Liquid cooling plate with efficient heat dissipation
By designing a liquid-cooled plate with a first groove and a second groove, the design of the flow path of the coolant in the liquid-cooled plate, the problem of high temperature in the central area of the object to be cooled is solved, and uniform temperature reduction of the temperature of each area of the object to be cooled is achieved, which improves heat dissipation efficiency and saves energy consumption.
Patent Information
- Application Number
- CN202422120077.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2025-06-10
- Estimated Expiration
- 2034-08-30
AI Technical Summary
When the existing liquid-cooled plate cools the object to be cooled, the central temperature of the object to be cooled is high and the surrounding temperature is low, which cannot effectively reduce the temperature in the center area and is not very heat dissipation efficiency.
A liquid-cooled plate for efficient heat dissipation is designed, including a first substrate, a first partition and a second substrate. A first and second grooves are formed on the second substrate. The coolant flows into the first groove from the outside, and then flows to the first substrate through the holes of the first partition for heat dissipation, and then flows into the second groove from the middle, and adjusts the flow path of the coolant according to the temperature distribution of the object to be cooled.
The temperature of the objects to be cooled is uniformly cooled, and the conventional liquid-cooled plates are prevented from excessive heat dissipation of the edges of the objects to be cooled, which improves heat dissipation efficiency and saves energy consumption.
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Figure CN222966131U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of radiators, and particularly relates to a liquid cooling plate with high heat dissipation efficiency. Background Art
[0002] During the operation of existing objects to be cooled (such as chips, power devices / modules, etc.), heat is generated. The temperature in the middle of the object to be cooled is high while the temperature around it is low.
[0003] When the existing liquid cooling plate cools the object to be cooled, usually the liquid cooling plate dissipates heat to each area of the object to be cooled without difference through the coolant, resulting in a high temperature in the central area and a low temperature around the object to be cooled. In order to reduce the temperature of the central area of the object to be cooled to a predetermined temperature, the flow rate of the coolant is increased and the temperature of the coolant is decreased, resulting in a not-high heat dissipation efficiency. Content of the Utility Model
[0004] Aiming at the above problems of the prior art, the purpose of the utility model is to provide a liquid cooling plate with uniform heat dissipation, which can improve the heat dissipation efficiency and save energy consumption.
[0005] To solve the above problems, the utility model provides a liquid cooling plate with high heat dissipation efficiency, and the liquid cooling plate with high heat dissipation efficiency includes:
[0006] A first substrate, on the upper surface of which an installation area is formed for connecting the object to be cooled, and the lower surface of the first substrate is formed as a plane;
[0007] A first partition, the upper surface of which is attached to the lower surface of the first substrate, and a plurality of first strip-shaped holes which are spaced apart and arranged in parallel are formed in the middle of the first partition. The first substrate covers all the first strip-shaped holes, and both the upper surface and the lower surface of the first partition are formed as planes;
[0008] A second substrate, the upper surface of which is attached to the lower surface of the first partition and covers the first strip-shaped holes. On the upper surface of the second substrate, an independent first groove and a second groove are formed. The first groove is arranged in the middle of the width direction of the second substrate and extends along the length direction of the second substrate. Both the first groove and the second groove intersect with the first strip-shaped holes. An inlet hole is formed in the first groove, the second groove is arranged along the edges of two opposite sides of the second substrate in the length direction, and an outlet hole is formed in the second groove. The upper surface of the second substrate is formed as a plane.
[0009] Furthermore, the second groove also extends along the edge of the first side in the width direction of the second substrate to form a "U" shape.
[0010] Further, the liquid inlet hole is disposed adjacent to the second side, the second side is disposed opposite to the first side, and the liquid outlet hole is disposed adjacent to the first side.
