Packaging structure of semiconductor

Abstract

The utility model relates to the technical field of packaging devices, in particular to a semiconductor packaging structure, which comprises a semiconductor packaging structure main body, and is characterized in that when the device is used, a packaging cover plate of the device is opened, a limiting cotton plate above a protection assembly is taken out, and a semiconductor chip is placed in a mounting groove in a mounting seat; the inner side of the mounting base is of a fully-wrapped sponge structure, the semiconductor chip is affected by a wrapping layer when shaking in the mounting base, then the limiting cotton plate is used for packaging the upper portion of the semiconductor chip, the safety of the semiconductor chip is guaranteed, when the chip needs to be taken out, the abutting plates at the two ends can be taken out, the protection assembly is pressed downwards, and therefore the chip can be taken out. The mounting groove slides on the side face of the push-out plate, the push-out plate lifts the semiconductor chip, a user can take out the semiconductor chip conveniently, and the surface of the semiconductor chip is prevented from being scratched or scratched when the semiconductor chip is taken out.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging devices, in particular to a semiconductor packaging structure. Background Art

[0002] Conductor packaging refers to the process of processing the tested wafers into independent chips according to the product model and functional requirements. The packaging process is as follows: the wafers from the wafer front-end process are cut into small chips through the dicing process, and then the cut chips are glued to the corresponding substrate (lead frame) frame islands, and then ultra-fine metal (gold, tin, copper, and aluminum) wires or conductive resins are used to connect the bonding pads of the chips to the corresponding pins of the substrate to form the required circuit; then the independent chips are packaged and protected with plastic shells, and a series of operations are required after the plastic packaging. After the packaging is completed, the finished product is tested, usually after inspection, testing, and packaging, and finally shipped;

[0003] A semiconductor packaging structure according to patent publication number CN210628279U belongs to the field of semiconductor packaging technology and includes a box body, wherein the inner wall of the box body is detachably connected to the outer wall of the bottom surface of the connecting plate by bolts A, and the outer wall of the box body is slidably connected to the outer wall of the slide rod by a sliding groove, and a connecting plate groove is provided on the upper surface of the connecting plate. However, when the device is in use, when the semiconductor chip fits into the groove inside the storage plate, it is inconvenient to take out the semiconductor chip, and it is easy to cause scratches on the surface of the semiconductor chip when the semiconductor chip is clamped by a tool.

[0004] In view of this, we propose a semiconductor packaging structure. Utility Model Content

[0005] In order to make up for the above deficiencies, the utility model provides a semiconductor packaging structure.

[0006] The technical solution of the utility model is:

[0007] A semiconductor packaging structure comprises a semiconductor packaging structure main body, a protective component is detachably installed inside the semiconductor packaging structure main body, an auxiliary component is installed on the right side of the protective component, the protective component comprises: a limiting cotton plate, a mounting groove, an ejection plate, a mounting seat, a retrieval bottom plate, and a packaging partition plate, a plurality of mounting seats are fixedly installed inside the protective component, a mounting groove is provided inside the mounting seat, an ejection plate is slidably connected to the inner side of the mounting groove, an ejection column is fixedly installed at the bottom of the ejection plate, a limiting cotton plate is provided above the mounting seat, and a retrieval bottom plate is fixedly installed at the bottom end of the ejection column.

[0008] As a preferred technical solution, abutment plates are installed on both sides of the picking bottom plate.

[0009] As a preferred technical solution, a temperature control box is detachably installed inside the auxiliary component. A display panel is provided at the front end of the temperature control box. A temperature detector is detachably installed inside the auxiliary component. A humidifier is detachably installed inside the auxiliary component.

[0010] As a preferred technical solution, a humidifying groove is provided at the output end of the humidifier.

[0011] As a preferred technical solution, a packaging cover plate is fitted and connected above the semiconductor packaging structure main body, and a packaging base is fixedly installed below the semiconductor packaging structure main body.

[0012] As a preferred technical solution, a protection groove is provided at the front end of the packaging base.

[0013] As a preferred technical solution, a dust cleaning groove is provided at the rear end of the packaging base.

