optical action surface 31 of the photon element 30 through the inclined surface 42 (bevel angle) of the optical element 40.

[0111] VI. The optical element 40 (such as a lens structure) of the present application can have a special design of the inclined surface 42 (bevel angle), so that the optical signal L provided by, for example, the laser 70 and / or the optical fiber 71 is effectively transmitted to the optical action surface 31 of the photon element 30 (such as a photon chip) through the inclined surface 42 (bevel angle) of the optical element 40, and it is also conducive to reducing the loss of the optical signal L during transmission.

[0112] VII. The height C of the action part 41 of the optical element 40 of the present application can be larger than the depth D of the opening 17 of the circuit structure 10, so as to avoid interference when the action part 41 of the optical element 40 is joined or combined to the optical action surface 31 of the photon element 30.

[0113] VIII. The present application can form a coating layer 50 on the first side 10a (circuit layer 11) of the circuit structure 10, the second electronic component 21 (such as a system-on-chip), the third electronic component 22 (such as an electronic integrated circuit), and the optical element 40 (such as a lens structure), so as to protect the second electronic component 21, the third electronic component 22, and the optical element 40 through the coating layer 50.

[0114] IX. The present application can protect the second electronic component 21, the third electronic component 22, and / or the optical element 40, etc. from being damaged through the coating layer 50, and can also use the coating layer 50 to avoid damage to the optical element 40 and affect the coupling efficiency between the optical element 40 and the photon element 30 (such as a photon chip).

[0115] The above embodiments are only used to exemplarily illustrate the principles and effects of the present application, rather than to limit the present application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of the present application. Therefore, the scope of the rights protected by the present application should be as listed in the claims.

Claims

1. A common optical package, characterized in that: include: A circuit structure having a first side and a second side opposite to each other and an opening, wherein the opening is formed on the first side of the circuit structure; At least one electronic component embedded in the circuit structure or disposed on a first side of the circuit structure; a photon element embedded in the circuit structure to electrically connect the at least one electronic element, and the photon element has an optically active surface exposed in the opening of the circuit structure; an optical element, which is disposed at the opening of the circuit structure and is combined with or corresponds to the optical action surface of the photonic element; as well as A cladding layer is formed on the first side of the circuit structure and the optical element so as to cover the optical element through the cladding layer.

2. The common optical package according to claim 1, wherein: The circuit structure further comprises a first circuit layer, a second circuit layer and an insulating layer. The first circuit layer and the second circuit layer are respectively located at the first side and the second side of the circuit structure. The insulating layer is between the first circuit layer and the second circuit layer, and the photon element is embedded in the insulating layer.

3. The common optical package according to claim 1, wherein: The opening of the circuit structure is a tapered opening, the size of the first end of the opening is larger than the size of the second end of the opening, and the second end of the opening corresponds to the optical action surface of the photonic element.

4. The common optical package according to claim 1, wherein: The size of one end of the opening of the circuit structure is larger than the size of the optical action surface of the photon element, and the one end of the opening of the circuit structure corresponds to the optical action surface of the photon element.

5. The common optical package according to claim 1, wherein: The at least one electronic component includes a first electronic component, a second electronic component and a third electronic component. The first electronic component is embedded in the circuit structure, and the second electronic component and the third electronic component are arranged on a first side of the circuit structure.

6. The common optical package according to claim 5, characterized in that The cladding layer is formed on the first side of the circuit structure, the second electronic element, the third electronic element and the optical element, so as to cover the second electronic element, the third electronic element and the optical element through the cladding layer.

7. The common optical package according to claim 5, characterized in that The first electronic component is a bridge component or a bridge chip, the second electronic component is a system on a chip, the third electronic component is an electronic integrated circuit, and the photonic component is a photonic chip, a photonic integrated circuit or a silicon photonic component.

8. The common optical package of claim 1, wherein: The optical element has an active part which directly contacts the optical active surface of the photon element, so that the active part of the optical element is directly combined with the optical active surface of the photon element.

9. The common optical package of claim 1, wherein: The optical element has an action portion, and the height of the action portion of the optical element is greater than the depth of the opening of the circuit structure.

10. The common optical package of claim 1, wherein: The optical element has an inclined surface which corresponds to the optical action surface of the photon element and the optical fiber at the same time, so that the optical signal provided by the optical fiber is transmitted to the optical action surface of the photon element through the inclined surface of the optical element.

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