[0011] Further, the liquid cooling plate with high efficiency heat dissipation further comprises:
[0012] A second partition plate, the upper surface of the second partition plate is attached to the lower surface of the first partition plate, a second strip-shaped hole which is spaced apart and arranged in parallel is formed in the middle of the second partition plate, the first strip-shaped hole and the second strip-shaped hole intersect with each other, and both the upper surface and the lower surface of the second partition plate are formed as planes;
[0013] The upper surface of the second substrate is attached to the lower surface of the second partition plate and covers all of the second strip-shaped holes, and the second substrate is connected to the first partition plate through the second partition plate.
[0014] Further, the first strip-shaped hole is inclined with respect to the length direction of the first partition plate, and the second strip-shaped hole is inclined with respect to the length direction of the second partition plate.
[0015] Further, a first angle formed by the first strip-shaped hole and a first direction of the length direction of the first partition plate is 30 to 60 degrees, a second angle formed by the second strip-shaped hole and the first direction of the length direction of the second partition plate is 150 to 120 degrees, and the first angle and the second angle are complementary angles to each other.
[0016] Further, the first strip-shaped hole and the second strip-shaped hole are perpendicular to each other.
[0017] Further, both the first strip-shaped hole and the second strip-shaped hole include multiple groups, multiple groups of the first strip-shaped holes are arranged at intervals along the length direction of the first partition plate, multiple types of the second strip-shaped holes are arranged at intervals along the length direction of the second partition plate, and multiple groups of the second strip-shaped holes correspond to multiple groups of the second strip-shaped holes one by one.
[0018] Further, the first partition plate includes a plurality of first sheet plates, and the plurality of first sheet plates are stacked to form the first partition plate, the second partition plate includes a plurality of second sheet plates, and the plurality of second sheet plates are stacked to form the second partition plate.
[0019] Further, the liquid cooling plate with high efficiency heat dissipation further comprises:
[0020] A liquid inlet joint, the liquid inlet joint is connected to the liquid inlet hole;
[0021] A liquid outlet joint, the liquid outlet joint is connected to the liquid outlet hole.
[0022] Due to the above technical solutions, the present utility model has the following beneficial effects:
[0023] The liquid cooling plate with high-efficiency heat dissipation according to the present utility model includes a first substrate, a first partition board and a second substrate. The second substrate is formed with an independent first groove and a second groove. The first groove is arranged in the middle of the width direction of the second substrate, and the second groove is arranged at the edge of the length direction of the second substrate. The coolant first flows into the first groove from the outside and then flows out from the second groove to the outside. The initial temperature of the coolant is relatively low, and it first dissipates heat from the middle of the liquid cooling plate (the middle of the liquid cooling plate corresponds to the middle of the object to be cooled), that is, it first dissipates heat from the middle region with relatively high temperature in the object to be cooled. The coolant flows from the middle to the edge, that is, it then dissipates heat from the edge region with relatively low temperature in the object to be cooled. Therefore, it can adjust the path of the coolant flowing through according to the temperature distribution of the object to be cooled, make the temperatures of all regions of the object to be cooled uniform, avoid the situation that the conventional liquid cooling plate overheats the edge of the object to be cooled in order to ensure heat dissipation from the region with high temperature in the middle of the object to be cooled, improve the heat dissipation efficiency and save energy consumption. Brief Description of the Drawings
[0024] In order to more clearly illustrate the technical solutions of the present utility model, the drawings required for use in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0025] Figure 1 is a structural diagram of a liquid cooling plate with high-efficiency heat dissipation according to an embodiment of the present utility model;
[0026] Figure 2 is Figure 1 a structural diagram of the back surface of the liquid cooling plate of the embodiment;
[0027] Figure 3 is an exploded view of a liquid cooling plate with high-efficiency heat dissipation according to an embodiment of the present utility model;
[0028] Figure 4 is a structural diagram of a first partition board according to an embodiment of the present utility model;
[0029] Figure 5 is a structural diagram of a second partition board according to an embodiment of the present utility model;
[0030] Figure 6 is Figure 4 a superposition diagram of the first partition board of the embodiment and Figure 5 the second partition board of the embodiment;
[0031] Figure 7 is a structural diagram of a second substrate according to an embodiment of the present utility model.