[0014] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0015] 1. When using the device of the present utility model, the packaging cover plate of the device is opened, and then the limit cotton plate above the protection component is taken out. The semiconductor chip is placed inside the installation groove in the installation seat. The inner side of the installation seat is a fully enclosed sponge structure. Even if the semiconductor chip shakes inside it, it will be affected by its wrapping layer. Then the limit cotton plate is used to seal the upper part to ensure the safety of the semiconductor chip. When the chip needs to be taken out, the contact plates at both ends can be taken out, and the protection component is pressed downward, so that the installation groove slides on the side of the push plate, and the push plate lifts the semiconductor chip, which is convenient for the user to take out the semiconductor chip and avoid scratching or scuffing the surface of the semiconductor chip during taking.

[0016] 2. When using the present utility model, the temperature control box is a small air conditioner structure, which can be connected to an external power supply by an electric wire, and the temperature is adjusted by the display panel. The sub-packaging partition is taken out, so that the temperature control box adjusts the temperature inside the semiconductor packaging structure main body to maintain it between -5 and 30 degrees, which is the best preservation temperature. At the same time, the temperature detector inside the temperature detector senses the temperature and humidity inside the device. When it is dry inside, the humidifier is connected to an external power supply, and humidification is carried out inside through the humidifying groove. Description of the Drawings

[0017] Figure 1 It is a schematic structural diagram of the semiconductor packaging structure main body of the present utility model;

[0018] Figure 2 It is a schematic structural diagram of the outer shape component of the present utility model;

[0019] Figure 3Schematic structural diagram of the protection component of the present utility model;

[0020] Figure 4 Schematic structural diagram of the auxiliary component of the present utility model.

[0021] In the figure: 1. Main body of semiconductor package structure; 11. Protection groove; 12. Package base; 13. Package cover plate; 14. Dust cleaning groove; 2. Protection component; 21. Limit cotton board; 22. Installation groove; 23. Push plate; 24. Installation seat; 25. Object taking bottom plate; 26. Subpackage partition; 27. Push column; 28. Contact plate; 3. Auxiliary component; 31. Temperature control box; 32. Display panel; 33. Temperature detector; 34. Humidification groove; 35. Humidifier. Specific embodiments

[0022] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present utility model belongs. The terms used in the description of the present utility model herein are only for the purpose of describing specific embodiments, and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0024] Please refer to Figures 1 to 4 , the present utility model provides a technical solution:

[0025] A semiconductor package structure includes a main body 1 of the semiconductor package structure. A protection component 2 is detachably installed inside the main body 1 of the semiconductor package structure. An auxiliary component 3 is installed on the right side of the protection component 2. The protection component 2 includes: a limit cotton board 21, an installation groove 22, a push plate 23, an installation seat 24, an object taking bottom plate 25, and a subpackage partition 26. A plurality of installation seats 24 are fixedly installed inside the protection component 2. An installation groove 22 is opened inside the installation seat 24. A push plate 23 is slidably connected to the inner side of the installation groove 22. A push column 27 is fixedly installed at the bottom of the push plate 23. A limit cotton board 21 is opened above the installation seat 24. An object taking bottom plate 25 is fixedly installed at the bottom end of the push column 27. Contact plates 28 are installed on both sides of the object taking bottom plate 25.

[0026] It should be added that when using the device, the packaging cover 13 of the device is opened, and then the limiting cotton plate 21 above the protective component 2 is taken out, and the semiconductor chip is placed inside the mounting groove 22 in the mounting seat 24. The inner side of the mounting seat 24 is a fully wrapped sponge structure, and the shaking of the semiconductor chip inside it will also be affected by its wrapping layer. The limiting cotton plate 21 is then packaged on the top to ensure the safety of the semiconductor chip. When the chip needs to be taken out, the resistance plates 28 at both ends can be taken out, and the protective component 2 is pressed downward to make the mounting groove 22 slide on the side of the ejection plate 23, so that the ejection plate 23 lifts the semiconductor chip, making it easier for the user to take out the semiconductor chip and avoid scratches or scratches on the surface of the semiconductor chip when taking it out.

[0027] As a preferred embodiment of the present invention, a temperature control box 31 is detachably installed inside the auxiliary component 3, a display panel 32 is provided at the front end of the temperature control box 31, a thermometer 33 is detachably installed inside the auxiliary component 3, a humidifier 35 is detachably installed inside the auxiliary component 3, and a humidification tank 34 is provided at the output end of the humidifier 35.

[0028] It is worth mentioning that when in use, the temperature control box 31 is a small air-conditioning structure, which can be connected to an external power source by electric wires, and the temperature is adjusted by the display panel 32. The packaging partition 26 is taken out, so that the temperature control box 31 can adjust the internal temperature of the semiconductor packaging structure body 1 to maintain it at the best preservation range of -5-30 degrees. At the same time, the thermometer 33 has a temperature measuring device inside to sense the temperature and humidity inside the device. When the interior is dry, the humidifier 35 is connected to an external power source, and the humidification tank 34 humidifies the interior.