[0032] Reference numerals:
[0033] 100, first substrate; 201, first sheet plate; 210, first partition; 211, first strip-shaped hole; 202, second sheet plate; 220, second partition; 221, second strip-shaped hole; 300, second substrate; 310, first groove; 320, liquid inlet hole; 330, second groove; 340, liquid outlet hole. Detailed implementation manners
[0034] In order to enable those skilled in the art to better understand the solution of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.
[0035] It should be noted that the terms "first", "second", etc. in the description and claims of the present utility model and the above-mentioned accompanying drawings are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence. It should be understood that such used data can be interchanged under appropriate circumstances so that the embodiments of the present utility model described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion.
[0036] Next, the liquid cooling plate with high-efficiency heat dissipation according to the embodiment of the present utility model will be described.
[0037] As Figures 1 to 7 shown, the liquid cooling plate with high-efficiency heat dissipation according to the embodiment of the present utility model includes: a first substrate 100, a first partition 210, and a second substrate 300.
[0038] First, the first substrate 100 will be described. An installation area is formed on the upper surface of the first substrate 100, and the installation area is used to connect the object to be cooled. The lower surface of the first substrate 100 is formed as a flat surface.
[0039] As Figure 1 shown, three installation areas are formed on the upper surface of the first substrate 100, so that three objects to be cooled can be cooled. The lower surface of the first substrate 100 is formed as a flat surface, which can reduce the processing difficulty and facilitate the connection with the first partition 210.
[0040] Next, the first partition 210 will be described. The upper surface of the first partition 210 is in contact with the lower surface of the first substrate 100. A plurality of first strip-shaped holes 211 that are spaced apart and parallel to each other are formed in the middle of the first partition 210. The first substrate 100 covers all the first strip-shaped holes 211. Both the upper surface and the lower surface of the first partition 210 are formed as planes.
[0041] As Figure 3 shown, the upper surface of the first partition 210 is closely attached to the lower surface of the first substrate 100. The coolant flows into the first partition 210, and the coolant passes through the first strip-shaped holes 211 on the first partition 210 and contacts the first substrate 100, thereby cooling the first substrate 100. A plurality of first strip-shaped holes 211 are formed on the first partition 210, which can enable the coolant to pass through the first partition 210 and increase the contact area between the coolant and the first substrate 100, improving the heat exchange efficiency.
[0042] Finally, the second substrate 300 will be described. The upper surface of the second substrate 300 is attached to the lower surface of the first partition 210 and covers the first strip-shaped holes 211. Independent first grooves 310 and second grooves 330 are formed on the upper surface of the second substrate 300. The first groove 310 is provided in the middle of the second substrate 300 in the width direction and extends along the length direction of the second substrate 300. Both the first groove 310 and the second groove 330 intersect with the first strip-shaped holes 211. An inlet hole 320 is formed in the first groove 310. The second groove 330 is provided along the edges of the two opposite sides of the second substrate 300 in the length direction. An outlet hole 340 is formed in the second groove 330. The upper surface of the second substrate 300 is formed as a plane.
[0043] As Figure 3 and Figure 7 shown, the coolant flows into the first groove 310 from the inlet hole 320 of the second substrate 300, then flows from the first groove 310 into the first strip-shaped holes 211 of the first partition 210, and then contacts the first substrate 100 to dissipate heat from the first substrate 100, thereby dissipating heat from the object to be cooled provided on the installation area of the first substrate 100. The coolant after dissipating heat from the first substrate 100 passes through the first strip-shaped holes 211 of the first partition 210, then flows into the second groove 330, and finally flows out of the liquid cooling plate from the outlet hole 340.
[0044] The plane of the lower surface of the first partition 210 being in contact with the plane of the upper surface of the second substrate 300 can enable the first partition 210 and the second substrate 300 to be in full contact, increasing the heat exchange area. Both the first groove 310 and the second groove 330 intersect with the first strip-shaped holes 211, which can enable the coolant flowing through the first groove 310 to flow into the first strip-shaped holes 211, and enable the coolant flowing through the first strip-shaped holes 211 to flow into the second groove 330.
[0045] The first groove 310 is provided in the middle of the second substrate 300 in the width direction, and the second groove 330 is provided at the edge of the second substrate 300 in the length direction. The coolant first flows into the first groove 310 from the outside and then flows out from the second groove 330 to the outside. The initial temperature of the coolant is relatively low, and it first dissipates heat from the middle of the liquid cooling plate (the middle of the liquid cooling plate corresponds to the middle of the object to be cooled), that is, it first dissipates heat from the middle area with a relatively high temperature in the object to be cooled. The coolant flows from the middle to the edge, that is, it then dissipates heat from the edge area with a relatively low temperature in the object to be cooled. Thus, it can adjust the path of the coolant flow according to the temperature distribution of the object to be cooled, making the temperature of each area of the object to be cooled uniform, avoiding the situation where a conventional liquid cooling plate over-dissipates heat from the edge of the object to be cooled in order to ensure heat dissipation from the area with a high temperature in the middle of the object to be cooled, improving the heat dissipation efficiency and saving energy.
[0046] In some embodiments of the present invention, the second groove 330 is further provided along the edge of the first side in the width direction of the second substrate 300 to form a "U" shape.
[0047] As Figure 7 shown, the second groove 330 forms a "U" shape with an opening facing the width direction. Through the "U"-shaped second groove 330, the number of liquid outlet holes 340 can be reduced, and one liquid outlet hole 340 can meet the requirements.
[0048] Furthermore, the liquid inlet hole 320 is provided adjacent to the second side, the second side is opposite to the first side, and the liquid outlet hole 340 is provided adjacent to the first side.
[0049] As Figure 7 shown, the liquid inlet hole 320 and the liquid outlet hole 340 are respectively provided at both ends of the second substrate 300 in the length direction and are relatively far apart, which can increase the length of the path of the coolant flow, avoid the situation where the coolant directly flows out without fully dissipating heat from the object to be cooled, and improve the cooling efficiency.
[0050] In some embodiments of the present invention, the liquid cooling plate with high-efficiency heat dissipation further includes a second partition 220. The second partition 220, the upper surface of the second partition 220 is attached to the lower surface of the first partition 210, and the middle of the second partition 220 is formed with second strip-shaped holes 221 that are spaced apart and arranged in parallel. The first strip-shaped hole 211 and the second strip-shaped hole 221 intersect with each other, and both the upper surface and the lower surface of the second partition 220 are formed as planes. The upper surface of the second substrate 300 is attached to the lower surface of the second partition 220 and covers all the second strip-shaped holes 221. The second substrate 300 is connected to the first partition 210 through the second partition 220.
[0051] As Figures 3 to 6As shown, the second partition plate 220 is disposed between the first partition plate 210 and the second substrate 300. The second strip-shaped hole 221 of the second partition plate 220 intersects with the first strip-shaped hole 211 of the first partition plate 210, so that the coolant can pass through the second strip-shaped hole 221 to the first strip-shaped hole 211, increasing the contact area between the coolant and the liquid cooling plate, improving the heat dissipation efficiency, and enabling the coolant to flow in layers, reducing the flow resistance.
[0052] The upper surface of the second substrate 300 covers the second strip-shaped hole 221, which can prevent the leakage of the coolant.
[0053] Furthermore, the first strip-shaped hole 211 is inclined with respect to the length direction of the first partition plate 210, and the second strip-shaped hole 221 is inclined with respect to the length direction of the second partition plate 220.
[0054] The first strip-shaped hole 211 being inclined with respect to the length direction of the first partition plate 210 and the second strip-shaped hole being inclined with respect to the length direction of the second partition plate 220 both enable some of the first strip-shaped holes 211 and the second strip-shaped holes 221 to directly communicate with the first groove 310 and the second groove 330, so that some of the coolant flows directly between the first groove 310 and the second groove 330 through some of the first strip-shaped holes 211 and the second strip-shaped holes 221, improving the cooling efficiency.