[0029] As a preferred embodiment of the present invention, a packaging cover plate 13 is fittedly connected to the top of the semiconductor packaging structure body 1, a packaging base 12 is fixedly installed to the bottom of the semiconductor packaging structure body 1, a protective groove 11 is provided at the front end of the packaging base 12, and a dust cleaning groove 14 is provided at the rear end of the packaging base 12.

[0030] During specific use, the dust falling from the inside of the protective component 2 is collected through the dust cleaning groove 14, and can be slid out for cleaning.

[0031] When the semiconductor packaging structure of the present utility model is in use, first, when using the device, the packaging cover plate 13 of the device is opened, and then the limiting cotton plate 21 above the protection component 2 is taken out. The semiconductor chip is placed inside the installation groove 22 in the mounting seat 24. The inner side of the mounting seat 24 is a fully enclosed sponge structure. Even if the semiconductor chip shakes inside it, it will be affected by its wrapping layer. Then, the limiting cotton plate 21 is used to encapsulate the upper part to ensure the safety of the semiconductor chip. When the chip needs to be taken out, the contact plates 28 at both ends can be taken out, and the protection component 2 is pressed downwards, so that the installation groove 22 slides on the side of the push plate 23, and the push plate 23 lifts the semiconductor chip, which is convenient for the user to take out the semiconductor chip and avoid scratching or scuffing the surface of the semiconductor chip during taking. When in use, the temperature control box 31 is a small air conditioner structure, which can be connected to an external power supply by an electric wire, and the temperature is adjusted by the display panel 32. The sub-packaging partition plate 26 is taken out, so that the temperature control box 31 adjusts the temperature inside the semiconductor packaging structure main body 1 to maintain it between -5 and 30 degrees, which is the best preservation temperature. At the same time, the temperature measuring device inside the temperature detector 33 senses the temperature and humidity inside the device. When it is dry inside, the humidifier 35 is connected to an external power supply, and the humidifying tank 34 humidifies the inside.

[0032] The above shows and describes the basic principles, main features and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. The above embodiments and the descriptions in the specification are only preferred examples of the present utility model and do not limit the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.

Claims

1. A semiconductor packaging structure, comprising a semiconductor packaging structure body (1), characterized in that: A protective component (2) is detachably installed inside the semiconductor packaging structure body (1), and an auxiliary component (3) is installed on the right side of the protective component (2). The protective component (2) includes: a limiting cotton plate (21), a mounting groove (22), an ejection plate (23), a mounting seat (24), a retrieval bottom plate (25), and a sub-packaging partition (26). A plurality of mounting seats (24) are fixedly installed inside the protective component (2), a mounting groove (22) is provided inside the mounting seat (24), an ejection plate (23) is slidably connected to the inner side of the mounting groove (22), an ejection column (27) is fixedly installed at the bottom of the ejection plate (23), a limiting cotton plate (21) is provided above the mounting seat (24), and a retrieval bottom plate (25) is fixedly installed at the bottom end of the ejection column (27).

2. A semiconductor packaging structure as claimed in claim 1, characterized in that: Resistance plates (28) are installed on both sides of the object-taking bottom plate (25).

3. The semiconductor packaging structure according to claim 1, wherein: A temperature control box (31) is detachably mounted inside the auxiliary component (3), a display panel (32) is provided at the front end of the temperature control box (31), a temperature measuring device (33) is detachably mounted inside the auxiliary component (3), and a humidifier (35) is detachably mounted inside the auxiliary component (3).

4. A semiconductor packaging structure as claimed in claim 3, characterized in that: A humidifying tank (34) is provided at the output end of the humidifier (35).

5. The semiconductor packaging structure according to claim 1, wherein: A packaging cover plate (13) is fitted and connected to the upper side of the semiconductor packaging structure body (1), and a packaging base (12) is fixedly installed to the lower side of the semiconductor packaging structure body (1).

6. A semiconductor packaging structure as claimed in claim 5, characterized in that: A protection groove (11) is provided at the front end of the packaging base (12).

7. A semiconductor packaging structure as claimed in claim 6, characterized in that: A dust cleaning groove (14) is provided at the rear end of the packaging base (12).

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