[0055] Moreover, the second strip-shaped hole 221 and the first strip-shaped hole 211 are arranged to intersect with each other, enabling the coolant to flow up and down at the intersection of the first strip-shaped hole 211 and the second strip-shaped hole 221, so that the coolant can be distributed to all of the first strip-shaped holes 211 and the second strip-shaped holes 221.
[0056] Furthermore, the first angle formed by the first strip-shaped hole 211 and the first direction of the length direction of the first partition plate 210 is 30 to 60 degrees, and the second angle formed by the second strip-shaped hole 221 and the first direction of the length direction of the second partition plate 220 is 150 to 120 degrees, and the first angle and the second angle are complementary angles.
[0057] The first strip-shaped hole 211 and the second strip-shaped hole 221 at this angle can make the distribution of the coolant relatively uniform.
[0058] Furthermore, the first strip-shaped hole 211 and the second strip-shaped hole 221 are perpendicular to each other.
[0059] The first strip-shaped hole 211 and the second strip-shaped hole 221 are perpendicular to each other, that is, the first strip-shaped hole 211 is at 45 degrees with respect to the first direction of the length direction of the first partition plate 210, and the second strip-shaped hole 221 is at 135 degrees with respect to the first direction of the length direction of the second partition plate 220, that is, a symmetric design, which can further increase the uniformity of the coolant distribution.
[0060] In some embodiments of the present utility model, both the first strip-shaped holes 211 and the second strip-shaped holes 221 include multiple groups. The multiple groups of first strip-shaped holes 211 are arranged at intervals along the length direction of the first partition plate 210, and the multiple types of second strip-shaped holes 221 are arranged at intervals along the length direction of the second partition plate. The multiple groups of second strip-shaped holes 221 correspond to the multiple groups of second strip-shaped holes 221 one by one.
[0061] As Figure 3 shown, three groups of first strip-shaped holes 211 arranged at intervals are provided on the first partition plate 210, and three groups of second strip-shaped holes 221 arranged at intervals corresponding to the first strip-shaped holes 211 one by one are provided on the second partition plate 220, so as to be able to correspond to the three installation areas of the first substrate 100, and thus be able to dissipate heat from three objects to be cooled. Therefore, multiple objects to be cooled can be cooled synchronously.
[0062] It should be noted that the above are only optional examples. The number of groups of the first strip-shaped holes 211 and the second strip-shaped holes 221 can also be four groups, five groups, seven groups, etc., and these should all be understood to be within the scope of the present utility model.
[0063] In some embodiments of the present utility model, the first partition plate 210 includes multiple first sheet plates 201, and the multiple first sheet plates 201 are stacked to form the first partition plate 210. The second partition plate 220 includes multiple second sheet plates 202, and the multiple second sheet plates 202 are stacked to form the second partition plate 220.
[0064] As Figure 3 shown, the first partition plate 210 is formed by stacking three first sheet plates 201, and the second partition plate 220 is formed by stacking three second sheet plates 202. The thickness of the first partition plate 210 and the second partition plate 220 can be conveniently adjusted through the first sheet plates 201 and the second sheet plates 202, and the thinner first sheet plates 201 and second sheet plates 202 can be formed by stamping, and the production is relatively simple.
[0065] In some embodiments of the present utility model, the liquid cooling plate with high-efficiency heat dissipation further includes a liquid inlet joint and a liquid outlet joint. The liquid inlet joint is connected to the liquid inlet hole 320. The liquid outlet joint is connected to the liquid outlet hole 340.
[0066] As Figure 2 and Figure 3 shown, the liquid inlet joint is connected to the liquid inlet hole 320, and the liquid outlet joint is connected to the liquid outlet hole 340. Thus, the liquid inlet hole 320 can be conveniently connected to the liquid inlet pipeline through the liquid inlet joint, and the liquid outlet hole 340 can be conveniently connected to the liquid outlet pipeline through the liquid outlet joint.
[0067] The above are only the preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. A liquid cooling plate with high heat dissipation efficiency, characterized in that: The liquid cooling plate with high efficiency heat dissipation comprises: A first substrate, wherein an installation area is formed on an upper surface of the first substrate, the installation area is used to connect an object to be cooled, and a lower surface of the first substrate is formed into a plane; A first partition, wherein the upper surface of the first partition is in contact with the lower surface of the first substrate, a plurality of first strip-shaped holes which are spaced apart and parallel to each other are formed in the middle of the first partition, the first substrate covers all the first strip-shaped holes, and the upper surface and the lower surface of the first partition are both formed into planes; A second substrate, the upper surface of the second substrate is attached to the lower surface of the first partition and covers the first strip-shaped hole, the upper surface of the second substrate is formed with a first groove and a second groove that are independent of each other, the first groove is arranged in the middle of the width direction of the second substrate and extends along the length direction of the second substrate, the first groove and the second groove both intersect with the first strip-shaped hole, a liquid inlet hole is formed in the first groove, the second groove is arranged along the edges of two opposite sides in the length direction of the second substrate, a liquid outlet hole is formed in the second groove, and the upper surface of the second substrate is formed as a plane.
2. The liquid cooling plate with high heat dissipation efficiency according to claim 1, characterized in that: The second groove is also arranged along an edge of a first side in a width direction of the second substrate to form a "U" shape.
3. The liquid cooling plate with high heat dissipation efficiency according to claim 2, characterized in that: The liquid inlet hole is disposed adjacent to the second side edge, the second side edge is disposed opposite to the first side edge, and the liquid outlet hole is disposed adjacent to the first side edge.
4. The liquid cooling plate with high heat dissipation efficiency according to claim 1, characterized in that: The liquid cooling plate with high efficiency heat dissipation also includes: A second partition, wherein the upper surface of the second partition is in contact with the lower surface of the first partition, a second strip-shaped hole is formed in the middle of the second partition, the first strip-shaped hole and the second strip-shaped hole are intersected with each other, and the upper surface and the lower surface of the second partition are both formed into planes; The upper surface of the second substrate is attached to the lower surface of the second partition and covers all of the second strip holes, and the second substrate is connected to the first partition through the second partition.
5. The liquid cooling plate with high heat dissipation efficiency according to claim 4, characterized in that: The first strip-shaped holes are oblique to the length direction of the first separator, and the second strip-shaped holes are oblique to the length direction of the second separator.
6. The liquid cooling plate with high heat dissipation efficiency according to claim 5, characterized in that: The first angle formed by the first strip hole and the first direction of the length direction of the first partition is 30 to 60 degrees, the second angle formed by the second strip hole and the first direction of the length direction of the second partition is 150 to 120 degrees, and the first angle and the second angle are complementary angles.
7. The liquid cooling plate with high heat dissipation efficiency according to claim 6, characterized in that: The first strip-shaped holes and the second strip-shaped holes are perpendicular to each other.
8. The liquid cooling plate with high heat dissipation efficiency according to claim 4, characterized in that: The first strip-shaped holes and the second strip-shaped holes each include multiple groups, the multiple groups of the first strip-shaped holes are arranged at intervals along the length direction of the first partition plate, the multiple groups of the second strip-shaped holes are arranged at intervals along the length direction of the second partition plate, and the multiple groups of the second strip-shaped holes correspond one-to-one to the multiple groups of the second strip-shaped holes.
9. The liquid cooling plate with high heat dissipation efficiency according to claim 4, characterized in that: The first separator includes a plurality of first sheet-like plates, which are stacked to form the first separator, and the second separator includes a plurality of second sheet-like plates, which are stacked to form the second separator.
10. The liquid cooling plate with high heat dissipation efficiency according to claim 1, characterized in that: The highly efficient heat dissipation liquid cooling plate also includes: A liquid inlet connector, the liquid inlet connector being connected to the liquid inlet hole; A liquid outlet connector, the liquid outlet connector is connected to the liquid outlet hole.